WO2005115624A1 - Temperierverfahren und-vorrichtung für die temperaturbehandlung kleiner flüssigkeitsmengen - Google Patents
Temperierverfahren und-vorrichtung für die temperaturbehandlung kleiner flüssigkeitsmengen Download PDFInfo
- Publication number
- WO2005115624A1 WO2005115624A1 PCT/EP2005/005617 EP2005005617W WO2005115624A1 WO 2005115624 A1 WO2005115624 A1 WO 2005115624A1 EP 2005005617 W EP2005005617 W EP 2005005617W WO 2005115624 A1 WO2005115624 A1 WO 2005115624A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- temperature control
- heating
- heating device
- liquid
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
- B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
- B01L7/525—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples with physical movement of samples between temperature zones
- B01L7/5255—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples with physical movement of samples between temperature zones by moving sample containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
- B01L2300/1816—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
- B01L2300/1827—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using resistive heater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/508—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above
- B01L3/5088—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above confining liquids at a location by surface tension, e.g. virtual wells on plates, wires
Definitions
- the invention relates to temperature control processes for carrying out a defined, in particular cyclical, temperature treatment of small amounts of liquid on substrates, temperature control devices and substrates for carrying out the method.
- reagents In particular in the case of PCR (polymerase chain reaction) for the duplication of specific DNA sequences, reagents must be subjected to a very defined and special temperature profile. As a rule, it is necessary to heat up and cool the reagents cyclically. It is of great importance for the reproducibility of the course of the reaction that the temperature ramps can be carried out quickly, precisely and reproducibly.
- z. B. used a Röche Light Cycler, in which the glass capillaries are cooled or heated with the help of a temperature-controlled air flow.
- a corresponding technology is e.g. B. described in US 5,455,175 or US 6,174,670.
- thermal cyclers have metallic recording blocks in which plastic caps or micro-titer plates are recorded with the PCR reagents.
- the metal block is heated using conventional resistance heating or Peltier elements, which can also be used for cooling.
- the metallic receptacle blocks In order to be able to cool the reagent vessels effectively, the metallic receptacle blocks must have a sufficiently large thermal capacity and therefore sufficient thermal mass to be able to dissipate the heat quickly.
- the cooling of the metallic receiving block is, for. B. with the aid of a strong blower or a Peltier element (US 5,038,852, US 5,333,675).
- the high thermal mass of the receiving block can lead to temperature gradients which lead to locally different temperature conditions.
- Another approach to heating / cooling is the use of tempered liquids which are passed through the receiving block (US 5,038,852). Corresponding switching valves and equipment configurations are to be provided.
- the reagents are processed on essentially planar substrates of the order of magnitude, as are known from microelectronics, in small amounts of liquid of the order of a few 10 nl to several 100 ⁇ l.
- Reaction vessels can z. B. generated by etched structures on the substrate.
- a special embodiment provides that the reagents are applied to a planar substrate in the form of drops, which are held together by their surface tension and thus do not require any etched structures.
- a localization of the drops held together by the surface tension can e.g. B. can be achieved by areas on the substrate surface which are preferably wetted by the reagent liquid and in this respect represent anchor points.
- Such completely planar substrates have e.g. B. the size of a few mm 2 to a few cm 2 .
- the object of the present invention is to specify temperature control methods and temperature control devices with the aid of which a defined, in particular cyclical, temperature treatment of small amounts of liquid on essentially planar substrates is made possible, which enables a precise and reproducible temperature profile with a simple construction.
- one or more quantities of liquid are applied to a preferably essentially planar substrate.
- the amounts of liquid are on the substrate z. B. held together by their surface tension or are in etched receptacle contours or separate containers and generally each comprise a few 10 nl to a few 10 ⁇ l.
- the substrate is preferably planar on the underside and likewise essentially planar on the upper side, with the exception of the possibly etched receiving contours.
- the substrate can e.g. B. be a glass slide or from other substrate material such.
- the amounts of liquid can e.g. B. applied in etched receiving structures or small containers on the substrate. It is particularly simple if the individual amounts of liquid are applied to the surface of the substrate in the form of drops, which generally comprise a few 10 nl to a few 10 ⁇ l.
- the substrate is brought into thermal contact with a heating device which is put into operation during the heating-up phases of the temperature treatment.
- the substrate with the amounts of liquid is therefore in constant thermal contact with the heating device, which, however, is only in operation during the heating phases.
- a heat-conductive element is brought into thermal contact with the substrate and / or the heating device, the heat capacity of which is greater than or equal to the sum of the heat capacities of the quantities of liquid, the substrate and at least that part of the heating device which is in thermal contact with the substrate.
- both the substrate and the heating device are cooled. This is done by thermal contact with a thermally conductive element, which due to its heat capacity can effectively dissipate the heat of the heating device and the substrate.
- This thermally conductive element is only in thermal contact during the cooling phases and therefore does not have to be heated during the heating phases. Due to the simple design of the carrier element for the small amounts of liquid, that is, the substrate, the heat capacity of the elements to be cooled is small due to the low thermal mass. The thermally conductive element for cooling during the cooling phases can therefore also have a lower thermal mass, so that it can also be cooled again quickly and easily.
- the thermal contact between the thermally conductive element and the substrate is interrupted and the heating device is put into operation.
- the thermally conductive element acts like a heat sink and acts as an effective mediator for releasing the heat to the environment.
- the contact between the thermally conductive element and the heating device or the substrate can take place at definable time intervals, so that a defined amount of heat can flow away from the substrate and the heating device. The defined heat transfer is guaranteed by the special selection of the heat capacity.
- the inventive method allows the use of e.g. B. transparent substrates that allow an optical examination during or after the reaction in a simple manner.
- the use of planar substrates increases the compatibility of the temperature control process with lab-on-the-chip applications.
- the temperature control process according to the invention can be carried out particularly easily if the substrate is simply placed on a heating device, for. B. on a hot plate, so as to make the thermal contact, and the thermally conductive element during the cooling phase with the heating device, for. B. the heating plate is brought into thermal contact.
- Another embodiment of the method according to the invention uses a substrate which comprises an integrated heating device.
- the one or more amounts of liquid are applied to the substrate with the integrated heating device.
- a thermally conductive higes element brought into thermal contact with the substrate the heat capacity is greater than or equal to the sum of the heat capacities of the amounts of liquid and the substrate.
- the thermal contact between the thermally conductive element and the substrate is interrupted and the heating device is put into operation.
- the heater integrated on the substrate can e.g. B. a resistance heater, which preferably comprises a vapor-deposited metal conductor of high resistance.
- the heating energy is coupled into this resistance heater with the aid of a power source.
- Another embodiment provides an induction heater into which energy is injected with the help of induction.
- the thermally conductive element While the thermally conductive element is not in thermal contact with the substrate or the heating device, it absorbs the heat absorbed. This can e.g. B. with the help of cooling liquids, an air flow or a Peltier element. It is particularly simple and advantageous if the thermally conductive element is in thermal contact with a heat sink when it is not connected to the heating device or the substrate. The amount of heat absorbed by the thermally conductive element during the cooling phase can then emit the absorbed heat to the heat sink during this contact phase. In particular, this can happen while the substrate is being heated by the heating device during a heating phase. The thermally conductive element therefore gives off the heat it has absorbed during the cooling phase to the cooling body until the start of the next cooling phase. The heat sink itself can in turn z. B.
- the heat transfer between the substrate or the heating device and the thermally conductive element on the one hand and between the thermally conductive element and the heat sink on the other hand can be achieved by using coupling media, e.g. As glycerin, can be further improved.
- the amounts of liquid, preferably drops, can on the planar substrate z. B. applied in flat etched receiving structures.
- a process in which the amounts of liquid in the form of drops are held together only by their surface tension is particularly simple and easy to process.
- the wetting properties of the surface of the substrate are selected such that the drops do not flow apart due to their small volume and their surface tension properties.
- areas can also be provided on the substrate which are preferably wetted by the liquid and in this respect represent anchor points for the liquid drops. Wetting-modulated surfaces of this type can be produced in a simple manner using lithographic processes. For processing aqueous solutions z. B. the surface areas outside the anchor points have been made hydrophobic by a silanization process.
- the drops in the amount of liquid can be covered with oil.
- the temperature control method according to the invention is suitable for temperature cycles above room temperature, since it is here that the amount of heat absorbed can be released directly from the thermally conductive element or from the heat sink.
- the temperatures to be set are higher than room temperature, particularly for the advantageous application of the temperature control method according to the invention for PCR products.
- a first temperature control device according to the invention has a heating device and a holding device for a preferably essentially planar substrate, which enable the substrate to be stored in thermal contact with the heating device.
- a thermally conductive element is provided which can be brought into thermal contact with a substrate held by the holding device or with the heating device, the heat capacity of the thermally conductive element being greater than the sum of the heat capacities of the substrate and the heating device.
- the temperature control device according to the invention has a movement device which is designed such that it can bring the thermally conductive element into thermal contact with the substrate or the heating device.
- the temperature control device according to the invention is particularly suitable for carrying out the temperature control method according to the invention.
- the movement device enables the thermally conductive element to be brought into contact with the substrate and / or the heating device.
- the selection of heat capacities according to the invention enables the removal of defined amounts of heat.
- the advantages of the temperature control device according to the invention also result in particular from the advantages of the temperature control method to be carried out with it.
- the holding device is formed directly by the heating device, in particular by a heating plate.
- the heating device can then serve directly as a support for the substrate, so that the thermal contact between the substrate and the heating device has already been established. Separate holding devices in addition to the heating device are then not necessary.
- the design with a hot plate, for. B. a silicon heating plate. Silicon offers itself because of its good and inexpensive availability. It has a high thermal conductivity, which enables a high heat dissipation or supply from or to the substrate.
- a transparent material such as e.g. B. lithium niobate used as a hot plate with the z. B. an optical detection of the course of the reaction from below is possible.
- Another temperature control device has a holding device for a substrate, which has an integrated heating device.
- the temperature control device also has an energy supply device, with the aid of which energy can be coupled into the heating device of the substrate in order to heat it.
- a thermally conductive element is provided which can be brought into thermal contact with a substrate held by the holding device and whose heat capacity is greater than the heat capacity of the substrate.
- this temperature control device also has a movement device which is designed such that it can bring the thermally conductive element into thermal contact with the substrate.
- Such a temperature control device can be used similarly to the temperature control device already described. It can e.g. B. substrates are used in which a metallic resistance heater is preferably vapor-deposited on the underside.
- a temperature control device provided for the use of such substrates has contact devices which come into contact with the resistance heater when the substrate is placed on it.
- the energy supply device of the temperature control device is in this case, for. B. a current source, with the help of which current can be sent through the resistance heater through the contact devices.
- Other temperature control devices have devices by means of which energy can be inductively coupled into an induction heater applied to the substrate. The function and advantages of the thermally conductive element and the movement device of the temperature control device have already been explained above.
- a movement device that includes an electromagnet is simple and precise to control.
- a thermally conductive element for removing the heat from the substrate or the heating device a block of thermally conductive material, for. B. made of metal, in particular aluminum or copper.
- a heat sink is provided with which the thermally conductive element can be brought into thermal contact in order to dissipate the amount of heat absorbed by the substrate or the heating device.
- a metal block, in particular made of aluminum or copper, is suitable as the heat sink, which advantageously has a heat capacity that is greater than the heat capacity of the thermally conductive element.
- the heat sink can comprise cooling fins that ensure effective heat dissipation to the environment. The heat flow can be calibrated in preliminary tests.
- a temperature measuring element is provided which can optionally be used to regulate the temperature control processes.
- a controller in particular a microprocessor controller, can be provided for this purpose.
- the method according to the invention and the device according to the invention are particularly suitable for PCR applications.
- substrates with integrated heating devices for use with a temperature control device according to the invention, in particular a substrate with a, preferably vapor-deposited resistance heating device and a substrate with a, preferably vapor-deposited induction heating.
- FIG. 1 a schematic side sectional view of an embodiment according to the invention in a first process state when carrying out a method according to the invention
- Figure 2 the device of Figure 1 in a second process state
- FIG. 3 a temperature cycle that can be carried out with the method according to the invention.
- the substrate is designated 1.
- the drops 3 are covered with an oil film 5 and are held together by their surface tension. If appropriate, there are hydrophilic anchor points on the substrate 1 in relation to their surroundings, which cause the drops 3 to be localized.
- the entire arrangement lies on the heating plate 7.
- substrate materials such. B. polished silicon, especially when used for PCR. It has a high thermal conductivity, which can effectively conduct the heat generated with the heating plate 7 to the drops 3.
- substrates are e.g. B. coated with silicon dioxide lithium niobate, glass or glass coated with silicon dioxide.
- the heating plate consists, for. B. made of silicon. Not shown is a temperature sensor, e.g. B. a platinum resistance thermometer. On the silicon hot plate, for. B. a thin-film heater made of nickel. The temperature sensor can e.g. B. with the help of thin-film technology also be integrated on the heating plate 7.
- the heating plate then carries a passivation, which is intended to prevent the sensor material from oxidizing during operation and thus moving away from the original calibration data.
- FIG. 13 shows a schematic representation of a lifting magnet for lifting a plunger 15 together with the thermally conductive element 9.
- B a copper block.
- a copper stamp with a mass of 12 g can be used.
- 11 denotes a copper storage block with an exemplary mass of 800 g.
- the lifting magnet 13 is designed such that movement of the copper block
- FIG. 10 shows the copper block 9 in thermal contact with the storage block 11 in FIG. 2 and there is an air gap 8 between the copper block 9 and the heating plate 7.
- FIG. 17 shows cooling fins which serve to cool the storage block 11.
- the embodiment can be used as follows. First, the liquid drops are applied to the substrate, in which, for. B. the PCR reaction is to take place. To protect against evaporation, an oil film 5 is placed over the liquid drops 3. The substrate prepared in this way is placed on the heating plate 7. In order to heat the substrate, the silicon heating plate 7 is heated with the resistance heating (not shown).
- the heating plate 7 is switched off for cooling and thermal contact of the heating plate 7 with the copper block 9 is generated.
- the copper block 9 is brought up into the position of FIG. 1 with the aid of the lifting magnet 13 and the stamp 15. Due to the greater heat capacity, the copper block 9 absorbs heat from the heating plate 7 and the substrate 1 and thus leads to their cooling. After the heat has been absorbed, the copper block 9 is moved back into the position of FIG. 2, in which it is in thermal contact with the copper storage block 11. For this, z. B. the winding of the electromagnet 13 de-energized. In the position of FIG. 2, the copper block 9 can effectively transfer the absorbed heat to the copper storage block 11.
- the movement of the copper block 9 with the aid of the electromagnet 13 and the operation of the heating plate 7 can be controlled by control electronics which use the signal from the temperature sensor (not shown in the figures) on the heating plate 7.
- the necessary heating power of the heating plate 7 or the time that the copper block must remain in contact with the heating plate in order to generate the desired temperature profiles can be determined in preliminary tests or estimated from the thermodynamic parameters.
- the described embodiment has the advantage that the heating plate can be easily loaded with substrates and the reagents on them.
- the substrates can be loaded with reagents outside the device. After the temperature treatment, they are easily accessible for analysis.
- the substrates can be used as disposable.
- An embodiment not shown, enables the use of substrates with an integrated heating device.
- no heating device is provided on the temperature control device, but a simple holder for the substrate.
- the substrate itself has e.g. B. a vapor-deposited resistance heater, which comes into contact with contact devices when the substrate is placed in the temperature control device, which are connected to a power source.
- a vapor-deposited resistance heater which comes into contact with contact devices when the substrate is placed in the temperature control device, which are connected to a power source.
- current is then conducted through the resistance heating of the substrate with the aid of this current source through the contact devices in order to heat the latter.
- an induction heater can be provided on the substrate, which can be heated by inductive coupling of energy.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05747692A EP1732692A1 (de) | 2004-05-25 | 2005-05-24 | Temperierverfahren und-vorrichtung für die temperaturbehandlung kleiner flüssigkeitsmengen |
US11/597,399 US20070295705A1 (en) | 2004-05-24 | 2005-05-24 | Tempering Methods and Tempering Device for the Thermal Treatment of Small Amounts of Liquid |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004025538A DE102004025538A1 (de) | 2004-05-25 | 2004-05-25 | Temperierverfahren und -vorrichtung für die Temperaturbehandlung kleiner Flüssigkeitsmengen |
DE102004025538.5 | 2004-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005115624A1 true WO2005115624A1 (de) | 2005-12-08 |
Family
ID=34969153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/005617 WO2005115624A1 (de) | 2004-05-24 | 2005-05-24 | Temperierverfahren und-vorrichtung für die temperaturbehandlung kleiner flüssigkeitsmengen |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070295705A1 (de) |
EP (1) | EP1732692A1 (de) |
DE (1) | DE102004025538A1 (de) |
WO (1) | WO2005115624A1 (de) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007102785A1 (en) | 2006-03-09 | 2007-09-13 | Agency For Science, Technology And Research | Apparatus for performing a reaction in a droplet and method of using the same |
WO2008000767A1 (de) * | 2006-06-27 | 2008-01-03 | Zenteris Gmbh | Kühleinrichtung für eine reaktionskammer zum prozessieren eines biochips und verfahren zum ansteuern einer solchen kühleinrichtung |
EP1878502A1 (de) * | 2006-07-14 | 2008-01-16 | Roche Diagnostics GmbH | Temperiervorrichtung |
WO2008027398A2 (en) | 2006-08-30 | 2008-03-06 | Advanced Molecular Systems, Llc | Rapid thermocycler |
WO2008135319A1 (de) * | 2007-05-07 | 2008-11-13 | Singulus Technolgies Ag | Induktionsheizung zur dynamischen temperierung einer matrize |
US7666664B2 (en) | 2006-07-14 | 2010-02-23 | Roche Molecular Systems, Inc. | Instrument for heating and cooling |
WO2014102403A1 (es) * | 2012-12-31 | 2014-07-03 | Ikerlan, S. Coop. | Termociclador |
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DE102007003754A1 (de) * | 2007-01-19 | 2008-07-24 | Eppendorf Ag | Temperiervorrichtung mit Kalibrierungseinrichtung |
GB0813562D0 (en) * | 2008-07-24 | 2008-09-03 | Bg Res Ltd | Improvements in reactor apparatus |
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2005
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- 2005-05-24 US US11/597,399 patent/US20070295705A1/en not_active Abandoned
- 2005-05-24 WO PCT/EP2005/005617 patent/WO2005115624A1/de active Application Filing
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JP2009529670A (ja) * | 2006-03-09 | 2009-08-20 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | 小滴中で反応を行うための装置及びその使用方法 |
WO2007102785A1 (en) | 2006-03-09 | 2007-09-13 | Agency For Science, Technology And Research | Apparatus for performing a reaction in a droplet and method of using the same |
EP2004328A1 (de) * | 2006-03-09 | 2008-12-24 | Agency for Science, Technology and Research | Vorrichtung zur durchführung einer reaktion in einem tröpfchen und verfahren zu ihrer verwendung |
EP2004328A4 (de) * | 2006-03-09 | 2009-07-22 | Agency Science Tech & Res | Vorrichtung zur durchführung einer reaktion in einem tröpfchen und verfahren zu ihrer verwendung |
WO2008000767A1 (de) * | 2006-06-27 | 2008-01-03 | Zenteris Gmbh | Kühleinrichtung für eine reaktionskammer zum prozessieren eines biochips und verfahren zum ansteuern einer solchen kühleinrichtung |
US8151589B2 (en) | 2006-06-27 | 2012-04-10 | Zenteris, GmbH | Cooling device for a reaction chamber for processing a biochip and method for controlling said cooling device |
EP1878502A1 (de) * | 2006-07-14 | 2008-01-16 | Roche Diagnostics GmbH | Temperiervorrichtung |
US7682819B2 (en) | 2006-07-14 | 2010-03-23 | Roche Molecular Systems, Inc. | Instrument for heating and cooling |
US7666664B2 (en) | 2006-07-14 | 2010-02-23 | Roche Molecular Systems, Inc. | Instrument for heating and cooling |
EP2061866A4 (de) * | 2006-08-30 | 2011-06-22 | Dxna Llc | Schnelles thermocycler-gerät |
EP2061866A2 (de) * | 2006-08-30 | 2009-05-27 | DxNA LLC | Schnelles thermocycler-gerät |
WO2008027398A2 (en) | 2006-08-30 | 2008-03-06 | Advanced Molecular Systems, Llc | Rapid thermocycler |
CN103525697A (zh) * | 2006-08-30 | 2014-01-22 | 戴克斯纳有限责任公司 | 快速热循环仪 |
DE102007021247A1 (de) * | 2007-05-07 | 2008-11-20 | Singulus Technologies Ag | Induktionsheizung zur dynamischen Temperierung einer Matrize |
WO2008135319A1 (de) * | 2007-05-07 | 2008-11-13 | Singulus Technolgies Ag | Induktionsheizung zur dynamischen temperierung einer matrize |
WO2014102403A1 (es) * | 2012-12-31 | 2014-07-03 | Ikerlan, S. Coop. | Termociclador |
Also Published As
Publication number | Publication date |
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EP1732692A1 (de) | 2006-12-20 |
US20070295705A1 (en) | 2007-12-27 |
DE102004025538A1 (de) | 2005-12-22 |
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