WO2007147278A3 - Led-lichtquelle und verfahren - Google Patents
Led-lichtquelle und verfahren Download PDFInfo
- Publication number
- WO2007147278A3 WO2007147278A3 PCT/CH2007/000303 CH2007000303W WO2007147278A3 WO 2007147278 A3 WO2007147278 A3 WO 2007147278A3 CH 2007000303 W CH2007000303 W CH 2007000303W WO 2007147278 A3 WO2007147278 A3 WO 2007147278A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal tape
- light source
- led light
- need
- light
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000012780 transparent material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
Die LED-Lichtquelle gemäss der Erfindung weist nebst mindestens einer lichtemittierenden LED (14) als lichterzeugendem Element und einem dieses umgebenden, allenfalls mit einem transparenten Material mindestens teilweise gefüllten, Schutzelement mindestens zwei dünne, d.h. 0,05mm bis 0,2 mm dicke, übergrosse Kontaktflächen (11c) auf, die folgende Eigenschaften haben: Sie sind so gross, dass sie einen dauerhaft sicheren elektrischen Kontakt, mit reproduzierbarem elektrischem Widerstand, ergeben, wenn sie mittels eines handelsüblichen, selbst klebenden Metallbandes mit elektrisch leitendem Klebstoff, oder mittels eines, allenfalls nur teilweise mit ihnen verlöteten Metallbandes, kontaktiert werden. Dies bedeutet in der Regel, dass ihre Fläche 1 cm2 oder grösser ist. Sie sind in sich mechanisch so stabil, dass sie die sichere mechanische Befestigung auf der rückseitigen Oberfläche eines flächigen Elementes, wie beispielsweise eines Teppichs, gewährleisten, wenn sie mit einem selbst klebenden Metallband auf dieses flächige Element befestigt werden.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1003/06 | 2006-06-21 | ||
CH10032006 | 2006-06-21 | ||
CH11342006 | 2006-07-15 | ||
CH1134/06 | 2006-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007147278A2 WO2007147278A2 (de) | 2007-12-27 |
WO2007147278A3 true WO2007147278A3 (de) | 2008-08-21 |
Family
ID=38529443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CH2007/000303 WO2007147278A2 (de) | 2006-06-21 | 2007-06-19 | Led-lichtquelle und verfahren |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2007147278A2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9551100B2 (en) | 2008-07-03 | 2017-01-24 | Philips Lighting Holding B.V. | Dust mite killing carpet |
KR101737094B1 (ko) | 2009-02-10 | 2017-05-29 | 필립스 라이팅 홀딩 비.브이. | 광학 센서를 포함하는 카펫 유닛 |
EP3044809B1 (de) * | 2013-09-13 | 2019-04-24 | Lumileds Holding B.V. | Verpackung mit einem rahmen für eine flip-chip-led |
DE102016114483A1 (de) * | 2016-08-04 | 2018-02-08 | Ic-Haus Gmbh | Optoelektronisches Bauelement |
DE202023000771U1 (de) | 2023-04-06 | 2024-07-09 | Fior Familie Gmbh | Teppich, insbesondere für den Innenbereich einer Sportanlage |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH689339A5 (de) * | 1998-02-12 | 1999-02-26 | Staufert Gerhard | Konfektionierbares LED-Leuchpaneel. |
WO2003023857A2 (de) * | 2001-09-13 | 2003-03-20 | Lucea Ag | Led-leuchtpaneel und trägerplatte |
US20030072153A1 (en) * | 2001-09-18 | 2003-04-17 | Nobuyuki Matsui | Lighting apparatus with enhanced capability of heat dissipation |
GB2382868A (en) * | 2001-12-05 | 2003-06-11 | Peter Norman Langmead | A lighting strip |
EP1493666A1 (de) * | 2003-07-02 | 2005-01-05 | Airbus Deutschland GmbH | Mehrlagige Leiterbahnenanordnung für die Stromversorgung einer Flugzeugkabinenbeleuchtung mit Leuchtdioden |
WO2005101489A2 (de) * | 2004-04-16 | 2005-10-27 | Lucea Ag | Gehäuse für led-chip und lichtquelle |
-
2007
- 2007-06-19 WO PCT/CH2007/000303 patent/WO2007147278A2/de active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH689339A5 (de) * | 1998-02-12 | 1999-02-26 | Staufert Gerhard | Konfektionierbares LED-Leuchpaneel. |
WO2003023857A2 (de) * | 2001-09-13 | 2003-03-20 | Lucea Ag | Led-leuchtpaneel und trägerplatte |
US20030072153A1 (en) * | 2001-09-18 | 2003-04-17 | Nobuyuki Matsui | Lighting apparatus with enhanced capability of heat dissipation |
GB2382868A (en) * | 2001-12-05 | 2003-06-11 | Peter Norman Langmead | A lighting strip |
EP1493666A1 (de) * | 2003-07-02 | 2005-01-05 | Airbus Deutschland GmbH | Mehrlagige Leiterbahnenanordnung für die Stromversorgung einer Flugzeugkabinenbeleuchtung mit Leuchtdioden |
WO2005101489A2 (de) * | 2004-04-16 | 2005-10-27 | Lucea Ag | Gehäuse für led-chip und lichtquelle |
Also Published As
Publication number | Publication date |
---|---|
WO2007147278A2 (de) | 2007-12-27 |
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