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WO2008111598A1 - Curable composition - Google Patents

Curable composition Download PDF

Info

Publication number
WO2008111598A1
WO2008111598A1 PCT/JP2008/054445 JP2008054445W WO2008111598A1 WO 2008111598 A1 WO2008111598 A1 WO 2008111598A1 JP 2008054445 W JP2008054445 W JP 2008054445W WO 2008111598 A1 WO2008111598 A1 WO 2008111598A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
lewis acid
disclosed
suppressed
complex
Prior art date
Application number
PCT/JP2008/054445
Other languages
French (fr)
Japanese (ja)
Inventor
Noriko Noro
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2009504062A priority Critical patent/JP5476119B2/en
Publication of WO2008111598A1 publication Critical patent/WO2008111598A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
    • C09J143/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C08K5/31—Guanidine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)

Abstract

Disclosed is a curable composition having excellent curability without containing a toxic organotin curing catalyst. This curable composition enables to obtain a cured product having excellent mechanical strength and suppressed in surface tackiness. Specifically disclosed is a curable composition characterized by containing (A) an organic polymer having a reactive silicon group, (B) a guanidine compound having a specific structure and (C) a Lewis acid and/or a complex of a Lewis acid.
PCT/JP2008/054445 2007-03-12 2008-03-12 Curable composition WO2008111598A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009504062A JP5476119B2 (en) 2007-03-12 2008-03-12 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-062217 2007-03-12
JP2007062217 2007-03-12

Publications (1)

Publication Number Publication Date
WO2008111598A1 true WO2008111598A1 (en) 2008-09-18

Family

ID=39759532

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054445 WO2008111598A1 (en) 2007-03-12 2008-03-12 Curable composition

Country Status (2)

Country Link
JP (1) JP5476119B2 (en)
WO (1) WO2008111598A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010035820A1 (en) * 2008-09-29 2010-04-01 株式会社カネカ Curable composition and cured product thereof
JP2010260909A (en) * 2009-04-30 2010-11-18 Konishi Co Ltd Curable silicone-based resin composition
JP2010260910A (en) * 2009-04-30 2010-11-18 Konishi Co Ltd Curable silicone-based resin composition
JP4672809B1 (en) * 2010-09-07 2011-04-20 コニシ株式会社 Sealant composition
JP2016175965A (en) * 2015-03-18 2016-10-06 シャープ化学工業株式会社 Nonadhesive moisture-curable resin composition
US11028230B1 (en) 2018-08-24 2021-06-08 Dow Silicones Corporation Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes
US11136436B2 (en) 2018-08-24 2021-10-05 Dow Silicones Corporation Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes
US11666888B2 (en) 2018-02-05 2023-06-06 Bio-Rad Laboratories, Inc. Chromatography resin having an anionic exchange-hydrophobic mixed mode ligand

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05255584A (en) * 1992-03-10 1993-10-05 Shin Etsu Chem Co Ltd Room-temperature-curable composition
JP2005248175A (en) * 2004-02-05 2005-09-15 Yokohama Rubber Co Ltd:The Curable composition
JP2006199721A (en) * 2005-01-18 2006-08-03 Konishi Co Ltd Curing catalyst for curable silicone-based resin and curable silicone-based resin composition
JP2006199730A (en) * 2005-01-18 2006-08-03 Konishi Co Ltd Curable resin composition and moisture-curable adhesive
JP2007039568A (en) * 2005-08-03 2007-02-15 Yokohama Rubber Co Ltd:The Curable composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05255584A (en) * 1992-03-10 1993-10-05 Shin Etsu Chem Co Ltd Room-temperature-curable composition
JP2005248175A (en) * 2004-02-05 2005-09-15 Yokohama Rubber Co Ltd:The Curable composition
JP2006199721A (en) * 2005-01-18 2006-08-03 Konishi Co Ltd Curing catalyst for curable silicone-based resin and curable silicone-based resin composition
JP2006199730A (en) * 2005-01-18 2006-08-03 Konishi Co Ltd Curable resin composition and moisture-curable adhesive
JP2007039568A (en) * 2005-08-03 2007-02-15 Yokohama Rubber Co Ltd:The Curable composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010035820A1 (en) * 2008-09-29 2010-04-01 株式会社カネカ Curable composition and cured product thereof
CN102165016B (en) * 2008-09-29 2014-03-12 株式会社钟化 Curable composition and cured product thereof
US8853309B2 (en) 2008-09-29 2014-10-07 Kaneka Corporation Curable composition and cured product thereof
JP2010260909A (en) * 2009-04-30 2010-11-18 Konishi Co Ltd Curable silicone-based resin composition
JP2010260910A (en) * 2009-04-30 2010-11-18 Konishi Co Ltd Curable silicone-based resin composition
JP4672809B1 (en) * 2010-09-07 2011-04-20 コニシ株式会社 Sealant composition
JP2012057002A (en) * 2010-09-07 2012-03-22 Konishi Co Ltd Sealing material composition
JP2016175965A (en) * 2015-03-18 2016-10-06 シャープ化学工業株式会社 Nonadhesive moisture-curable resin composition
US11666888B2 (en) 2018-02-05 2023-06-06 Bio-Rad Laboratories, Inc. Chromatography resin having an anionic exchange-hydrophobic mixed mode ligand
US11028230B1 (en) 2018-08-24 2021-06-08 Dow Silicones Corporation Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes
US11136436B2 (en) 2018-08-24 2021-10-05 Dow Silicones Corporation Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes

Also Published As

Publication number Publication date
JPWO2008111598A1 (en) 2010-06-24
JP5476119B2 (en) 2014-04-23

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