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WO2007083357A1 - Dispositif et procédé de test de composants électroniques - Google Patents

Dispositif et procédé de test de composants électroniques Download PDF

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Publication number
WO2007083357A1
WO2007083357A1 PCT/JP2006/300558 JP2006300558W WO2007083357A1 WO 2007083357 A1 WO2007083357 A1 WO 2007083357A1 JP 2006300558 W JP2006300558 W JP 2006300558W WO 2007083357 A1 WO2007083357 A1 WO 2007083357A1
Authority
WO
WIPO (PCT)
Prior art keywords
test
electronic component
tray
test tray
electronic device
Prior art date
Application number
PCT/JP2006/300558
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Ito
Kazuyuki Yamashita
Koya Karino
Yoshihito Kobayashi
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2006/300558 priority Critical patent/WO2007083357A1/fr
Publication of WO2007083357A1 publication Critical patent/WO2007083357A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as ICs).
  • ICs semiconductor integrated circuit elements
  • electronic component testing apparatuses are used to test the performance and functions of ICs in a packaged state.
  • a handler that constitutes an electronic component testing device a large number of ICs accommodated in a tray are transported into the handler, and each IC is brought into electrical contact with a contact portion of a test head to perform an electronic component test.
  • a tester the device body
  • the test is completed, each IC is unloaded from the test head and placed on the tray according to the test result, so that it is sorted into categories such as non-defective products and defective products.
  • test tray is transported in a vertical position and the IC is tested in a vertical position for the purpose of reducing the size of the apparatus and improving the mutual design freedom of the handler and the tester.
  • IC is tested in a vertical position for the purpose of reducing the size of the apparatus and improving the mutual design freedom of the handler and the tester.
  • Patent Document 1 there has been known one that is brought into contact with the contact portion (see, for example, Patent Document 1).
  • the test tray is converted from a horizontal posture to a vertical posture before being carried into the soak chamber, and is transported in a state in which the vertical posture is maintained in the soak chamber.
  • the IC easily dropped from the test tray for a long time when the test tray was in the vertical position.
  • Patent Document 1 JP-A-7-31425
  • An object of the present invention is to provide an electronic component testing apparatus that suppresses ICs from dropping during transportation.
  • an electronic device under test is placed on a test tray.
  • An electronic component testing apparatus used for testing electrical characteristics of the electronic device under test by bringing the electronic device under test into electrical contact with the outside of the contour of the test head in a state where the electronic device is mounted.
  • An application unit that applies a thermal stress of a predetermined temperature to the electronic device under test in a state where the electronic device under test is mounted on the test tray, and the electronic device under test mounted on the test tray in a predetermined posture.
  • a test unit that presses a component against the test head and electrically contacts the electronic component to be tested mounted on the test tray to the outside of the contour, and the application unit includes the test tray within the application unit.
  • an electronic device test apparatus having a first posture changing means for changing from a horizontal posture to the predetermined posture (see claim 1).
  • the test tray is converted into a predetermined posture that is a posture at the time of the horizontal posture force test in the application unit that applies a thermal stress of a predetermined temperature to the electronic device under test. This prevents the IC from dropping from the test tray during transport.
  • a predetermined posture for the test for example, a vertical posture obtained by rotating the test tray 90 degrees from the horizontal posture can be cited.
  • the first posture changing means is provided in the latter half portion of the application section (see claim 2).
  • the first posture changing means is provided in the application section and in the vicinity of the outlet (see claim 3). ).
  • the electronic component to be tested be mounted on the test tray, and a loader unit that carries the test tray into the application unit in a horizontal posture is preferably provided. (See Section 4).
  • the electronic device under test is further equipped with a removing unit that removes thermal stress from the test tray mounted on the test tray, and the removing unit includes the test tray in the removing unit.
  • Predetermined posture force It is preferable to have second posture changing means for converting to a horizontal posture (see claim 5).
  • the second posture changing means is provided in the first half of the removal portion (see claim 6).
  • the second attitude control means includes the removal It is preferable that it is provided in the vicinity of the entrance and in the vicinity of the entrance (see claim 7).
  • the tray is provided with an unloader section that receives the test tray from the removal section and classifies the electronic devices under test based on a test result. Is preferred (see claim 8).
  • the electronic device under test is electrically contacted to the outside of the contour of the test head in a state where the electronic device under test is mounted on the test tray.
  • An electronic component test method for testing electrical characteristics of the electronic device under test wherein the electronic device under test is heated to a predetermined temperature in a state where the electronic device under test is mounted on the test tray.
  • An applying step for applying stress, and the electronic device under test mounted on the test tray in a predetermined posture is pressed against the test head, and the electronic device under test mounted on the test tray is brought into contact with the contact portion.
  • a test step wherein in the applying step, the test tray is converted from a horizontal posture to the predetermined posture while applying a thermal stress to the electronic device under test. That test methods of electronic component is provided (see claim 9).
  • the test tray in the applying step of applying a thermal stress of a predetermined temperature to the electronic device under test, the test tray is converted from a horizontal posture to a predetermined posture that is a posture at the time of testing. This can prevent the IC from dropping from the test tray during transport.
  • a predetermined posture for the test for example, a vertical posture obtained by rotating the test tray 90 degrees from the horizontal posture can be cited.
  • test tray is converted into the horizontal posture force to the predetermined posture in the latter half of the application step (see claim 10).
  • the electronic component to be tested be mounted on the test tray and provided with a loader step that delivers the test tray to the application step in a horizontal posture. (See claim 11).
  • the electronic device includes a removal step of removing thermal stress from the electronic component under test in a state of being mounted on the test tray, and a plurality of the electronic components under test are included in the removal step. It is preferable to convert the test tray from the predetermined posture to a horizontal posture while removing heat stress from (refer to claim 12). [0021] Although not particularly limited in the above invention, it is preferable to convert the test tray into the predetermined posture force horizontal posture in the first half of the removal step (see claim 13).
  • FIG. 1 is a perspective view showing an entire electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a side view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 4 is a schematic perspective view showing three-dimensional handling of a test tray in the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing the operation of the test tray along the vertical direction in the thermostatic chamber of the electronic device test apparatus according to the embodiment of the present invention.
  • Fig. 6 is a schematic cross-sectional view showing the operation of the test tray along the vertical direction in the heat removal tank of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 7 is an exploded perspective view showing a test tray used in the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 8 is a perspective view showing an accommodating portion provided in the test tray shown in FIG.
  • FIG. 9 is a schematic perspective view showing an entire mechanism for operating a test tray of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 10 is a schematic sectional view taken along line xx in FIG.
  • FIG. 11 is a partial front view of the upper part of the thermostatic chamber as viewed along the xi direction of FIG.
  • FIG. 12 is a partial side view of the lower part of the thermostatic chamber as viewed along the xii direction of FIG.
  • FIG. 13 is a cross-sectional view for explaining a connection state between an IC mounted on a test tray and a contact pin of the test head in the embodiment of the present invention.
  • FIG. 14 is a schematic cross-sectional view showing the operation of a test tray along the vertical direction in a thermostatic chamber of an electronic component test apparatus according to another embodiment of the present invention.
  • FIG. 15 is a schematic cross-sectional view showing a test tray routed along a vertical direction in a thermostatic chamber of an electronic device test apparatus according to still another embodiment of the present invention.
  • FIG. 1 is a perspective view showing an entire electronic component testing apparatus according to the present embodiment
  • FIG. 2 is a side view showing the electronic component testing apparatus according to the present embodiment
  • FIG. 3 is an electronic component testing apparatus according to the present embodiment
  • FIG. 4 is a conceptual diagram showing tray handling in the test apparatus
  • FIG. 4 is an electronic component according to the present embodiment.
  • Fig. 5 is a schematic perspective view showing the three-dimensional routing of the test tray in the test apparatus.
  • Fig. 5 is a schematic cross-sectional view showing the routing of the test tray along the vertical direction in the thermostatic chamber of the electronic component testing apparatus according to this embodiment.
  • FIG. 6 is a schematic cross-sectional view showing the operation of the test tray along the vertical direction in the heat removal tank of the electronic component testing apparatus according to the present embodiment.
  • the electronic component testing apparatus includes a handler 1 for handling an IC under test, a test head 5 with which the IC is electrically contacted, It also consists of a tester 9 that sends a test signal to test head 5 and performs an IC test.
  • the handler 1 includes a chamber unit 100, a storage unit 200 that stores pre-test ICs or stores classified ICs, and a loader that sends the pre-test ICs from the storage unit 200 to the chamber unit 100.
  • the unit 300 and the unloader unit 400 that transports the tested ICs that have been tested in the chamber unit 100 to the storage unit 200 while classifying them are configured.
  • This handler 1 is a device that applies high-temperature or low-temperature thermal stress to the IC during the test, presses the IC against the test head 5, and further classifies the IC according to the test result.
  • the test in the given state is carried out by transferring the ICs from the tray on which a large number of ICs to be tested are mounted (hereinafter referred to as force stator tray KST) to the test tray TST that is circulated and conveyed in the handler 1 .
  • this test tray TST is loaded into the chamber portion 100 in a horizontal posture after IC is loaded by the loader portion 300 (position I in Figs. 3 and 4).
  • the horizontal posture is converted to the vertical posture (position 11 ⁇ position III in FIGS. 3 to 5), and each IC is mounted on the test tray TST in the test chamber 120 in the test head.
  • the electrical characteristics of the IC are tested by pressing the contact pin 51 of 5 (see Fig. 13) and making electrical contact (Position IV ⁇ Position V ⁇ Position VI in Figs. 3 and 4). ).
  • the IC is returned from the vertical posture to the horizontal posture in the heat removal tank 130 and then transferred to the unloader section 400 (position VII ⁇ position VIII in FIGS. 3, 4 and 6). In part 400, it is transferred to the customer tray KST according to the test results (position IX and position X in Figs. 3, 4 and 6).
  • FIG. 7 is an exploded perspective view showing a test tray used in the electronic device testing apparatus according to the present embodiment
  • FIG. FIG. 8 is a perspective view showing an accommodating portion provided in the test tray shown in FIG.
  • the test tray TST has a rectangular frame 61 in which a plurality of bars 62 are formed in parallel and substantially at equal intervals.
  • a plurality of protruding mounting pieces 63 are formed at substantially equal intervals on both sides of each crosspiece 62 or on the side 61a of the frame 61 facing the crosspiece 62.
  • maintenance part 64 is each divided on the basis of the attachment piece 63 between the opposing crosspieces 62 or between the opposing crosspiece 62 and the edge
  • One carrier 65 is held in each holding portion 64, and each carrier 65 is attached to two attachment pieces 63 by a fastener 66 in a floating state.
  • 16 carriers are installed in one test tray TST.
  • the carrier 65 has the same shape and the same size as the outer shape, and an accommodating portion 67 for accommodating an IC is formed in each carrier 65.
  • the accommodating portion 67 is determined according to the shape of the IC to be accommodated, and has a rectangular concave shape in this example.
  • Each carrier 65 is provided with a hook-shaped latch 68 as shown in FIG.
  • the latch 68 is formed so as to protrude upward from the bottom surface of the housing portion 67 and can be elastically deformed by a synthetic resin material constituting the carrier 65.
  • the latch 68 is latched on the surface of the IC housed in the housing portion 67.
  • the 68 return part is locked to prevent the IC from shifting out.
  • Latch release mechanisms 315 and 415 are provided on both sides of the suction pads 314 and 414 for sucking the IC.
  • the suction pad 314 releases the suction of the IC, whereby the housing portion 67 It is possible to accommodate IC.
  • the latch release mechanism 315 is separated from the latch 68, the latch 68 returns to the original state by the elastic force. Therefore, the IC to which the latch 68 is locked does not fall from the test tray TST even if the test tray TST is in the vertical position.
  • the suction pad 314 and the latch release mechanism 315 are provided in the XY movement device 310 of the order unit 300 described later.
  • FIG. 9 is a schematic perspective view showing the entire mechanism for operating the test tray of the electronic component test apparatus according to the present embodiment
  • FIG. 10 is a schematic cross-sectional view taken along line xx of FIG. 9, and
  • FIG. 9 is a partial front view of the upper part of the bath viewed along the xi direction of FIG. 9,
  • FIG. 12 is a partial side view of the lower part of the thermostatic bath viewed along the xii direction of FIG. 9, and
  • FIG. 13 is a test in this embodiment.
  • FIG. 4 is a cross-sectional view for explaining a connection state between an IC mounted on a tray and a contact pin of a test head.
  • the storage unit 200 includes a pre-test IC stocker 201 that stores pre-test ICs, a tested IC stocker 202 that stores ICs classified according to test results, and an operation range that includes all stockers. And a tray transfer device 205 having the same.
  • the pre-test IC stocker 201 and the tested IC stocker 202 have a frame-shaped tray support frame 203, and an elevator 204 that can enter from the bottom of the tray support frame 203 and move up and down. is doing.
  • a plurality of customer trays KST are stacked and supported on the tray support frame 203, and the stacked customer trays KST can be moved in the vertical direction by the elevator 204.
  • a pre-test IC stocker 201 holds a stack of customer trays that store ICs to be tested. On the other hand, in the tested IC stocker 202, customer trays KST in which the ICs that have been tested are appropriately classified are stacked and held.
  • the tested IC stocker 201 As shown in FIG. 3, in this embodiment, eight stockers STK_1, STK_2,..., STK-8 are provided as the tested IC stocker 201, and the maximum depending on the test result. It can be classified into 8 types. In other words, in addition to the distinction between non-defective products and defective products, it is possible to classify non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It ’s going to be.
  • the above-described customer tray KST is carried to the loader unit 300 by an elevating table (not shown) so as to face the upper surface through the window 151 provided on the substrate 15. And the customer IC force loaded on the tray KST Stops at position 1 of the loader unit 300 (see Fig. 3 to Fig. 5 and Fig. 9) and is loaded on the test tray TST.
  • the loader unit 300 includes an XY moving device 310 that transfers the ICs before the test from the customer tray KST to the test tray TST. As shown in Fig. 1, this XY moving device 310 can reciprocate between the test tray TST and the customer tray KST by the two rails 311 installed on the top of the board 15 and the two rails 311.
  • a movable arm 312 (this direction is defined as Y direction), and a movable head 313 supported by the movable arm 312 and movable in the X direction along the movable arm 312.
  • the above-described suction pad 314 (see FIG. 8) is mounted downward on the movable head 313 of the XY moving device 310.
  • the XY mover 310 sucks the IC from the customer tray KST using the suction pad 314, moves the IC, and releases the suction pad 314 suction at a predetermined position on the test tray TST. It is possible to transship ICs to TST. For example, about eight such suction pads 314 are attached to one movable head 313, and eight ICs can be transferred from the customer tray KST to the test tray TST at a time.
  • a precursor 320 is provided between the customer tray KST and the test tray TST.
  • the precursor 320 has a relatively deep recess, which is not particularly illustrated, and the periphery of the recess is surrounded by an inclined surface. Therefore, the ICs to be transferred from the customer tray KST to the test tray TST are dropped into the Preciseer 320 before being placed on the test tray TST, so that the mutual positional relationship between the eight ICs can be accurately determined and The IC can be accurately transferred to the test tray TST.
  • test tray TST is carried into the chamber unit 100 by the tray transfer device 16 (described later).
  • the tray transfer device 205 stores the empty tray in the empty tray stocker 206, and supplies the empty tray to the stocker 202 when the customer tray KST of the tested IC stocker 202 is filled with the IC.
  • the chamber unit 100 includes a thermostat 110 for applying a high or low temperature heat stress to the IC loaded on the test tray TST, and an IC in a state where thermal stress is applied in the thermostat 110.
  • the test chamber 120 is in contact with 5, the heat removal tank 130 removes thermal stress from the IC tested in the test chamber 120, and the force is also configured.
  • the thermostat 110 in the present embodiment corresponds to an example of the application unit in the claims
  • the test chamber 120 in the present embodiment corresponds to an example of the test unit in the claims, and is excluded in the present embodiment.
  • the heat bath 130 corresponds to an example of a removal unit in the claims.
  • the constant temperature bath 110 and the heat removal bath 130 are arranged so as to protrude upward from the test chamber 120.
  • a substrate 15 is passed between the upper part of the thermostatic chamber 110 and the upper part of the heat removal tank 130, and a tray transport device 16 composed of, for example, a rotating roller is provided on the substrate 15.
  • the tray transfer device 16 returns the test tray TST to the thermostat 110 via the heat removal tank 130, the unloader 400 and the loader 300.
  • the constant temperature bath 110 can apply a high or low temperature thermal stress of about 55 ° C. to 150 ° C. to the IC mounted on the test tray TST.
  • the constant temperature bath 110 has a horizontal transport device 111 for horizontally moving the test tray TST supplied from the loader unit 300 by the tray transport device 16, and a test tray from the horizontal transport device 111.
  • the vertical transport device 112 that receives the TST and transports it vertically downward, and the test tray TST from the vertical transport device 112, and rotates the test tray TST from the vertical posture to the horizontal posture.
  • the posture changing device 113 for transferring the pressure to the test chamber 120 and the force S are provided.
  • the horizontal transport device 111 includes an L-shaped holding member 11la capable of holding the side portion of the test tray TST, and the holding member 11la as a test tray TST.
  • An air cylinder 11 lb that supports the air cylinder 11 lb so as to be movable in the width direction, a base member 11 lc that moves the air cylinder 11 lb up and down in the Z direction, and a pair of lenores that support the base member 11 lc movably in the Y direction. It consists of 11 Id.
  • the horizontal transfer device 111 receives the test tray TST from the tray transfer device 16 at one end of the rail 11 Id, and after the base member 11 lc slightly lifts the air cylinder 11 lb, the other end of the rail 1 1 Id Move and drive the air cylinder 11 lb to widen the spacing of the holding member 11 la By releasing the test tray TST, the test tray TST is delivered to the clamp 112a of the vertical conveyance device 112.
  • the vertical conveying device 112 includes a plurality of clamps 112a capable of holding the test tray TST in a horizontal posture, and an endless in which these clamps 112a are provided at substantially equal intervals.
  • Belt conveyor 112b, and the plurality of clamps 112a can be moved in the vertical direction by the belt conveyor 112b.
  • test tray TST When the test tray TST is supplied from the horizontal transport device 111, the vertical transport device 112 descends over a certain period of time while holding the test tray TST in a horizontal posture by the clamp 112a (FIG. 3 to FIG. 3). Position 5) in Figures 5 and 9. During this time, high or low temperature thermal stress is applied to multiple ICs mounted on the test tray TST.
  • the attitude changing device 113 includes a rail 113a provided along the Z-axis direction so as to face the belt conveyor 112b of the vertical conveying device 112, and an upper surface of the rail 113a.
  • a movable arm 113b that is movable along the Z-axis direction and can be expanded and contracted in the Y-axis direction
  • a movable head 113c that is provided at the tip of the movable arm 113b and that can rotate around the X-axis
  • X A chuck 113d is provided on the movable head 113c so as to be extendable and contractable in the direction, and can grip the test tray TST.
  • the posture changing device 113 receives the test tray TST from the clamp 112a positioned at the lowermost stage of the vertical conveying device 112, and rotates the test tray TST clockwise while moving the test tray TST downward. , Turn the test tray TST from horizontal to vertical, and deliver the test tray TST to the guide rail 101 (position 111 in FIGS. 3 to 5 and 9).
  • the test tray TST placed on the guide rail 101 is pushed out into the test chamber 120 in a vertical posture by the belt conveyance device 102 provided in parallel with the upper portion of the guide rail 101.
  • the guide rail 101 and the belt conveyance device 102 communicate with the test chamber 120 and the heat removal tank 130 through the outlet 114 of the constant temperature bath 110.
  • the time for the test tray TST to be in the vertical posture is shortened to prevent the IC from dropping, and the rotation time is applied to heat. Can be absorbed in time.
  • the second half of the thermostatic chamber 110 which is a test chamber from the thermostatic chamber 110.
  • An attitude changing device 113 is provided in the vicinity of the exit 114 to the Yamba 120 (see FIG. 5). This further shortens the time for which the test tray TST is in the vertical position and further prevents the IC from falling.
  • the “horizontal posture” means a posture in which the main surface of the test tray TST is directed in the vertical direction and the input / output terminals of the IC are directed downward.
  • “Position” means a posture in which the main surface of the test tray TST faces the left-right direction.
  • the test head 5 is disposed at the center thereof. Then, when the test tray TST is transported to the position facing the test head 5 (position V in FIGS. 3, 4 and 9), the IC is mounted with the test tray TST in the vertical state as shown in FIG. Press against the test head 5 to bring the IC input / output terminal HB into electrical contact with the contact pin 51 of the test head 5.
  • a pusher 121 for pressing the IC toward the test head 5 is provided at a position facing the test head 5. This pusher 121 presses the IC housed in each carrier 65 toward the test head 5 (presses in the Y direction in FIG. 9), contacts the IC with the test head 5, and the electrical characteristics of the IC. Run the test.
  • the result of this test is an address determined by the identification number assigned to the test tray TST and the IC number assigned in the test tray TST, and is stored in the storage device of the electronic component test apparatus.
  • the test head 5 is rotatably supported, for example, with the shaft 52 as a fulcrum. Therefore, when the test head 5 is tilted outward, the contact pin of the test head 5 is 51 can be exposed to the outside of Handler 1 in an upward posture. This facilitates the work of taking the test head 5 out of the handler 1.
  • the heat removal tank 130 can remove thermal stress from a tested IC mounted on the test tray TST.
  • the heat removal bath 130 cools the IC to a room temperature by blowing air, and when low temperature is applied in the thermostatic bath 110, the IC is heated with hot air or a heater. Then return to a temperature that does not cause condensation.
  • an attitude changing device 133 Inside the heat removal tank 130, an attitude changing device 133, a vertical transfer device 132, and a horizontal transfer device 131 having the same structure as that of the thermostatic bath 110 are provided. Then, as shown in FIG. 6, the belt conveying device 102 along the guide rail 101 passes through the inlet 134 to the heat removal tank 130.
  • the loaded test tray TST is transferred to the vertical transfer device 132 while the posture changing device 133 converts the vertical posture into the horizontal posture (position VII in FIGS. 3, 5, and 9).
  • the vertical transfer device 132 receives the test tray TST from the posture changing device 133, and ascends over a certain time while holding the test tray TST in the horizontal posture (position VI in FIGS. 3, 5, and 9).
  • test tray TST is transported to the top by the vertical transport device 132, the horizontal transport device 131 transfers the test tray TST to the tray transport device 16.
  • the tray transfer device 16 carries the test tray TST to the unloader unit 400.
  • the time for the test tray TST to be in the vertical posture is shortened to prevent the IC from dropping, and the rotation time is heated. It can be absorbed during the removal time.
  • the posture changing device 133 is provided in the first half of the heat removal tank 130 and in the vicinity of the inlet 134 from the test chamber 120 to the heat removal tank 130. This further shortens the time during which the test tray TST is in the vertical position, and further prevents the IC from dropping.
  • the unloader unit 400 includes two XY movement devices 410, and each XY movement device 410 has the same configuration as the XY movement device 310 provided in the loader unit 300, and includes a lenore 411, a movable arm. 412, movable head 413 and suction pad 414 force are configured.
  • This XY moving device 410 transfers the IC from the test tray TST to the customer tray KST according to the test result.
  • the test tray TST is carried out of the heat removal tank 130 by the tray transfer device 16, and is stopped at a position I X and a position X (see FIGS. 3, 5, and 9).
  • the customer tray KST is carried to the unloader section 400 by the lifting table so as to face the upper surface through the window 152 provided on the substrate 15.
  • the ascending / descending table lowers the full customer tray KST and transfers the full customer tray KST to the tray transfer arm 205.
  • the tray transfer arm 205 loads the customer tray KST on the stocker STK-1, STK-2, ST, and STK-8 according to the classification in the tested IC stocker 202.
  • the empty tray is taken out from the tray and supplied to the window 152.
  • FIG. 14 is a schematic cross-sectional view showing the operation of the test tray along the vertical direction in the thermostatic chamber of the electronic component testing apparatus according to another embodiment of the present invention
  • FIG. 15 is still another embodiment of the present invention. It is a schematic sectional drawing which shows the handling of the test tray along the perpendicular direction in the thermostat of the electronic component testing apparatus which concerns on this.
  • a buffer unit for storing several converted test trays TST may be provided.
  • the test tray TST immediately after being supplied from the loader unit 300 to the thermostat 110 is converted into a horizontal posture force and a vertical posture by the posture changing device 113, and the test tray TST in the vertical posture is exited. You may send out toward 114 sequentially.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un dispositif de test de composants électroniques servant à tester les caractéristiques électriques de circuits intégrés. Pour ce faire, les circuits intégrés sont mis en contact électrique avec les broches de contact d'une tête (5) de test, de sorte qu'une pluralité de circuits intégrés sont chargés sur un plateau de test (TST). Le dispositif de test de composants électroniques comporte un bain (110) à température constante permettant d'appliquer sur les circuits intégrés une contrainte thermique à une température prescrite lorsque ceux-ci sont chargés sur le plateau de test; et une chambre (120) de test qui applique les circuits intégrés sur la tête (5) de test en mettant le plateau de test en position verticale et en amenant simultanément les circuits intégrés chargés sur ledit plateau en contact électrique avec des parties de contact. Le bain (110) à température constante est équipé d'un dispositif (113) de changement de position permettant de faire passer le plateau de test de la position verticale à une position horizontale dans ledit bain (110).
PCT/JP2006/300558 2006-01-17 2006-01-17 Dispositif et procédé de test de composants électroniques WO2007083357A1 (fr)

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PCT/JP2006/300558 WO2007083357A1 (fr) 2006-01-17 2006-01-17 Dispositif et procédé de test de composants électroniques

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PCT/JP2006/300558 WO2007083357A1 (fr) 2006-01-17 2006-01-17 Dispositif et procédé de test de composants électroniques

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011185637A (ja) * 2010-03-05 2011-09-22 Chugoku Electric Power Co Inc:The 電力計支持装置

Citations (3)

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