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WO2005074463A3 - Thin film thermoelectric devices for power conversion and cooling - Google Patents

Thin film thermoelectric devices for power conversion and cooling Download PDF

Info

Publication number
WO2005074463A3
WO2005074463A3 PCT/US2004/041431 US2004041431W WO2005074463A3 WO 2005074463 A3 WO2005074463 A3 WO 2005074463A3 US 2004041431 W US2004041431 W US 2004041431W WO 2005074463 A3 WO2005074463 A3 WO 2005074463A3
Authority
WO
WIPO (PCT)
Prior art keywords
header
cooling
thin film
power conversion
thermoelectric devices
Prior art date
Application number
PCT/US2004/041431
Other languages
French (fr)
Other versions
WO2005074463A2 (en
Inventor
Rama Venkatasubramanian
Brooks O'quinn
Edward Siivola
Kip Coonley
Pratima Addepalli
Randy Alley
John Posthill
Thomas Colpitts
Anil Reddy
Chris Caylor
Peter Thomas
Original Assignee
Nextreme Thermal Solutions
Rama Venkatasubramanian
Brooks O'quinn
Edward Siivola
Kip Coonley
Pratima Addepalli
Randy Alley
John Posthill
Thomas Colpitts
Anil Reddy
Chris Caylor
Peter Thomas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextreme Thermal Solutions, Rama Venkatasubramanian, Brooks O'quinn, Edward Siivola, Kip Coonley, Pratima Addepalli, Randy Alley, John Posthill, Thomas Colpitts, Anil Reddy, Chris Caylor, Peter Thomas filed Critical Nextreme Thermal Solutions
Priority to EP04821305A priority Critical patent/EP1756881A4/en
Priority to JP2006544022A priority patent/JP2007535803A/en
Publication of WO2005074463A2 publication Critical patent/WO2005074463A2/en
Priority to US11/406,100 priority patent/US7638705B2/en
Priority to US11/641,563 priority patent/US20100257871A1/en
Publication of WO2005074463A3 publication Critical patent/WO2005074463A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Hybrid Cells (AREA)

Abstract

A thermoelectric device having at least one thermoelectric unit including at least one thermoelectric pair of n-type and p-type thermoelements, a first header couplet to one side of the thermoelectric pair, and a second header coupled to a second side of the thermoelectric pair. The thermoelectric pair has a termal conduction channel area smaller than an area of the first header or the second header such that the thermal conduction area is a fraction of the area of the first header or the second header.
PCT/US2004/041431 2003-12-11 2004-12-13 Thin film thermoelectric devices for power conversion and cooling WO2005074463A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP04821305A EP1756881A4 (en) 2003-12-11 2004-12-13 Thin film thermoelectric devices for power conversion and cooling
JP2006544022A JP2007535803A (en) 2003-12-11 2004-12-13 Thin film thermoelectric devices for power conversion and cooling
US11/406,100 US7638705B2 (en) 2003-12-11 2006-04-18 Thermoelectric generators for solar conversion and related systems and methods
US11/641,563 US20100257871A1 (en) 2003-12-11 2006-12-18 Thin film thermoelectric devices for power conversion and cooling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52847903P 2003-12-11 2003-12-11
US60/528,479 2003-12-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/406,100 Continuation-In-Part US7638705B2 (en) 2003-12-11 2006-04-18 Thermoelectric generators for solar conversion and related systems and methods

Publications (2)

Publication Number Publication Date
WO2005074463A2 WO2005074463A2 (en) 2005-08-18
WO2005074463A3 true WO2005074463A3 (en) 2009-04-02

Family

ID=34837339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/041431 WO2005074463A2 (en) 2003-12-11 2004-12-13 Thin film thermoelectric devices for power conversion and cooling

Country Status (3)

Country Link
EP (1) EP1756881A4 (en)
JP (1) JP2007535803A (en)
WO (1) WO2005074463A2 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003293034A1 (en) 2002-11-25 2004-06-18 Pratima Addepalli Trans-thermoelectric device
CA2549826C (en) 2003-12-02 2014-04-08 Battelle Memorial Institute Thermoelectric devices and applications for the same
US8455751B2 (en) 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7851691B2 (en) * 2003-12-02 2010-12-14 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7834263B2 (en) 2003-12-02 2010-11-16 Battelle Memorial Institute Thermoelectric power source utilizing ambient energy harvesting for remote sensing and transmitting
US7638705B2 (en) * 2003-12-11 2009-12-29 Nextreme Thermal Solutions, Inc. Thermoelectric generators for solar conversion and related systems and methods
US7523617B2 (en) 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US8039727B2 (en) * 2006-04-26 2011-10-18 Cardiac Pacemakers, Inc. Method and apparatus for shunt for in vivo thermoelectric power system
US8538529B2 (en) 2006-04-26 2013-09-17 Cardiac Pacemakers, Inc. Power converter for use with implantable thermoelectric generator
US8003879B2 (en) 2006-04-26 2011-08-23 Cardiac Pacemakers, Inc. Method and apparatus for in vivo thermoelectric power system
CN101669221B (en) * 2006-11-13 2012-05-23 麻省理工学院 Solar thermoelectric conversion
CN100427631C (en) * 2006-11-24 2008-10-22 清华大学 Nano SiC granule composite CoSb3 base thermoelectric material and its preparing process
US8696724B2 (en) 2007-01-11 2014-04-15 Scion Neurostim, Llc. Devices for vestibular or cranial nerve stimulation
US8267984B2 (en) 2007-08-03 2012-09-18 Scion Neurostim, Llc. Neurophysiological activation by vestibular or cranial nerve stimulation
US8267983B2 (en) 2007-01-11 2012-09-18 Scion Neurostim, Llc. Medical devices incorporating thermoelectric transducer and controller
US8525016B2 (en) 2009-04-02 2013-09-03 Nextreme Thermal Solutions, Inc. Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
WO2011075573A1 (en) 2009-12-18 2011-06-23 Scion Neurostim, Llc Devices and methods for vestibular and/or cranial nerve stimulation
DE102010004200A1 (en) 2010-01-08 2011-07-14 Emitec Gesellschaft für Emissionstechnologie mbH, 53797 Device for generating electrical energy from a thermally conductive material
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
US9744074B2 (en) 2010-12-16 2017-08-29 Scion Neurostim, Llc Combination treatments
CA2821260C (en) 2010-12-16 2018-09-11 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
US10537467B2 (en) 2010-12-16 2020-01-21 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
US10512564B2 (en) 2010-12-16 2019-12-24 Scion Neurostim, Llc Combination treatments
CN104576913A (en) * 2014-12-29 2015-04-29 华中科技大学 Semiconductor temperature difference power generation sheet
JP7438685B2 (en) 2019-07-30 2024-02-27 株式会社Kelk Thermoelectric module and method for manufacturing thermoelectric module
CN112953307A (en) * 2021-04-15 2021-06-11 重庆大学 Device with thermoelectric power generation and heat dissipation functions and thermoelectric power generation method
US20240243545A1 (en) * 2023-01-17 2024-07-18 Lawrence Livermore National Security, Llc Systems and methods for cooling high power devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017102A1 (en) * 1998-05-12 2002-02-14 Bell Lon E. Thermoelectric heat exchanger
US6557354B1 (en) * 2002-04-04 2003-05-06 International Business Machines Corporation Thermoelectric-enhanced heat exchanger
US20030099279A1 (en) * 2001-10-05 2003-05-29 Research Triangle Insitute Phonon-blocking, electron-transmitting low-dimensional structures

Family Cites Families (7)

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DE1262457B (en) * 1961-07-11 1968-03-07 Philips Nv Semiconductor arrangement with thermoelectric cooling
US4640977A (en) * 1984-04-23 1987-02-03 Omnimax Energy Corporation Thermoelectric generator using variable geometry with support pedestals of dissimilar materials than the basic thermoelectric semi-conductor elements
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
US5237821A (en) * 1987-08-20 1993-08-24 Kabushiki Kaisha Komatsu Seisakusho Multistep electronic cooler
JPH08316532A (en) * 1995-05-19 1996-11-29 Hitachi Chem Co Ltd Cooling unit structure
US6388185B1 (en) * 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
US6474074B2 (en) * 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017102A1 (en) * 1998-05-12 2002-02-14 Bell Lon E. Thermoelectric heat exchanger
US20030099279A1 (en) * 2001-10-05 2003-05-29 Research Triangle Insitute Phonon-blocking, electron-transmitting low-dimensional structures
US6557354B1 (en) * 2002-04-04 2003-05-06 International Business Machines Corporation Thermoelectric-enhanced heat exchanger

Also Published As

Publication number Publication date
EP1756881A4 (en) 2011-03-09
JP2007535803A (en) 2007-12-06
WO2005074463A2 (en) 2005-08-18
EP1756881A2 (en) 2007-02-28

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