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WO2008082565A1 - Microelectronic devices and methods of manufacturing such devices - Google Patents

Microelectronic devices and methods of manufacturing such devices Download PDF

Info

Publication number
WO2008082565A1
WO2008082565A1 PCT/US2007/026048 US2007026048W WO2008082565A1 WO 2008082565 A1 WO2008082565 A1 WO 2008082565A1 US 2007026048 W US2007026048 W US 2007026048W WO 2008082565 A1 WO2008082565 A1 WO 2008082565A1
Authority
WO
WIPO (PCT)
Prior art keywords
lid
package
substantially impermeable
active region
microelectronic assembly
Prior art date
Application number
PCT/US2007/026048
Other languages
French (fr)
Inventor
Victor Liew
Michael J. Nystrom
Michael R. Feldman
James Morris
Belgacem Haba
Original Assignee
Tessera, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera, Inc. filed Critical Tessera, Inc.
Publication of WO2008082565A1 publication Critical patent/WO2008082565A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L31/0203—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • This application relates to microelectronic devices and methods of manufacturing microelectronic devices .
  • microelectronic devices have active regions with optical sensors. Each active region typically is located inside a chamber and surrounded by a molded package. A transparent lid is provided above the active region and enables the passage of optical data to the optical sensors. [0004] The rapid evolution of microelectronic elements has created continued demand to improve the performance of such microelectronic devices and to improve the methods of manufacturing such microelectronic devices.
  • a method of forming a microelectronic assembly includes providing a device having an active region.
  • a support structure is applied adjacent to the active region but not extending onto the active region.
  • a lid is positioned in contact with the support structure and extending over the active region. The lid is pressed against a mold surface that is contoured to complement the lid and, while pressing the lid against the mold surface, a package is molded contiguous with the lid.
  • the support structure is an adhesive material.
  • the device, the support structure and the lid define a substantially empty- cavity around the active region. During molding, the device, the support structure and the lid substantially prevent mold compound from migrating into the cavity.
  • pressing the lid against the mold surface includes pressing a surface of the lid facing away from the device against the mold surface. Pressing the lid against the mold surface substantially prevents mold compound from migrating across an upper surface of the lid during package formation.
  • the method typically includes connecting an electrical conductor between the device and an external conductive element. Molding the package typically includes covering the electrical conductor with mold compound. [0009]
  • the active region typically is populated with one or more microelectronic devices, such as optical devices.
  • the lid is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices.
  • the lid includes a glass portion.
  • the package in some instances, is substantially opaque to electromagnetic radiation at wavelengths relevant to the one or more optical devices.
  • the method also includes substantially sealing the package, for example, by forming a substantially impermeable housing around the package and sealing a first gap between the substantially impermeable housing and the lid.
  • the method prior to molding the package, typically includes placing the substantially impermeable housing inside the mold.
  • the molding process integrates the substantially impermeable housing into the microelectronic assembly.
  • the substantially impermeable housing is typically a material selected from the group consisting of: ceramic, metal and glass .
  • sealing the first gap includes forming a metallic layer on an upper surface of the lid and applying a bead (e.g., a metal-based bead such as solder) between the metallic layer and a metallic part of the substantially impermeable housing.
  • a bead e.g., a metal-based bead such as solder
  • Forming the metallic layer on the upper surface of the lid typically is performed by depositing the metallic layer near a peripheral edge of the lid's upper surface.
  • the method includes positioning the device so that its lower surface is in contact with a substantially impermeable substrate.
  • the method includes sealing a second gap between the substantially impermeable housing and the substantially impermeable substrate. Sealing the second gap typically includes applying a bead across the second gap.
  • the substantially impermeable housing typically has an aperture. The impermeable housing typically is coupled to the package so that the aperture is aligned with the lid.
  • molding the package includes forming one or more alignment features in an upper surface of the package, where the one or more alignment features are adapted to engage corresponding alignment features on an optics assembly or other assembly to be mated to the package.
  • Such methods include positioning an optics (or other) assembly above the package so that the one or more alignment features in the upper surface of the package engage the corresponding alignment features on the optics assembly.
  • forming the alignment features includes positioning one or more pins inside the mold prior to molding the package. In those instances, the one or more pins are captured in mold compound during package formation so that the one or more pins extend upward from the upper surface of the package . [0015] In certain implementations, forming the one or more alignment features includes forming a structure from mold compound. Typically, the structure extends upward from the upper surface of the package and defines an aperture that is adapted to receive the optics assembly. In certain embodiments, the aperture is substantially cylindrical with internal screw threads. In those implementations, at least a portion of optics assembly has a substantially cylindrical body with external screw threads adapted to engage the internal screw threads of the substantially cylindrical aperture.
  • an alternative method of forming a microelectronic assembly includes providing a device having an upper surface with an active region, positioning a support structure adjacent to the active region but not extending onto the active region, positioning a lid in contact with the support structure and extending over the active region, wherein the lid and the support structure define a substantially empty cavity, pressing the lid against a mold surface that is contoured to complement the lid and, while pressing the lid against the mold surface, molding a package contiguous to the lid.
  • a method of sealing a microelectronic assembly includes providing a microelectronic assembly.
  • the microelectronic assembly includes a device, a support structure on an upper surface of the device, a lid in contact with the support structure and extending over the active region and a package contiguous with the lid.
  • the method further includes forming a substantially impermeable housing around at least part of the package and sealing a first gap between the substantially impermeable housing and the lid.
  • a microelectronic assembly includes a device having an active region.
  • a support structure is adjacent to the active region but does not extend onto or over the active region.
  • a lid is in contact with the support structure and extends over the active region.
  • the device, the lid and the support structure define a substantially empty cavity around the active region.
  • a package is contiguous with the lid.
  • an alternative microelectronic assembly includes a device with an active region.
  • a support structure is on an upper surface of the device.
  • a lid is in contact with the support structure and extends over the active region.
  • a package is contiguous with the lid.
  • a substantially impermeable housing is around the package.
  • a metallic layer is on an upper surface of the lid, and a bead is between the metallic layer and a metallic part of the substantially impermeable housing.
  • a microelectronic assembly can be produced having elements that are in precise alignment with each other.
  • the microelectronic assembly can include an optics assembly that is in precise relative alignment with the imaging plane of such device. Precise relative alignment can improve the functionality of optical microelectronic devices.
  • a seal can be formed around a microelectronic assembly package. The seal can be manufactured in a simple, cost-effective manner and can substantially reduce the entrance of contaminants into the assembly's active region. By reducing the entrance of such contaminants into the active region, the operation of such a microelectronic assembly, particularly over time, can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1A-1E are cross-sectional elevational views showing a method of forming a microelectronic assembly according to one embodiment of the invention.
  • FIGS. 2A-2F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to another embodiment of the invention.
  • FIGS. 3A-3F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to yet another embodiment of the invention.
  • FIG. 4 is a cross-sectional elevational view of a microelectronic assembly according to an embodiment of the invention.
  • FIGS. 5A-5F are cross-sectional elevational views showing a method of forming and sealing a microelectronic assembly according to another embodiment of the invention.
  • FIG. 6 is a cross-sectional elevational view of a microelectronic assembly having a sealed package according to yet another embodiment of the invention.
  • FIGS. 1A-1E are cross-sectional elevational views showing a method of forming a microelectronic assembly according to one embodiment of the invention.
  • the illustrated method includes providing a device 102 having an upper surface 104 with an active region 106.
  • the active region 106 is populated with microelectronic devices, such as optical devices.
  • a support structure 108 is coupled to the upper surface 104.
  • the support structure 108 is adjacent to the active region 106 but does not extend onto the active region 106.
  • the support structure 108 is an adhesive material.
  • the support structure 108 is typically a continuous structure that surrounds the active region 106.
  • a lid 110 is in contact with the support structure 108 and is suspended above the active region 106.
  • the lid 110 is a material that is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices. Such materials include, for example, glass or plastic.
  • Bond pads 112 are exposed at the upper surface 104 of the device 102 outside the area on the upper surface 104 bounded by the support structure 108.
  • the device 102, the lid 110 and the support structure 108 define a cavity 114 around the active region 106. Aside from containing the microelectronic devices, the cavity 114 is otherwise substantially empty.
  • the term "substantially empty” should be construed broadly to include cavities that are filled with air, gas or that are under vacuum.
  • the cavity 114 is bounded on all sides by the support structure 108.
  • the upper surface 104 of the device 102 defines the bottom of the cavity 114.
  • the lid 110 extends over the area that is bounded by the support structure 108 and defines a top of the cavity 114.
  • the device 102 is electrically coupled to external conductive elements 114. More particularly, in the illustrated embodiment, wire bonds 115 are provided to electrically couple the bond pads 112 exposed at the upper surface 104 of the device 102 to respective external conductive elements 116.
  • the method includes pressing the lid 110 against a first mold surface 118 that is contoured to complement the lid 110.
  • the surface 120 of the lid 110 facing away from the device 102 is substantially flat. That surface 120 is pressed against a portion of the first mold surface 118 by virtue of a second mold surface 122 applying an upward force against the device 102.
  • the portion of the mold surface 118 that contacts the surface 120 of the lid 110 also is substantially flat. In that way, the substantially flat first mold surface 118 is contoured to complement the similarly substantially flat portion of the lid 110 that is in contact therewith.
  • the first mold surface 118 and the second mold surface 122 can be moved together so as to grip the assembly therebetween for molding.
  • the method includes molding a package 126 while pressing the lid 110 against the first mold surface 118.
  • the package 126 is molded so that it is contiguous with the lid 110. Pressing the lid 110 against the first mold surface 118 during molding substantially prevents mold compound from migrating across the upper surface 120 of the lid 110.
  • mold compound forms a package 126 that surrounds a perimeter of the lid 110.
  • the mold compound also covers the bond pads 112, the wire bonds 115 and part of the external conductive elements 116.
  • the package 126 is substantially opaque to electromagnetic radiation at wavelengths that are relevant to the optical devices in the active region 106.
  • the device 102, the support structure 108 and the lid 110 substantially prevent mold compound from migrating into the cavity 114 during molding. Accordingly, the cavity 114 remains substantially empty throughout the molding process .
  • FIG. IE shows a microelectronic assembly 128 that is produced using the above method.
  • the illustrated microelectronic assembly 128 includes a device 102 with an active region 106.
  • a support structure 108 is adjacent to the active region 106 but does not extend onto the active region 106.
  • a lid 110 is in contact with the support structure 108 and extends over the active region 106.
  • a package 126 is contiguous with the lid 110 but does not extend over an upper surface 120 of the lid 110. In the illustrated implementation, an upper surface 130 of the package 126 is approximately flush with the upper surface 120 of the lid 110.
  • the device 102, the lid 110 and the support structure 108 define a cavity 114 around the active region 106. Aside from the components in the active region 106, the cavity 114 is substantially empty.
  • the lid 110 is substantially transparent to electromagnetic radiation at wavelengths relevant to the optical devices.
  • the package 126 is substantially opaque to those wavelengths.
  • FIGS. 2A-2F are cross-sectional elevational views showing a method of forming a microelectronic assembly- according to another embodiment of the invention.
  • the illustrated method is similar to the method discussed above with reference to FIGS. IA-IE, except that the method of FIGS. 2A-2F includes forming alignment features 202 in the upper surface 130 of the package 226 and using those alignment features 202 to align and position an optics assembly 204 relative to the package 226.
  • the first mold surface 218 includes holes 208.
  • one or more pins 206 Prior to molding, one or more pins 206 are positioned inside the mold so as to extend at least partially out of the holes 208.
  • the pins 206 can be held in place within the holes 208 either by using a light adhesive material, by gravity (if, for example, the first mold surface 218 is the lower of the two mold surfaces 218, 122), by friction or by using any other suitable technique.
  • the method includes pressing the lid 110 against a portion of the first mold surface 218 that is contoured to complement the lid 110. Then, in FIG. 2E, with the pins 206 held in place at the holes 208 and while pressing the lid 110 against the first mold surface 218, a package 226 is molded contiguous with the lid 110. During molding, the pins 206 are captured by the mold compound so that the pins 206 become an integral part of the resulting package 226. In that resulting package 226 (see FIG. 2F), the pins 206 extend from the upper surface 130 of the package 226. [0045] As shown in FIG. 2F, the method also includes positioning an optics assembly 204 above the package 226.
  • the illustrated optics assembly 204 includes a housing 210 with alignment features ⁇ e.g., holes 212) formed in a surface 214 of the housing 210 that faces the upper surface 130 of the package 226. More particularly, the alignment features 202 (e.g., pins 206) extending from the upper surface 230 of the package 226 engage the corresponding alignment features (i.e., holes 212) on the surface 214 of the optics assembly housing 210 that faces the upper surface 230 of the package 226. The engagement of the pins 202 to the holes 212 facilitates proper alignment of the optics assembly 204 relative to the imaging plane of the device 102.
  • alignment features 202 e.g., pins 206
  • the optics assembly 204 also butts up against an upper edge of the lid 110 or an upper edge of the molding.
  • the pins 206 might be used to provide alignment along a plane that is parallel to the upper surface of the lid 110 and/or the package 226.
  • the resulting assembly includes a lid 110 that is precisely parallel to the plane (e.g., the imaging plane) of the active region 106 on the device 102.
  • the first mold surface 218 directly engages the lid 110. Therefore, the resulting molded package 226 has features that are in precise alignment relative to the imaging plane. Accordingly, the pins 206 too are in precise relative alignment to the imaging plane. Because the pins 206 are in precise relative alignment to the imaging plane, the optics assembly 204, which is aligned relative to the pins 206, also is precisely aligned relative to the imaging plane.
  • the illustrated housing 204 includes an aperture 224 that lines up with the lid 110 when the optics assembly 204 is coupled to the microelectronic assembly.
  • a pair of lenses 218, 220 and an infrared filter 222 are positioned inside the aperture 224 of the housing 204.
  • the pair of lenses 218, 220 and the infrared filter 222 can be molded into the housing 210 or can be held in place by an adhesive material.
  • the lenses 218, 220 help to focus light onto the active region 106 and the infrared filter 222 filters infrared light.
  • different optical elements or combinations of optical elements can be provided in the optics assembly 204 as well .
  • FIG. 2F illustrates pins 206 that extend from the molded package 226 to engage holes 212 in the optics assembly housing 210
  • an alternate implementation includes pins that extend from the optics assembly housing to engage corresponding holes in the molded package.
  • Other techniques may be utilized to facilitate alignment between the molded package and the optics assembly.
  • FIGS. 3A-3F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to yet another embodiment of the invention. The illustrated method is similar to the method discussed above with reference to FIGS. 2A-2F, except that the method of FIGS. 3A-3F includes forming the alignment features from mold compound.
  • the first mold surface 318 includes a channel 302 formed therein.
  • the channel 302 is substantially cylindrical and has an inner surface 304 with threads and an outer surface 306 that is substantially smooth.
  • the lid 110 is placed in contact with a portion of the first mold surface 318 so as to not cover the channel 302 in the first mold surface 318.
  • the portion of the first mold surface 318 that contacts the lid 110 is contoured to complement the lid 110.
  • the upper surface 120 of the lid is substantially flat and the portion of the first mold surface 318 that contacts the lid 110 also is substantially flat.
  • the channel 302 is left uncovered so that, during molding, it fills with mold compound.
  • the package 326 is formed contiguous with the lid 110. Since, during molding, the lid 110 is pressed tightly against the first mold surface 318, mold compound is prevented from migrating over the upper surface 120 of the lid 110. [0054] Since the channel 302 is in fluid communication with the mold cavity during the molding process, mold compound fills the channel 302. (See FIG. 3E.) Once the mold compound substantially cures, the resulting package 326 can be unscrewed from the channel 302.
  • the resulting package 326 is shown in FIG. 3F and includes a structure 308 that extends upward from the upper surface 330 of the package 326 and defines an aperture 310 that is adapted to receive the optics assembly 350.
  • the aperture 310 is substantially cylindrical.
  • the illustrated optics assembly 350 also is substantially cylindrical and is sized to fit into the aperture 310.
  • the substantially cylindrical aperture 310 has an inner wall with internal screw threads 312.
  • the optics assembly housing 352 has corresponding external screw threads 314.
  • the external screw threads 314 of the optics assembly housing 352 are adapted to engage the internal screw threads 312 of the substantially cylindrical aperture 310.
  • the resulting microelectronic assembly includes a molded package 326 with one or more alignment features in its upper surface 130 and an optics assembly 204 with corresponding alignment features (e.g., screw threads 314), where the one or more alignment features in the upper surface are engaged to the corresponding alignment features (e.g., screw threads 314) on the optics assembly 304.
  • the lid 110 is precisely parallel to the plane (e.g., the imaging plane) of the active region 106 on the device 102.
  • the first mold surface 318 directly engages the lid 110. Therefore, the resulting molded package 326 has features that are in precise alignment relative to the imaging plane.
  • FIG. 4 is a cross-sectional elevational view of a microelectronic assembly 400 according to an embodiment of the invention.
  • the illustrated microelectronic assembly 400 is similar to the microelectronic assembly discussed above with reference to FIGS. IA- IE, except that the microelectronic assembly 400 of FIG. 4 includes an optics stack 402 that is molded in place atop the lid 110.
  • the optics stack 402 typically includes one or more optical elements, such as refractive surfaces, diftractive surfaces, antireflective coatings, infrared filter coatings and/or light blocking apertures.
  • the mold compound is formed so as to at least partially enclose the optics stack 402 and hold the optics stack 402 in place.
  • FIGS. 5A-5F are cross-sectional elevational views showing a method of forming and sealing a microelectronic assembly according to another embodiment of the invention.
  • the illustrated method includes providing a device 102 having an upper surface 104 with an active region 106.
  • a support structure 108 is coupled to the upper surface 104 adjacent to the active region 106 but does not extend onto the active region 106.
  • a lid 110 is in contact with the support structure 108 and is suspended above the active region 106. Bond pads 112 are exposed at the upper surface 104 of the device 102 outside the area of the upper surface 104 bounded by the support structure 108.
  • the illustrated lid 110 has a thin metallic layer 502 on its upper surface 120.
  • the thin metallic layer 502 typically is formed by evaporation, sputtering or other processes.
  • the thin metallic layer 502 is formed along a peripheral edge of the upper surface 120 and extends inward from the peripheral edge a small distance.
  • the center portion of the illustrated lid 110 is not covered by the thin metallic layer 502 and so, readily passes light into the active region 106.
  • the device 102, the lid 110 and the support structure 108 define a cavity 114 that contains the active region 106.
  • the cavity is otherwise substantially empty.
  • the cavity 114 is bounded on all sides by the support structure 108.
  • the upper surface 104 of the device 102 defines the bottom of the cavity 114.
  • the lid 110 extends over the area that is bounded by the support structure 108 and defines the top of the cavity 114.
  • the device 102 is coupled to a substrate 124.
  • the substrate 124 typically includes a substantially impermeable material, such as a ceramic, metal or glass. In some implementations, the entire substrate 124 is formed with one or more substantially impermeable materials.
  • the device 102 is electrically coupled to external conductive elements 116 via wire bonds 114.
  • the method includes, prior to molding, placing a housing 504 inside a mold cavity 506.
  • the housing 504 typically is formed from one or more substantially impermeable materials (e.g., glass, metal or ceramic) . Accordingly, the housing 504 itself is adapted to act as a substantially impermeable barrier.
  • the housing 504 includes indentations, pins, extensions, or other features that can facilitate alignment between the housing 504 and another assembly (e.g., an optics assembly) .
  • the first mold surface 518 includes a projection 510 extending toward the second mold surface 122.
  • the housing 504 includes an opening 508, through which the projection 510 extends.
  • the housing can be held in place inside the mold cavity 506 prior to and during molding.
  • gravity can hold the housing 504 in place.
  • a light adhesive material can hold the housing 504 in place.
  • friction between the opening 508 and the projection 510 can hold the housing 504 in place.
  • the microelectronic assembly is positioned inside the mold cavity 506 so that the lid 110 and/or the thin metallic layer 502 are in contact with the lower surface of the projection 510.
  • the lower surface of the projection 510 is contoured so as to complement the upper surface 120 of the lid 110 and/or the thin metallic layer 502.
  • the projection 510 is contoured so that it can seal against the lid 110 and/or the thin metallic layer 502 to prevent migration of mold compound onto the lid 110 during package formation.
  • a package 526 is formed while pressing the lid 110 and/or the thin metallic layer 502 against the first mold surface 518. Forming the package integrates the housing 504 into the resulting package. The resulting package 526 is contiguous with the lid 110. However, pressing the lid 110 against the first mold surface 518 during molding substantially prevents mold compound from migrating across the upper surface 120 of the lid 110.
  • the package 526 surrounds a perimeter of the lid 110.
  • the mold compound also covers the bond pads 112, the wire bonds 114 and part of the external conductive elements 116.
  • the package 526 is substantially opaque.
  • the device 102, the support structure 108 and the lid 110 substantially prevent mold compound from migrating into the cavity 114 during molding. Accordingly, the cavity 114 remains substantially empty throughout the molding process.
  • the method includes applying a bead 512 (e.g., a metal-based bead such as a solder bead) between the metallic layer 502 on the lid 110 and the substantially impermeable housing 504. That bead 512 seals the gap between the lid 110 and the substantially impermeable housing 504. It is further noted that there are many inks that, when sintered under heat, could form beads suitable for application according to the present techniques.
  • the method also includes applying a bead 514 between the substantially impermeable housing 504 and the substrate 124. That bead 514 seals any gap that might have existed between the substantially impermeable housing 504 and the substrate 124.
  • FIG. 5F shows an example of a structure produced by the above method.
  • the substrate 124, the housing 504, the lid 110 and the soldered joints therebetween, together seal the relatively porous molded package from external contaminants.
  • the opening 508 in the housing is aligned with the lid 110 so as to allow the passage of light to the lid 110.
  • FIG. 6 is a cross-sectional elevational view of microelectronic assembly 602 having a sealed package 626 according to yet another embodiment of the invention.
  • the illustrated microelectronic assembly 602 includes a device 102 coupled to a substantially impermeable substrate 124.
  • a support structure 108 is on an upper surface of the device 102.
  • a transparent lid 110 is in contact with the support structure 108 and extends over an active region 106 on the device 102.
  • An optics stack 402 is positioned above the lid 110.
  • a package 626 is contiguous with the lid 110 and the optics stack 402. During molding of the package 626, the upper surface of the lid 110 is pressed securely against the correspondingly contoured lower surface of the optics assembly 402.
  • Mold compound is thereby prevented from migrating onto the upper surface of the lid 110. Also, in some implementations, during molding, the upper surface of the optics assembly is pressed securely against a mold surface that is contoured in a manner to complement the upper surface of the optics assembly.
  • a substantially impermeable housing is formed around the package 626 and includes an opening above the optics assembly 402 to allow the passage of light to the lid 110 and ultimately to the active region 106 on the device 102.
  • a metallic layer 502 is formed on an upper surface of the optics assembly 402.
  • a bead 512 is between the metallic layer 502 and a metallic part of the substantially impermeable housing 504.
  • a second bead 514 is provided between the housing 504 and a metallic part of the substantially impermeable substrate 124.
  • the support structure 108 is an adhesive material.
  • an adhesive material as the support structure can advantageously simplify the manufacturing processes disclosed herein by helping to ensure that the lid 110 stays in place. Keeping the lid 110 in place can be particularly advantageous prior to molding the package 626.
  • the support structure could be other items, such as stud bumps or the like.
  • the first mold surface (e.g., 218 in FIG. 2C) has one or more features adapted to engage one or more side edges of the lid 110 when the lid is brought into contact with the first mold surface. That engagement helps to ensure proper horizontal alignment between the first mold surface and the optical device while the package is molded.
  • the engagement features extend from the first mold surface toward the second mold surface thereby forming a lip.
  • the lip is dimensioned so as to surround an upper edge of the lid 110. Ensuring proper alignment between the first mold surface and the optical device while the package is being molded is particularly important in those instances (e.g., FIGS. 2A-2F and FIGS. BASF) where the first mold surface is used to form one or more alignment features in the package.
  • the upper surface 120 of the lid 110 is shown in the figures as being a substantially flat surface, in some implementations, the upper surface 120 could be contoured in a variety of ways. In those implementations, the portion of the first mold surface (e.g., 118) that contacts the upper surface 120 of the lid 110 during molding would be contoured in a manner to complement the contours of the upper surface 120. More particularly, that portion of the first mold surface 118 would be contoured so that a tight seal could be achieved between it and the upper surface 120 of the lid 110. [0080] In some embodiments, the upper surface of the package is approximately flush with an upper surface of the lid. In other embodiments, the lid extends upward from the upper surface of the package.
  • the upper surface of the lid is recessed relative to the upper surface of the package.
  • the implementations disclosed herein include an upper surface of the package that is substantially parallel to the upper surface of the lid, in some implementations, the upper surface of the package can be angled or otherwise contoured relative to the upper surface of the lid in a non-parallel manner.
  • the order of steps in the various methods disclosed herein can be varied considerably and some embodiments include additional steps not specifically shown in the figures. For example, in some instances, particularly if the seal between the lid 110 and the first mold surface ⁇ e.g., 118) is not sufficiently tight, then some mold compound could migrate over the upper surface 120 of the lid 110. If that happens, an additional step of cleaning the upper surface 120 after molding might be desirable. Cleaning the upper surface 120 after molding can be accomplished, for example, by water jet cleaning.
  • the mold compound can be cured in a number of ways. For example, the simple passage of time may cure the mold compound. Alternatively, the curing may be facilitated by the application of heat or other facilitator to the mold compound. [0083] Typically, the upper surface of the lid and/or the thin metallic layer is kept in contact with the first mold surface until the mold compound is substantially cured. Maintaining such contact throughout the molding process helps ensure that little to no mold compound migrates onto the upper surface of the lid during molding.
  • the alignment features 202 formed in the upper surface of the package and the corresponding alignment features formed in the optics assembly can be implemented in a number of ways and can take on a variety of different shapes and sizes. Similarly, the alignment features can be formed from a variety of materials .
  • the housing 504 can be any size or shape. However, typically, the housing 504 is sized and shaped to fit over a package of a microelectronic assembly. Sealing the gap between the housing and the substrate and sealing the gap between the housing and the lid can be accomplished in a variety of ways. [0086] The techniques of sealing the package 526 of the microelectronic assembly disclosed in FIGS. 5A-5F can be implemented together with various combinations of the techniques shown in the other figures. Additionally, the manufacturing techniques and method and the structural features disclosed herein can be applied to a number of different types of microelectronic devices.

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Abstract

A method of forming a microelectronic assembly includes providing a device (102) having an active region (106), applying an adhesive support structure (108) adjacent to the active region but not extending onto the active region, positioning a lid (110) in contact with the adhesive support structure and extending over the active region, pressing the lid (110) against a mold surface (118) that is contoured to complement the lid (110) and, while pressing the lid against the mold surface (118), molding a package (126) contiguous with the lid (110).

Description

MICROELECTRONIC DEVICES AND METHODS
OF MANUFACTURING SUCH DEVICES CROSS-REFERENCE TO RELATED APPLICATION (S)
[0001] This International application claims priority from United States Application Serial No. 11/985,962, filed November 19, 2007 which is a continuation of United States Patent Application Serial No. 11/726,366, filed March 21, 2007, which is a continuation- in-part of United States Patent Application Serial No. 11/648,718, filed December 29, 2006, the disclosures of which are incorporated by reference herein. FIELD OF THE INVENTION
[0002] This application relates to microelectronic devices and methods of manufacturing microelectronic devices . BACKGROUND OF THE INVENTION
[0003] Some microelectronic devices have active regions with optical sensors. Each active region typically is located inside a chamber and surrounded by a molded package. A transparent lid is provided above the active region and enables the passage of optical data to the optical sensors. [0004] The rapid evolution of microelectronic elements has created continued demand to improve the performance of such microelectronic devices and to improve the methods of manufacturing such microelectronic devices. SUMMARY OF THE INVENTION
[0005] In one aspect, a method of forming a microelectronic assembly is disclosed. The method includes providing a device having an active region. A support structure is applied adjacent to the active region but not extending onto the active region. A lid is positioned in contact with the support structure and extending over the active region. The lid is pressed against a mold surface that is contoured to complement the lid and, while pressing the lid against the mold surface, a package is molded contiguous with the lid.
[0006] In some implementations, the support structure is an adhesive material. In some implementations, the device, the support structure and the lid define a substantially empty- cavity around the active region. During molding, the device, the support structure and the lid substantially prevent mold compound from migrating into the cavity.
[0007] In some implementations, pressing the lid against the mold surface includes pressing a surface of the lid facing away from the device against the mold surface. Pressing the lid against the mold surface substantially prevents mold compound from migrating across an upper surface of the lid during package formation.
[0008] The method typically includes connecting an electrical conductor between the device and an external conductive element. Molding the package typically includes covering the electrical conductor with mold compound. [0009] The active region typically is populated with one or more microelectronic devices, such as optical devices. In those implementations, the lid is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices. In one example, the lid includes a glass portion. The package, in some instances, is substantially opaque to electromagnetic radiation at wavelengths relevant to the one or more optical devices.
[0010] In some implementations, the method also includes substantially sealing the package, for example, by forming a substantially impermeable housing around the package and sealing a first gap between the substantially impermeable housing and the lid. In those instances, prior to molding the package, the method typically includes placing the substantially impermeable housing inside the mold. In those instances, the molding process integrates the substantially impermeable housing into the microelectronic assembly. The substantially impermeable housing is typically a material selected from the group consisting of: ceramic, metal and glass . [0011] According to certain implementations, sealing the first gap includes forming a metallic layer on an upper surface of the lid and applying a bead (e.g., a metal-based bead such as solder) between the metallic layer and a metallic part of the substantially impermeable housing. It is further noted that there are many inks that, when sintered under heat, could form a bead suitable for such an application. Forming the metallic layer on the upper surface of the lid typically is performed by depositing the metallic layer near a peripheral edge of the lid's upper surface.
[0012] In some embodiments, the method includes positioning the device so that its lower surface is in contact with a substantially impermeable substrate. In those instances, the method includes sealing a second gap between the substantially impermeable housing and the substantially impermeable substrate. Sealing the second gap typically includes applying a bead across the second gap. The substantially impermeable housing typically has an aperture. The impermeable housing typically is coupled to the package so that the aperture is aligned with the lid.
[0013] In some implementations, molding the package includes forming one or more alignment features in an upper surface of the package, where the one or more alignment features are adapted to engage corresponding alignment features on an optics assembly or other assembly to be mated to the package. Such methods include positioning an optics (or other) assembly above the package so that the one or more alignment features in the upper surface of the package engage the corresponding alignment features on the optics assembly.
[0014] In certain implementations, forming the alignment features includes positioning one or more pins inside the mold prior to molding the package. In those instances, the one or more pins are captured in mold compound during package formation so that the one or more pins extend upward from the upper surface of the package . [0015] In certain implementations, forming the one or more alignment features includes forming a structure from mold compound. Typically, the structure extends upward from the upper surface of the package and defines an aperture that is adapted to receive the optics assembly. In certain embodiments, the aperture is substantially cylindrical with internal screw threads. In those implementations, at least a portion of optics assembly has a substantially cylindrical body with external screw threads adapted to engage the internal screw threads of the substantially cylindrical aperture. [0016] In another aspect, an alternative method of forming a microelectronic assembly is disclosed. The alternative method includes providing a device having an upper surface with an active region, positioning a support structure adjacent to the active region but not extending onto the active region, positioning a lid in contact with the support structure and extending over the active region, wherein the lid and the support structure define a substantially empty cavity, pressing the lid against a mold surface that is contoured to complement the lid and, while pressing the lid against the mold surface, molding a package contiguous to the lid.
[0017] In yet another aspect, a method of sealing a microelectronic assembly is disclosed. That method includes providing a microelectronic assembly. The microelectronic assembly includes a device, a support structure on an upper surface of the device, a lid in contact with the support structure and extending over the active region and a package contiguous with the lid. The method further includes forming a substantially impermeable housing around at least part of the package and sealing a first gap between the substantially impermeable housing and the lid.
[0018] In still another aspect, a microelectronic assembly is disclosed. The microelectronic assembly includes a device having an active region. A support structure is adjacent to the active region but does not extend onto or over the active region. A lid is in contact with the support structure and extends over the active region. The device, the lid and the support structure define a substantially empty cavity around the active region. A package is contiguous with the lid. [0019] According to another aspect, an alternative microelectronic assembly is disclosed and includes a device with an active region. A support structure is on an upper surface of the device. A lid is in contact with the support structure and extends over the active region. A package is contiguous with the lid. A substantially impermeable housing is around the package. A metallic layer is on an upper surface of the lid, and a bead is between the metallic layer and a metallic part of the substantially impermeable housing. [0020] In some implementations, one or more of the following advantages are present.
[0021] A microelectronic assembly can be produced having elements that are in precise alignment with each other. For example, the microelectronic assembly can include an optics assembly that is in precise relative alignment with the imaging plane of such device. Precise relative alignment can improve the functionality of optical microelectronic devices. [0022] Additionally, a seal can be formed around a microelectronic assembly package. The seal can be manufactured in a simple, cost-effective manner and can substantially reduce the entrance of contaminants into the assembly's active region. By reducing the entrance of such contaminants into the active region, the operation of such a microelectronic assembly, particularly over time, can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIGS. 1A-1E are cross-sectional elevational views showing a method of forming a microelectronic assembly according to one embodiment of the invention.
[0024] FIGS. 2A-2F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to another embodiment of the invention. [0025] FIGS. 3A-3F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to yet another embodiment of the invention. [0026] FIG. 4 is a cross-sectional elevational view of a microelectronic assembly according to an embodiment of the invention.
[0027] FIGS. 5A-5F are cross-sectional elevational views showing a method of forming and sealing a microelectronic assembly according to another embodiment of the invention. [0028] FIG. 6 is a cross-sectional elevational view of a microelectronic assembly having a sealed package according to yet another embodiment of the invention.
[0029] Like reference numerals indicate like elements. DETAILED DESCRIPTION
[0030] FIGS. 1A-1E are cross-sectional elevational views showing a method of forming a microelectronic assembly according to one embodiment of the invention.
[0031] Referring to FIG. IA, the illustrated method includes providing a device 102 having an upper surface 104 with an active region 106. The active region 106 is populated with microelectronic devices, such as optical devices. A support structure 108 is coupled to the upper surface 104. The support structure 108 is adjacent to the active region 106 but does not extend onto the active region 106. In some implementations, the support structure 108 is an adhesive material. The support structure 108 is typically a continuous structure that surrounds the active region 106. A lid 110 is in contact with the support structure 108 and is suspended above the active region 106. Typically, the lid 110 is a material that is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices. Such materials include, for example, glass or plastic. Bond pads 112 are exposed at the upper surface 104 of the device 102 outside the area on the upper surface 104 bounded by the support structure 108. [0032] The device 102, the lid 110 and the support structure 108 define a cavity 114 around the active region 106. Aside from containing the microelectronic devices, the cavity 114 is otherwise substantially empty. The term "substantially empty" should be construed broadly to include cavities that are filled with air, gas or that are under vacuum. The cavity 114 is bounded on all sides by the support structure 108. The upper surface 104 of the device 102 defines the bottom of the cavity 114. The lid 110 extends over the area that is bounded by the support structure 108 and defines a top of the cavity 114.
[0033] As shown in FIG. IB, the device 102 is electrically coupled to external conductive elements 114. More particularly, in the illustrated embodiment, wire bonds 115 are provided to electrically couple the bond pads 112 exposed at the upper surface 104 of the device 102 to respective external conductive elements 116.
[0034] Referring now to FIG. 1C, the method includes pressing the lid 110 against a first mold surface 118 that is contoured to complement the lid 110. In the illustrated embodiment, the surface 120 of the lid 110 facing away from the device 102 is substantially flat. That surface 120 is pressed against a portion of the first mold surface 118 by virtue of a second mold surface 122 applying an upward force against the device 102. The portion of the mold surface 118 that contacts the surface 120 of the lid 110 also is substantially flat. In that way, the substantially flat first mold surface 118 is contoured to complement the similarly substantially flat portion of the lid 110 that is in contact therewith. [0035] In the illustrated embodiment, the first mold surface 118 and the second mold surface 122 can be moved together so as to grip the assembly therebetween for molding. The first mold surface 118 and the second mold surface 122 also can be moved apart so as to release the assembly after molding. [0036] As shown in FIG. ID, the method includes molding a package 126 while pressing the lid 110 against the first mold surface 118. The package 126 is molded so that it is contiguous with the lid 110. Pressing the lid 110 against the first mold surface 118 during molding substantially prevents mold compound from migrating across the upper surface 120 of the lid 110. In the illustrated implementation, mold compound forms a package 126 that surrounds a perimeter of the lid 110. The mold compound also covers the bond pads 112, the wire bonds 115 and part of the external conductive elements 116. Typically, the package 126 is substantially opaque to electromagnetic radiation at wavelengths that are relevant to the optical devices in the active region 106.
[0037] In the illustrated implementation, the device 102, the support structure 108 and the lid 110 substantially prevent mold compound from migrating into the cavity 114 during molding. Accordingly, the cavity 114 remains substantially empty throughout the molding process .
[0038] FIG. IE shows a microelectronic assembly 128 that is produced using the above method.
[0039] The illustrated microelectronic assembly 128 includes a device 102 with an active region 106. A support structure 108 is adjacent to the active region 106 but does not extend onto the active region 106. A lid 110 is in contact with the support structure 108 and extends over the active region 106. A package 126 is contiguous with the lid 110 but does not extend over an upper surface 120 of the lid 110. In the illustrated implementation, an upper surface 130 of the package 126 is approximately flush with the upper surface 120 of the lid 110.
[0040] The device 102, the lid 110 and the support structure 108 define a cavity 114 around the active region 106. Aside from the components in the active region 106, the cavity 114 is substantially empty. The lid 110 is substantially transparent to electromagnetic radiation at wavelengths relevant to the optical devices. The package 126 is substantially opaque to those wavelengths.
[0041] FIGS. 2A-2F are cross-sectional elevational views showing a method of forming a microelectronic assembly- according to another embodiment of the invention. [0042] The illustrated method is similar to the method discussed above with reference to FIGS. IA-IE, except that the method of FIGS. 2A-2F includes forming alignment features 202 in the upper surface 130 of the package 226 and using those alignment features 202 to align and position an optics assembly 204 relative to the package 226.
[0043] Referring to FIG. 2C, the first mold surface 218 includes holes 208. Prior to molding, one or more pins 206 are positioned inside the mold so as to extend at least partially out of the holes 208. The pins 206 can be held in place within the holes 208 either by using a light adhesive material, by gravity (if, for example, the first mold surface 218 is the lower of the two mold surfaces 218, 122), by friction or by using any other suitable technique.
[0044] Referring now to FIG. 2D, the method includes pressing the lid 110 against a portion of the first mold surface 218 that is contoured to complement the lid 110. Then, in FIG. 2E, with the pins 206 held in place at the holes 208 and while pressing the lid 110 against the first mold surface 218, a package 226 is molded contiguous with the lid 110. During molding, the pins 206 are captured by the mold compound so that the pins 206 become an integral part of the resulting package 226. In that resulting package 226 (see FIG. 2F), the pins 206 extend from the upper surface 130 of the package 226. [0045] As shown in FIG. 2F, the method also includes positioning an optics assembly 204 above the package 226. The illustrated optics assembly 204 includes a housing 210 with alignment features {e.g., holes 212) formed in a surface 214 of the housing 210 that faces the upper surface 130 of the package 226. More particularly, the alignment features 202 (e.g., pins 206) extending from the upper surface 230 of the package 226 engage the corresponding alignment features (i.e., holes 212) on the surface 214 of the optics assembly housing 210 that faces the upper surface 230 of the package 226. The engagement of the pins 202 to the holes 212 facilitates proper alignment of the optics assembly 204 relative to the imaging plane of the device 102.
[0046] In some implementations, the optics assembly 204 also butts up against an upper edge of the lid 110 or an upper edge of the molding. In those instances, the pins 206 might be used to provide alignment along a plane that is parallel to the upper surface of the lid 110 and/or the package 226. [0047] The resulting assembly includes a lid 110 that is precisely parallel to the plane (e.g., the imaging plane) of the active region 106 on the device 102. In the molding operation, the first mold surface 218 directly engages the lid 110. Therefore, the resulting molded package 226 has features that are in precise alignment relative to the imaging plane. Accordingly, the pins 206 too are in precise relative alignment to the imaging plane. Because the pins 206 are in precise relative alignment to the imaging plane, the optics assembly 204, which is aligned relative to the pins 206, also is precisely aligned relative to the imaging plane.
[0048] The illustrated housing 204 includes an aperture 224 that lines up with the lid 110 when the optics assembly 204 is coupled to the microelectronic assembly. A pair of lenses 218, 220 and an infrared filter 222 are positioned inside the aperture 224 of the housing 204. The pair of lenses 218, 220 and the infrared filter 222 can be molded into the housing 210 or can be held in place by an adhesive material. The lenses 218, 220 help to focus light onto the active region 106 and the infrared filter 222 filters infrared light. In some implementations, different optical elements or combinations of optical elements can be provided in the optics assembly 204 as well . [0049] Although FIG. 2F illustrates pins 206 that extend from the molded package 226 to engage holes 212 in the optics assembly housing 210, an alternate implementation includes pins that extend from the optics assembly housing to engage corresponding holes in the molded package. Other techniques may be utilized to facilitate alignment between the molded package and the optics assembly.
[0050] FIGS. 3A-3F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to yet another embodiment of the invention. The illustrated method is similar to the method discussed above with reference to FIGS. 2A-2F, except that the method of FIGS. 3A-3F includes forming the alignment features from mold compound.
[0051] According to the illustrated method (see FIG. 3C) , the first mold surface 318 includes a channel 302 formed therein. The channel 302 is substantially cylindrical and has an inner surface 304 with threads and an outer surface 306 that is substantially smooth.
[0052] As shown in FIG. 3D, prior to molding, the lid 110 is placed in contact with a portion of the first mold surface 318 so as to not cover the channel 302 in the first mold surface 318. The portion of the first mold surface 318 that contacts the lid 110 is contoured to complement the lid 110. In the illustrated implementation, the upper surface 120 of the lid is substantially flat and the portion of the first mold surface 318 that contacts the lid 110 also is substantially flat. The channel 302 is left uncovered so that, during molding, it fills with mold compound.
[0053] Once the lid 110 is so positioned relative to the first mold surface 318, the package 326 is formed contiguous with the lid 110. Since, during molding, the lid 110 is pressed tightly against the first mold surface 318, mold compound is prevented from migrating over the upper surface 120 of the lid 110. [0054] Since the channel 302 is in fluid communication with the mold cavity during the molding process, mold compound fills the channel 302. (See FIG. 3E.) Once the mold compound substantially cures, the resulting package 326 can be unscrewed from the channel 302.
[0055] The resulting package 326 is shown in FIG. 3F and includes a structure 308 that extends upward from the upper surface 330 of the package 326 and defines an aperture 310 that is adapted to receive the optics assembly 350. In the illustrated implementation, the aperture 310 is substantially cylindrical. The illustrated optics assembly 350 also is substantially cylindrical and is sized to fit into the aperture 310. The substantially cylindrical aperture 310 has an inner wall with internal screw threads 312. The optics assembly housing 352 has corresponding external screw threads 314. The external screw threads 314 of the optics assembly housing 352 are adapted to engage the internal screw threads 312 of the substantially cylindrical aperture 310.
[0056] The resulting microelectronic assembly (see FIG. 3F) includes a molded package 326 with one or more alignment features in its upper surface 130 and an optics assembly 204 with corresponding alignment features (e.g., screw threads 314), where the one or more alignment features in the upper surface are engaged to the corresponding alignment features (e.g., screw threads 314) on the optics assembly 304. [0057] In the resulting assembly, the lid 110 is precisely parallel to the plane (e.g., the imaging plane) of the active region 106 on the device 102. In the molding operation, the first mold surface 318 directly engages the lid 110. Therefore, the resulting molded package 326 has features that are in precise alignment relative to the imaging plane. Accordingly, the alignment features (i.e., screw threads 312) that extend from the upper surface of the package 326 to engage the optics assembly 350 also are in precise relative alignment to the imaging plane. Because those alignment features are in precise relative alignment to the imaging plane, the optics assembly 350, which is screwed into the screw threads 312, also is precisely aligned relative to the imaging plane. The resulting assembly also facilitates adjusting the height of the optics assembly 350 above the imaging plane, which might advantageously improve performance of the resulting assembly. [0058] FIG. 4 is a cross-sectional elevational view of a microelectronic assembly 400 according to an embodiment of the invention.
[0059] The illustrated microelectronic assembly 400 is similar to the microelectronic assembly discussed above with reference to FIGS. IA- IE, except that the microelectronic assembly 400 of FIG. 4 includes an optics stack 402 that is molded in place atop the lid 110. The optics stack 402 typically includes one or more optical elements, such as refractive surfaces, diftractive surfaces, antireflective coatings, infrared filter coatings and/or light blocking apertures. The mold compound is formed so as to at least partially enclose the optics stack 402 and hold the optics stack 402 in place.
[0060] In some implementations, the illustrated microelectronic assembly 400 is manufactured by positioning the optics stack above the lid 110 prior to molding. Then, molding is performed to couple the optics stack to the lid 110. [0061] FIGS. 5A-5F are cross-sectional elevational views showing a method of forming and sealing a microelectronic assembly according to another embodiment of the invention. [0062] More particularly, referring to FIG. 5A, the illustrated method includes providing a device 102 having an upper surface 104 with an active region 106. A support structure 108 is coupled to the upper surface 104 adjacent to the active region 106 but does not extend onto the active region 106. A lid 110 is in contact with the support structure 108 and is suspended above the active region 106. Bond pads 112 are exposed at the upper surface 104 of the device 102 outside the area of the upper surface 104 bounded by the support structure 108.
[0063] The illustrated lid 110 has a thin metallic layer 502 on its upper surface 120. The thin metallic layer 502 typically is formed by evaporation, sputtering or other processes. In the illustrated implementation, the thin metallic layer 502 is formed along a peripheral edge of the upper surface 120 and extends inward from the peripheral edge a small distance. The center portion of the illustrated lid 110 is not covered by the thin metallic layer 502 and so, readily passes light into the active region 106.
[0064] In the illustrated embodiment, the device 102, the lid 110 and the support structure 108 define a cavity 114 that contains the active region 106. The cavity is otherwise substantially empty. The cavity 114 is bounded on all sides by the support structure 108. The upper surface 104 of the device 102 defines the bottom of the cavity 114. The lid 110 extends over the area that is bounded by the support structure 108 and defines the top of the cavity 114.
[0065] Referring now to FIG. 5B, the device 102 is coupled to a substrate 124. The substrate 124 typically includes a substantially impermeable material, such as a ceramic, metal or glass. In some implementations, the entire substrate 124 is formed with one or more substantially impermeable materials. The device 102 is electrically coupled to external conductive elements 116 via wire bonds 114.
[0066] Referring now to FIG. 5C, the method includes, prior to molding, placing a housing 504 inside a mold cavity 506. The housing 504 typically is formed from one or more substantially impermeable materials (e.g., glass, metal or ceramic) . Accordingly, the housing 504 itself is adapted to act as a substantially impermeable barrier. In some implementations, the housing 504 includes indentations, pins, extensions, or other features that can facilitate alignment between the housing 504 and another assembly (e.g., an optics assembly) .
[0067] In the illustrated embodiment, the first mold surface 518 includes a projection 510 extending toward the second mold surface 122. The housing 504 includes an opening 508, through which the projection 510 extends. There are a number of ways that the housing can be held in place inside the mold cavity 506 prior to and during molding. For example, gravity can hold the housing 504 in place. Alternatively, a light adhesive material can hold the housing 504 in place. In other implementations, friction between the opening 508 and the projection 510 can hold the housing 504 in place. [0068] In FIG. 5D, the microelectronic assembly is positioned inside the mold cavity 506 so that the lid 110 and/or the thin metallic layer 502 are in contact with the lower surface of the projection 510. The lower surface of the projection 510 is contoured so as to complement the upper surface 120 of the lid 110 and/or the thin metallic layer 502. The projection 510 is contoured so that it can seal against the lid 110 and/or the thin metallic layer 502 to prevent migration of mold compound onto the lid 110 during package formation. [0069] Referring now to FIG. 5E, a package 526 is formed while pressing the lid 110 and/or the thin metallic layer 502 against the first mold surface 518. Forming the package integrates the housing 504 into the resulting package. The resulting package 526 is contiguous with the lid 110. However, pressing the lid 110 against the first mold surface 518 during molding substantially prevents mold compound from migrating across the upper surface 120 of the lid 110. In the illustrated implementation, the package 526 surrounds a perimeter of the lid 110. The mold compound also covers the bond pads 112, the wire bonds 114 and part of the external conductive elements 116. Typically, the package 526 is substantially opaque. [0070] In the illustrated implementation, the device 102, the support structure 108 and the lid 110 substantially prevent mold compound from migrating into the cavity 114 during molding. Accordingly, the cavity 114 remains substantially empty throughout the molding process.
[0071] As shown in FIG. 5F, after molding, the method includes applying a bead 512 (e.g., a metal-based bead such as a solder bead) between the metallic layer 502 on the lid 110 and the substantially impermeable housing 504. That bead 512 seals the gap between the lid 110 and the substantially impermeable housing 504. It is further noted that there are many inks that, when sintered under heat, could form beads suitable for application according to the present techniques. The method also includes applying a bead 514 between the substantially impermeable housing 504 and the substrate 124. That bead 514 seals any gap that might have existed between the substantially impermeable housing 504 and the substrate 124. If either the housing 110 or the substrate 124 are non- metallic, then a metallic layer might need to be deposited on the non-metallic material prior to applying the beads 512, 514. [0072] FIG. 5F shows an example of a structure produced by the above method. In the illustrated structure, the substrate 124, the housing 504, the lid 110 and the soldered joints therebetween, together, seal the relatively porous molded package from external contaminants. Also, the opening 508 in the housing is aligned with the lid 110 so as to allow the passage of light to the lid 110.
[0073] FIG. 6 is a cross-sectional elevational view of microelectronic assembly 602 having a sealed package 626 according to yet another embodiment of the invention. [0074] The illustrated microelectronic assembly 602 includes a device 102 coupled to a substantially impermeable substrate 124. A support structure 108 is on an upper surface of the device 102. A transparent lid 110 is in contact with the support structure 108 and extends over an active region 106 on the device 102. An optics stack 402 is positioned above the lid 110. A package 626 is contiguous with the lid 110 and the optics stack 402. During molding of the package 626, the upper surface of the lid 110 is pressed securely against the correspondingly contoured lower surface of the optics assembly 402. Mold compound is thereby prevented from migrating onto the upper surface of the lid 110. Also, in some implementations, during molding, the upper surface of the optics assembly is pressed securely against a mold surface that is contoured in a manner to complement the upper surface of the optics assembly.
[0075] A substantially impermeable housing is formed around the package 626 and includes an opening above the optics assembly 402 to allow the passage of light to the lid 110 and ultimately to the active region 106 on the device 102. A metallic layer 502 is formed on an upper surface of the optics assembly 402. A bead 512 is between the metallic layer 502 and a metallic part of the substantially impermeable housing 504. A second bead 514 is provided between the housing 504 and a metallic part of the substantially impermeable substrate 124. [0076] Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims .
[0077] For example, in some implementations, the support structure 108 is an adhesive material. Using an adhesive material as the support structure can advantageously simplify the manufacturing processes disclosed herein by helping to ensure that the lid 110 stays in place. Keeping the lid 110 in place can be particularly advantageous prior to molding the package 626. Alternatively, the support structure could be other items, such as stud bumps or the like.
[0078] In some implementations, the first mold surface (e.g., 218 in FIG. 2C) has one or more features adapted to engage one or more side edges of the lid 110 when the lid is brought into contact with the first mold surface. That engagement helps to ensure proper horizontal alignment between the first mold surface and the optical device while the package is molded. Typically, the engagement features extend from the first mold surface toward the second mold surface thereby forming a lip. In some implementations, the lip is dimensioned so as to surround an upper edge of the lid 110. Ensuring proper alignment between the first mold surface and the optical device while the package is being molded is particularly important in those instances (e.g., FIGS. 2A-2F and FIGS. BASF) where the first mold surface is used to form one or more alignment features in the package.
[0079] Additionally, although the upper surface 120 of the lid 110 is shown in the figures as being a substantially flat surface, in some implementations, the upper surface 120 could be contoured in a variety of ways. In those implementations, the portion of the first mold surface (e.g., 118) that contacts the upper surface 120 of the lid 110 during molding would be contoured in a manner to complement the contours of the upper surface 120. More particularly, that portion of the first mold surface 118 would be contoured so that a tight seal could be achieved between it and the upper surface 120 of the lid 110. [0080] In some embodiments, the upper surface of the package is approximately flush with an upper surface of the lid. In other embodiments, the lid extends upward from the upper surface of the package. In still other embodiments, the upper surface of the lid is recessed relative to the upper surface of the package. Additionally, although the implementations disclosed herein include an upper surface of the package that is substantially parallel to the upper surface of the lid, in some implementations, the upper surface of the package can be angled or otherwise contoured relative to the upper surface of the lid in a non-parallel manner. [0081] The order of steps in the various methods disclosed herein can be varied considerably and some embodiments include additional steps not specifically shown in the figures. For example, in some instances, particularly if the seal between the lid 110 and the first mold surface {e.g., 118) is not sufficiently tight, then some mold compound could migrate over the upper surface 120 of the lid 110. If that happens, an additional step of cleaning the upper surface 120 after molding might be desirable. Cleaning the upper surface 120 after molding can be accomplished, for example, by water jet cleaning.
[0082] The mold compound can be cured in a number of ways. For example, the simple passage of time may cure the mold compound. Alternatively, the curing may be facilitated by the application of heat or other facilitator to the mold compound. [0083] Typically, the upper surface of the lid and/or the thin metallic layer is kept in contact with the first mold surface until the mold compound is substantially cured. Maintaining such contact throughout the molding process helps ensure that little to no mold compound migrates onto the upper surface of the lid during molding.
[0084] The alignment features 202 formed in the upper surface of the package and the corresponding alignment features formed in the optics assembly can be implemented in a number of ways and can take on a variety of different shapes and sizes. Similarly, the alignment features can be formed from a variety of materials .
[0085] The housing 504 can be any size or shape. However, typically, the housing 504 is sized and shaped to fit over a package of a microelectronic assembly. Sealing the gap between the housing and the substrate and sealing the gap between the housing and the lid can be accomplished in a variety of ways. [0086] The techniques of sealing the package 526 of the microelectronic assembly disclosed in FIGS. 5A-5F can be implemented together with various combinations of the techniques shown in the other figures. Additionally, the manufacturing techniques and method and the structural features disclosed herein can be applied to a number of different types of microelectronic devices.
[0087] Accordingly, other embodiments are within the scope of the following claims.

Claims

1. A method of forming a microelectronic assembly, the method comprising: providing a device having an active region,- applying an adhesive support structure adjacent to the active region but not extending onto the active region; positioning a lid in contact with the adhesive support structure and extending over the active region; pressing the lid against a mold surface that is contoured to complement the lid; and while pressing the lid against the mold surface, molding a package contiguous with the lid.
2. The method of claim 1 wherein pressing the lid against the mold surface comprises pressing a surface of the lid facing away from the device toward the mold surface.
3. The method of claim 2 wherein pressing the lid against the mold surface substantially prevents mold compound from migrating across the upper surface of the lid.
4. The method of claim 1 wherein the lid and the adhesive support structure define a cavity.
5. The method of claim 4 wherein the device, the adhesive support structure and the lid substantially prevent mold compound from migrating into the cavity during molding.
6. The method of claim 1 further comprising: connecting an electrical conductor between the device and an external conductive element, wherein molding the package further comprises covering the electrical conductor.
7. The method of claim 1 wherein the active region is populated with one or more microelectronic devices .
8. The method of claim 7 wherein the one or more microelectronic devices comprise one or more optical devices, and wherein the lid is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices .
9. The method of claim 8 wherein the lid is glass.
10. The method of claim 1 wherein molding the package comprises molding a substantially opaque package.
11. The method of claim 1 further comprising substantially sealing the package.
12. The method of claim 11 wherein substantially sealing the package comprises: forming a substantially impermeable housing around the package ; and sealing a first gap between the substantially impermeable housing and the lid.
13. The method of claim 12 wherein forming the substantially impermeable housing around the package comprises: prior to molding the package, placing the substantially impermeable housing inside the mold; and wherein molding the package comprises integrating the substantially impermeable housing into the microelectronic assembly.
14. The method of claim 13 wherein the substantially impermeable housing is a material selected from the group consisting of: ceramic, metal and glass.
15. The method of claim 12 wherein sealing the first gap comprises : forming a metallic layer on an upper surface of the lid; and applying a bead between the metallic layer and a metallic part of the substantially impermeable housing.
16. The method of claim 15 wherein forming the metallic layer on the upper surface of the lid comprises depositing the metallic layer near a peripheral edge of the upper surface.
17. The method of claim 12 further comprising: positioning the device in contact with a substantially impermeable substrate; and sealing a second gap between the substantially impermeable housing and the substantially impermeable substrate .
18. The method of claim 17 wherein sealing the second gap comprises applying a bead across the second gap.
19. The method of claim 12 wherein the substantially- impermeable housing defines an aperture that is aligned with the lid.
20. The method of claim 1 wherein molding the package comprises : forming one or more alignment features in an upper surface of the package, wherein the one or more alignment features are adapted to engage corresponding alignment features on an optics assembly.
21. The method of claim 20 further comprising: positioning the optics assembly above the package so that the one or more alignment features in the upper surface of the package engage the corresponding alignment features on the optics assembly.
22. The method of claim 20 further comprising: positioning one or more pins inside the mold prior to molding the package, wherein forming the one or more alignment features comprises capturing the one or more pins in mold compound so that the one or more pins extend from the upper surface of the package .
23. The method of claim 20 wherein forming the one or more alignment features comprises forming a structure from mold compound .
24. The method of claim 23 wherein the structure extends upward from the upper surface of the package and defines an aperture that is adapted to receive the optics assembly.
25. The method of claim 24 wherein the aperture is substantially cylindrical with internal screw threads, and wherein at least a portion of the optics assembly has a substantially cylindrical body with external screw threads adapted to engage the internal screw threads of the substantially cylindrical aperture.
26. The method of claim 23 wherein the structure comprises a recess in the upper surface of the package and wherein the alignment features on the optics assembly are adapted to engage the recess .
27. A method of forming a microelectronic assembly, the method comprising: providing a device having an upper surface with an active region,- positioning a support structure adjacent to the active region but not extending onto the active region; positioning a lid in contact with the support structure and extending over the active region, wherein the lid and the support structure define a substantially empty cavity; pressing the lid against a mold surface that is contoured to complement the lid; and while pressing the lid against the mold surface, molding a package contiguous to the lid.
28. The method of claim 27 wherein pressing the lid against the mold surface comprises pressing a surface of the lid facing away from the device against the mold surface to substantially prevent mold compound from migrating across the surface of the lid during molding.
29. The method of claim 27 wherein the device, the support structure and the lid substantially prevent mold compound from migrating into the cavity during molding.
30. The method of claim 27 wherein the active region is populated by one or more optical devices and wherein the lid is substantially transparent to electromagnetic radiation at wavelengths that are relevant to the one or more optical devices.
31. The method of claim 27 further comprising: forming a substantially impermeable housing around the package; and sealing a first gap between the substantially impermeable housing and the lid.
32. The method of claim 31 wherein forming the substantially impermeable housing around the package comprises : prior to molding the package, placing the substantially impermeable housing inside the mold; and wherein molding the package comprises integrating the substantially impermeable housing into the microelectronic assembly.
33. The method of claim 32 wherein sealing the first gap comprises : forming a metallic layer near a peripheral edge of an upper surface of the lid; and applying a bead between the metallic layer and a metallic part of the substantially impermeable housing.
34. The method of claim 32 further comprising: positioning the device in contact with a substantially impermeable substrate; and sealing a second gap between the substantially impermeable housing and the substantially impermeable substrate .
35. The method of claim 34 wherein sealing the second gap comprises applying a bead across the second gap.
36. The method of claim 27 wherein molding the package comprises : forming one or more alignment features in an upper surface of the package, wherein the one or more alignment features are adapted to engage corresponding alignment features on an optics assembly.
37. The method of claim 27 further comprising: positioning the optics assembly above the package so that the one or more alignment features in the upper surface of the package engage the corresponding alignment features on the optics assembly.
38. A method of sealing a microelectronic assembly, the method comprising: providing a microelectronic assembly comprising: a device with an active region; a support structure on an upper surface of the device; a lid in contact with the support structure and extending over the active region; and a package contiguous with the lid; forming a substantially impermeable housing around the package ; and sealing a first gap between the substantially impermeable housing and the lid.
39. The method of claim 38 wherein forming the substantially impermeable housing around the package comprises: prior to molding the package, placing the substantially impermeable housing inside the mold; and wherein molding the package comprises integrating the substantially impermeable housing into the microelectronic assembly.
40. The method of claim 38 wherein the substantially impermeable housing is a material selected from the group consisting of: ceramic, metal and glass.
41. The method of claim 38 wherein sealing the first gap comprises : forming a metallic layer on an upper surface of the lid; and applying a bead between the metallic layer and a metallic part of the substantially impermeable housing.
42. The method of claim 41 wherein forming the metallic layer on the upper surface of the lid comprises: depositing the metallic layer near a peripheral edge of the upper surface .
43. The method of claim 38 further comprising: positioning the device in contact with a substantially impermeable substrate; and sealing a second gap between the substantially impermeable housing and the substantially impermeable substrate.
44. The method of claim 43 wherein sealing the second gap comprises applying a bead across the second gap.
45. A microelectronic assembly comprising: a device having an active region; an adhesive support structure adjacent to the active region but not extending onto the active region,- a lid in contact with the adhesive support structure and extending over the active region; a package contiguous with the lid but not extending over an upper surface of the lid.
46. The microelectronic assembly of claim 45 wherein the lid and the adhesive support structure define a cavity.
47. The microelectronic assembly of claim 46 wherein the device, the adhesive support structure and the lid are positioned relative to each other so as to substantially prevent mold compound from migrating into the cavity during molding.
48. The microelectronic assembly of claim 45 further comprising: an electrical conductor connecting the device to an external conductive element, wherein the package covers the electrical conductor.
49. The microelectronic assembly of claim 45 wherein the active region includes one or more optical devices, and wherein the lid is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices .
50. The microelectronic assembly of claim 49 wherein the lid is glass.
51. The microelectronic assembly of claim 45 wherein the package is substantially opaque.
52. The microelectronic assembly of claim 45 further comprising a substantially impermeable housing around the package .
53. The microelectronic assembly of claim 52 wherein the substantially impermeable housing is a material selected from the group consisting of: ceramic, metal and glass.
54. The microelectronic assembly of claim 52 further comprising: a metallic layer on an upper surface of the lid; and a bead between the metallic layer and a metallic part of the substantially impermeable housing.
55. The microelectronic assembly of claim 45 further comprising: a substantially impermeable substrate, wherein the device is in contact with the substantially impermeable substrate; and a bead across a second gap between the substantially impermeable housing and the substantially impermeable substrate.
56. The microelectronic assembly of claim 45 wherein the substantially impermeable housing defines an aperture that is aligned with the lid.
57. The microelectronic assembly of claim 45 wherein the package comprises: one or more alignment features in an upper surface of the package ; and an optics assembly with corresponding alignment features, wherein the one or more alignment features in the upper surface are engaged to the corresponding alignment features on the optics assembly.
58. The microelectronic assembly of claim 57 wherein the one or more alignment features comprise structures formed from mold compound.
59. A microelectronic assembly comprising: a device having an active region; a support structure adjacent to the active region but not extending onto the active region; a lid in contact with the support structure and extending over the active region, wherein the lid and the support structure define a substantially empty cavity; and a package contiguous with the lid.
60. The microelectronic assembly of claim 59 wherein the device, the support structure and the lid substantially prevent mold compound from migrating into the cavity during molding.
61. The microelectronic assembly of claim 59 wherein the active region is populated by one or more optical devices and wherein the lid is substantially transparent to electromagnetic radiation at wavelengths that are relevant to the one or more optical devices.
62. The microelectronic assembly of claim 59 further comprising: a substantially impermeable housing around the package ; and a metallic layer near a peripheral edge of an upper surface of the lid; and a bead between the metallic layer and a metallic part of the substantially impermeable housing.
63. The microelectronic assembly of claim 62 further comprising: a substantially impermeable substrate in contact with the device; and a bead between the substantially impermeable substrate and the substantially impermeable housing.
64. The microelectronic assembly of claim 59 further comprising: an optics assembly above the package, wherein the package comprises one or more alignment features in an upper surface thereof, and wherein the one or more alignment features in the upper surface of the package engage corresponding alignment features on the optics assembly.
65. A microelectronic assembly comprising: a device with an active region; a support structure on an upper surface of the device; a lid in contact with the support structure and extending over the active region; a package contiguous with the lid; a substantially impermeable housing around the package ; a metallic layer on an upper surface of the lid; and a bead between the metallic layer and a metallic part of the substantially impermeable housing.
66. The microelectronic assembly of claim 65 wherein the substantially impermeable housing is a material selected from the group consisting of: ceramic, metal and glass.
67. The microelectronic assembly of claim 65 wherein the metallic layer is near a peripheral edge of the lid's upper surface .
68. The microelectronic assembly of claim 65 further comprising: a substantially impermeable substrate in contact with the device; and a bead between the substantially impermeable housing and the substantially impermeable substrate.
PCT/US2007/026048 2006-12-29 2007-12-20 Microelectronic devices and methods of manufacturing such devices WO2008082565A1 (en)

Applications Claiming Priority (6)

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US64871806A 2006-12-29 2006-12-29
US11/648,718 2006-12-29
US72636607A 2007-03-21 2007-03-21
US11/726,366 2007-03-21
US98596207A 2007-11-19 2007-11-19
US11/985,962 2007-11-19

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