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WO2008146828A1 - メタル版の洗浄方法及び洗浄装置並びにメタル版洗浄用の噴射ノズル - Google Patents

メタル版の洗浄方法及び洗浄装置並びにメタル版洗浄用の噴射ノズル Download PDF

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Publication number
WO2008146828A1
WO2008146828A1 PCT/JP2008/059768 JP2008059768W WO2008146828A1 WO 2008146828 A1 WO2008146828 A1 WO 2008146828A1 JP 2008059768 W JP2008059768 W JP 2008059768W WO 2008146828 A1 WO2008146828 A1 WO 2008146828A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal plate
cleaning
spray nozzle
alkali water
cleaning metal
Prior art date
Application number
PCT/JP2008/059768
Other languages
English (en)
French (fr)
Inventor
Junji Fukagawa
Masahiko Iwakura
Yoshihiro Hagihara
Toshihide Takagi
Original Assignee
Nakamura Choko Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007141400A external-priority patent/JP5115030B2/ja
Priority claimed from JP2008136716A external-priority patent/JP5120064B2/ja
Priority claimed from JP2008136726A external-priority patent/JP2009279897A/ja
Application filed by Nakamura Choko Co., Ltd. filed Critical Nakamura Choko Co., Ltd.
Priority to CN2008800179300A priority Critical patent/CN101680098B/zh
Publication of WO2008146828A1 publication Critical patent/WO2008146828A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B05B7/045—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber the gas and liquid flows being parallel just upstream the mixing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B05B7/0475—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber with means for deflecting the peripheral gas flow towards the central liquid flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)

Abstract

　【課題】グリコール系やアルコール系の有機溶剤を使用せず、環境負荷の少ない安価な洗浄方法であり、かつ０．２２ｍｍ幅や０．１４ｍｍ幅といった非常に狭い幅の印刷パターンの穴をも綺麗に洗浄可能なメタル版の洗浄方法及び洗浄装置並びメタル版洗浄用の気液噴射ノズルを提供する。 　【解決手段】印刷配線基板に対してクリーム半田を印刷するために用いたメタル版１の洗浄方法であって、アルカリ性水と圧縮空気とをアルカリ性水噴射ノズル１４内において混合して、アルカリ性水を微細粒化しながら、この微細粒化したアルカリ性水をアルカリ性水噴射ノズル１４からメタル版１に向けて高速で噴き付けてメタル版１を洗浄する。
PCT/JP2008/059768 2007-05-29 2008-05-28 メタル版の洗浄方法及び洗浄装置並びにメタル版洗浄用の噴射ノズル WO2008146828A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800179300A CN101680098B (zh) 2007-05-29 2008-05-28 金属版的清洗方法、清洗装置和金属版清洗用喷射喷嘴

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007141400A JP5115030B2 (ja) 2007-05-29 2007-05-29 メタル版の洗浄方法及び洗浄装置並びにメタル版洗浄用の噴射ノズル
JP2007-141400 2007-05-29
JP2008136716A JP5120064B2 (ja) 2008-05-26 2008-05-26 メタル版の洗浄方法
JP2008-136716 2008-05-26
JP2008-136726 2008-05-26
JP2008136726A JP2009279897A (ja) 2008-05-26 2008-05-26 洗浄装置

Publications (1)

Publication Number Publication Date
WO2008146828A1 true WO2008146828A1 (ja) 2008-12-04

Family

ID=40075066

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059768 WO2008146828A1 (ja) 2007-05-29 2008-05-28 メタル版の洗浄方法及び洗浄装置並びにメタル版洗浄用の噴射ノズル

Country Status (3)

Country Link
KR (1) KR20100033485A (ja)
CN (1) CN101680098B (ja)
WO (1) WO2008146828A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010244627A (ja) * 2009-04-07 2010-10-28 Alphana Technology Co Ltd ディスク駆動装置の生産方法及びディスク駆動装置
CN111744855A (zh) * 2020-06-30 2020-10-09 中国航发动力股份有限公司 一种零件表面残留阻流剂清理方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102672297B (zh) * 2011-03-11 2015-03-04 华晴国际有限公司 应用于表面粘着锡膏印刷装置的水基溶液自动清洗方法
US20130019904A1 (en) * 2011-07-20 2013-01-24 Illinois Tool Works Inc. Batch cleaning apparatus and method for batch cleaning printed circuit boards
CN105196699A (zh) * 2015-11-05 2015-12-30 东莞市科隆威自动化设备有限公司 全自动视觉印刷机的酒精均匀喷洒装置及喷洒方法
CN105483727B (zh) * 2015-12-09 2018-06-22 清华大学 一种脱除废电路板中绿油膜的方法
CN107159620A (zh) * 2017-06-28 2017-09-15 苏州艾酷玛赫设备制造有限公司 一种模具的清洗方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08253883A (ja) * 1995-03-14 1996-10-01 Nippon Steel Corp 金属帯の洗浄方法
JPH10156298A (ja) * 1996-11-27 1998-06-16 Sawaa Corp:Kk 超音波洗浄乾燥装置およびその方法
JP2000107711A (ja) * 1998-09-30 2000-04-18 Sawaa Corporation:Kk 超音波洗浄装置
JP2000164121A (ja) * 1998-11-30 2000-06-16 Fujifilm Olin Co Ltd プラズマディスプレーパネル用の隔壁形成用ペースト及び隔壁形成方法
JP2005232547A (ja) * 2004-02-20 2005-09-02 Canon Chemicals Inc 金属部材の洗浄方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2955990B2 (ja) * 1996-06-28 1999-10-04 株式会社沖電気コミュニケーションシステムズ スクリーン版洗浄装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08253883A (ja) * 1995-03-14 1996-10-01 Nippon Steel Corp 金属帯の洗浄方法
JPH10156298A (ja) * 1996-11-27 1998-06-16 Sawaa Corp:Kk 超音波洗浄乾燥装置およびその方法
JP2000107711A (ja) * 1998-09-30 2000-04-18 Sawaa Corporation:Kk 超音波洗浄装置
JP2000164121A (ja) * 1998-11-30 2000-06-16 Fujifilm Olin Co Ltd プラズマディスプレーパネル用の隔壁形成用ペースト及び隔壁形成方法
JP2005232547A (ja) * 2004-02-20 2005-09-02 Canon Chemicals Inc 金属部材の洗浄方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010244627A (ja) * 2009-04-07 2010-10-28 Alphana Technology Co Ltd ディスク駆動装置の生産方法及びディスク駆動装置
CN111744855A (zh) * 2020-06-30 2020-10-09 中国航发动力股份有限公司 一种零件表面残留阻流剂清理方法

Also Published As

Publication number Publication date
CN101680098B (zh) 2011-07-20
KR20100033485A (ko) 2010-03-30
CN101680098A (zh) 2010-03-24

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