WO2008146705A1 - プローブカードの固定装置 - Google Patents
プローブカードの固定装置 Download PDFInfo
- Publication number
- WO2008146705A1 WO2008146705A1 PCT/JP2008/059457 JP2008059457W WO2008146705A1 WO 2008146705 A1 WO2008146705 A1 WO 2008146705A1 JP 2008059457 W JP2008059457 W JP 2008059457W WO 2008146705 A1 WO2008146705 A1 WO 2008146705A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe card
- holder
- fixing device
- fluctuation
- contraction
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009516278A JP5306192B2 (ja) | 2007-05-31 | 2008-05-22 | プローブカードの固定装置 |
CN200880015743A CN101681861A (zh) | 2007-05-31 | 2008-05-22 | 探针卡的固定装置 |
US12/598,216 US8212579B2 (en) | 2007-05-31 | 2008-05-22 | Fixing apparatus for a probe card |
KR1020097026136A KR101142760B1 (ko) | 2007-05-31 | 2008-05-22 | 프로브 카드의 고정장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-145410 | 2007-05-31 | ||
JP2007145410 | 2007-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008146705A1 true WO2008146705A1 (ja) | 2008-12-04 |
Family
ID=40074958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059457 WO2008146705A1 (ja) | 2007-05-31 | 2008-05-22 | プローブカードの固定装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8212579B2 (ja) |
JP (1) | JP5306192B2 (ja) |
KR (1) | KR101142760B1 (ja) |
CN (1) | CN101681861A (ja) |
TW (1) | TW200903705A (ja) |
WO (1) | WO2008146705A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102094188A (zh) * | 2009-12-10 | 2011-06-15 | 奥博泰克Lt太阳能公司 | 用于真空处理设备的喷头组件 |
JP2011141227A (ja) * | 2010-01-08 | 2011-07-21 | Yokogawa Electric Corp | 半導体試験装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101688049B1 (ko) * | 2010-12-03 | 2016-12-20 | 삼성전자 주식회사 | 테스터 및 그 테스터를 포함한 테스트 장치 |
US8736294B2 (en) * | 2010-12-14 | 2014-05-27 | Formfactor, Inc. | Probe card stiffener with decoupling |
US9134357B1 (en) | 2011-03-25 | 2015-09-15 | Maxim Integrated, Inc. | Universal direct docking at probe test |
US9182935B2 (en) | 2011-09-27 | 2015-11-10 | Z124 | Secondary single screen mode activation through menu option |
ITVI20110343A1 (it) * | 2011-12-30 | 2013-07-01 | St Microelectronics Srl | Sistema e adattatore per testare chips con circuiti integrati in un package |
JP6054150B2 (ja) * | 2012-11-22 | 2016-12-27 | 日本電子材料株式会社 | プローブカードケース及びプローブカードの搬送方法 |
CN103018496A (zh) * | 2012-12-14 | 2013-04-03 | 深圳市天微电子有限公司 | 晶圆测试装置 |
TWI565951B (zh) * | 2015-08-24 | 2017-01-11 | 旺矽科技股份有限公司 | 探針頭 |
TWI604198B (zh) * | 2016-06-22 | 2017-11-01 | 思達科技股份有限公司 | 測試裝置、夾持組件及探針卡載具 |
CN108490925A (zh) * | 2018-05-30 | 2018-09-04 | 苏州智华汽车电子有限公司 | 车载摄像头控制器功能检测治具 |
JP7129261B2 (ja) * | 2018-07-27 | 2022-09-01 | キオクシア株式会社 | 試験装置 |
KR102228162B1 (ko) * | 2020-06-24 | 2021-03-15 | 오창준 | 프로브 홀더 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005328053A (ja) * | 2004-05-14 | 2005-11-24 | Feinmetall Gmbh | 電気検査装置 |
JP2007057438A (ja) * | 2005-08-25 | 2007-03-08 | Tokyo Electron Ltd | プローブカード |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6972578B2 (en) * | 2001-11-02 | 2005-12-06 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
JP3621938B2 (ja) | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | プローブカード |
US7221430B2 (en) | 2004-05-11 | 2007-05-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4589710B2 (ja) * | 2004-12-13 | 2010-12-01 | 株式会社日本マイクロニクス | プローバ |
JP4486880B2 (ja) * | 2004-12-27 | 2010-06-23 | 日本電子材料株式会社 | コンタクトプローブ |
-
2008
- 2008-05-22 WO PCT/JP2008/059457 patent/WO2008146705A1/ja active Application Filing
- 2008-05-22 US US12/598,216 patent/US8212579B2/en not_active Expired - Fee Related
- 2008-05-22 KR KR1020097026136A patent/KR101142760B1/ko active IP Right Grant
- 2008-05-22 CN CN200880015743A patent/CN101681861A/zh active Pending
- 2008-05-22 JP JP2009516278A patent/JP5306192B2/ja not_active Expired - Fee Related
- 2008-05-27 TW TW097119481A patent/TW200903705A/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005328053A (ja) * | 2004-05-14 | 2005-11-24 | Feinmetall Gmbh | 電気検査装置 |
JP2007057438A (ja) * | 2005-08-25 | 2007-03-08 | Tokyo Electron Ltd | プローブカード |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102094188A (zh) * | 2009-12-10 | 2011-06-15 | 奥博泰克Lt太阳能公司 | 用于真空处理设备的喷头组件 |
US20110139372A1 (en) * | 2009-12-10 | 2011-06-16 | Wendell Thomas Blonigan | Showerhead assembly for vacuum processing apparatus |
CN102094188B (zh) * | 2009-12-10 | 2015-02-18 | 奥博泰克Lt太阳能公司 | 用于真空处理设备的喷头组件 |
JP2011141227A (ja) * | 2010-01-08 | 2011-07-21 | Yokogawa Electric Corp | 半導体試験装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5306192B2 (ja) | 2013-10-02 |
TWI373093B (ja) | 2012-09-21 |
CN101681861A (zh) | 2010-03-24 |
US20100127726A1 (en) | 2010-05-27 |
JPWO2008146705A1 (ja) | 2010-08-19 |
TW200903705A (en) | 2009-01-16 |
US8212579B2 (en) | 2012-07-03 |
KR20100017810A (ko) | 2010-02-16 |
KR101142760B1 (ko) | 2012-05-08 |
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