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WO2007000407A3 - Verfahren und vorrichtung zur herstellung von selbstklebenden rfid-transpondern - Google Patents

Verfahren und vorrichtung zur herstellung von selbstklebenden rfid-transpondern Download PDF

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Publication number
WO2007000407A3
WO2007000407A3 PCT/EP2006/063465 EP2006063465W WO2007000407A3 WO 2007000407 A3 WO2007000407 A3 WO 2007000407A3 EP 2006063465 W EP2006063465 W EP 2006063465W WO 2007000407 A3 WO2007000407 A3 WO 2007000407A3
Authority
WO
WIPO (PCT)
Prior art keywords
strip
antenna
carrier strip
rfid
antennae
Prior art date
Application number
PCT/EP2006/063465
Other languages
English (en)
French (fr)
Other versions
WO2007000407A2 (de
Inventor
Ralf Wolfgang God
Volker Brod
Dieter Bergmann
Original Assignee
Muehlbauer Ag
Ralf Wolfgang God
Volker Brod
Dieter Bergmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer Ag, Ralf Wolfgang God, Volker Brod, Dieter Bergmann filed Critical Muehlbauer Ag
Priority to EP06763858A priority Critical patent/EP1897039A2/de
Publication of WO2007000407A2 publication Critical patent/WO2007000407A2/de
Publication of WO2007000407A3 publication Critical patent/WO2007000407A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/021—Making adhesive labels having a multilayered structure, e.g. provided on carrier webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/027—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags involving, marking, printing or coding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Die Erfindung betrifft die Herstellung von selbstklebenden RFID-Transpondern, bei dem RFID-Chips mit Antennen aufeinanderfolgend verbunden werden, wobei das Verfahren folgende Schritte beinhaltet: a) Fortbewegen eines Antennenbandes (13) und Fortbewegen eines selbstklebenden Trägerbandes (18) mit der gleichen Geschwindigkeit; b) Aufbringen der Chips auf das Antennenband (13) zur Bildung von RFID-Transponderinlays mittels einer Aufbringeinrichtung (17), wobei jeder Chip jeweils einer Antenne (15) zugeordnet und mittels einer Kontaktiereinrichtung (17) in elektrischen Kontakt damit gebracht wird; c) Zusammenführen des Antennenbandes (13) und des Trägerbandes (18) und Auflaminieren des Trägerbandes (18) auf das Antennenband (13) derart, dass das Trägerband (18) die Antennen (15) und Chips bedeckt, mittels einer Laminiereinrichtung (23, 24); d) Vereinzeln jedes RFID-Transponderinlays mittels Durchtrennung des Antennenbandes (13) und ohne Durchtrennung des Trägerbandes (18) zur Bildung von Transpondern (30a) mittels einer Vereinzelungseinrichtung (25,26), und e) Abziehen von antennenfreien Anteilen (28) des Antennenbandes (13) von dem Trägerband (18), um das die vereinzelten RFID-Transponder (30a) tragende Trägerband (30) zu erhalten.
PCT/EP2006/063465 2005-06-28 2006-06-22 Verfahren und vorrichtung zur herstellung von selbstklebenden rfid-transpondern WO2007000407A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06763858A EP1897039A2 (de) 2005-06-28 2006-06-22 Verfahren und vorrichtung zur herstellung von selbstklebenden rfid-transpondern

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102005030482.6 2005-06-28
DE102005030482 2005-06-28
DE102006026105.4 2006-06-03
DE102006026105A DE102006026105B4 (de) 2005-06-28 2006-06-03 Verfahren und Vorrichtung zur Herstellung von selbstklebenden RFID-Transpondern

Publications (2)

Publication Number Publication Date
WO2007000407A2 WO2007000407A2 (de) 2007-01-04
WO2007000407A3 true WO2007000407A3 (de) 2007-03-15

Family

ID=36968341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/063465 WO2007000407A2 (de) 2005-06-28 2006-06-22 Verfahren und vorrichtung zur herstellung von selbstklebenden rfid-transpondern

Country Status (3)

Country Link
EP (1) EP1897039A2 (de)
DE (1) DE102006026105B4 (de)
WO (1) WO2007000407A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070163704A1 (en) * 2006-01-18 2007-07-19 Upm Rafsec Oy Method for manufacturing a label comprising a transponder
US10402713B1 (en) 2013-10-30 2019-09-03 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9379289B1 (en) 2013-10-30 2016-06-28 Automated Assembly Corporation LEDs on adhesive transfer tape
US10169698B1 (en) 2013-10-30 2019-01-01 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9897292B1 (en) 2013-10-30 2018-02-20 Automated Assembly Corporation Solid-state lighting elements on adhesive transfer tape
CN110625670B (zh) * 2018-06-25 2024-06-14 纽豹智能识别技术(无锡）有限公司 一种智能天线辊刀裁切及真空贴敷系统
US10398873B1 (en) 2018-07-20 2019-09-03 Automated Assembly Corporation Rolled substrate cable
US10786428B1 (en) 2019-04-02 2020-09-29 Automated Assembly Corporation Method of making a blister package lid
DE102021131911B3 (de) 2021-08-30 2022-10-06 Bw Papersystems Stuttgart Gmbh RFID-Konvertierungsanlage und Steuerungsverfahren für eine Mehrzahl von Inlay-Spendemodulen

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
EP1018703A1 (de) * 1999-01-04 2000-07-12 Sihl GmbH Laminierte, mehrschichtige Transportgutetikettenbahn mit RFID-Transpondern
US20030029540A1 (en) * 2000-01-17 2003-02-13 Rafsec Oy Method for the manufacture of a smart label inlet web, and a smart label inlet web
EP1295733A1 (de) * 2001-09-24 2003-03-26 Gather Formulare Formblatt, sowie Verfahren zum Herstellen eines Formblattes mit integriertem RFID-Transponder
US20030136503A1 (en) * 2002-01-18 2003-07-24 Avery Dennison Corporation RFID label technique
US20050021172A1 (en) * 2003-06-25 2005-01-27 Intermec Ip Corp. Method and apparatus for preparing media
US20050183264A1 (en) * 2004-02-23 2005-08-25 Eric Eckstein Method for aligning capacitor plates in a security tag and a capacitor formed thereby

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GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
FR2775533B1 (fr) * 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
DE59800598D1 (de) * 1998-11-18 2001-05-10 Sihl Gmbh Verfahren zur Entfernung von Einheiten aus Laminatbahnen, die eine Vielzahl von Einheiten aufweisen

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
EP1018703A1 (de) * 1999-01-04 2000-07-12 Sihl GmbH Laminierte, mehrschichtige Transportgutetikettenbahn mit RFID-Transpondern
US20030029540A1 (en) * 2000-01-17 2003-02-13 Rafsec Oy Method for the manufacture of a smart label inlet web, and a smart label inlet web
EP1295733A1 (de) * 2001-09-24 2003-03-26 Gather Formulare Formblatt, sowie Verfahren zum Herstellen eines Formblattes mit integriertem RFID-Transponder
US20030136503A1 (en) * 2002-01-18 2003-07-24 Avery Dennison Corporation RFID label technique
US20050021172A1 (en) * 2003-06-25 2005-01-27 Intermec Ip Corp. Method and apparatus for preparing media
US20050183264A1 (en) * 2004-02-23 2005-08-25 Eric Eckstein Method for aligning capacitor plates in a security tag and a capacitor formed thereby

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CHRIS LYNN: "RFID and Printed Electronics: A New Opportunity for Printers?", THE SEYBOLD REPORT, 23 March 2005 (2005-03-23), internet, pages 1 - 10, XP002399629, Retrieved from the Internet <URL:http://www.hillamtech.com/Local_Files/SeyboldRFID23Mar05.pdf> [retrieved on 20060919] *
MARK ANDY: "Getting in-line for RFID", LABELS & LABELLING MAGAZINE ARTICLE, June 2005 (2005-06-01), pages 031 - 036, XP002401492, Retrieved from the Internet <URL:http://www.markandy.com/aboutma/pdf/RFID%20L&L.pdf> [retrieved on 20060919] *
MARK ANDY: "RFID label converting in one pass", CONVERTING MAGAZINE ARTICLE, June 2005 (2005-06-01), XP002401493, Retrieved from the Internet <URL:http://www.markandy.com/aboutma/pdf/RFID%20Label%20-%20Converting.pdf> [retrieved on 20060919] *

Also Published As

Publication number Publication date
WO2007000407A2 (de) 2007-01-04
DE102006026105A1 (de) 2007-01-04
DE102006026105B4 (de) 2011-07-07
EP1897039A2 (de) 2008-03-12

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