[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2009008429A1 - 部品装着機及びその使用方法 - Google Patents

部品装着機及びその使用方法 Download PDF

Info

Publication number
WO2009008429A1
WO2009008429A1 PCT/JP2008/062346 JP2008062346W WO2009008429A1 WO 2009008429 A1 WO2009008429 A1 WO 2009008429A1 JP 2008062346 W JP2008062346 W JP 2008062346W WO 2009008429 A1 WO2009008429 A1 WO 2009008429A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera
mounting head
component
mounting
conveyer
Prior art date
Application number
PCT/JP2008/062346
Other languages
English (en)
French (fr)
Inventor
Shinsuke Suhara
Original Assignee
Fuji Machine Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Mfg. Co., Ltd. filed Critical Fuji Machine Mfg. Co., Ltd.
Priority to CN2008800242624A priority Critical patent/CN101743787B/zh
Publication of WO2009008429A1 publication Critical patent/WO2009008429A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

　第２カメラ３５付きの装着ヘッド３３と、カメラ無しの装着ヘッドとを選択して取付可能にした部品装着機において、第２カメラ３５付きの装着ヘッド３３を取り付けて使用する場合は、部品供給装置２０とコンベア１３との間から第１カメラを取り外して部品供給装置２０をコンベア１３側に移動させて該部品供給装置２０とコンベア１３との間隔を狭めた状態にする。そして、この状態で、フィーダ２３から供給される部品を第２カメラ３５付きの装着ヘッド３３の吸着ノズル３４で吸着して、その吸着部品を第２カメラ３５で撮像して画像処理する。これにより、第２カメラ３５付きの装着ヘッド３３を使用する場合に、吸着ステーションと装着ステーションとの間の装着ヘッド３３の移動距離を短くしてサイクルタイムを短縮する。
PCT/JP2008/062346 2007-07-12 2008-07-08 部品装着機及びその使用方法 WO2009008429A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800242624A CN101743787B (zh) 2007-07-12 2008-07-08 部件安装机及其使用方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007182734A JP4822282B2 (ja) 2007-07-12 2007-07-12 部品装着機及びその使用方法
JP2007-182734 2007-07-12

Publications (1)

Publication Number Publication Date
WO2009008429A1 true WO2009008429A1 (ja) 2009-01-15

Family

ID=40228600

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062346 WO2009008429A1 (ja) 2007-07-12 2008-07-08 部品装着機及びその使用方法

Country Status (3)

Country Link
JP (1) JP4822282B2 (ja)
CN (2) CN102665383B (ja)
WO (1) WO2009008429A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101519942B1 (ko) 2010-10-05 2015-05-14 에이치티씨 코퍼레이션 Ａｐｎ 기반의 혼잡 제어의 처리 방법 및 관련 통신 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5765772B2 (ja) * 2011-05-17 2015-08-19 富士機械製造株式会社 部品実装機
US10015919B2 (en) * 2016-02-26 2018-07-03 Panasonic Intellectual Property Management Co., Ltd. Component supply device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07265771A (ja) * 1994-03-28 1995-10-17 Sanyo Electric Co Ltd 流体供給装置及びそれを使用した粘性流体塗布方法、並びにそれらを使用した部品装着装置
JP2000036688A (ja) * 1999-07-16 2000-02-02 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2004006510A (ja) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd 部品実装基板生産装置及び方法
JP2004031613A (ja) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd 電子部品実装装置における基板搬送装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326438C (zh) * 2002-03-25 2007-07-11 雅马哈发动机株式会社 安装机及安装方法
CN100508721C (zh) * 2002-06-25 2009-07-01 富士机械制造株式会社 对基板作业系统
CN101267728B (zh) * 2002-11-21 2011-09-21 富士机械制造株式会社 元件安装设备
JP4243137B2 (ja) * 2003-05-23 2009-03-25 株式会社日立ハイテクインスツルメンツ 電子部品装着方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07265771A (ja) * 1994-03-28 1995-10-17 Sanyo Electric Co Ltd 流体供給装置及びそれを使用した粘性流体塗布方法、並びにそれらを使用した部品装着装置
JP2000036688A (ja) * 1999-07-16 2000-02-02 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2004006510A (ja) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd 部品実装基板生産装置及び方法
JP2004031613A (ja) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd 電子部品実装装置における基板搬送装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101519942B1 (ko) 2010-10-05 2015-05-14 에이치티씨 코퍼레이션 Ａｐｎ 기반의 혼잡 제어의 처리 방법 및 관련 통신 장치

Also Published As

Publication number Publication date
CN102665383A (zh) 2012-09-12
JP2009021386A (ja) 2009-01-29
CN102665383B (zh) 2015-09-09
JP4822282B2 (ja) 2011-11-24
CN101743787B (zh) 2012-04-25
CN101743787A (zh) 2010-06-16

Similar Documents

Publication Publication Date Title
WO2009065831A3 (de) Roboter, medizinischer arbeitsplatz und verfahren zum projizieren eines bildes auf die oberfläche eines objekts
WO2012142593A3 (en) Vacuum mount system for portable electronic device
GB2458428A (en) Single and multi-spectral illumination system and method
WO2005120043A3 (en) Portable electronic device with adjustable image capture orientation and method therefore
EP2528425A3 (en) Electronic component mounting apparatus
TW200512856A (en) Component mounting apparatus and component mounting method
EP2706789A3 (en) Communication apparatus, method for controlling communication apparatus, and program
MX357753B (es) Método para producción de filtro de panal.
WO2009102513A3 (en) Method and apparatus for placing substrate support components
EP1553815A3 (en) Apparatus and method for mounting component
EP1965627A3 (en) Apparatus and method for mounting electronic component
HK1144235A1 (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
PT2188199E (pt) Processo e instalação para o alinhamento de produtos transportados sobre uma mesa
EP3093147A3 (en) Digital printing
EP1821335A3 (en) Wafer processing apparatus
JP2007150136A5 (ja)
TW200710383A (en) Apparatus for inspecting outside appearances
EP1986484A3 (en) Electronic component mounting apparatus
WO2009008429A1 (ja) 部品装着機及びその使用方法
EP2541595A3 (en) Decoupling capacitor circuitry and method of forming the same
GB0620228D0 (en) An apparatus for electromagnetically forming a workpiece
GB2486074A (en) Box canvas apparatus and method
PH12015500783A1 (en) Automatic multiple head cleaner for a dispensing system and related method
WO2009004868A1 (ja) 部品吸着方法および表面実装機
WO2006047141A3 (en) Vacuum gripper for handling small components

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880024262.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08790983

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08790983

Country of ref document: EP

Kind code of ref document: A1