[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2009008455A1 - Glass-integrated resin molding and method of molding therefor - Google Patents

Glass-integrated resin molding and method of molding therefor Download PDF

Info

Publication number
WO2009008455A1
WO2009008455A1 PCT/JP2008/062420 JP2008062420W WO2009008455A1 WO 2009008455 A1 WO2009008455 A1 WO 2009008455A1 JP 2008062420 W JP2008062420 W JP 2008062420W WO 2009008455 A1 WO2009008455 A1 WO 2009008455A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
glass
molding
resin molding
glass member
Prior art date
Application number
PCT/JP2008/062420
Other languages
French (fr)
Japanese (ja)
Inventor
Fukuo Kanno
Takao Motojima
Yuji Sasaki
Original Assignee
Agc Matex Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Matex Co., Ltd. filed Critical Agc Matex Co., Ltd.
Publication of WO2009008455A1 publication Critical patent/WO2009008455A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14434—Coating brittle material, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

A glass-integrated resin molding composed of a glass member and a resin molding in which, in place of customary thermosetting resins, use is made of a thermoplastic resin moldable through a simpler process and in which the bonding strength therebetween is satisfactory. There is disclosed a glass integrating resin molding method, including injecting a resin in a metal mold having a glass member disposed therein and forming a resin molding around the glass member so as to attain integration with the glass member, thereby obtaining a glass-integrated resin molding. As this resin, use is made of a resin composition obtained by blending a compound having hydroxyl and/or epoxy in its molecule with a thermoplastic resin as a base resin. Preferably, the thermoplastic resin is a liquid crystal polymer or crystalline resin (exclusive of the liquid crystal polymer). Also preferably, the compound with hydroxyl is a phenoxy resin, and the compound with epoxy is an epoxy resin.
PCT/JP2008/062420 2007-07-12 2008-07-09 Glass-integrated resin molding and method of molding therefor WO2009008455A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-183141 2007-07-12
JP2007183141A JP2010214589A (en) 2007-07-12 2007-07-12 Glass-integrated resin molding, and molding method therefor

Publications (1)

Publication Number Publication Date
WO2009008455A1 true WO2009008455A1 (en) 2009-01-15

Family

ID=40228626

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062420 WO2009008455A1 (en) 2007-07-12 2008-07-09 Glass-integrated resin molding and method of molding therefor

Country Status (2)

Country Link
JP (1) JP2010214589A (en)
WO (1) WO2009008455A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112662131A (en) * 2020-12-22 2021-04-16 广东盈骅新材料科技有限公司 Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101408647B1 (en) * 2012-02-29 2014-06-17 주식회사 프레코 Crime prevention glass manufacturing method and the apparatus
JP6251485B2 (en) * 2012-03-01 2017-12-20 東洋樹脂株式会社 Optical inspection base with optical inspection window
JP6079534B2 (en) * 2013-09-30 2017-02-15 沖電気工業株式会社 Bill discrimination device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01310924A (en) * 1988-06-10 1989-12-15 Nippon Petrochem Co Ltd Insert molding method for thermotropic liquid crystal polymer
JPH0446961A (en) * 1990-06-15 1992-02-17 Dainippon Ink & Chem Inc Resin composition
JPH0450258A (en) * 1990-06-19 1992-02-19 Mitsubishi Kasei Corp Liquid crystal polyester resin composition
JPH08113719A (en) * 1994-10-14 1996-05-07 Nippon Petrochem Co Ltd Encapsulation material for electrical and electronic parts
JPH09262864A (en) * 1996-03-28 1997-10-07 Polyplastics Co Insert molded products
JP2002096634A (en) * 2000-09-25 2002-04-02 Asahi Glass Co Ltd Method of manufacturing window plate with mounting member
JP2005240003A (en) * 2004-01-27 2005-09-08 Mitsubishi Engineering Plastics Corp Thermoplastic polyester resin composition and insert molded product

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01310924A (en) * 1988-06-10 1989-12-15 Nippon Petrochem Co Ltd Insert molding method for thermotropic liquid crystal polymer
JPH0446961A (en) * 1990-06-15 1992-02-17 Dainippon Ink & Chem Inc Resin composition
JPH0450258A (en) * 1990-06-19 1992-02-19 Mitsubishi Kasei Corp Liquid crystal polyester resin composition
JPH08113719A (en) * 1994-10-14 1996-05-07 Nippon Petrochem Co Ltd Encapsulation material for electrical and electronic parts
JPH09262864A (en) * 1996-03-28 1997-10-07 Polyplastics Co Insert molded products
JP2002096634A (en) * 2000-09-25 2002-04-02 Asahi Glass Co Ltd Method of manufacturing window plate with mounting member
JP2005240003A (en) * 2004-01-27 2005-09-08 Mitsubishi Engineering Plastics Corp Thermoplastic polyester resin composition and insert molded product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112662131A (en) * 2020-12-22 2021-04-16 广东盈骅新材料科技有限公司 Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board
CN112662131B (en) * 2020-12-22 2023-10-20 广东盈骅新材料科技有限公司 Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board

Also Published As

Publication number Publication date
JP2010214589A (en) 2010-09-30

Similar Documents

Publication Publication Date Title
WO2008126812A1 (en) Copper alloy composite and process for producing the same
TWI366575B (en) Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
CN102938986B (en) Casing and manufacturing method thereof
EP2442178A3 (en) Image display device and production method thereof
WO2009075252A1 (en) Epoxy resin curing agent, method for producing the same, and epoxy resin composition
WO2014020072A3 (en) Liquid hardeners for hardening epoxide resins (ii)
WO2008010823A3 (en) Thermoplastic based composites
EP2194093B8 (en) Resin composition, molding resin composition prepared by using the same, laminates, and process for the production of laminates
WO2008157571A3 (en) Crash durable epoxy adhesives with very low sensitivity to temperature variations
WO2009098280A3 (en) System comprising at least one extruded or injection moulded part, method for the production thereof and use of the same
WO2013095908A3 (en) Process for preparing cured epoxy composites
TW200745589A (en) Optical film and manufacturing method for the same
WO2010024642A3 (en) Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition
MY163198A (en) Thermosetting epoxy resin composition and uses thereof
WO2009008455A1 (en) Glass-integrated resin molding and method of molding therefor
IN2014DN07718A (en)
MY156659A (en) Resin composition for encapsulating semiconductor and semiconductor device
ATE409712T1 (en) EPOXY RESIN COMPOSITION
WO2009008209A1 (en) Resin composition and process for producing molded object from the resin composition
TW200643096A (en) Resin composition and optical components
EP1923415A4 (en) Polyurethane/thiourethane-based optical resin and process for producing the same
EP2842445A3 (en) Method of manufacturing shoe insoles and shoe insole
TW201129666A (en) Adhesive composition for semiconductor device and die attach film
WO2009036018A3 (en) Blow moldable polyimide/polyamide composition, process for blow molding and articles made thereby
WO2006096694A3 (en) Long fiber-reinforced thermoplastic compositions, articles made therefrom and methods of making the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08791007

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08791007

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP