[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2006083518A3 - Chucking system for nano-manufacturing - Google Patents

Chucking system for nano-manufacturing Download PDF

Info

Publication number
WO2006083518A3
WO2006083518A3 PCT/US2006/001145 US2006001145W WO2006083518A3 WO 2006083518 A3 WO2006083518 A3 WO 2006083518A3 US 2006001145 W US2006001145 W US 2006001145W WO 2006083518 A3 WO2006083518 A3 WO 2006083518A3
Authority
WO
WIPO (PCT)
Prior art keywords
nano
manufacturing
chucking system
land
protrusions
Prior art date
Application number
PCT/US2006/001145
Other languages
French (fr)
Other versions
WO2006083518A2 (en
Inventor
Daniel A Babbs
Byung-Jin Choi
Anshuman Cherala
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,499 external-priority patent/US7636999B2/en
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Priority to EP06718240A priority Critical patent/EP1843884A4/en
Priority to JP2007553121A priority patent/JP4648408B2/en
Priority to SG201000535-3A priority patent/SG159498A1/en
Publication of WO2006083518A2 publication Critical patent/WO2006083518A2/en
Publication of WO2006083518A3 publication Critical patent/WO2006083518A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention is directed towards a chucking system, including, inter alia, a body having a surface with a pin extending therefrom having a throughway defined therein, and a land surrounding the protrusions defining a channel between the pin and the land. In a further embodiment, the body comprises a plurality of protrusions.
PCT/US2006/001145 2005-01-31 2006-01-12 Chucking system for nano-manufacturing WO2006083518A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP06718240A EP1843884A4 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing
JP2007553121A JP4648408B2 (en) 2005-01-31 2006-01-12 Chucking system for nano machining
SG201000535-3A SG159498A1 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/047,499 2005-01-31
US11/047,428 2005-01-31
US11/108,208 2005-04-18
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate

Publications (2)

Publication Number Publication Date
WO2006083518A2 WO2006083518A2 (en) 2006-08-10
WO2006083518A3 true WO2006083518A3 (en) 2007-03-29

Family

ID=36777728

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2006/001160 WO2006083520A2 (en) 2005-01-31 2006-01-12 Method of separating a mold from a solidified layer disposed on a substrate
PCT/US2006/001145 WO2006083518A2 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing
PCT/US2006/001151 WO2006083519A2 (en) 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2006/001160 WO2006083520A2 (en) 2005-01-31 2006-01-12 Method of separating a mold from a solidified layer disposed on a substrate

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2006/001151 WO2006083519A2 (en) 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck

Country Status (4)

Country Link
EP (1) EP1843884A4 (en)
KR (1) KR101254042B1 (en)
TW (2) TWI277504B (en)
WO (3) WO2006083520A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773729B2 (en) * 2005-02-28 2011-09-14 キヤノン株式会社 Transfer apparatus and device manufacturing method
JP5069979B2 (en) * 2007-09-03 2012-11-07 東芝機械株式会社 Release device, supply / discharge system, and release method
WO2010005032A1 (en) * 2008-07-09 2010-01-14 東洋合成工業株式会社 Pattern-forming method
JP5438578B2 (en) * 2010-03-29 2014-03-12 富士フイルム株式会社 Method and apparatus for forming fine uneven pattern
JP4774125B2 (en) * 2010-10-04 2011-09-14 キヤノン株式会社 Transfer apparatus, mold, and device manufacturing method
JP6333031B2 (en) 2014-04-09 2018-05-30 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6659104B2 (en) * 2014-11-11 2020-03-04 キヤノン株式会社 Imprint method, imprint apparatus, mold, and article manufacturing method
US10620532B2 (en) * 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP7284639B2 (en) 2019-06-07 2023-05-31 キヤノン株式会社 Molding apparatus and article manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160430A (en) * 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
US6512401B2 (en) * 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
US20050046449A1 (en) * 2003-08-26 2005-03-03 Davis Jeffrey B. Voltage mismatch tolerant input/output buffer
US7023238B1 (en) * 2004-01-07 2006-04-04 Altera Corporation Input buffer with selectable threshold and hysteresis option

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110341C2 (en) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Method and apparatus for aligning a thin substrate in the image plane of a copier
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
JPH06244269A (en) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp Semiconductor manufacturing apparatus, wafer vacuum chuck device thereof, and gas cleaning and nitride film formation therefor
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
CA2393037C (en) * 1999-12-01 2008-07-15 Nokia Corporation Providing gateway functionality in a virtual private network
WO2002008835A2 (en) * 2000-07-16 2002-01-31 Board Of Regents, The University Of Texas System High-resolution overlay alignment methods and systems for imprint lithography
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
US7296519B2 (en) * 2002-05-27 2007-11-20 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from stamp to a substrate
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160430A (en) * 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
US6512401B2 (en) * 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
US20050046449A1 (en) * 2003-08-26 2005-03-03 Davis Jeffrey B. Voltage mismatch tolerant input/output buffer
US7023238B1 (en) * 2004-01-07 2006-04-04 Altera Corporation Input buffer with selectable threshold and hysteresis option

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1843884A4 *

Also Published As

Publication number Publication date
KR101254042B1 (en) 2013-04-12
TWI291212B (en) 2007-12-11
KR20070102723A (en) 2007-10-19
TW200633114A (en) 2006-09-16
EP1843884A2 (en) 2007-10-17
WO2006083519A3 (en) 2009-04-23
WO2006083520A3 (en) 2009-05-14
WO2006083518A2 (en) 2006-08-10
TW200633846A (en) 2006-10-01
WO2006083519A2 (en) 2006-08-10
WO2006083520A2 (en) 2006-08-10
TWI277504B (en) 2007-04-01
EP1843884A4 (en) 2008-12-17

Similar Documents

Publication Publication Date Title
SG159498A1 (en) Chucking system for nano-manufacturing
WO2006083518A3 (en) Chucking system for nano-manufacturing
IL187873A0 (en) Surface functional electro-textile with functionality modulation capability, methods for making the same, and applications incorporatiing the same
WO2009137399A3 (en) High density breaker fluids and methods of use thereof
TW200706689A (en) Gas providing member and processing device
WO2006076815A3 (en) Angularly stable device for mutually fixing a longitudinal carrier to a bone fixing element
CA115970S (en) Transmitter assembly
WO2001063241A3 (en) Microfluidic devices and methods
WO2007103724A3 (en) Pipe and tubing connector
EP1731121A3 (en) Ear plug
WO2009146699A3 (en) Ball joint
WO2007076132A3 (en) Compositions comprising oriented, immobilized macromolecules and methods for their preparation
WO2007041062A3 (en) Devices and methods for facilitating fluid transport
DE602008002648D1 (en) Dual communication trailer assembly with an insert in a base
CA118276S (en) Yagi antenna
WO2005044396A3 (en) Ball that is divided into compartments and contains integrated electronic transmission means
WO2008033620A3 (en) Systems and methods for developing a secondary collimator
WO2007076174A3 (en) Methods, systems, and apparatus for multi-domain markers
TW200702568A (en) Fastener receptacle
CA115127S (en) Ink cartridge
WO2005114452A3 (en) Service oriented architecture
WO2008056254A3 (en) Element for signs, process and system for manufacturing it
CA115124S (en) Ink cartridge
WO2005121573A3 (en) Joint assembly
WO2005015335A3 (en) High accuracy low leakage valve for high pressure applications

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680003091.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006718240

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007553121

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE