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WO2009038207A1 - Process for producing copper powder and copper powder - Google Patents

Process for producing copper powder and copper powder Download PDF

Info

Publication number
WO2009038207A1
WO2009038207A1 PCT/JP2008/067078 JP2008067078W WO2009038207A1 WO 2009038207 A1 WO2009038207 A1 WO 2009038207A1 JP 2008067078 W JP2008067078 W JP 2008067078W WO 2009038207 A1 WO2009038207 A1 WO 2009038207A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper powder
slurry
oxide
copper
hydrazine
Prior art date
Application number
PCT/JP2008/067078
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Aoki
Yoshinobu Nakamura
Takahiko Sakaue
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to CN2008801074240A priority Critical patent/CN101801568B/en
Priority to KR20107004861A priority patent/KR101510369B1/en
Publication of WO2009038207A1 publication Critical patent/WO2009038207A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A process for producing a copper powder which has a particle size distribution with an extremely narrow width and is reduced in impurity content; and a copper powder which is obtained by the process, has heightened conductivity, is homogeneous, and has high quality. The process for copper powder production comprises: adding a hydrazine-based reducing agent to a copper salt compound slurry obtained by adding an alkali solution to an aqueous copper salt solution to obtain a slurry of cuprous oxide; washing the cuprous-oxide slurry with water and slurrying the oxide again; and adding a hydrazine-based reducing agent again to the resultant slurry of the washed cuprous oxide. In this process, a phosphorus compound is added to the reaction slurry before completion of the final reduction reaction so as to result in a phosphorus/copper molar ratio, P/Cu, in the range of 0.0001-0.003.
PCT/JP2008/067078 2007-09-21 2008-09-22 Process for producing copper powder and copper powder WO2009038207A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801074240A CN101801568B (en) 2007-09-21 2008-09-22 Process for producing copper powder and copper powder
KR20107004861A KR101510369B1 (en) 2007-09-21 2008-09-22 Process for producing copper powder and copper powder

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007246083A JP5392884B2 (en) 2007-09-21 2007-09-21 Method for producing copper powder
JP2007-246083 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038207A1 true WO2009038207A1 (en) 2009-03-26

Family

ID=40468016

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067078 WO2009038207A1 (en) 2007-09-21 2008-09-22 Process for producing copper powder and copper powder

Country Status (5)

Country Link
JP (1) JP5392884B2 (en)
KR (1) KR101510369B1 (en)
CN (1) CN101801568B (en)
TW (1) TWI455777B (en)
WO (1) WO2009038207A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140203222A1 (en) * 2011-05-18 2014-07-24 Toda Kogyo Corporation Copper particles, copper paste, process for producing conductive coating film, and conductive coating film
US20150266090A1 (en) * 2012-11-26 2015-09-24 Mitsui Mining & Smelting Co., Ltd. Copper powder and method for producing same
US9975110B1 (en) 2016-11-23 2018-05-22 Honda Motor Co., Ltd. Method for producing metal catalyst nanoparticles
CN110773177A (en) * 2019-09-10 2020-02-11 安徽德诠新材料科技有限公司 Preparation method of ternary copper catalyst with high specific surface area
CN114786839A (en) * 2019-11-22 2022-07-22 东邦钛株式会社 Copper powder and method for producing same
WO2023047990A1 (en) * 2021-09-27 2023-03-30 宇部マテリアルズ株式会社 Magnesium oxide powder, vulcanizer composition for rubber, rubber composition, method for producing magnesium oxide powder

Families Citing this family (18)

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JP5476631B2 (en) * 2010-03-05 2014-04-23 株式会社村田製作所 Electronic component and manufacturing method thereof
JP5531691B2 (en) * 2010-03-16 2014-06-25 株式会社村田製作所 Conductive paste and method for manufacturing ceramic electronic component
JP5759688B2 (en) * 2010-08-17 2015-08-05 三井金属鉱業株式会社 Flat copper particles
JP5820202B2 (en) * 2010-09-30 2015-11-24 Ｄｏｗａエレクトロニクス株式会社 Copper powder for conductive paste and method for producing the same
TWI487581B (en) * 2010-11-12 2015-06-11 Mitsui Mining & Smelting Co Low carbon copper particles and methods for producing the same
KR101239391B1 (en) * 2011-01-05 2013-03-05 한국지질자원연구원 Method of manufacturing fine cupper powders for electronic materials with easily size control
JP5120477B2 (en) * 2011-04-07 2013-01-16 日立化成工業株式会社 Electrode paste composition and solar cell
JP5785433B2 (en) * 2011-04-28 2015-09-30 三井金属鉱業株式会社 Low carbon copper particles
JP6199430B2 (en) * 2011-09-30 2017-09-20 Ｄｏｗａエレクトロニクス株式会社 Cuprous oxide powder and method for producing the same
JP5700864B2 (en) * 2013-05-15 2015-04-15 石原ケミカル株式会社 Copper fine particle dispersion, conductive film forming method, and circuit board
JP6303022B2 (en) * 2014-10-03 2018-03-28 三井金属鉱業株式会社 Copper powder
JP6698367B2 (en) * 2015-03-31 2020-05-27 山陽特殊製鋼株式会社 Metal powder consisting of spherical particles
WO2016170904A1 (en) * 2015-04-22 2016-10-27 日立金属株式会社 Metal particles, method for manufacturing same, coated metal particles, and metal powder
US10773311B2 (en) 2015-09-03 2020-09-15 Dowa Electronics Materials Co., Ltd. Phosphorus-containing copper powder and method for producing the same
JP2017179428A (en) * 2016-03-29 2017-10-05 Ｄｏｗａエレクトロニクス株式会社 Conductive material, forming method of conducive film, circuit board, semiconductor device, and manufacturing method of semiconductor device
CN108526490B (en) * 2018-05-14 2021-05-25 六盘水中联工贸实业有限公司 Method for producing copper metal powder by using copper chloride or cuprous chloride
CN112296345B (en) * 2019-07-23 2022-02-18 富兰克科技（深圳）股份有限公司 Preparation method of self-dispersible nano-copper with long organic carbon chain, nano-copper preparation and application thereof
JP7000621B1 (en) * 2021-06-17 2022-01-19 古河ケミカルズ株式会社 Method for manufacturing copper fine particles

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299406A (en) * 1985-10-28 1987-05-08 Mitsui Mining & Smelting Co Ltd Production of copper powder
JPH09256007A (en) * 1996-03-22 1997-09-30 Murata Mfg Co Ltd Production of copper powder
JP2007169770A (en) * 2005-12-26 2007-07-05 Mitsui Mining & Smelting Co Ltd Copper powder, copper particle and method for producing the copper particle

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1060108C (en) * 1997-01-21 2001-01-03 北京化工大学 Method for preparing superfine copper powder
JP2911429B2 (en) * 1997-06-04 1999-06-23 三井金属鉱業株式会社 Production method of copper fine powder
JP3635451B2 (en) * 1998-09-11 2005-04-06 株式会社村田製作所 Metal powder, method for producing the same, and conductive paste
KR100743844B1 (en) * 1999-12-01 2007-08-02 도와 마이닝 가부시끼가이샤 Copper powder and process for producing copper powder
JP2002363618A (en) * 2001-06-11 2002-12-18 Sumitomo Electric Ind Ltd Copper ultrafine grain and production method therefor
JP4868716B2 (en) * 2004-04-28 2012-02-01 三井金属鉱業株式会社 Flake copper powder and conductive paste
JP4879473B2 (en) * 2004-10-25 2012-02-22 三井金属鉱業株式会社 Flake copper powder, method for producing flake copper powder, and conductive slurry containing flake copper powder
JP4662760B2 (en) * 2004-12-22 2011-03-30 三井金属鉱業株式会社 Ultrafine copper powder, ultrafine copper powder slurry, and method for producing ultrafine copper powder slurry

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299406A (en) * 1985-10-28 1987-05-08 Mitsui Mining & Smelting Co Ltd Production of copper powder
JPH09256007A (en) * 1996-03-22 1997-09-30 Murata Mfg Co Ltd Production of copper powder
JP2007169770A (en) * 2005-12-26 2007-07-05 Mitsui Mining & Smelting Co Ltd Copper powder, copper particle and method for producing the copper particle

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140203222A1 (en) * 2011-05-18 2014-07-24 Toda Kogyo Corporation Copper particles, copper paste, process for producing conductive coating film, and conductive coating film
US9221979B2 (en) * 2011-05-18 2015-12-29 Toda Kogyo Corporation Copper particles, copper paste, process for producing conductive coating film, and conductive coating film
US20150266090A1 (en) * 2012-11-26 2015-09-24 Mitsui Mining & Smelting Co., Ltd. Copper powder and method for producing same
US10518323B2 (en) * 2012-11-26 2019-12-31 Mitsui Mining & Smelting Co., Ltd. Copper power and method for producing same
US9975110B1 (en) 2016-11-23 2018-05-22 Honda Motor Co., Ltd. Method for producing metal catalyst nanoparticles
CN110773177A (en) * 2019-09-10 2020-02-11 安徽德诠新材料科技有限公司 Preparation method of ternary copper catalyst with high specific surface area
CN110773177B (en) * 2019-09-10 2022-05-20 安徽德诠新材料科技有限公司 Preparation method of ternary copper catalyst with high specific surface area
CN114786839A (en) * 2019-11-22 2022-07-22 东邦钛株式会社 Copper powder and method for producing same
CN114786839B (en) * 2019-11-22 2024-03-26 东邦钛株式会社 Copper powder and method for producing same
WO2023047990A1 (en) * 2021-09-27 2023-03-30 宇部マテリアルズ株式会社 Magnesium oxide powder, vulcanizer composition for rubber, rubber composition, method for producing magnesium oxide powder

Also Published As

Publication number Publication date
TWI455777B (en) 2014-10-11
TW200932405A (en) 2009-08-01
KR101510369B1 (en) 2015-04-06
CN101801568B (en) 2012-10-03
JP2009074152A (en) 2009-04-09
KR20100071970A (en) 2010-06-29
CN101801568A (en) 2010-08-11
JP5392884B2 (en) 2014-01-22

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