WO2007102605A1 - Plating method, electroconductive film, process for producing the electroconductive film, and light-transparent electromagnetic wave shielding film - Google Patents

Abstract

This invention provides a method for electroplating on a mesh pattern on a film having high surface resistivity evenly without increasing the line width, and an electroconductive film having excellent electroconductivity and a light-transparent electromagnetic wave shielding film having excellent electromagnetic wave shielding effect using the method. In the method for continuously electroplating an identical type of a noble metal on the surface of a film having a surface resistivity of 1 to 1000 Ω/□ using a continuously provided plurality of elctroplating tanks, the accumulated plating electrification amount in the former part from the upstream toward the downstream of the plurality of electroplating tank is not less than 14.40% and less than 50.20% based on the total accumulated plating electrification amount.

Description

 Specification

 Plating treatment method, conductive film and manufacturing method thereof, and translucent electromagnetic wave shielding film

 Technical field

 The present invention relates to a plating method, a conductive film obtained using the same, and a translucent electromagnetic wave shielding film.

 Background art

 In recent years, electromagnetic wave shielding films used for flexible wiring boards and plasma displays used for electronic devices and the like have been developed. This development requires a technique for forming a metal conductive thin film on the resin film.

 For example, Patent Document 1 discloses a method for producing an electromagnetic wave shielding film by exposing and developing a photosensitive material containing a silver salt, and further applying physical development or sticking treatment to the developed silver. The

[0003] When an electromagnetic wave shielding film is produced using the technique described in Patent Document 1, there is a necessary power S to form a metal film by plating the developed silver in order to improve electromagnetic wave shielding properties. However, developed silver has a high surface resistance and directly electrolyzes on the resin film, so the electrodeposition rate by plating is slow and productivity is poor.

On the other hand, Patent Document 2 proposes a technique for changing the glossiness after plating by adjusting the current density during electroplating.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2004-221564

 Patent Document 2: Japanese Patent Laid-Open No. 5-331697

 Disclosure of the invention

 Problems to be solved by the invention

[0006] However, Patent Document 2 does not disclose a technique of high surface resistance! /, And a technique of directly electrolyzing the resin film. The present invention has been made in view of the above-mentioned background, and is to provide a plating process method that can uniformly apply plating when performing a plating process on a film. A further object of the present invention is to provide a conductive film having excellent conductive properties and a translucent electromagnetic wave shielding film having an excellent electromagnetic wave shielding effect by using the above plating method.

Means for solving the problem

 As a result of diligent investigations to solve the above problems, the present inventors have found that when an electroconductive film is obtained by plating on a covering portion formed on a film, the amount of current ( If the energization amount is too low, scorching will occur and uneven plating will occur. On the other hand, if the current value is increased to suppress scorching, plating will be diffusion-controlled, and plating unevenness will likely occur. As a result, the present invention has been completed.

 (1) That is, the present invention uses an electrolytic plating apparatus having a plurality of continuous plating baths, and has a surface resistance of 1 to: ίΟΟΟ Ω / electrolytic plating of the same type of metal on the film surface of the mouth It is a method, Comprising: It is 14.40% or more and less than 50.20% with respect to the total accumulated energization amount power in the first half part toward the downstream from the upstream of a plurality of said continuous nudging tanks.

 (2) Further, the present invention is a staking treatment method in which a plurality of plating tanks are used for electrolytic staking continuously to a long film having a staking part, in the first half of the plurality of plating tubs. Cumulative energization amount power in the case of 14.14% or more and less than 50.20% of the total accumulated energization amount.

 (3) Further, the present invention is a plating process method in which a plurality of plating tanks are used for electrolytic plating continuously on a long film having a covered portion, and the first of the plurality of plating tanks. The plating tank includes a power supply roller, and the current value of the power supply roller is 1 to 30 mm.

According to the present invention, even when a plating process is performed on a film, it is possible to form a uniform plating layer that hardly causes uneven plating. In particular, when an attempt is made to obtain a conductive film by plating on a mesh that also has a fine metal wire force formed on a resin film, the metal fine wire is likely to be burnt and the wire width is likely to increase. By applying the plating treatment method of the present invention, uneven plating is suppressed, so that disconnection of the fine metal wire is suppressed and a fine metal wire having a desired line width can be formed. In the present invention, if the current value of the plating is increased too much, scoring occurs locally, and the current value is increased to such an extent that scoring does not occur. The inventors have experimented that plating unevenness is likely to occur when the speed is reduced, and that if the current value is sufficiently reduced, the plating unevenness will be worse than improved. Was born from the finding. Furthermore, from the study of the present invention, if an attempt is made to prevent uneven plating using a leveling agent or the like, the side portions of the mesh pattern are likely to be stuck, resulting in an unnecessary increase in line width. There is a problem that a desired thin line width cannot be obtained, and it is difficult for conventional technology to cause electrolysis on a mesh pattern without causing a burn or disconnection and without increasing the line width. Was also obtained.

 Further, by using the staking treatment method of the present invention, it is possible to uniformly apply plating even to a film having a high surface resistance, and further, in the conductive film, the line width of the mesh-like pattern is reduced. The conductivity can be effectively increased without increasing it.

 Moreover, it is preferable that this invention is the following aspects.

(4) Cumulative energization amount force in the first half of the plurality of plating tanks from upstream to downstream 20% or more and less than 50% (more preferably 25% or more and less than 45%) of the total accumulated energization amount The plating method as described in any one of (1) to (3) above, wherein

(5) The plating process according to (1) or (2), wherein the first plating tank among the plurality of plating tanks includes a power supply roller, and the current value of the power supply roller is 1 to 30A. Method.

 (6) The plating method according to any one of (1) to (5) above, wherein a current value of the power supply roller is 1 to 10A.

 (7) The plating method as described in any one of (1) to (6) above, wherein the film has a covering portion.

 (8) The maximum current value applied in the electroplating process is at least five times the current value applied to the first tank upstream of the plurality of electroplating tanks. The plating method according to any one of (1) to (7) above.

(9) The plating current value of the electrolytic plating bath after the completion of 90% of the electrolytic plating bath with multiple plating baths of the same type of precious metal The maximum current applied in the electrolytic plating bath The plating treatment according to any one of (1) to (8) above, wherein the plating treatment is smaller than the value Method.

 (10) The plating current value applied in the most downstream tank of the plurality of electrolytic plating tanks does not exceed the plating current value applied in the last tank of the first half. The plating method according to any one of (1) to (9).

 (11) The plating method according to any one of (1) to (10), wherein the metal is copper.

 (12) The plating method according to (1) to (11) above, wherein the film has a metal mesh pattern as a covering portion.

 (13) The plating method according to (12), wherein the metal mesh pattern is formed of developed silver.

 (14) A conductive film manufactured by a manufacturing method including the plating method described in (1) to (13) above, V.

 (15) A translucent electromagnetic wave shielding film comprising the conductive film described in (14) above.

 (16) A method for producing a conductive film that uses a plurality of plating tanks to continuously electrolytically adhere to a long film having a covering portion, and includes cumulative plating energization in the first half of the plurality of plating tanks. A method for producing a conductive film characterized in that it is 14.40% or more and less than 50.20% of the total cumulative energization amount.

The invention's effect

 According to the present invention, when plating is performed on a film, it is possible to form a uniform plating layer that is difficult to cause uneven plating. In particular, when an attempt is made to obtain a conductive film by plating on a mesh made of fine metal wires formed on a resin film, the thin metal wires are broken and the line width is likely to increase. By applying the plating method of the present invention, uneven plating is suppressed, so that disconnection of the fine metal wire is suppressed and a fine metal wire having a desired line width can be formed.

Further, by using the staking treatment method of the present invention, it is possible to uniformly apply plating even to a film having a high surface resistance, and further, in the conductive film, the line width of the mesh-like pattern is reduced. The conductivity can be effectively increased without increasing it. [0010] According to the plating treatment method of the present invention, plating can be uniformly applied even to a film having a high surface resistance. In addition, according to the plating method of the present invention, by setting a predetermined current value and controlling the amount of current in a plurality of plating tanks, plating is unevenly applied even to a film having a high surface resistance. Therefore, it is possible to apply electrolysis onto the mesh pattern without increasing the line width. Furthermore, a conductive film having excellent conductive properties and a translucent electromagnetic wave shielding film having an excellent electromagnetic wave shielding effect can be provided by using the staking treatment method. These can be incorporated into flexible wiring boards and plasma displays to improve conductivity and electromagnetic shielding performance.

 Brief Description of Drawings

 FIG. 1 is a diagram for explaining an electrolytic plating process in the present invention.

 FIG. 2 is a schematic diagram showing an example of an electrolytic plating bath suitably used in the plating method of the present invention.

 Explanation of symbols

[0012] 1 film

 11 Plating tank

 12a, 12b Feed roller

 13 Anode plate

 14 Guide roller

 15 Copper plating solution

 16 films

 17 Liquid roller

 BEST MODE FOR CARRYING OUT THE INVENTION

[0013] The plating treatment method of the present invention is a plating treatment method in which a plurality of plating tanks are used for electrolytic plating onto a film, and the cumulative amount of energization in the first half of the plurality of plating tanks is the total cumulative amount. 14.40% or more and less than 50.20% of the energization amount (more preferably 20% or more and less than 45%, more preferably 25% or more and less than 45%). Further, in the present invention, the first plating tank among the plurality of plating tanks is provided with a power supply roller, and the current value force of the power supply roller ^ to 30 A (more Preferably, 1 to: LOA). In the present invention, the same type of metal (copper that is preferred for noble metals is more preferable) is electroplated using an electroplating apparatus having a plurality of continuous plating baths. As described above, the energization amount (also cumulative energization amount) of the plurality of electrolytic plating baths is specified. In other words, it is characterized in that the cumulative plating energizing power in the first half from the upstream to the downstream of multiple electrolytic plating baths is 14.40% or more and less than 50.20% of the total accumulated energizing amount! /

 By specifying the cumulative amount of energization in the first half as described above, for example, the surface resistance is 1 to: L000 Ω / mouth, the surface resistance is high, and the resistance value unevenness is small even for the film. Therefore, it is possible to perform electrolysis plating with little uneven electrodeposition. In the case of initial electrolysis under low current conditions where the cumulative energization amount in the first half is less than 14.40%, or conversely, in the case of rapid initial electrolysis where it is 50.20% or more, the surface to be burned is burnt. It tends to cause unevenness in the texture (unevenness of the finished resistance value). The reason why scorching is likely to occur at the beginning of the high current condition seems to be because the voltage load is too strong at the place where the resistance is high. Become. The reason for this is unknown, but in any of the above cases, which are contradictory to each other, the electrodeposition reaction becomes diffusion-controlled electrolysis, which controls the supply of the metal to be electrodeposited, and it becomes easy to pick up uneven resistance values of the film itself. For the reason.

 In the method of the present invention in which the initial electrolysis is performed under low current electrolysis conditions, electrodeposition of the noble metal layer proceeds at a relatively slow V and speed, but the electrical resistance value of the mesh-like silver decreases with the progress of electrodeposition. In order to increase the productivity of the soldering process, the current value is increased to effectively increase the electrolysis rate and the cumulative amount of energization, and the semantic power that is preferred in the electroplating process is also applied. The maximum current value is preferably at least 5 times the current value applied to the uppermost stream (first tank) of a plurality of electrolysis baths, more preferably at least 7 times.

In the present invention, the maximum amount of current applied in the electroplating process is 5 times or more than the current value applied to the uppermost first tank of the plurality of electrolysis tanks. Is preferred. By the electroplating process in the first half, the film surface is stuck to some extent, and when the resistance value decreases, the current value is increased at once, so that the electroplating can be performed on the mesh pattern without increasing the line width. It becomes possible. The increase in line width is This is thought to be due to the fact that the part of the side of the shrunk pattern that is difficult to be attached is plated. By making diffusion-controlled, the partial force at the top of the pattern that can be easily plated is fastened.

 [0015] From the standpoint of uniformizing the electrodeposition layer thickness, it is more important to level the electrodeposition layer than the electrodeposition rate at the end of the electrodeposition process. After completion, the plating current value S of the electrolysis bath is preferably smaller than the maximum current value applied in the electroplating process, more preferably 0.5 times the maximum current value or less. It is preferable that From the same point of view, if the plating current value applied to the most downstream tank of the plurality of electrolytic plating tanks does not exceed the plating current value applied to the last tank in the first half, the same applies. Electrodeposition layer is convenient for leveling the thickness.

 [0016] Embodiments of the present invention will be specifically described below. First, the electroplating device will be described with reference to the figure.

 FIG. 1 is a diagram for explaining an electrolytic plating process in the present invention. Film 1 is a long film on which a portion to be plated is formed, and has a surface resistance of 1 to ίΟΟΟΩ / mouth. Film 1 is electrolyzed continuously in the order of the electrolysis baths a, b, c, d, e, and f in the direction of the arrow, that is, from upstream to downstream of the multiple electrolysis baths. The Figure 1 shows an embodiment using six electrolytic baths. In the present invention, “the first half of the plurality of electrolytic plating baths toward the downstream side” means the first half of the six electrolytic plating baths, that is, the electrolytic plating baths a, b, and c. In addition, the “uppermost first tank of a plurality of electrolytic plating tanks” is an electrolytic plating tank a in the form of FIG. “After 90% of the electroplating process is completed” means that 90% of all 6 tanks are 5.4 tanks. ). The “most downstream tank of the plurality of electrolytic plating tanks” is the electrolytic plating tank f. The “last tank in the first half” is the electrolysis bath c. If the number of tanks is an odd number, the middle tank is regarded as the boundary between the first half and the second half, and the tank does not belong to the first half.

 [0017] The number of all electrolytic baths is preferably 2 to 40, more preferably 4 to 30, and particularly preferably 10 to 20.

[0018] A plating apparatus (plating tank) for suitably carrying out the plating treatment according to the present invention is performed in order from a feeding reel (not shown) around which a film is wound, similarly to other known apparatuses. Next, the film fed out is subjected to acid washing and water washing treatment, and then sent to an electroplating tank for continuous plating. The plated film is sequentially placed on a reel for reeling (not shown). It has a configuration for winding.

 [0019] Fig. 2 shows an example of an electrolytic plating bath suitably used in the plating method according to the present invention. The electrolytic plating tank 11 shown in FIG. 2 is capable of continuously plating a long film 16. The arrow indicates the transport direction of the film 16.

 The electrolytic plating tank 11 stores a plating solution containing a metal such as copper (preferably a noble metal).

 In the electrolytic bath 11, a pair of anode plates 13 are arranged in parallel, and a pair of guide rollers 14 are arranged inside the pair of anode plates 13. The guide roller 14 is movable in the vertical direction, so that the processing time for the film 16 can be adjusted.

[0020] Above the electrolytic plating tank 11, power supply rollers (force swords) 12a and 12b for supplying and discharging the film 16 to and from the electrolytic plating tank 11 are disposed. In addition, a liquid draining roller 17 is disposed above the electrolytic bath 11 below the power feeding roller 12b on the carry-out side. Between the liquid draining roller 17 and the power feeding roller 12b on the carry-out side, Film force A water spray (not shown) is installed to remove the plating solution! However, the feeding roller 12b on the carry-out side is not always necessary.

 The film 16 unloaded from the electroplating tank 11 can be moved toward the next plating tank by the feed rollers 12a and 12b.

 The anode plate 13 is connected to a positive terminal of a power supply device (not shown) via an electric wire (not shown), and the power supply rollers 12a and 12b are connected to a negative terminal of the power supply device (not shown). The energization amount can be controlled by a predetermined circuit.

 As described above, the cathode is preferably in the form of power supply rollers 12a and 12b. Although the power supply roller may be full power supply or partial power supply, it is preferable to use full power supply because plating unevenness that hardly causes uneven current density is unlikely to occur. For this reason, it is preferable that all the portions of the power supply roller that are in contact with the film are made of conductive metal and the surface is flat.

In the electrolytic bath 11 described above, for example, when the size of the bath is 10 cm × 10 cm × 10 cm to 100 cm × 200 cm × 300 cm, the feeding roller 12a on the entrance side and the film 16 The distance between the lowermost part of the surface in contact with the plating solution surface (distance La shown in FIG. 2) is preferably 0.5 cm to l 5 cm, and 1 cm to more preferably LOcm. More preferably, it is set to 1 cm to 7 cm.

 The distance between the lowermost part of the surface where the power supply roller 12b on the outlet side is in contact with the film 16 and the plating solution surface (distance Lb shown in FIG. 2) is preferably 0.5 cm to 15 cm.

 In the latter half of the electroplating process, the resistance is low and a larger amount of current can be applied, so that plating can be performed in a wider range. Therefore, with regard to the size of the tank, particularly the depth, it is preferable that the electrolytic plating tank in the latter half is larger than the electrolytic plating tank in the first half, preferably 1.2 to 3 times, more preferably 1. 5 to 2.5 times.

 Next, a method for plating a film using the plating apparatus equipped with the electrolytic bath 11 will be described. Hereinafter, an example in which a copper plating solution is used will be described, but the present invention is not limited thereto. First, a copper plating solution is stored in the electrolytic plating bath 11.

 [0023] Various organic additives may be added to the copper plating solution. Preferred organic additives include organic compounds that suppress plating reactions (plating inhibitors), organic compounds that promote plating reactions (plating accelerators), and organic compounds that flatten barbarian films that are electrodeposited during the process of plating. (Plating leveling agent), and it is particularly preferable to add all of these, which preferably contain two or more selected from these strengths.

 [0024] The organic compound that suppresses the plating reaction is preferably a chain polymer having a water-soluble group. The chain polymer may be branched. The polymer may be composed of a single monomer or a copolymer of two or more monomers. The water-soluble group is preferably a hydroxyl group, a sulfate group, a sulfite group, a carboxyl group, or a phosphonate group, and particularly preferably a hydroxyl group. As the polymer component, in particular, the polymer component having an oxygen atom suppresses a plating reaction that easily adsorbs to the copper plating surface. It is preferable because the plating becomes uniform and dense because it is easily adsorbed to the outside of the hole where the plating reaction has progressed too much and is selectively suppressed.

As the polymer component, polyalkylene glycols are preferred. In this case, the carbon number of the alkylene group is preferably 2 to 8, more preferably 2 to 3. Specifically, polyethylene glycol, polypropylene glycol, polyethylene glycol 'polypropylene glycolate block copolymer type (pull nick type) surfactant, polyethylene glycol' polypropylene Glycol graft copolymerization type (tetronic type) surfactants, glycerin ethers, compounds with selected group strengths such as dialether strength can be used, preferably molecular weight 1000-10000, more preferably <2000- 6000 positive ethylene gale, molecular weight 100-5000, more preferred <is 200-2000 positive p-pile !; = 3—nore, molecular weight 1000-10000, J ri girls or 1500-4000 poge length · Posif. P-pillung !; = 3 A polyethylene block strength of 2000-6000 S is the most preferred. The chain polymer having a water-soluble group can be used alone or in combination of two or more. The polymer concentration is preferably 10-5000mgZL, more preferably 50-2000mg / L force! / ヽ.

 [0025] An organic compound having a sulfur-containing group is preferred as the compound that promotes the plating reaction. Examples of sulfur-containing yellow groups include sulfide groups, thiol groups (mercapto groups), sulfonic acid groups, sulfinic acid groups, and thiosulfuric acid groups. By including an organic compound having a sulfur-containing group, the plating reaction in the recesses that are difficult to be plated is efficiently promoted, so that the plating becomes uniform and dense, and the scratch resistance and heat resistance are improved. Specific examples of the organic compound having a sulfur-containing group include a sulfoalkyl sulfonic acid (the alkyl group has 1 to 10, preferably 2 to 4 carbon atoms) and a salt thereof, a bissulfo organic compound and a dithiorubamate derivative. A compound selected from the group, thiosulfuric acid or its salt strength can be used, and preferred specific examples include bis (3-sulfopropyl) disulfide (SPS), sodium mercaptopropanesulfonate (MPS) and the like. In addition, it is also preferable to use the compounds listed in column 0012 of JP-A-7-316875. The sulfur organic compounds may be used alone or in combination of two or more. The concentration of the sulfur organic compound is preferably 0.02 to 2000 mg / l ^, more preferably 0.1 to 300 mg / l ^! / ヽ.

 [0026] Further, a nitrogen compound is preferable as the organic compound for planarizing the metal growth film electrodeposited in the plating process. By including a nitrogen compound in the plating solution, preferably in combination with an organic compound that suppresses the plating reaction, the inhibitory organic compound is more diffusely controlled and selectively outside the mesh pattern hole. Adsorption is suppressed and the uniformity of the thickness is further improved.

Nitrogen compounds include polyalkyleneimines, 1-hydroxyethyl-2-alkylimines Dazoline salt, polydialkylaminoethyl acrylate, quaternary salt, polybulupyridine quaternary salt, polybulamidine, polyallylamine, polyaminesulfonic acid, auramine and its derivatives, methyl violet and its derivatives, crystal violet and its derivatives, Janus black and A derivative thereof, a compound selected from a group force having a Janus green force, can be used. The nitrogen compounds can be used alone or in combination of two or more. The concentration of the nitrogen compound is preferably 0.1 to LOOOmgZL, more preferably 0.5 to 150 mgZL.

 [0027] Examples of the copper source compound contained in the copper plating solution include a copper plating solution containing one or more of copper sulfate, copper borofluoride, copper chloride, copper pyrophosphate and the like. It is preferable to use a plating solution containing copper sulfate, such as a low bathing cost and easy management. It is more preferable to use a copper sulfate pentahydrate or a copper sulfate aqueous solution previously dissolved in water.

 In the copper plating solution, copper ion sources other than those described above can be used without particular limitation as long as they are copper compounds that can be dissolved in an acidic solution and can form an acidic copper plating solution having a pH of 3 or less. Specific examples of the copper ion source other than the above include copper oxides such as copper oxide, copper methanesulfonate and copper propanesulfonate, copper alkanol sulfonate such as copper propanolsulfonate, copper acetate and copper citrate. And organic acid copper such as copper tartrate and salts thereof. A copper compound can also be used individually by 1 type, and can also be used in combination of 2 or more type.

 [0028] The copper ion concentration in the copper plating solution is preferably 150 to 300 g / L, more preferably 150 to 250 g / L, in terms of the mass of copper sulfate pentahydrate. An even more preferable range is 180 to 220 g / L.

Usually, when electrolytic plating is performed, the copper ion concentration in the plating solution is often 80 to 100 g / L. However, when electrolytic plating is performed on a film having a high surface resistance as in the present invention, the current density per unit area increases because electrons do not easily reach a large area, and the copper ion concentration in a range normally used. Then, the supply of copper ions will be added to the supply of electrons! Hydrogen will be generated on the surface of the film, resulting in poor quality! Copper adhesion (so-called "burn") will adhere, and it will be uniform. It becomes difficult to form an adhesive film. Therefore, in the present invention, it is preferable that the copper ion concentration of the plating solution is 150 gZL or more. It can prevent plating and form a uniform and non-uniform plating film.

 Note that the copper ion concentration of 300 gZL or less was set to a preferable range, and even if it was used over 300 gZL, the effect was hardly increased and it was uneconomical, and it took time to dissolve and precipitation was likely to occur. Because there is.

 [0029] The acid collected in the plating solution is not particularly limited as long as the pH of the plating solution is kept sufficiently low, and examples thereof include sulfuric acid, nitric acid, hydrochloric acid and the like. The pH is preferably a force of 3 or less depending on the acid concentration, more preferably 1 or less. It is not preferable that the acidic copper plating liquid strength exceeds H3 because copper tends to precipitate.

 For example, when a plating solution containing copper sulfate is used, the concentration of sulfuric acid in the plating solution is preferably 30 to 300 gZL, more preferably 50 to 150 gZL. The pH varies depending on the sulfuric acid concentration, but is preferably 3 or less, more preferably 1 or less.

 [0031] The copper plating solution preferably contains chlorine ions in the solution, and preferably has a concentration of 20 to 150 mg / L. 30-: More preferably LOOmg / L. On the other hand, the copper plating replenisher may similarly add chlorine ions, but the effect of the present invention can be obtained without adding chlorine ions.

[0032] The current density on the force sword surface is 3 to 50 AZdm ² , preferably 5 to ²⁰ AZdm ² .

It is preferable to agitate the plating solution in the plating tank. Air agitation, pump agitation, anode agitation, film agitation, or a combination of these may be used. U, which is 0.05 to 2.00m ³ Zm ³ 'min (standard volume of air flowing in 1 minute to the unit liquid layer area).

 The bath temperature of the copper plating solution is 15 to 40, preferably 20 to 35 ° C.

[0033] After storing the copper plating solution in the electrolytic plating tank 11, the film 16 is set in a state where it is wound around a supply reel (not shown), and the surface on the side where the plating of the film 16 is to be formed The film 16 is wound around a conveyance roller (not shown) so that the power contacts 12a and 12b come into contact with each other. A voltage is applied to the anode plate 13 and the feed rollers 12a and 12b, and the film 16 is conveyed while being in contact with the feed rollers 12a and 12b. Film 16 is introduced into electrolytic bath 11 and immersed in copper plating solution 15 for copper plating. When passing between the liquid draining rollers 17, the copper plating solution 15 adhering to the film 16 is wiped off and collected in the electrolytic plating bath 11. The film 16 is washed with water and wound on a wrinkle reel (not shown) after the plating process is completed or when each staking process is completed.

[0034] The conveyance speed of the film 16 is preferably set in the range of 0.5 mZ to 30 mZ. The conveyance speed of the film 16 is more preferably in the range of lmZ min to 10 mZ, and still more preferably in the range of 1.5 mZ min to 5 mZ min.

[0035] The applied voltage is preferably in the range of 1V to 100V, more preferably in the range of 2V to 60V. It is preferable that the applied voltage in the electrolytic bath is gradually lowered by applying a force in the film traveling direction. Moreover, as a current value of the 1st tank, 1-30A is preferable 1-10A is more preferable 2A-10A is further more preferable. This current is when the film width is 24 cm, and it is preferably 1/24 to 30/24 mm when converted per lcm film width. In this case, it is 0.042-0.158A. I especially like the power!

 In some cases, the width of the film may be changed. In that case, the current value is changed according to the film width W, but the current value at this time is preferably WX (1/24) to WX (30/24) A, and WX (1/24) to WX (10/24) A is more preferable (0.04 XW) to (0.158 XW) A is more preferable. That is, in the method of the present invention, the current value is controlled according to the film width W, and the current value of the power feeding roller is preferably WX (1/24) to WX (30/24) A. It is preferable that 12b is in contact with the entire surface of the film (substantially electrically in the contact area, 80% or more).

 The applied voltage is preferably in the range of IV to: LOOV, more preferably in the range of 2V to 60V. It is preferable that the applied voltage in the electrolytic bath is gradually lowered by applying a force in the film traveling direction. In addition, the current value of the first plating tank among the multiple plating tanks is 0.04 to 1.25 A as the current value per lcm in the direction perpendicular to the film transport direction, and 0.04 to 0.5 A. Is more preferably 0.08-0.5A. It is preferable that the feeding rollers 12a and 12b are in contact with the entire surface of the film (substantially electrically in the contact area, and the portion that is 80% or more).

[0036] It should be noted that a shower or the like is provided near the film between the power supply rollers 12a and 12b and the power supply rollers 12a and 12b and the liquid level of the fitting liquid to cool the power supply rollers 12a and 12b and the film 16. It is preferable to reject.

 [0037] It is preferable to perform water washing and acid washing before the plating treatment in the electrolytic bath. The treatment solution used for the acid cleaning can be one containing sulfuric acid or the like.

 [0038] By performing the plating process as described above, a copper conductive metal film is plated on the film surface. When the plated film is used as an electromagnetic shielding film for a display, the thinner the conductive metal film, the wider the viewing angle of the display, which is preferable. Also, when a film is used as a conductive wiring material, a thin film is required because of the demand for higher density. From this point of view, the thickness of the conductive metal film to be plated is preferably less than 9 μm, more preferably 0.1 m or more and less than 5 μm. More preferably, it is not less than m and less than 3 μm.

 [0039] It should be noted that the plating treatment method of the present invention, when applied to a film having a surface resistance of 1 to 5 ° Ω, can suppress unevenness that normally occurs. . The preferred range of the surface resistance is 5 to 500 Ω well, the more preferred range is 10 to: ΟΟΟΟ Ω well, and the more preferred V ヽ range is 30 to 50 Ω well.

 As long as the surface resistance of the film that is the subject of the present invention is within the above range as long as it is a film having a covering portion, the effects of the present invention are sufficiently exhibited. Examples of the film having a covering portion include a film obtained by subjecting a support surface to some conductive sputtering, a film provided with a vacuum deposited thin film, and a film formed with a conductive polymer. The film having a covering portion of the present invention is particularly preferably a developed film obtained by subjecting a silver salt photosensitive material to the operation described later.

More specifically, the film having a covering portion is desirably a film having a metal mesh pattern (metal mesh pattern). As the metal, gold, silver, copper and the like are preferable as the metal having conductivity, but silver is more preferable. The metal mesh pattern on the film is preferably continuous (not electrically interrupted). If even a part of the conductive pattern is disconnected, there is a risk that the first electrolyzing bath may become unstickable or uneven. By applying the staking process on the continuous metal mesh pattern, A conductive metal film is formed on a metal mesh, and the film after plating (conductive film) is useful as, for example, a printed wiring board or PDP electromagnetic shielding film formed on an insulator film.

 In general, “mesh” is a unit representing the density of sieve meshes. In this specification, “mesh” refers to a mesh-like sieve according to conventional usage in the art.

[0040] The metal mesh pattern may be formed by a shift method, but is preferably formed by developed silver. As the film having a silver mesh pattern formed by developed silver, it is preferable to use a film formed by exposing and developing a photosensitive material having an emulsion layer containing a silver salt emulsion on a support. The structure of the photosensitive material and the method for producing a film having a silver mesh pattern formed from developed silver using the photosensitive material will be described below.

 As described above, the present invention is most preferably applied to a silver mesh pattern obtained by subjecting a photographic emulsion having a silver salt emulsion layer on a support to mesh pattern exposure and development. The pattern becomes a solid light-transmitting electromagnetic wave shielding film without unevenness by the plating treatment of the present invention. Therefore, in the following, the steps other than the plating treatment in the series of steps for obtaining a light-transmitting electromagnetic wave shielding film from a silver salt emulsion will be described.

[0041] 1. Photosensitive material L agent layer]

 The light-sensitive material preferably has an emulsion layer containing a silver salt emulsion as a photosensor on a support. In order to form an emulsion layer on a support, it is possible to use a known coating technique. In addition to the silver salt emulsion, the emulsion layer may contain a dye, a binder, a solvent and the like as required. Hereinafter, each component constituting the emulsion layer will be described.

 (Dye)

The emulsion layer may contain a dye. The dye is included as a filter dye or for various purposes such as prevention of irradiation. The dye may contain a solid dispersion dye. Examples of the dye preferably used include dyes represented by the general formula (FA), general formula (FA1), general formula (FA2), and general formula (FA3) described in JP-A-9-179243. Specifically, compounds F1 to F34 described in the publication are preferable. In addition, JP-A-7 -(112-2) to (Π-24) described in JP-A-152112, (I II-5) to (III-18) described in JP-A-7-152112, and ( IV-2) to (IV-7) are also preferably used.

 [0042] In addition, as dyes that can be used, solid fine particle dispersed dyes that are decolored during development or fixing processing include cyanine dyes, pyrylium dyes, and amino acids described in JP-A-3-138640. Um dye. Further, as dyes that do not decolorize during processing, cyanine dyes having a carboxyl group described in JP-A-9-96891, cyanine dyes that do not contain an acid group described in JP-A-8-245902, and 8-333519 Lake cyanine dyes described in Japanese Patent Application Laid-Open No. 1-266536, cyanopolar cyanine dyes described in Japanese Patent Application Laid-Open No. 3-36038, pyrylium dyes described in Japanese Patent Application Laid-Open No. 62 299959, Polymer type cyanine dye described in Japanese Patent No. 253639, solid fine particle dispersion of oxonol dye described in Japanese Patent Application Laid-Open No. 2-282244, light scattering particle described in Japanese Patent Application Laid-Open No. 63-131135, Yb3 described in Japanese Patent Application Laid-open No. 9 5913 + Compounds and ITO powders described in JP-A-7-113072 and the like. Further, dyes represented by the general formula (F1) and general formula (F2) described in JP-A-9-179243, specifically, compounds F35 to F112 described in the same publication can also be used.

 [0043] The dye may contain a water-soluble dye. Such water-soluble dyes include oxonol dyes, benzylidene dyes, merocyanine dyes, cyanine dyes and azo dyes. Of these, oxonol dyes, hemioxonol dyes, and benzylidene dyes are useful. Specific examples of water-soluble dyes include British Patent Nos. 584, 609, 1, 177, 429, JP-A-48-85130, ^ 149-99620, and 49-114420. Gazette, Nos. 52-20822, 59-154439, 59-208548, U.S. Pat.Nos. 2,274,782, 2,533,472, 2,956 No. 879, No. 3, 148, 187, No. 3, 177, 078 No. 3, No. 3, 247, 127 No. 3, No. 3, 540, 887 No. 3, 575 No. 704, No. 3, 653, 905, and No. 3, 718, 427.

[0044] The content of the dye in the emulsion layer has an effect of preventing irradiation, From the viewpoint of a decrease in sensitivity due to an increase in the amount, 0.01 to 10% by mass is preferable with respect to the total solid content, and 0.1 to 5% by mass is more preferable.

[0045] (Silver salt emulsion)

 Examples of the silver salt emulsion include inorganic silver salts such as halogen silver and organic silver salts such as silver acetate. It is preferable to use a halogen silver emulsion that has excellent characteristics as an optical sensor. Techniques used for silver halide photographic film, photographic paper, printing plate making film, emulsion mask for photomask, etc. relating to halogenated silver can also be used in the photosensitive material according to the present embodiment.

 [0046] The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, halogen silver containing mainly AgCl, AgBr and Agl is preferably used, and halogen silver containing mainly AgBr and AgCl is preferably used. Silver chlorobromide, silver iodochlorobromide and silver iodobromide are also preferably used. Silver chlorobromide, silver bromide, silver iodochlorobromide and silver iodobromide are more preferable, and silver chlorobromide and iodochlorobromide containing 50 mol% or more of silver chloride are most preferable. Silver is used.

 [0047] Here, "halogenated silver mainly composed of AgBr (silver bromide)" refers to silver halide having a bromide ion mole fraction of 50% or more in the silver halide composition. . The silver halide grains mainly composed of AgBr may contain iodide ions and chloride ions in addition to bromide ions.

 [0048] Silver and silver halide are in the form of solid grains. From the viewpoint of the shape of the silver mesh pattern formed after exposure and development, the average grain size of silver halide is 0. 1 to 1 OOOnm d / zm) is preferred. 0.1 to 100 nm is more preferred. 1 to 5 Onm is even more preferred.

 The spherical equivalent diameter of silver halide grains is the diameter of the grains having a spherical shape and the same volume.

 [0049] The shape of the silver halide grains is not particularly limited, and for example, various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, tetragonal flat plate shape, etc.), octahedral shape, tetrahedral shape, etc. The cubic shape and the tetrahedron shape are preferable.

The silver halide grains can have a uniform internal and surface layer, or they can be different. Moreover, you may have the localized layer from which a halogen composition differs in a particle | grain inside or the surface.

 [0050] A silver halide emulsion, which is a coating solution for an emulsion layer, was produced by P. Glalkides, Chimie et Physique P hotographique (Paul Montei, published 196 / year u. F. Dunn Photographic Emulsion Chemistry (The Focal Press, 1966 And VLZelikmani, Making and Coating Photographic Emulsion (published by The Focal Press, 1964) and the like.

 [0051] That is, as a method for preparing the silver halide emulsion, either an acidic method or a neutral method may be used, and a method of reacting a soluble silver salt with a soluble halogen salt may be a one-side mixing method. Any of a simultaneous mixing method, a combination thereof, and the like may be used.

 Further, as a method for forming silver particles, a method of forming particles in the presence of excess silver ions (so-called back mixing method) can also be used. Further, as one type of the simultaneous mixing method, a method of keeping pAg constant in a liquid phase in which halogenated silver is formed, that is, a so-called controlled double jet method can be used.

 It is also preferable to form grains using a so-called halogenated silver solvent such as ammonia, thioether or tetrasubstituted thiourea. Such a method is more preferably a tetra-substituted thiourea compound, which is described in JP-A Nos. 53-82408 and 55-77737.

Preferred thiourea compounds include tetramethylthiourea and 1,3-dimethyl-2-imidazolidinethione. Harogeni匕銀amount of the solvent, the particle size of the type of compound and the purpose of use, 10 one ⁵ to ^10-2 mol, per different force Harogeni匕銀1 mol by halogen composition are preferred.

[0052] The controlled double jet method and the grain forming method using a halogenated silver solvent are preferably used because the crystal form is regular and the grain size distribution is narrow, and it is easy to produce a halogenated silver emulsion. Can do.

In order to make the grain size uniform, as described in British Patent No. 1,535,016, JP-B-48-36890, JP-B-52-16364, silver nitrate or halogenated silver is used. A method of changing the alkali addition rate according to the particle growth rate, as described in British Patent No. 4,242,445, JP-A-55-158124, etc. Using the method of changing the concentration of the aqueous solution, it is preferable to grow silver as quickly as possible without exceeding the critical saturation.

 Monodisperse emulsions are preferred for the formation of silver halide emulsions used in the formation of emulsion layers {(standard deviation of grain size) Z (average grain size)} It is preferably 15% or less, and most preferably 10% or less.

 In the silver halide emulsion, a plurality of types of silver halide emulsions having different grain sizes may be mixed.

 [0053] The silver halide emulsion may contain a metal belonging to Group VIII or Group VIIB. In particular, in order to achieve high contrast and low capri, it is preferable to contain a rhodium compound, an iridium compound, a ruthenium compound, an iron compound, an osmium compound and the like. These compounds are compounds having various ligands, and may be, for example, cyanide ions, halogen ions, thiocyanate ions, nitrosino ions, water, hydroxide ions, In addition to such pseudohalogens and ammonia, organic molecules such as amines (methylamine, ethylenediamine, etc.), heterocyclic compounds (imidazole, thiazole, 5-methylthiazole, mercaptoimidazole, etc.), urea, thiourea, etc. it can. For higher sensitivity, K [Fe (CN)) ^> K [Ru (CN)], K [Cr (CN)]

 4 6 4 6 3 6 Doping of a metal hexasyanide complex is advantageously performed.

[0054] As the rhodium compound, a water-soluble rhodium compound can be used. Examples of the water-soluble rhodium compounds include rhodium halide (III) compounds, hexachlororhodium (III) complex salts, pentachloroacorhodium complex salts, tetrachlorodiacolodium complex salts, hexabromorhodium (III) complex salts, hexanes. Examples include ammine rhodium (III) complex salt, trizalatrdium (III) complex salt, and K Rh Br.

 3 2 9

 These rhodium compounds are used by dissolving in water or a suitable solvent, but are generally used in order to stabilize the solution of the rhodium compound, that is, an aqueous hydrogen halide solution (for example, hydrochloric acid, odorous acid, Hydrofluoric acid, etc.) or halogenated alkali (eg κ

Cl, NaCl, KBr, NaBr, etc.) can be used. Instead of using water-soluble rhodium, it is also possible to add other halogen silver particles doped with rhodium and dissolve it at the time of preparing the silver halide silver. [0055] Examples of the iridium compound include Hexaclo oral iridium complex salts such as K IrCl and K IrCl,

 2 6 3 6

 Hexabromoiridium complex salts, hexammine iridium complex salts, pentachloro-trosyl iridium complex salts and the like.

 Examples of the ruthenium compound include hexaclonal ruthenium, pentachloro-trosyl ruthenium, K [Ru (CN)] and the like.

 4 6

 Examples of the iron compound include potassium hexanoate (π) and ferrous thiocyanate.

 The above ruthenium and osmium are in the form of water-soluble complex salts described in JP-A-63-2042, JP-A-1-285941, JP-A-2-20852, JP-A-2-20855, etc. Particularly preferred are hexacoordination complexes represented by the following formula.

[ML] ^-n

 6

 (Here, M represents Ru or Os, and n represents 0, 1, 2, 3 or 4.)

 In this case, the counter ion has no significance, and for example, ammonium or alkali metal ions are used. Preferable ligands include a halide ligand, a cyanide ligand, a cyan oxide ligand, a nitrosyl ligand, a thionitrosyl ligand, and the like. Examples of specific complexes used in the present invention are shown below, but the present invention is not limited thereto.

[0057] [RuCl] — ³ , [RuCl (Η Ο) Υ [RuCl (NO)] ” ² , [RuBr (NS)] — ² , [Ru (CO) CI]

 6 4 2 2 5 5 3 3

- ^2, [Ru (CO) Cl] - ^2, [Ru (CO) Br] - ^2, [OsCl] ^{- 3, [OsCl (NO)} ] "2, [Os (NO) (C

 5 5 6 5

N) Y [Os (NS) Br] - ^2, [Os (CN)] - ^4, [Os (0) (CN)] - ^4.

 5 5 6 2 5

[0058]添力卩量silver halide per mole of ^10-omega to ^10-2 mol Z mol Ag der Rukoto is preferred instrument 10 ⁹ ~ of these compounds: L0- ³ mol / mol Ag More preferably it is.

 [0059] In addition, halogen silver containing Pd (II) ions and Z or Pd metal can also be preferably used. Pd may be uniformly distributed in the silver halide grains, but is preferably contained in the vicinity of the surface layer of the silver halide grains. Here, Pd “contains in the vicinity of the surface layer of the halogenated silver particle” means that the surface force of the halogenated silver particle is within 50 nm in the depth direction and has a layer having a higher palladium content than the other layers. Means that.

Such silver halide grains are added with Pd during the formation of silver halide grains. It is preferable to add Pd after adding at least 50% of the total addition amount of silver ions and halogen ions, respectively. It is also preferable that Pd (II) ions be added to the surface layer of neurogenic silver by a method such as addition at the time of post-ripening.

[0060] The content of Pd ions and Z or Pd metal contained in the silver halide, the Harogeni spoon silver, 10- ^4-0 with respect to the number of moles of silver. It is preferably a 5 mol Z mol Ag More preferably, it is 0.01 to 0.3 mol Z mol Ag.

 Examples of the Pd compound used include PdCl and Na PdCl.

 4 2 4

 [0061] Further, in order to improve sensitivity as an optical sensor, chemical sensitization performed with a photographic emulsion can be performed. As the chemical sensitization method, sulfur sensitization, selenium sensitization, tellurium sensitization and the like, chalcogen sensitization, noble metal sensitization such as gold sensitization, reduction sensitization and the like can be used. These can be used alone or in combination. When the above chemical sensitization methods are used in combination, for example, sulfur sensitization method and gold sensitization method, sulfur sensitization method and selenium sensitization method and gold sensitization method, sulfur sensitization method and tellurium sensitization. A combination of sensitivity and gold sensitization is preferred.

[0062] The sulfur sensitization is usually performed by adding a sulfur sensitizer and stirring the emulsion at a high temperature of 40 ° C or higher for a predetermined time. As the sulfur sensitizer, known compounds can be used. For example, in addition to sulfur compounds contained in gelatin, various sulfur compounds such as thiosulfate, thioureas, and thiazoles can be used. , Rhodons, etc. can be used. Preferred sulfur compounds are thiosulfate and thiourea compounds. The addition amount of the sulfur sensitizer, pH during chemical ripening, temperature, changes in various conditions under such size of Harogeni匕銀particles, per mol of silver halide 10- ⁷ ~: LO- ² Mole is more preferred 1

[0063] As the selenium sensitizer used for the selenium sensitization, a known selenium compound can be used. That is, the selenium sensitization is usually carried out by adding unstable and Z or non-unstable selenium compounds and stirring the emulsion at a high temperature of 40 ° C. or higher for a predetermined time. As the unstable selenium compound, the compounds described in JP-B-44-15748, JP-A-43-13489, JP-A-4-109240, JP-A-4-324855 and the like can be used. . In particular, it is preferable to use compounds represented by the general formulas (VIII) and (IX) in JP-A-4-324855. [0064] The tellurium sensitizer used in the tellurium sensitizer is a compound that generates silver telluride, which is presumed to be a sensitization nucleus, on the surface or inside of a silver halide silver grain. The rate of silver telluride formation in the silver halide silver emulsion can be tested by the method described in JP-A-5-313284. Specifically, U.S. Pat.Nos. 1,623,499, 3,320,069, 3,772,031, British Patent 235,211, No. 1,121,496, No. 1,295,462, No. 1,396,696, Canadian Patent No. 800,958, JP-A-4-204640 Gazette, 4-271341, Gazette 4-333043, Gazette 5-303157, Journal 'Chemical Society ^ ~ Chemical' Communication (J.Chem.Soc.Chem.Commun.) 635 (1980), 1102 (1979), 645 (1979), Journal of 'Chemical' Society 'Perkin' Transaction (J.Chem.So Perkin.Trans.) 1 卷, 2191 (1980) ), S. Patai, The Chemistry of Organic Selenium and Tellurium Compounds, 1 卷 (1986), Can be used compounds described in 2 Certificates (1987). In particular, compounds represented by the general formulas (11), (111) and (IV) in JP-A-5-313284 are preferred.

[0065] The amount of the selenium sensitizer and a tellurium sensitizer, Harogeni匕銀particles used, but the chemical ripening condition and the like and, generally Harogeni匕銀per mole 10- ⁸ to 10- ² mol, better good Ku is 10- ⁷ ~: L0- ³ moles is used. The conditions for chemical sensitization in the present invention are not particularly limited, but the pH is 5 to 8, pAg is 6 to 11, preferably 7 to 10, and the temperature is 40 to 95 ° C, preferably 45 to 85. ° C.

[0066] Examples of the noble metal sensitizer include gold, platinum, noradium, iridium and the like, and gold sensitization is particularly preferable. Specific examples of gold sensitizers used for gold sensitization include salt and gold acid, potassium chromate orate, potassium thiothiocyanate, gold sulfide, tiodarcos gold (1), tiomannose gold ( I) and the like, can be used per mole 10- ^7-10 moles silver halide. A cadmium salt, a sulfite salt, a lead salt, a thallium salt, etc. may coexist in the halogen-silver emulsion used in the present invention in the process of halogen-silver particle formation or physical ripening. [0067] Reduction sensitization can be used for silver salt emulsions. As the reduction sensitizer, stannous salts, amines, formamidinesulfinic acid, silane compounds, and the like can be used. To the above silver halide emulsion, thiosulfonic acid compound may be added by the method shown in European Published Patent (EP) 293917. The silver halide emulsion used in the preparation of the light-sensitive material used in the present invention may be only one type, or two or more types (for example, those having different average grain sizes, those having different halogen compositions, and different crystal habits). , Different chemical sensitization conditions, and different sensitivities) may be used in combination. In particular, in order to obtain high contrast, it is preferable to apply an emulsion with higher sensitivity as it is closer to the support as described in JP-A-6-324426.

 [0068] (Binder)

 A binder can be used in the emulsion layer for the purpose of uniformly dispersing silver salt grains and assisting the adhesion between the emulsion layer and the support. As the binder, it is preferable to use a force water-soluble polymer that can use both a water-insoluble polymer and a water-soluble polymer as a binder.

 Examples of the binder include polysaccharides such as gelatin, polybutyl alcohol (PVA), polyvinylpyrrolidone (PVP), starch, cellulose and derivatives thereof, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, Examples include polyacrylic acid, polyalginic acid, polyhyaluronic acid, carboxycellulose, and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.

 [0069] The content of the binder contained in the emulsion layer is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited.

 [0070] (Solvent)

The solvent used for forming the emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, etc. , Esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof. The content of the solvent used in the emulsion layer is such as the silver salt and binder contained in the emulsion layer. Together The range of 30 to 90% by mass with respect to the total mass is preferred, and the range of 50 to 80% by mass is more preferred.

[0071] [Support]

 As the support used for the photosensitive material, a plastic film, a plastic plate, a glass plate and the like can be used.

 Examples of the raw material for the plastic film and plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene and EVA; Bulu resin such as vinyl and poly vinylidene; other polyether ether ketone (PEEK), polysulfone (PSF), polyether sulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin Fats, triacetyl cellulose (TAC), etc. can be used.

 In the present invention, the plastic film is preferably a polyethylene terephthalate film from the viewpoints of transparency, heat resistance, ease of handling, and cost.

 [0072] When the electroconductive film after the plating treatment is used as an electromagnetic wave shielding film for a display, the electromagnetic wave shielding film is required to be transparent. Therefore, it is desirable that the support has high transparency. ,. In this case, the total visible light transmittance of the plastic film or plastic plate is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%. In addition, the plastic film and the plastic plate may be colored so that there is no problem as a use of the conductive film.

 [0073] The plastic film and the plastic plate can be used as a single layer, but it is also possible to use a multilayer film in which two or more layers are combined.

 The thickness of the plastic film and the plastic plate is preferably 200 m or less, more preferably 20 μm to 180 μm, and most preferably 50 μm to 120 μm.

[0074] When a glass plate is used as the support, the type thereof is not particularly limited. However, when the conductive film is used as an electromagnetic shielding film for a display, a tempered glass having a reinforcing layer provided on the surface thereof may be used. preferable. It is more likely that tempered glass can prevent breakage than glass that has not been tempered. Furthermore, tempered glass obtained by the air cooling method is Even if one breakage occurs, the broken piece is small and the end face is not sharp.

[0075] [Protective layer]

 The light-sensitive material may be provided with a protective layer having a binder force such as gelatin or a high molecular weight polymer on the emulsion layer. By providing a protective layer, scratch prevention and mechanical properties can be improved. However, even if it is preferable not to provide the protective layer for the sticking treatment, a thinner one (thickness of, for example, 0 or less) is preferable. The formation method of the coating method of the said protective layer is not specifically limited, A well-known coating method can be selected suitably.

[0076] 2. Production of film with silver mesh pattern

 A film having a silver mesh pattern can be produced by subjecting the photosensitive material to exposure, development processing, and other processing as required. Hereinafter, each step will be described.

 [Exposure]

 The exposure can be performed using electromagnetic waves. Examples of electromagnetic waves include light such as visible light and ultraviolet rays, and radiation such as X-rays. Furthermore, a light source with a wavelength distribution may be used for exposure, or a light source with a specific wavelength may be used.

 [0077] Examples of the light source include scanning exposure using a cathode ray (CRT). A cathode ray tube exposure apparatus is simpler and more compact and less expensive than an apparatus using a laser. Also, the adjustment of the optical axis and color is easy. As the cathode ray tube used for image exposure, various light emitters that emit light in the spectral region are used as necessary. For example, one or more of a red light emitter, a green light emitter, and a blue light emitter are used in combination. The spectral region is not limited to the above red, green, and blue, and a phosphor that emits light in the yellow, orange, purple, or infrared region is also used. In particular, a cathode ray tube that emits white light by mixing these light emitters is often used. Also, mercury lamp g-line, mercury lamp i-line, etc., which are also preferred for ultraviolet lamps, are used.

Further, exposure can be performed using various laser beams. For example, a laser is a combination of a solid-state laser using a gas laser, light emitting diode, semiconductor laser, semiconductor laser, or semiconductor laser as an excitation light source and a nonlinear optical crystal. A scanning exposure method using monochromatic high-density light such as a second harmonic light source (SHG) can be preferably used, and a KrF excimer laser, ArF excimer laser, F2 laser, etc. can also be used. To make the system compact and inexpensive, exposure is

It is preferable to use a semiconductor laser, a semiconductor laser, or a second harmonic generation light source (SHG) that combines a solid-state laser and a nonlinear optical crystal. In order to design a compact, inexpensive, long-life and highly stable device, exposure is preferably performed using a semiconductor laser.

 [0079] Specifically, as the laser light source, a blue semiconductor laser with a wavelength of 430 to 460 nm (presented by Nichia Chemical at the 48th Applied Physics Related Conference in March 2001), a semiconductor laser (oscillation) LiNbO SH with a waveguide inversion domain structure

 Three

Approx. 530nm green laser, wavelength 685nm red semiconductor laser (Hitachi type No. HL6738MG), wavelength 650nm red semiconductor laser (Hitachi type No. HL6501MG), etc., are preferably used. It is done.

 [0080] In addition, it is preferable to perform exposure in a pattern such as a lattice. As a method of exposing in a pattern, it may be performed by surface exposure using a photomask or by scanning exposure using a laser beam. At this time, an exposure method such as contact exposure, proximity exposure, reduced projection exposure, reflection projection exposure, or the like, which can be either refractive exposure using a lens or reflection exposure using a reflecting mirror, can be used.

 [0081] [Development processing]

 The development process may be performed using a normal development process technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. There are no particular restrictions on the developer, but PQ developer, MQ developer, MAA developer, etc. can also be used. Commercial products such as CN-16, CR-56, CP45 X Developers such as FD-3, Papitol, C-41, E-6, RA-4, D-19, D-72, etc. prescribed by KODAK, or the developer included in the kit can be used. A lith developer can also be used.

 As the squirrel developer, D85 prescribed by KODAK can be used.

[0082] A dihydroxybenzene-based developing agent can be used as the developer. Dihydro Examples of the xylbenzene developing agent include hydroquinone, chlorohydroquinone, isopropylhydroquinone, methylhydroquinone, hydroquinone monosulfonate, and the like. Examples of auxiliary developing agents that exhibit superadditivity with the above-mentioned dihydroxybenzene-based developing agents include 1-phenolino 3-virazolidone and p-aminophenol. As the developer used in the production method of the present invention, a combination of a dihydroxybenzene developing agent and 1-phenolinovirazolidone; or a combination of a dihydroxybenzene developing agent and paminophenols is preferably used.

[0083] Examples of the developing agent used in combination with 1-phenol 3-virazolidone or a derivative thereof used as an auxiliary developing agent include 1-phenol-3-virazolidone, 1-phenyl-1,4-dimethyl. 1-pyrazolidone, 1-phenyl-4-methyl 4-hydroxymethyl-3-bisazolidone.

 Examples of P-aminophenol auxiliary developing agents include N-methyl p-aminophenol, ρ-aminophenol, N— (j8-hydroxyethyl) p-aminophenol, and N— (4-hydroxyphenol) glycine. Of these, N-methyl-paminophenol is preferred. The dihydroxybenzene-based developing agent is generally preferably used in an amount of 0.05 to 0.8 mol / L, more preferably 23 mol ZL or more, and more preferably 0. It is in the range of 23 to 0.6 mol / L. In the case of using a combination of dihydroxybenzenes with 1-phenol-3-bisazolidone or p-aminophenols, the former is 0.23-0.6 mol ZL, more preferably 0.23-0. 5 mol ZL, the latter being preferably used in an amount of 0.06 mol ZL or less, more preferably 0.03 mol ZL to 0.003 mol ZL.

[0084] Additives (eg, preservatives, chelating agents) that are usually used for the developer (hereinafter sometimes referred to simply as "developer" in which both the development starter and the developer replenisher are combined) Can be contained. Examples of the preservative include sulfites such as sodium sulfite, potassium sulfite, lithium sulfite, ammonium sulfite, sodium bisulfite, potassium metabisulfite, and sodium formaldehyde sodium bisulfite. The sulfite is preferably used in an amount of 0.20 mol ZL or more, more preferably in an amount of 0.3 mol ZL or more. If added too much, silver stains in the developer may be caused. . 2 mol ZL Is desirable. Particularly preferred is 0.35-0.7 mol ZL.

[0085] Further, as a preservative for a dihydroxybenzene developing agent, a small amount of an ascorbic acid derivative may be used in combination with a sulfite. Here, the ascorbic acid derivative includes ascorbic acid and its stereoisomer erythorbic acid and its alkali metal salts (sodium and potassium salts). As the ascorbic acid derivative, it is preferable to use sodium erythorbate in terms of material cost. The amount of the ascorbic acid derivative added is preferably in the range of 0.03 to 0.12 in terms of molar ratio with respect to the dihydroxybenzene developing agent, and more preferably in the range of 0.05 to 0.10. When an ascorbic acid derivative is used as the preservative, it is preferable that the developer does not contain a boron compound.

[0086] In addition to the above, additives that can be used in the developer include development inhibitors such as sodium bromide and potassium bromide; organic solvents such as ethylene glycol, diethylene glycol, triethylene glycol, and dimethylformamide. ; Development accelerators such as alkanolamines such as diethanolamine and triethanolamine, imidazole or derivatives thereof, and mercapto compounds, indazole compounds, benzotriazole compounds, and benzoimidazole compounds as capri-protecting agents Alternatively, it may be included as a black pepper inhibitor. Specific examples of the benzoimidazole compound include 5--troindazole, 5-p-trobenzoylaminoindazole, 1-methyl-5-troindazole, 6-toluindazole, 3-methyl-5--. Troindazole, 5 --- Trobenzimidazole, 2-Isopropyl-5-Trobenzimidazole, 5-Trobenstriazole, 4-[(2 Mercapto 1,3,4-thiadiazol-2-yl) thio] butanesulfone Examples include sodium acid, 5 amino-1,3,4 thiadiazole-2 thiol, methylbenzotriazole, 5 methylbenzotriazole, and 2 mercaptobenzotriazole. The content of these benzoimidazole compounds is usually from 0.01 to LOmmol, more preferably from 0.1 to 2mmol per liter of developer.

Further, various organic / inorganic chelating agents can be used in combination in the developer.

Examples of the inorganic chelating agent that can be used include sodium tetrapolyphosphate and sodium hexametaphosphate. On the other hand, the organic chelating agents mainly include organic carboxylic acids, aminopolycarboxylic acids, organic phosphonic acids, aminophosphonic acids, and organic phosphonocarboxylic acids. You can!

[0088] As is preferably developer per liter添Ka卩量these chelating agents, 1 X 10- ⁴ ~1 X

10 ¹ Monore, more preferably ί or 1 X 10 ³ to 1 X 10- ² Monore.

Further, as a silver stain preventing agent in the developer, JP-A-56-24347, JP-B-56-465

It is possible to use compounds described in Japanese Patent Publication No. 85, Japanese Examined Patent Publication No. 62-2849, and Japanese Unexamined Patent Publication No. Hei 4-362942.

 In addition, compounds described in JP-A-61-267759 can be used as dissolution aids. Further, the developer may contain a color toning agent, a surfactant, an antifoaming agent, a hardener, and the like as necessary.

 [0090] The development processing temperature and time are interrelated and are determined in relation to the total processing time. In general, the development temperature is preferably about 20 ° C to about 50 ° C, and more preferably 25 to 45 ° C. I like it. The development time is preferably 5 seconds to 2 minutes, more preferably 7 seconds to 1 minute 30 seconds.

 The development process can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part. For the fixing process, a technique of fixing process used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.

 [0092] Preferable components of the fixing solution used in the fixing step include the following.

That is, sodium thiosulfate, ammonium thiosulfate, and if necessary, tartaric acid, citrate, darconic acid, boric acid, iminodiacetic acid, 5-sulfosalicylic acid, darcoheptanoic acid, Thai diamine, ethylenediamine tetraacetic acid, diethylenetriaminepentaacetic acid, nitrite It is preferable to contain a salt of acetic acid. From the viewpoint of environmental protection in recent years, it is preferable not to contain boric acid. Examples of the fixing agent used in the fixing solution include sodium thiosulfate and ammonium thiosulfate. Ammonium thiosulfate is preferable from the viewpoint of fixing speed, but sodium thiosulfate is used from the viewpoint of environmental protection in recent years. May be used. The amount of these known fixing agents used can be appropriately changed, and is generally about 0.1 to about 2 mol Z liter. Particularly preferred is 0.2 to 1.5 mol Z liter. If desired, the fixer may contain a hardener (eg, a water-soluble aluminum compound), a preservative (eg, sulfite, bisulfite), a pH buffer (eg, acetic acid), a pH adjuster (eg, ammonia, Sulfuric acid), chelating agents, surface activity Agents, wetting agents, fixing accelerators.

 [0093] Examples of the surfactant include anionic surfactants such as sulfates and sulfones, polyethylene surfactants, and amphoteric surfactants described in JP-A-57-6740. It is done. A known antifoaming agent may be added to the fixing solution. Examples of the wetting agent include alkanolamine and alkylene glycol. Examples of the fixing accelerator include thiourea derivatives described in Japanese Patent Publication Nos. 45-35754, 58-122535, and 58-122536; alcohols having triple bonds in the molecule; Examples include thioether compounds described in US Pat. No. 4126459; mesoionic compounds described in JP-A-4-229860, and compounds described in JP-A-2-44355 may be used. Examples of the pH buffer include organic acids such as acetic acid, malic acid, succinic acid, tartaric acid, citrate, oxalic acid, maleic acid, glycolic acid and adipic acid, boric acid, phosphate and sulfite. Inorganic buffers such as can be used. As the pH buffer, acetic acid, tartaric acid, and sulfite are preferably used. Here, the pH buffer is used for the purpose of preventing the pH of the fixing agent from rising due to the introduction of the developer, and is preferably 0.01 to: L 0 mol Z liter, more preferably 0.02 to 0.6. Use about mol Z liters. The pH of the fixing solution is preferably 4.0 to 6.5, and particularly preferably 4.5 to 6.0. Further, it is possible to use a compound described in JP-A No. 64-4739 as a dye elution accelerator.

 [0094] Examples of the hardener in the fixing solution include water-soluble aluminum salts and chromium salts. A preferable compound as the hardener is a water-soluble aluminum salt, and examples thereof include aluminum chloride, aluminum sulfate, potash vane and the like. A preferable addition amount of the above hardener is 0.01 to 0.2 mol Z liter, more preferably 0.03 to 0.08 mol Z liter.

[0095] The fixing temperature in the fixing step is preferably about 20 ° C to about 50 ° C, more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution, 600mlZm ² or less preferably fixture 500 ml / m ² or less and more preferably fixture 300 ml / m ² or less is particularly preferred for the process of the photosensitive material.

[0096] The photosensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. . In the water washing treatment or stabilization treatment, the amount of washing water is usually 20 liters or less per lm ^{2 of the} light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water). For this reason, not only water-saving treatment can be performed, but also the piping for installing the automatic machine can be dispensed with. As a method for reducing the replenishment amount of flush water, a multi-stage countercurrent method (for example, two-stage, three-stage, etc.) has been known for a long time. When this multi-stage counter-current method is applied to the production method of the present invention, the photosensitive material after fixing is gradually processed in a normal direction, that is, in contact with the fixing solution in the order of V and processing solution. Therefore, it is washed with water for further efficiency. Further, when washing with a small amount of water, it is more preferable to provide a squeeze roller and crossover roller washing tank described in JP-A-63-18350 and 62-287252. Further, various oxidizer additions and filter filtrations may be combined in order to reduce the pollution load that becomes a problem when washing with a small amount of water. Furthermore, in the above method, an overflow liquid from the washing bath or the stable bath generated by replenishing the washing bath or the stable bath with the water subjected to the prevention means according to the treatment. As described in JP-A-60-235133, a part or all of them can be used for a processing solution having a fixing function, which is a previous processing step. In addition, water-soluble surfactants and antifoaming agents are added to prevent unevenness of water bubbles, which are likely to occur when washing with a small amount of water, and to prevent transfer of the processing agent component adhering to the Z or squeeze roller to the processed film. Also good. In addition, in the water washing treatment or the stable water treatment, a dye adsorbent described in JP-A-63-163456 may be installed in the water washing tank in order to prevent contamination by the dye eluted from the photosensitive material. In addition, in the stable water treatment following the water washing treatment, the compounds described in JP-A-2-201357, JP-A-2-132435, JP-A-1102553, and JP-A No. 46-44446 are disclosed. May be used as the final bath of the light-sensitive material. At this time, if necessary, metal compounds such as ammonia compounds, Bi, A1, fluorescent brighteners, various chelating agents, membrane pH regulators, hardeners, bactericides, fungicides, alkanolamines, A surfactant can also be added. Water used in the water washing or stabilization process is sterilized with tap water, deionized water, halogen, UV germicidal lamps, various oxidizing agents (such as ozone, hydrogen peroxide, and chlorate). It is preferred to use fresh water. Further, even if washing water containing the compounds described in JP-A-4-39 652 and JP-A-5-241309 is used, Good.

 The bath temperature and time at the water washing treatment or stable temperature are preferably 0 to 50 ° C. and 5 seconds to 2 minutes.

 [0098] The mass of the metallic silver in the exposed area after the development treatment is preferably 80% by mass or more with respect to the mass of silver contained in the exposed area before the exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more with respect to the mass of silver contained in the exposed portion before exposure, high conductivity can be obtained.

 [0099] The gradation after development processing is not particularly limited, but is preferably more than 4.0. When the gradation after development processing exceeds 4.0, the conductivity can be increased while maintaining the transparency of the light-transmitting portion high. Examples of means for setting the gradation to 4.0 or higher include doping of the aforementioned rhodium ions and iridium ions.

 [0100] Physical development processing may be performed on the metallic silver portion after development processing. Here, physical development means that metal particles such as silver ions are reduced with a reducing agent on metal or metal compound nuclei to precipitate metal particles. This physical development is used in the production of instant B & W films, instant slide films, printing plates, and the like, and in this embodiment, techniques used for these can be applied.

 The physical development may be performed simultaneously with the above development process or separately after the development process.

 [0101] The light-sensitive material that has been subjected to development processing, and preferably further subjected to fixing processing, is then subjected to the plating treatment of the present invention. This process is as described above.

[0102] [Oxidation treatment]

 The developed silver portion after the development treatment may be oxidized. By performing the oxidation treatment, for example, when a slight amount of metal is deposited on the light-transmitting portion other than the developed silver portion, the metal is removed, and the light-transmitting portion has almost 100% transparency. be able to.

Examples of the oxidation treatment include known methods using various oxidizing agents such as Fe (III) ion treatment. As described above, the oxidation treatment can be carried out after the emulsion layer exposure and development treatment, or after physical development or staking treatment, and further after the development treatment and after physical development or staking treatment, . [0103] Further, the developed silver portion after the exposure and development treatment can be treated with a solution containing Pd. Pd may be a divalent palladium ion or metallic palladium. This treatment can accelerate electrolytic plating or physical development speed.

 [0104] 3. Translucent electromagnetic shielding film · Optical filter

 By applying the above-described plating method of the present invention to a film having a silver mesh pattern obtained by exposing and developing a photosensitive material containing a silver salt emulsion as described above, a conductive material is formed on the silver mesh. A translucent conductive film is obtained that has been plated with a conductive metal film.

 Since this translucent conductive film has high electromagnetic shielding properties and translucency, it is possible to capture images such as CRT, EL, liquid crystal display, plasma display panel, other image display flat panel, or CCD. It can be used as an electromagnetic shielding film by being incorporated in a semiconductor integrated circuit. In addition, the use of the conductive metal film according to the present invention is not limited to the display device and the like, but includes a measuring device that generates an electromagnetic wave, a window or a case for looking inside the measuring device or the manufacturing device, It can be installed in windows of buildings or automobile windows that may be affected by electromagnetic wave interference by radio towers or high-voltage lines.

 [0105] The translucent conductive film according to the present invention has a fine fine line pattern since the silver mesh is formed of developed silver, and maintains or improves the image quality without significantly impairing the luminance. Therefore, it is particularly useful as a translucent electromagnetic shielding film used on the front surface of an image display device such as a plasma display panel.

[0106] In order to prevent V from degrading the electromagnetic wave shielding ability of the translucent electromagnetic wave shielding film, it is desirable to ground the conductive metal part. For this reason, it is desirable to form a conductive portion for grounding on the translucent electromagnetic wave shielding film, and to make the conductive portion electrically contact the ground portion of the display body. The conducting part is preferably provided around the metallic silver part or the conductive metal part along the peripheral edge of the translucent electromagnetic wave shielding film, and the conducting part is formed by a mesh pattern. However, it may be patterned! /, For example, it may be formed of a solid metal foil. However, in order to improve the electrical contact with the ground part of the display body, This is not puttering And are preferred.

 [0107] Further, when the translucent conductive film according to the present invention is used as a translucent electromagnetic wave shielding film, an adhesive layer, a glass plate, and a later-described translucent conductive film (translucent electromagnetic wave shielding film) are used. It is preferable to apply a protective film, a functional film, or the like to form an optical film. Hereinafter, each layer that can be provided on the translucent conductive film (translucent electromagnetic wave shielding film) will be described.

 [0108] Ku adhesive layer>

 The position where the adhesive layer is provided on the translucent electromagnetic wave shielding film may be the surface on the side where the conductive metal portion is formed, or on the surface opposite to the side where the conductive metal portion is formed. Yo ... You may form in the bonding part of a translucent electromagnetic wave shielding film and other layers (a glass plate, a protective film, a functional film, etc.). The thickness of the adhesive layer is preferably equal to or greater than the thickness of the metal silver part (or conductive metal part), for example, can be in the range of 10-80 / ζ πι, and 20-50 μm More preferably.

 [0109] The refractive index of the adhesive in the adhesive layer is preferably 1.40 to L70. By setting the refractive index to 1.40 to L70, the difference between the refractive index of the support of the translucent electromagnetic wave shielding film and the refractive index of the adhesive is reduced, and the visible light transmittance is reduced. Can be prevented.

[0110] Further, it is preferable that the adhesive is an adhesive that flows by heating or pressurizing. Particularly, the adhesive is fluidized by heating at 200 ° C or less or pressurizing at ¹ kgfZcm ² (0. lMNZm ² ) or more. Preferred to be an adhesive, showing.

 By using such an adhesive, the translucent electromagnetic wave shielding film can be bonded to a display or plastic plate as an adherend by flowing the adhesive layer. In particular, it can be easily bonded to an adherend having a curved surface or a complicated shape by pressure molding.

For this purpose, the softening temperature of the adhesive is preferably 200 ° C. or lower. Because of the use of translucent electromagnetic shielding films, the environment used is usually less than 80 ° C, so the softening temperature of the adhesive layer is 80 ° C to 120 ° C. preferable. The softening temperature is the temperature at which the viscosity is 10 ¹² boise (10 ³ MPa's) or less, and usually the flow is recognized within about 1 to 10 seconds at that temperature. [0111] Typical examples of the adhesive that flows by heating or pressurization as described above include the following thermoplastic resins. For example, natural rubber (refractive index n = 1.52), polyisoprene (n = 1.521), poly 1,2 butadiene (n = l.50), polyisobutene (n = 1.505 to 1.51), polybutene (n = 1.513), poly 2 Heteroleu 1,3 butadiene (n = l.50), poly 2 t-butyl-1,3 butadiene (n = l.506), poly 1,3 butadiene (n = 1.515), Oxyethylene (n = l.456), polyoxypropylene (n = l.450), polybutyl ether ( _n = l .454), polybutyl hexyl ether (n = l .459), polybutyl butyl ether ( Polyethers such as n = l.456), Polyburacetate (n = l.467), Polyburp mouthpiece pionate (n = l.467) and other polyesters, Polyurethane (n = 1.5 to 1.6), Ethyl cell mouth scan (n = 1.479), polychlorinated Bulle (n = 1.54~1.55), polyacrylonitrile (n = 1.52), Porimeta Tarironitoriru _(n = l.52), polysulfone (n = l.633), Lisulfide (n = 1.6), phenoxy resin (n = 1.5-1.6), polyethyl acrylate (n = 1.469), polybutyl acrylate (n = 1.466), poly 2-ethyl hexyl acrylate (n = l .463), poly (t-butyl acrylate) (n = l .464), poly 3 ethoxypropyl acrylate (n = l. 465), polyoxycanolepo-noretetramethylene (n = 1.465), polymethyl acrylate ( n = 1.472 to 1.480), polyisopropyl metatalylate (n = l .473), polydodecyl metatalylate (n = 1.474), polytetradecyl metatalylate (n = l.475), poly n-propyl (Metaclurin Kn = 1.484), Poly (1,3,3,5) Trimethylcyclohexyl methacrylate (η = 1.484), Polyethyl methacrylate (η = 1.485), Poly 2 Nitrole 2-methylpropyl methacrylate ( η = 1.487), poly 1,1-jetylpropyl methacrylate (η = 1. 489), polymethyl Metakurire Κη = 1.489) is a poly (meth) acrylic acid ester usable features such. Two or more kinds of these thermoplastic resins may be copolymerized as required, or two or more kinds may be blended and used.

[0112] Further, copolymer resins of acrylic resins and non-acrylic resins are also preferred for the purpose of adhesives. Examples of such copolymer resins include epoxy acrylate (η = 1.48 to 1.60), urethane acrylate. Rate (η = 1.5 to 1.6), polyether acrylate (η = 1.48 to 1.49), polyester atrelate (η = 1.48 to 1.54) can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesiveness. Examples of epoxy acrylate include 1,6 hexanediol diglycidyl ether, neopentyl glycol diglycol. Sidyl ether, allylic alcohol diglycidyl ether, resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycolinoresiglicidinoate ethere, trimethylonorepropane triglycidinoleate, glycerin tri Examples include (meth) acrylic acid adducts such as glycidyl ether, pentaerythritol tetraglycidyl ether, and sorbitol tetraglycidyl ether. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, are effective in improving adhesion. These copolymerized resins can be used in combination of two or more as required. On the other hand, the mass average molecular weight of the adhesive polymer (measured using a standard polystyrene calibration curve by gel permeation chromatography, hereinafter the same) is preferably 500 or more. If the molecular weight is 500 or less, the cohesive force of the adhesive composition is too low, which may reduce the adhesion to the adherend.

[0113] The adhesive may contain a curing agent (crosslinking agent). Adhesive curing agents include amines such as triethylenetetramine, xylenediamine, diaminodiphenylmethane, anhydrous phthalic acid, maleic anhydride, dodecyl succinic anhydride, pyromellitic anhydride, and benzophenone tetracarboxylic anhydride. Acid anhydrides, diaminodiphenylsulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, ethylmethylimidazole and the like can be used. These may be used alone or in combination of two or more.

 [0114] The addition amount of the curing agent may be selected in the range of 0.1 to 50 parts by mass, preferably 1 to 30 parts by mass with respect to 100 parts by mass of the adhesive polymer. If the amount of addition is less than 0.1 parts by mass, curing may be insufficient, and if it exceeds 50 parts by mass, excessive crosslinking may occur, which may adversely affect adhesion.

[0115] In addition to the hardener, additives such as diluents, plasticizers, antioxidants, fillers, colorants, UV absorbers and tackifiers may be added to the adhesive as necessary. You may mix | blend. In order to form an adhesive layer on the translucent electromagnetic shielding film, the adhesive layer composition containing the above-mentioned adhesive polymer, curing agent, other additives, etc. is applied to part or all of the conductive metal part. It can be formed by coating to coat, solvent drying and heat curing. [0116] Protective film>

 A protective film can be attached to the translucent electromagnetic wave shielding film according to the present invention. The protective film may be provided on both sides of the transmissive electromagnetic wave shielding film, or may be provided on only one side (for example, on the conductive metal portion).

 As described later, the translucent electromagnetic wave shielding film is often further bonded with a functional film having effects such as strengthening the outermost surface, imparting antireflection properties, imparting antifouling properties, and the like. When a functional film is provided on the translucent electromagnetic shielding film, it is desirable to remove the protective film. Therefore, it is desirable that the protective film be peelable.

 The peel strength of the protective film is preferably 5 mNZ25 mm width to 5 NZ25 mm width, more preferably 10 mNZ25 mm width to 100 mNZ25 mm width. If it is less than the lower limit, peeling is too easy and the protective film may be peeled off during handling or inadvertent contact. If the upper limit is exceeded, a large force is required for peeling, and a mesh is required for peeling. This is also not preferable because the metal foil may peel off the transparent base film (or from the adhesive layer).

[0117] Examples of the film constituting the protective film include polyolefin resins such as polyethylene resin and polypropylene resin, polyester resins such as polyethylene terephthalate resin, resin films such as polycarbonate resin and acrylic resin. Is preferably used. In addition, it is preferable to apply a corona discharge treatment to the bonding surface of the protective film or to laminate an easy adhesion layer.

[0118] Special Functional Film>

 When a translucent electromagnetic shielding film is used for a display (especially a plasma display), it is preferable to provide each functionality by attaching a functional film having the functionality described below. The functional film can be attached to the translucent electromagnetic shielding film through an adhesive or the like.

 (Anti-reflective 'Anti-glare)

The translucent electromagnetic wave shielding film has anti-reflection (AR: anti-reflection) properties to suppress external light reflection, or anti-glare (AG: anti-glare) properties to prevent reflection of mirror images, Alternatively, it is preferable to provide anti-glare and anti-glare (ARAG) properties having both of these characteristics.

 With these performances, it is possible to prevent the display screen from becoming difficult to see due to the reflection of lighting equipment. In addition, by reducing the visible light reflectance on the film surface, it is possible to improve contrast and the like that can be achieved only by preventing reflection. Anti-glare property ・ When a functional film having anti-glare properties is applied to a translucent electromagnetic wave shielding film, the visible light reflectance is preferably 2% or less, more preferably 1.3% or less. More preferably, it is 0.8% or less.

 [0119] The functional film as described above can be formed by providing a functional layer having antireflection properties and antiglare properties on a suitable transparent substrate.

 As the antireflection layer, for example, a thin film made of fluorine-based transparent polymer resin, magnesium fluoride, silicon-based resin, silicon oxide, etc., for example, having a single layer with an optical film thickness of 1Z4 wavelength, the refractive index is different. , Metal oxides, fluorides, halides, nitrides, sulfides and other inorganic compounds, or silicon-based resin, acrylic resin, fluorine-based resin, etc. Can be formed.

 [0120] As the antiglare layer, 0.1 π! It is possible to form a laminar force having a surface state with minute irregularities of about 10 m. Specifically, acrylic or silicone resin, melamine resin, urethane resin, alkyd resin, fluorinated resin, or other thermosetting or photocurable resin, silica, organic It can be formed by coating and curing an ink obtained by dispersing particles of an inorganic compound or organic compound such as a silicon compound, melamine, or acrylic. The average particle size of the particles is preferably about 1 to 40 m.

 The antiglare layer can also be formed by applying the thermosetting or photocurable resin as described above and then pressing and curing a mold having a desired dalos value or surface state. Monkey.

When the antiglare layer is provided, the haze of the translucent electromagnetic wave shielding film is preferably 0.5% or more and 20% or less, more preferably 1% or more and 10% or less. If the haze is too small, the antiglare property is insufficient, and if the haze is too large, the transmitted image sharpness tends to be low. [0121] (Hard coat)

 In order to add scratch resistance to the translucent electromagnetic wave shielding film, it is also preferable that the functional film has a hard coat property. Examples of the hard coat layer include thermosetting type or photosetting type resin such as acrylic resin, silicone resin, melamine resin, urethane resin, alkyd resin, and fluorine resin. However, the type and formation method are not particularly limited. The thickness of the hard coat layer is preferably about 1 to 50 / ζ πι. When the above-described antireflection layer and wrinkle or antiglare layer are formed on the hard coat layer, a functional film having scratch resistance / antireflection and wrinkle or antiglare is obtained, which is preferable.

The surface hardness of the translucent electromagnetic shielding film with hard coat properties is _JIS (κ-54

The pencil hardness according to (00) is preferably at least H, more preferably 2H, even more preferably 3H or more.

[0122] (Antistatic property)

 In order to prevent dust adhesion due to electrostatic charging and electrostatic discharge due to contact with the human body, it is preferable that the transmissive electromagnetic wave shielding film has antistatic properties.

As the functional film having antistatic properties, a film having high electrical conductivity can be used. For example, the electrical conductivity may be about 10 ¹¹ ΩZ or less in terms of surface resistance.

 A highly conductive film can be formed by providing an antistatic layer on a transparent substrate. Specific examples of the antistatic agent used in the antistatic layer include a trade name Pelestat (manufactured by Sanyo Kasei Co., Ltd.), a trade name electroslipper (manufactured by Kao Corporation), and the like. In addition, the antistatic layer may be formed of a known transparent conductive film such as ITO, or a conductive film in which conductive ultrafine particles such as ITO ultrafine particles and tin oxide ultrafine particles are dispersed. ,. Antistatic properties may be imparted to the above-mentioned hard coat layer, antireflection layer, antiglare layer, etc. by adding conductive fine particles.

[0123] (Anti-fouling property)

 If the light-transmitting electromagnetic wave shielding film has antifouling property, it is preferable because it can be easily removed when it is prevented from being smudged or smudged.

A functional film having antifouling properties can be obtained, for example, by applying a compound having antifouling properties on a transparent substrate. Antifouling compounds include water and Z or oil Any compound having non-wetting property to fat may be used, for example, a fluorine compound and a key compound. Specific examples of the fluorine compound include trade name OPTOOL (manufactured by Daikin) and the like, and examples of the key compound include trade name Takata Quantum (manufactured by NOF Corporation).

 [0124] (UV-cutting property)

 It is preferable that the light-transmitting electromagnetic wave shielding film is imparted with UV-cutting properties for the purpose of preventing deterioration of the dye and transparent substrate described later. The functional film having ultraviolet cut-off property can be formed by a method in which an ultraviolet absorber is contained in the transparent substrate itself or by providing an ultraviolet absorbing layer on the transparent substrate.

 As the ultraviolet ray cutting ability necessary for protecting the dye, the transmittance in the ultraviolet region shorter than the wavelength of 380 nm is 20% or less, preferably 10% or less, more preferably 5% or less. A functional film having an ultraviolet cutting property can be obtained by forming a layer containing an ultraviolet absorber or an inorganic compound that reflects or absorbs ultraviolet rays on a transparent substrate. Conventionally known UV absorbers such as benzotriazoles and benzophenones can be used, and their type 'concentration is dispersibility in the medium to be dispersed or dissolved' solubility, absorption wavelength-absorption coefficient, medium It is determined by the thickness of the material and is not particularly limited.

[0125] It should be noted that the functional film having ultraviolet cut-off property preferably has little absorption in the visible light region and does not significantly reduce the visible light transmittance or exhibit a color such as yellow. Moreover, when the layer containing the pigment | dye mentioned later is formed in the functional film, it is desirable that the layer which has ultraviolet-cutting property exists outside the layer.

[0126] (Gas barrier property)

If a translucent electromagnetic shielding film is used in a temperature and humidity environment higher than normal temperature and humidity, the dye described later deteriorates due to moisture, or moisture aggregates in the adhesive used for bonding and the bonding interface. The light-transmitting electromagnetic wave shielding film preferably has a gas barrier property because it may become cloudy or the adhesive may be phase-separated and deposited due to the influence of moisture. In order to prevent such deterioration and fogging of the pigment, it is important to prevent the penetration of water into the pigment-containing layer and the adhesive layer, and the water vapor permeability of the functional film is preferably lOgZm ² · day or less, preferably Is preferably ⁵ gZm ² · day or less. [0127] (Other optical properties)

 Since the plasma display generates intense near-infrared rays, it is preferable to impart infrared shielding properties (particularly near-infrared shielding properties) when the light-transmitting electromagnetic wave shielding film is used particularly for plasma displays.

 As a functional film having near-infrared cutting properties, a film having a transmittance of 25% or less in a wavelength region of 800 to 1 OOOnm is preferably less than 15%, more preferably less than 10%. is there.

 [0128] When the light-transmitting electromagnetic wave shielding film is used for a plasma display, it is preferable that the transmitted color is-neutral gray or blue gray. This is to maintain or improve the light emission characteristics and contrast of the plasma display, and is also a force that may prefer a white color temperature slightly higher than the standard white color.

 [0129] Furthermore, the color plasma display is not suitable for the situation where the color reproducibility is sufficiently satisfied. In particular, the emission spectrum of red display shows several emission peaks ranging from 580 nm to 700 nm. However, there is a problem that red emission becomes poor in color purity close to orange due to a relatively strong emission peak on the short wavelength side. Therefore, the functional film preferably has a function of selectively reducing unnecessary light emission from the phosphor or the discharge gas which is the cause of the functional film.

 [0130] These optical properties can be controlled by using a dye. In other words, near-infrared absorbers can be used for near-infrared cut, and dyes that selectively absorb unwanted luminescence can be used to reduce unwanted luminescence. The color tone can also be made suitable by using a dye having an appropriate absorption in the visible region.

[0131] The dye may be a general dye or pigment having a desired absorption wavelength in the visible region, or a compound known as a near infrared absorber, and the type thereof is not particularly limited. For example, anthraquinone, phthalocyanine, methine, azomethine, oxazine, imonium, azo, styryl, coumarin, porphyrin, dibenzofuranone, diketopyrrolopyrrole, rhodamine, xanthene, Examples thereof include organic dyes that are generally commercially available, such as pyromethene-based compounds, dithiol-based compounds, and diiminium-based compounds. [0132] The plasma display has a heat resistance that does not deteriorate at about 80 ° C, for example, because the temperature of the translucent electromagnetic wave shielding film increases when the temperature of the environment where the panel surface temperature is high is high. Is preferable.

 In addition, some dyes have poor light resistance. If such dyes cause problems with the light emission of plasma displays and the deterioration of UV light and visible light from outside light, functional films as described above. It is preferable to prevent the dye from being deteriorated by ultraviolet rays or visible rays by adding an ultraviolet absorber to the layer or providing a layer that does not transmit ultraviolet rays.

 The same applies to humidity and a combined environment in addition to heat and light. If it deteriorates, the transmission characteristics of the optical filter will change, and the color tone may change or the near-infrared cutting ability may decrease.

 In addition, since the dye is dissolved or dispersed in the resin composition for forming the transparent substrate or the coating composition for forming the coating layer, the dye may be highly soluble or dispersible in the solvent. preferable.

 [0133] The concentration of the dye is appropriately set based on the absorption wavelength of the dye, the absorption coefficient, the transmission characteristics required for the translucent electromagnetic wave shielding film, the transmittance, and the type of the medium or coating film to be dispersed. can do.

 When the functional film contains a pigment, it may be contained inside the transparent substrate, or a layer containing the pigment may be coated on the surface of the substrate. Moreover, you may contain a pigment | dye in an adhesive layer. Further, two or more kinds of dyes having different absorption wavelengths may be mixed and contained in one layer, or two or more layers containing dyes may be contained.

 [0134] In addition, since the dye may be deteriorated by contact with a metal, when such a dye is used, the functional film containing the dye has a layer containing the light-transmitting electromagnetic wave shield. More preferably, it is arranged so that it does not come into contact with the conductive metal part on the metal film.

 Example

[0135] The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is limited to the specific examples shown below. It should not be interpreted more restrictively.

 [Example 1]

 (Preparation of silver halide photosensitive material)

 Contains silver odorous silver salt particles (1 = 0.2 mol%, Br = 40 mol%) containing gelatin lO.Og and an average equivalent spherical diameter of 0.1 l / zm for 60 g of Ag in an aqueous medium. An emulsion was prepared.

Further, the concentration of ^10-7 (mol Z mol of silver) of K Rh Br and K IrCl This emulsion

 3 2 9 2 6

 The silver bromide grains were doped with Rh ions and Ir ions. Na PdCl

2 4 was added, further Shioi匕金acid and Chio after gold-sulfur sensitization using sodium sulfate, gelatin together with a hardening agent, a polyethylene terephthalate as the coating amount of silver is lgZm ² (PE T) It was coated on a support that also had a force. At this time, the volume ratio of AgZ gelatin was 1Z2.

 The PET support was 90 πι thick and 30 cm wide. Coating was carried out for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave 24 cm in the center of the coating to obtain a roll-shaped halogen silver halide light-sensitive material.

[0137] (Exposure)

 For the exposure of silver halide photosensitive materials, exposure heads using DMDs (digital 'mirror' devices) described in the invention of Japanese Patent Application Laid-Open No. 2004-1244 are arranged so as to have a width of 25 cm. The exposure head and exposure stage are curved so that the laser beam forms an image, and the photosensitive material feed mechanism and scoring mechanism are attached. The exposure was performed in a continuous exposure apparatus provided with a stagnation having a buffer function so as not to affect the speed of the exposed portion. The wavelength of exposure is 4

At OOnm, the beam shape is approximately 12 μm, and the output of the laser light source is 100 J.

 The exposure pattern was such that the grid pattern force was 5 degrees with a line width of 8 m, and the pitch was continuous 24 cm wide and 10 m long at 300 m intervals.

[0138] (Development processing)

 • Developer 1L formulation (same composition for replenisher)

 Hydroquinone 22 g

Sodium sulfite 50 g Potassium carbonate 40 g

 Ethylenediamine 'tetraacetic acid 2 g

 Potassium bromide 4 g

 Houjie-Leng IJn—Nore 4000 1 g

 Potassium hydroxide 4 g

 Adjust to pH 10.2

 [0139], Fixer 1L formulation (same composition for replenisher)

 Ammonium thiosulfate solution (75%) 300 ml

 Ammonium sulfite monohydrate 25 g

 1,3-Diaminopropane 'tetraacetic acid 8 g

 Acetic acid 5 g

 Ammonia water (27%) 1 g

 Adjust to pH 6.2

 [0140] Using the above processing agent, the exposed silver halide photosensitive material is processed with an automatic developing machine FG-710PTS manufactured by Fuji Photo Film Co., Ltd. The processing conditions are development at 33 ° C for 40 seconds and fixing at 30 ° C. For 25 seconds, washing was performed with running water (5 L / min) for 25 seconds.

As running processing conditions, the running processing was carried out for 3 days at a photosensitive material processing amount of 100 m ² / day, a developer replenishment amount of 500 mlZm ² , and a fixing solution replenishment amount of 640 mlZm ² . As described above, a film having a silver mesh pattern formed in a lattice shape on a transparent film was prepared. The surface resistance of this film was 45.2 Ω.

[0141] (Plating treatment)

For the film on which the silver mesh pattern is formed by the above treatment, an electrolytic plating apparatus having a total of 18 plating tanks having the same functional tank configuration as the electrolytic plating tank 11 shown in FIG. 2 is used. Electrolytic plating was performed. At that time, the current value of each tank was adjusted as shown in Table 1 to prepare an electroplating film sample of sample numbers 101 to L10. The electrolytic plating apparatus has a continuous configuration so as to be described later. The film was attached to an electroplating apparatus so that the silver mesh surface of the film faced downward (so that the silver mesh surface was in contact with the feed roller). The size of the electrolytic bath 11 is 80cm x 80cm x 80cm for each bath. there were.

 The power supply rollers 12a and 12b were mirror-finished stainless steel rollers (10cmφ, length 70cm), and the guide rollers 14 and other transport rollers were 5cmφ and length 70cm. In addition, by adjusting the height of the guide roller 14, a constant in-liquid treatment time was ensured even if the line speed was different.

 [0142] The distance (distance La shown in Fig. 2) between the lowermost part of the surface where the feeding roller 12a on the entrance side and the silver mesh surface of the film are in contact with each other was 9 cm. The distance (distance Lb shown in Fig. 2) between the lowermost part of the surface where the power supply roller on the outlet side and the silver mesh part of the photosensitive material are in contact with each other was set to 19 cm. The line transfer speed was 2.3mZ.

 [0143] The plating bath for the plating treatment solution and the antifungal solution in the plating treatment is as follows: The composition of the copper plating solution (the replenisher solution has the same composition)

 Copper sulfate pentahydrate 200g

 Sulfuric acid (47%) 200mL

 Hydrochloric acid (2N) 0.5mL

 Add pure water and add 1L

 pH -0. 1 *

 Note *; pH meter reading

[0144] · Black liquid (Replenisher has the same composition)

 Nickel sulfate hexahydrate lOOg

 Ammonium thiocyanate 15g

 Zinc sulfate heptahydrate 20g

 Saccharin sodium dihydrate lg

 Add pure water and add 1L

 pH (pH adjustment with sulfuric acid and sodium hydroxide) 5.0

[0145] · Antifungal liquid

 Urumura Kogyo Sul Cup AT—21 100ml

Add pure water and add 1L Below, the processing time of a plating tank is shown. The current values applied in each tank are shown in Table 1 below. In Table 1, the amount of electrolysis was indicated by the current value (A). Since the width of the film sample S is 24 cm wide and the conveyance speed is 2.3 m / min, if the effective current density on the film surface (force sword surface) is shown as a reference, the current value is 1 A. 09AZdm ² Equivalent to this. In addition, all copper plating solutions, water washing and fenders were treated at a temperature of 25-30 ° C and a drying temperature of 50 ° C-70 ° C. When the temperature of the copper plating solution was increased to 45 ° C or higher, the film surface was significantly damaged, and proper plating could not be performed, resulting in very many scratches.

 Plating 1 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Plating 2 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Plating 3 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Plating 4 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Plating 5 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Plating 6 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Plating 7 30 seconds

 Flush 30 seconds

Dry 30 seconds Plating 8 30 seconds Washing 30 seconds Drying 30 seconds Plating 9 30 seconds Washing 30 seconds Drying 30 seconds Plating 10 30 seconds Washing 30 seconds Drying 30 seconds Plating 11 30 seconds Washing 30 seconds Drying 30 seconds Plating 12 30 seconds Washing 30 seconds Drying 30 seconds Plating 13 30 seconds Washing 30 seconds Drying 30 seconds Plating 14 30 seconds Washing 30 seconds Drying 30 seconds Plating 15 30 seconds Washing 30 seconds Drying 30 seconds Plating 16 30 seconds Washing 30 seconds Drying 30 seconds Plating 17 30 seconds Flush 30 seconds

 Dry 30 seconds

 Plating 18 30 seconds

 Flush 30 seconds

 Dry 30 seconds

 Blackening treatment 30 seconds Current 24A

 Flush 30 seconds

 Dry 30 seconds

 Blackening treatment 30 seconds Current 16A

 Flush 30 seconds

 Dry 30 seconds

 Defense 30 seconds

 Flush 30 seconds

 Dry 1 min 50. C-70. C

 [0148] (Surface resistance measurement)

 Film samples were plated 10 m at a time, and after the treatment, the surface resistance of the mesh surface was measured. Surface resistance measurement is performed with a Lloystar GP (Model No. MCP-T610) series 4-probe probe (ASP) manufactured by Daiinsmen, Inc., and measured at 10 arbitrary locations excluding lm from the beginning and end. The maximum surface resistance and the minimum surface resistance were determined. The results obtained are shown in Table 1.

 [0149] (Measurement of line width)

 The sample after plating was photographed with an electron microscope, and the line width of the mesh was measured. As the line width is narrower V, the higher the transmittance, the smaller the haze.

 Table 1 Various current values

[0150] [Table 1]

 In Table 1, “First half cumulative ratio (%;)” is the ratio of the total amount of energization in the first half from the upstream to the downstream of the electroplating bath (with respect to the total amount of energization in total). %).

In Table 1, the number of platings is the number of plating processes in one plating tank, and the number of platings is 1 at the end of the first plating tank. The number of platings is 18 at the end of this process. The cumulative ratio is the ratio of the cumulative energization amount to the cumulative total energization amount. The surface resistance difference is a value shown as a measure of uneven electrodeposition, and the difference is small. This means that the variation in surface current density is small as a result of less uneven current density.

 The plating current value is the current value (A) indicating the amount of electrolysis energized over the entire width of a film sample with a width of 24 cm.

[0152] As shown in Table 1, sample numbers 101 and 106 have a cumulative ratio of the first half that is outside the range of the present invention. On the other hand, in the present invention, the surface resistance difference is small! /. In Sample Nos. 103 and 104, no increase in fine lines was observed.

[0153] [Example 2]

 Sample Nos. 103 and 104 of the present invention of Example 1 were coated with a protective film having a total thickness of 28 m on the side opposite to the metal mesh of the PET support (manufactured by Panac Industry Co., Ltd., product number T-25 ) Was laminated using a laminator roller. Also, on the metal mesh side, a protective film (product name: Sartect Y-26F, manufactured by Sanei Soken Co., Ltd.) with a total thickness of 65 μm, in which an acrylic adhesive layer is laminated on a polyethylene film, is a laminator. Bonding was performed using a roller.

 [0154] Next, a glass plate having a thickness of 2.5 mm and an outer dimension of 950 mm X 550 mm was bonded via a transparent acrylic adhesive with the surface opposite to the metal mesh of the PET support as the bonding surface. .

 [0155] Next, a 100 m thick PET film, an antireflection layer, and a near-infrared absorbing agent are placed on an inner metal mesh excluding the outer edge 20 mm through an acrylic translucent adhesive with a thickness of 25 μm. A near-infrared absorbing film having an antireflection function composed of an inclusion layer (trade name Talialas ARZNIR, manufactured by Sumitomo Osaka Cement Co., Ltd.) was bonded. The acrylic light-transmitting pressure-sensitive adhesive layer contained a toning dye (PS-Red-G, PS-Violet-RC manufactured by Mitsui Chemicals) that adjusts the transmission characteristics of the optical filter.

 Further, an antireflection film (trade name: Look Look 8201 manufactured by Nippon Oil & Fats Co., Ltd.) was bonded to the glass plate via an adhesive material to produce an optical filter.

[0156] Since each of the obtained optical filters had an electromagnetic wave shielding film with a protective film, scratches and metal mesh defects were extremely small. Also metal metal The screen is black and the display image does not take on a metallic color. Also, it has practically no trouble V, level electromagnetic wave shielding ability and near infrared ray cutting ability (transmittance of 300 to 800 nm is 15% or less). In addition, the antireflection layer on both sides was excellent in visibility. Further, it has been shown that a color-adjusting function can be imparted by including a dye, and can be suitably used as an optical filter such as a plasma display.

Claims

The scope of the claims

 [1] Using an electrolytic plating apparatus having a plurality of continuous plating tanks, the surface resistance is 1 to: LOOO

 A method of staking treatment in which the same type of metal is electroplated on the surface of the film of Ω / mouth, and the cumulative amount of energization in the first half from the upstream to the downstream of the plurality of continuous staking baths A plating method characterized in that it is 14.40% or more and less than 50.20% of the energization amount.

 [2] A plating process method in which a plurality of plating tanks are used to continuously perform electrolytic plating on a long film having a covered portion, and the cumulative plating current capacity in the first half of the plurality of plating tanks A method for treating staking, characterized in that it is 14.40% or more and less than 50.20% of the total accumulated squeezing amount.

 [3] A plating process method in which, using a plurality of plating tanks, electrolytic plating is continuously performed on a long film having a patched portion.

 The first plating tank among the plurality of plating tanks includes a power supply roller, and the current value of the power supply roller is 1 to 30A.

[4] The cumulative amount of energization in the first half of the plurality of plating tanks from upstream to downstream is 20% or more and less than 50% of the total accumulated energization amount.

The plating method according to any one of ~ 3.

[5] The plating method according to claim 1 or 2, wherein a first plating tank among the plurality of plating tanks includes a power supply roller, and a current value of the power supply roller is 1 to 30A.

[6] The plating method according to any one of claims 1 to 5, wherein a current value of the power supply roller is 1 to 10A.

7. The tacking method according to any one of claims 1 to 6, wherein the film has a tacked portion.

 [8] The maximum current value applied in the electroplating process is more than 5 times the current value applied to the uppermost first tank of the plurality of electroplating tanks. The plating method according to any one of claims 1 to 7.

[9] 90% of the electrolytic plating process with multiple plating tanks of the same type of precious metal, and the current value of the plating current of the electrolytic plating tank after that. Maximum current applied in the electrolytic plating process The plating method according to claim 1, wherein the plating method is smaller than the value.

[10] The plating current value applied in the most downstream tank of the plurality of electrolytic plating tanks does not exceed the plating current value applied in the last tank in the first half. The plating method according to any one of 1 to 9.

[11] The plating method according to any one of [1] to [11], wherein the metal is copper.

 [12] The plating method according to any one of [1] to [1], wherein the film has a metal mesh pattern as a covering portion.

13. The plating method according to claim 12, wherein the metal mesh pattern is formed of developed silver.

[14] A conductive film produced by a production method including the plating method according to any one of claims 1 to 13.

[15] A translucent electromagnetic wave shielding film comprising the conductive film according to [14].

[16] A method for producing a conductive film that uses a plurality of plating tanks to continuously electrolytically adhere to a long film having a covered portion, and is a cumulative film in the first half of the plurality of plating tanks. A method for producing a conductive film characterized in that it is 14.40% or more and less than 50.20% of the total cumulative energization amount.