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WO2010079889A3 - Ｌｅｄ의 봉지재 에칭 방법 및 그에 따른 에칭 패턴 - Google Patents

Ｌｅｄ의 봉지재 에칭 방법 및 그에 따른 에칭 패턴 Download PDF

Info

Publication number
WO2010079889A3
WO2010079889A3 PCT/KR2009/006885 KR2009006885W WO2010079889A3 WO 2010079889 A3 WO2010079889 A3 WO 2010079889A3 KR 2009006885 W KR2009006885 W KR 2009006885W WO 2010079889 A3 WO2010079889 A3 WO 2010079889A3
Authority
WO
WIPO (PCT)
Prior art keywords
etching
laser beam
molding compound
pattern
led
Prior art date
Application number
PCT/KR2009/006885
Other languages
English (en)
French (fr)
Other versions
WO2010079889A2 (ko
Inventor
이종명
Original Assignee
주식회사 아이엠티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이엠티 filed Critical 주식회사 아이엠티
Publication of WO2010079889A2 publication Critical patent/WO2010079889A2/ko
Publication of WO2010079889A3 publication Critical patent/WO2010079889A3/ko

Links

Classifications

    • H01L33/52—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2933/0091—
    • H01L33/54—

Landscapes

  • Led Device Packages (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

LED의 봉지재의 에칭 방법 및 그에 따른 에칭 패턴이 제공된다. 그러한 에칭 방법은, 레이저 빔을 발생시키는 레이저 발생부와, 레이저 빔을 스캐닝하기 위한 레이저빔 스캐닝부와, 레이저 스폿을 만들기 위한 초점 렌즈부와, LED가 작업 영역에 위치하도록 하기 위한 스테이지부를 포함하는 에칭 장치로써 수행되며, 스테이지부 상의 작업 영역 내에 LED를 로딩하는 단계와, 레이저 빔을 발진시켜 미리 설정된 에칭 패턴에 따라 레이저빔 스캐닝부에서 레이저 빔의 위치를 제어하면서 봉지재를 에칭하는 단계를 포함하며, 에칭 패턴은, 점 패턴, 격자 패턴 및 링 패턴 중 어느 하나일 수 있으며, 봉지재가 복수 개의 동심원들로 패터닝되는 링 패턴인 경우, 동심원들의 피치 및 레이저의 출력을 제어하여, 봉지재의 에칭 패턴의 상부면이, 오목한 형상, 볼록한 형상 및 비구면 형상 중 어느 하나의 형상이 될 수 있다.
PCT/KR2009/006885 2009-01-08 2009-11-23 Ｌｅｄ의 봉지재 에칭 방법 및 그에 따른 에칭 패턴 WO2010079889A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090001652A KR101051140B1 (ko) 2009-01-08 2009-01-08 Ｌｅｄ의 봉지재 에칭 방법 및 그에 따른 에칭 패턴
KR10-2009-0001652 2009-01-08

Publications (2)

Publication Number Publication Date
WO2010079889A2 WO2010079889A2 (ko) 2010-07-15
WO2010079889A3 true WO2010079889A3 (ko) 2010-09-02

Family

ID=42316935

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006885 WO2010079889A2 (ko) 2009-01-08 2009-11-23 Ｌｅｄ의 봉지재 에칭 방법 및 그에 따른 에칭 패턴

Country Status (2)

Country Link
KR (1) KR101051140B1 (ko)
WO (1) WO2010079889A2 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100669080B1 (ko) * 2005-05-04 2007-01-15 주식회사 아이엠티 유기발광 디스플레이 제조용 레이저 패터닝 장치 및 방법
KR20070013292A (ko) * 2004-04-01 2007-01-30 크리 인코포레이티드 발광 소자의 레이저 패터닝 및 패터닝된 발광 소자
KR100703216B1 (ko) * 2006-02-21 2007-04-09 삼성전기주식회사 발광다이오드 패키지의 제조 방법
JP2008016647A (ja) * 2006-07-06 2008-01-24 Sanyo Electric Co Ltd 発光装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793333B1 (ko) 2006-04-21 2008-01-11 삼성전기주식회사 표면실장형 발광 다이오드 소자의 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070013292A (ko) * 2004-04-01 2007-01-30 크리 인코포레이티드 발광 소자의 레이저 패터닝 및 패터닝된 발광 소자
KR100669080B1 (ko) * 2005-05-04 2007-01-15 주식회사 아이엠티 유기발광 디스플레이 제조용 레이저 패터닝 장치 및 방법
KR100703216B1 (ko) * 2006-02-21 2007-04-09 삼성전기주식회사 발광다이오드 패키지의 제조 방법
JP2008016647A (ja) * 2006-07-06 2008-01-24 Sanyo Electric Co Ltd 発光装置およびその製造方法

Also Published As

Publication number Publication date
KR101051140B1 (ko) 2011-07-22
KR20100082251A (ko) 2010-07-16
WO2010079889A2 (ko) 2010-07-15

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