CAPACIT1NE STRAIN SENSORS
BACKGROUND
[0001] The present invention relates to strain gages. More particularly, the present invention
relates to capacitive strain sensors.
[0002] A strain gage is a device used to measure surface strains in structural materials. One type of strain gage used to measure surface strain is a foil type resistance strain gage. Another type of strain gage used to measure surface strain is a capacitive strain gage. A capacitive strain gage generally utilizes capacitors with capacitive plates or elements which are moveable relative to each other as a function of applied strain. As force is applied, causing strain to the structural material, relative movement of the capacitor elements causes the capacitance to change. The change in capacitance is measured by detecting a change in an applied electrical signal.
SUMMARY
[0003] The present invention provides a capacitive strain sensor comprising first and second
anchors and first, second and third finger sets. The first finger set has a plurality of first fingers extending in a first direction. The second finger set has a plurality of second fingers extending in a second direction. The third finger set has a first plurality of third fingers extending in the second direction and positioned adjacent the first fingers such that the first plurality of third fingers overlap the first fingers and a second plurality of third fingers extending in the first direction and positioned adjacent the second fingers such that the second plurality of third fingers overlap the second fingers. The first, second and third finger sets are associated with the first and second anchors such that movement of the first anchor causes the third finger set to move relative to the first and second finger sets such that a first capacitance change is detected between the first fingers and the first plurality of third fingers and a second capacitance change is
detected between the second fingers and the second plurality of second fingers. The first and
second capacitance changes provide a resultant differential capacitance which can be utilized to
determine an applied strain.
[0004] In at least one embodiment, the first, second and third finger sets are provided with
buckled beams to provide a mechanical advantage that improves accuracy and sensitivity of the
strain sensor.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Fig. 1 is a top plan view schematically illustrating overlapped capacitor figures of a linear strain sensor.
[0006] Fig. 2 is a top plan view of a linear comb strain sensor according to a first embodiment of the present invention.
[0007] Fig. 3 is a top plan view schematically illustrating a buckled beam of a linear strain sensor.
[0008] Fig. 4 is a top plan view of a buckled beam strain sensor according to a second
embodiment of the present invention.
[0009] Fig. 5 is micropho to graph of the strain sensor of Fig. 4 illustrating finger
displacement before and after a strain is applied.
[0010] Fig. 6 is a graph showing the typical output versus an applied strain.
[0011] Fig. 7 shows an illustrative process of forming the sensor of Fig. 4.
[0012] Fig. 8 is an SEM picture of the sensor of Fig. 4.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0013] The present invention will be described with reference to the accompanying drawing
figures wherein like numbers represent like elements throughout. Certain terminology, for
example, "top", "bottom", "right", "left", "front", "frontward", "forward", "back", "rear" and
"rearward", is used in the following description for relative descriptive clarity only and is not intended to be limiting.
[0014] Fig. 1 shows the principle of a simplified linear comb drive strain sensor. The
structure includes a first set of capacitor fingers 10 extending from anchor A and a second set of capacitor fingers 12 extending from anchor B. The fingers 12 extend toward and overlap with
the fingers 10. The capacitance between the fingers 10 and 12 is expressed as: x=—, where G is the overlapping length of the fingers 10, 12; h is the thickness of the fingers 10, 12 in the
direction perpendicular to the paper; sis the permeability constant of the material used to
construct the fingers 10, 12, and G is the gap between the fingers 10, 12. When a strain is
applied, as indicated by the arrow S in Fig. 1, it causes a lateral displacement, Δx, of the relative
position of the fingers 10, 12. That is, the overlapping length of the fingers 10, 12 changes, thereby resulting in a change in the capacitance. The capacitance change is expressed as: . _ Axhε
ACx = G
[0015] Fig. 2 shows a linear comb drive strain sensor 20 in accordance with a first embodiment of the present invention. The strain sensor 20 includes first and second finger sets 30 and 40 extending from anchor A and a third finger set 50 extending from anchor B. The first finger set 30 includes a trunk 32 attached to anchor A at base 34. A spring 22 may extend from the opposite end of trunk 32 to anchor B to stabilize the finger set 30. A plurality of branches 36 extend from the trunk 32. Each branch 36 includes a plurality of capacitor fingers 38 extending therefrom toward anchor A. The second finger set 40 includes a trunk 42 attached to anchor A at base 44. A spring 22 may extend from the opposite end of trunk 42 to anchor B to stabilize the finger set 40. A plurality of branches 46 extend from the trunk 42. Each branch 46 includes a plurality of capacitor fingers 48 extending therefrom toward anchor B.
[0016] The third finger set 50 includes a trunk 52 attached to anchor B at base 54. A spring 22 may extend from the opposite end of trunk 52 to anchor A to stabilize the finger set 50. A first set of branches 56 extend from the trunk 52 toward the first finger set 30. Each branch 56 includes a plurality of capacitor fingers 58 extending therefrom toward anchor B such that the capacitor fingers 58 overlap the capacitor fingers 38 of the first finger set 30. A second set of branches 66 extend from the trunk 52 toward the first finger set 40. Each branch 66 includes a plurality of capacitor fingers 68 extending therefrom toward anchor A such that the capacitor fingers 68 overlap the capacitor fingers 48 of the first finger set 40.
[0017] When displacement, Δx, is applied at anchor B, the third finger set 50 moves with
anchor B while the first and second finger sets 30 and 40 remain stationary with the anchor A. Referring to Fig. 2, as anchor B moves away from anchor A, the first fingers 58 of finger set 50 move toward the fingers 38 of the first finger set 30 and the second fingers 68 of finger set 50 move away from the fingers 48 of the second finger set 40, as illustrated in the exploded portions of Fig. 2. As a result, a capacitance change Cx+ is generated between the fingers 38 and 58 and a capacitance change Cx" is generated between the fingers 48 and 68. By comparing capacitance change Cx+ and capacitance change Cx7 a differential capacitance change is generated. The differential capacitance is utilized to determine the applied strain. Utilizing a differential capacitance change compared to a single capacitance change provides greater accuracy and
sensitivity by eliminating the common mode interferences and environmental error.
[0018] In the illustrated example, anchor B moves away from anchor A, but the principle is the same when anchor B moves toward anchor A. Sensor sensitivity can be optimized by carefully selecting parameters such as sensor gauge length, number of fingers, gap between fingers, finger thickness, and finger material.
[0019] Referring to Figs. 3-5, a capacitive strain sensor 120 that is a second embodiment of the present invention will be described. Fig. 3 shows the principle of the buckled beam
amplification scheme utilized in the present embodiment. The buckled beam scheme includes a center beam 114 supported by opposed supports 110 and 112. Support 110 extends from anchor
A at an angle α relative to the horizontal and support 112 extends in the opposite direction from
anchor B at an angle α relative to the horizontal. When a strain is applied to anchor A, it causes
a small lateral displacement, Δx, of anchor A. For a small tilt angle α, the center deflection of
the beam, Δw, is larger than Δx, thus resulting in a mechanical gain, AmeCh, which is expressed - A,„ d, =- -2 ctg(a) .
[0020] Referring to Fig. 4, a capacitive strain sensor 120 incorporating the buckled beam amplification scheme is shown. The sensor 120 includes three finger sets 130, 140, and 150 extending between anchors A and B. The first finger set 130 includes a center beam 132 supported by opposed supports 134 and 136 extending from anchors A and B, respectively.
Each of the supports 134, 136 extends at a positive angle α relative to the horizontal, such that a
compressive strain applied to anchor A will cause the center beam 132 to move upward as indicated by arrow O in Fig. 4. A plurality of fingers 138 extend from the center beam 132 toward the third finger set 150. The second finger set 140 includes a center beam 142 supported by opposed supports 144 and 146 extending from anchors A and B, respectively. Each of the
supports 144, 146 extends at a positive angle α relative to the horizontal, such that a
compressive strain applied to anchor A will cause the center beam 142 to move upward as indicated by arrow P in Fig. 4. A plurality of fingers 148 extend from the center beam 142 toward the third finger set 150.
[0021] The third finger set 150 includes a center beam 152 supported by opposed supports 154 and 156 extending from anchors A and B, respectively. Each of the supports 154, 156
extends at a negative angle relative to the horizontal, such that a compressive strain applied to
anchor A will cause the center beam 152 to move downward as indicated by arrow Q in Fig. 4.
A first plurality of fingers 158 extend from the center beam 152 toward the first finger set 130 such that the fingers 158 overlap fingers 138 and a second plurality of fingers 168 extend from the center beam 152 toward the first finger set 140 such that the fingers 168 overlap fingers 148.
[0022] Referring to Fig. 5, a microphotograph of finger displacement before and after a
strain is applied is shown. In the illustrated microphotographs, an outward force is applied to anchor A such that the center beam 152 of the third finger set 150 moves upward and the center beams 132 and 142 of the first and second finger sets 130 and 140 move downward. In accordance with such center beam movement, the first fingers 158 of finger set 150 move toward the fingers 138 of the first finger set 130 and the second fingers 168 of finger set 150 move away from the fingers 148 of the second finger set 140. As a result, a capacitance change Cx+ is generated between the fingers 138 and 158 and a capacitance change Cx" is generated between the fingers 148 and 1 8. By comparing capacitance change Cx+ and capacitance change Cx", a differential capacitance change is generated. The differential capacitance is utilized to determine the applied strain. Again, utilizing a differential capacitance change compared to a single capacitance change provides greater accuracy and sensitivity by eliminating the common mode interferences and environmental error.
[0023] Sensor performance can be optimized by selecting parameters with the developed
finite element analysis simulation program. The mechanical amplification created by the buckled beams improves the sensor sensitivity; hence reducing the sensitivity requirement and
power dissipation on the interface circuits. A sensitivity of 0.1 microstrain and a dynamic range of 10,000 can be expected with this design and a matching interface circuit. A typical output versus an applied strain is shown in Fig. 6. The measured non-linearity is 0.5%FS, and
sensitivity is around 250aF/uε, close to the predicted result using FEA simulation. The
fundamental resolution limit of this sensor is the combined noise contributed from Brownian
motion and mechanical vibration, which is less than 0.1 με over a 10kHz bandwidth,
corresponding to a displacement of 0.1 nm (1 A) according to the analysis.
[0024] A prototype fabrication with only one mask was made to verify the design and
simulation results. The process, shown in Fig. 7, started with a SOI wafer with device layer and
oxide layer of 20um and 2um, respectively. The wafer was patterned and followed by a DRIE
process. The wafer was then diced, cleaned, and followed by a timed HF release process. A layer
of 200A Aluminum was then sputtered on the device to reduce the sensor series resistance and
resistive thermal noise.
[0025] An SEM picture of the sensor is shown in Fig. 8 with the following parameters:
Gauge Length (Lg) -1000 um; Buckled Beam Length (Lb) - 300 um; Buckling angle (α) - 5.71°;
Number of Fingers - 37; Finger gap - 3 um; Measured Sensitivity - 250 aF/με. The prototype
fabrication achieved a yield close to 100% due to the simplicity of the design and fabrication process.