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WO2008102621A1 - Pressure sensitive adhesive member having crest-shaped microstructure - Google Patents

Pressure sensitive adhesive member having crest-shaped microstructure Download PDF

Info

Publication number
WO2008102621A1
WO2008102621A1 PCT/JP2008/051430 JP2008051430W WO2008102621A1 WO 2008102621 A1 WO2008102621 A1 WO 2008102621A1 JP 2008051430 W JP2008051430 W JP 2008051430W WO 2008102621 A1 WO2008102621 A1 WO 2008102621A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
pressure sensitive
adhesive member
base material
crest
Prior art date
Application number
PCT/JP2008/051430
Other languages
French (fr)
Japanese (ja)
Inventor
Youhei Maeno
Yoshinori Yoshida
Yuki Sugo
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2008102621A1 publication Critical patent/WO2008102621A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

This invention provides a pressure sensitive adhesive member having excellent pressure sensitive adhesive properties and a process for producing the pressure sensitive adhesive member. The pressure sensitive adhesive member comprises a base material and a columnar convex part provided on the surface of the base material. The columnar convex part has on its side face a crest-shaped microstructure. The production process of a pressure sensitive adhesive member comprises step (1) of filling a resin into pores in a porous film on a base material, step (2) of curing the resin to form a columnar convex part on the base material, step (3) of removing the porous film from the base material, and step (4) of plasma etching the columnar convex part.
PCT/JP2008/051430 2007-02-20 2008-01-30 Pressure sensitive adhesive member having crest-shaped microstructure WO2008102621A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007039107A JP2008201883A (en) 2007-02-20 2007-02-20 Adhesive member having ridge-like fine structure
JP2007-039107 2007-02-20

Publications (1)

Publication Number Publication Date
WO2008102621A1 true WO2008102621A1 (en) 2008-08-28

Family

ID=39709900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051430 WO2008102621A1 (en) 2007-02-20 2008-01-30 Pressure sensitive adhesive member having crest-shaped microstructure

Country Status (3)

Country Link
JP (1) JP2008201883A (en)
TW (1) TW200914570A (en)
WO (1) WO2008102621A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128343A1 (en) * 2008-04-16 2009-10-22 日東電工株式会社 Fibrous rod-like structure aggregates and adhesive members wherein same are used
WO2010096023A1 (en) * 2009-02-17 2010-08-26 Agency For Science, Technology And Research A high aspect ratio adhesive structure and a method of forming the same
WO2012013290A1 (en) * 2010-07-30 2012-02-02 Gottlieb Binder Gmbh & Co. Kg Contact closure component
WO2020028230A3 (en) * 2018-07-29 2020-03-12 Bvw Holding Ag Patterned surfaces with suction

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201912441TA (en) 2017-07-20 2020-01-30 Mitsui Chemicals Inc Adhesive member and production method for adhesive member
DE102017131344A1 (en) 2017-12-27 2019-06-27 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Shaped body with structured surface for reversible adhesion
DE102017131347A1 (en) 2017-12-27 2019-06-27 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Structure with improved adhesion
DE102017131345A1 (en) 2017-12-27 2019-06-27 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Double-sided reversible adhesive structure
JP6752250B2 (en) 2018-03-28 2020-09-09 東レエンジニアリング株式会社 Tool height adjustment device and chip component transfer device equipped with this
CN113164655A (en) * 2018-11-21 2021-07-23 Bvw控股公司 Microstructured surface
DE102020109939A1 (en) * 2020-04-09 2021-10-14 Leibniz-Institut Für Neue Materialien Gemeinnützige Gesellschaft Mit Beschränkter Haftung Molded body with structured surface for controlled adhesion

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003519267A (en) * 1999-12-20 2003-06-17 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Adhesive microstructure and method for forming the same
JP2006505414A (en) * 2002-05-13 2006-02-16 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Improved adhesive microstructure and method for forming the same
WO2007032164A1 (en) * 2005-09-12 2007-03-22 Nissan Motor Co., Ltd. Joinable structure and process for producing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003519267A (en) * 1999-12-20 2003-06-17 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Adhesive microstructure and method for forming the same
JP2006505414A (en) * 2002-05-13 2006-02-16 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Improved adhesive microstructure and method for forming the same
WO2007032164A1 (en) * 2005-09-12 2007-03-22 Nissan Motor Co., Ltd. Joinable structure and process for producing the same

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128343A1 (en) * 2008-04-16 2009-10-22 日東電工株式会社 Fibrous rod-like structure aggregates and adhesive members wherein same are used
JPWO2009128343A1 (en) * 2008-04-16 2011-08-04 日東電工株式会社 Fibrous columnar structure aggregate and adhesive member using the same
US8025971B2 (en) 2008-04-16 2011-09-27 Nitto Denko Corporation Fibrous columnar structure aggregate and pressure-sensitive adhesive member using the aggregate
WO2010096023A1 (en) * 2009-02-17 2010-08-26 Agency For Science, Technology And Research A high aspect ratio adhesive structure and a method of forming the same
US8961855B2 (en) 2009-02-17 2015-02-24 Agency For Science, Technology And Research High aspect ratio adhesive structure and a method of forming the same
TWI495704B (en) * 2009-02-17 2015-08-11 Agency Science Tech & Res A high aspect ratio adhesive structure and a method of forming the same
WO2012013290A1 (en) * 2010-07-30 2012-02-02 Gottlieb Binder Gmbh & Co. Kg Contact closure component
CN103119111A (en) * 2010-07-30 2013-05-22 戈特利布捆扎机械有限及两合公司 Contact closure component
US9072345B2 (en) 2010-07-30 2015-07-07 Gottlieb Binder Gmbh & Co. Kg Contact closure component
CN103119111B (en) * 2010-07-30 2018-10-16 戈特利布捆扎机械有限及两合公司 Touch fastener
WO2020028230A3 (en) * 2018-07-29 2020-03-12 Bvw Holding Ag Patterned surfaces with suction
US11390778B2 (en) 2018-07-29 2022-07-19 Bvw Holding Ag Patterned surfaces with suction

Also Published As

Publication number Publication date
JP2008201883A (en) 2008-09-04
TW200914570A (en) 2009-04-01

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