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WO2009109799A3 - Monolithic capacitive transducer - Google Patents

Monolithic capacitive transducer Download PDF

Info

Publication number
WO2009109799A3
WO2009109799A3 PCT/IB2008/000601 IB2008000601W WO2009109799A3 WO 2009109799 A3 WO2009109799 A3 WO 2009109799A3 IB 2008000601 W IB2008000601 W IB 2008000601W WO 2009109799 A3 WO2009109799 A3 WO 2009109799A3
Authority
WO
WIPO (PCT)
Prior art keywords
comb
fingers
substrate
comb fingers
plane
Prior art date
Application number
PCT/IB2008/000601
Other languages
French (fr)
Other versions
WO2009109799A2 (en
Inventor
Tiansheng Zhou
Original Assignee
Tiansheng Zhou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tiansheng Zhou filed Critical Tiansheng Zhou
Priority to PCT/IB2008/000601 priority Critical patent/WO2009109799A2/en
Priority to JP2010549201A priority patent/JP5258908B2/en
Publication of WO2009109799A2 publication Critical patent/WO2009109799A2/en
Publication of WO2009109799A3 publication Critical patent/WO2009109799A3/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

A capacitive transducer includes a substrate having a first surface and a second surface. The first surface of the substrate defines a first plane. The substrate has a cavity with an interior peripheral edge. The cavity extends between the first surface and the second surface. A body is provided that has an exterior peripheral edge. The body is parallel to the first plane and at least partially blocking the cavity. The body is connected to the substrate by resilient hinges such that, upon the application of a force, the body moves perpendicular to the first plane. A first set of comb fingers is mounted to the substrate. The first set of comb fingers is connected to a first electrical connection. A second set of comb fingers is mounted to the body and extends past the exterior peripheral edge of the body. The second set of comb fingers is connected to a second electrical connection that is isolated from the first connection. The first set of comb fingers and the second set of comb finger are interdigitated such that as the body moves, the first set of comb fingers and the second set of comb finger maintain a relative spacing. The first set of comb fingers and the second set of comb fingers define a capacitance. The capacitance is related to the relative position of the first set of comb drive fingers and the second set of comb drive fingers.
PCT/IB2008/000601 2008-03-03 2008-03-03 Monolithic capacitive transducer WO2009109799A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/IB2008/000601 WO2009109799A2 (en) 2008-03-03 2008-03-03 Monolithic capacitive transducer
JP2010549201A JP5258908B2 (en) 2008-03-03 2008-03-03 Monolithic capacitive transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2008/000601 WO2009109799A2 (en) 2008-03-03 2008-03-03 Monolithic capacitive transducer

Publications (2)

Publication Number Publication Date
WO2009109799A2 WO2009109799A2 (en) 2009-09-11
WO2009109799A3 true WO2009109799A3 (en) 2009-10-29

Family

ID=41056405

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/000601 WO2009109799A2 (en) 2008-03-03 2008-03-03 Monolithic capacitive transducer

Country Status (2)

Country Link
JP (1) JP5258908B2 (en)
WO (1) WO2009109799A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052589B2 (en) * 2009-12-10 2012-10-17 アオイ電子株式会社 microphone
US9487386B2 (en) * 2013-01-16 2016-11-08 Infineon Technologies Ag Comb MEMS device and method of making a comb MEMS device
KR101531100B1 (en) * 2013-09-30 2015-06-23 삼성전기주식회사 Microphone
US10171917B2 (en) * 2016-12-29 2019-01-01 GMEMS Technologies International Limited Lateral mode capacitive microphone

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6829814B1 (en) * 2002-08-29 2004-12-14 Delphi Technologies, Inc. Process of making an all-silicon microphone
US7114397B2 (en) * 2004-03-12 2006-10-03 General Electric Company Microelectromechanical system pressure sensor and method for making and using

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4174351B2 (en) * 2002-03-15 2008-10-29 株式会社豊田中央研究所 Device having movable electrode, movable mirror device, vibrating gyroscope, and manufacturing method thereof
JP4085854B2 (en) * 2003-03-20 2008-05-14 株式会社デンソー Manufacturing method of semiconductor dynamic quantity sensor
JP4591000B2 (en) * 2004-09-16 2010-12-01 株式会社デンソー Semiconductor dynamic quantity sensor and manufacturing method thereof
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
JP2007210083A (en) * 2006-02-13 2007-08-23 Hitachi Ltd Mems element and its manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6829814B1 (en) * 2002-08-29 2004-12-14 Delphi Technologies, Inc. Process of making an all-silicon microphone
US7134179B2 (en) * 2002-08-29 2006-11-14 Delphi Technologies, Inc. Process of forming a capacitative audio transducer
US7114397B2 (en) * 2004-03-12 2006-10-03 General Electric Company Microelectromechanical system pressure sensor and method for making and using
US7296476B2 (en) * 2004-03-12 2007-11-20 General Electric Company Microelectromechanical system pressure sensor and method for making and using
US7305889B2 (en) * 2004-03-12 2007-12-11 General Electric Company Microelectromechanical system pressure sensor and method for making and using

Also Published As

Publication number Publication date
JP2011514088A (en) 2011-04-28
JP5258908B2 (en) 2013-08-07
WO2009109799A2 (en) 2009-09-11

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