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WO2005046020A3 - Elektromotor, sowie verfahren zur herstellung eines solchen - Google Patents

Elektromotor, sowie verfahren zur herstellung eines solchen Download PDF

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Publication number
WO2005046020A3
WO2005046020A3 PCT/EP2004/052720 EP2004052720W WO2005046020A3 WO 2005046020 A3 WO2005046020 A3 WO 2005046020A3 EP 2004052720 W EP2004052720 W EP 2004052720W WO 2005046020 A3 WO2005046020 A3 WO 2005046020A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
motor
components
substrates
plastic body
Prior art date
Application number
PCT/EP2004/052720
Other languages
English (en)
French (fr)
Other versions
WO2005046020A2 (de
Inventor
Peter Urbach
Wolfgang Feiler
Thomas Raica
Stefan Hornung
Original Assignee
Bosch Gmbh Robert
Peter Urbach
Wolfgang Feiler
Thomas Raica
Stefan Hornung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Peter Urbach, Wolfgang Feiler, Thomas Raica, Stefan Hornung filed Critical Bosch Gmbh Robert
Priority to JP2006536101A priority Critical patent/JP4217742B2/ja
Priority to US10/577,965 priority patent/US7687947B2/en
Priority to EP04791344A priority patent/EP1685596A2/de
Publication of WO2005046020A2 publication Critical patent/WO2005046020A2/de
Publication of WO2005046020A3 publication Critical patent/WO2005046020A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

Elektromotor (10), insbesondere zum Verstellen beweglicher Teile im Kraftfahrzeug, mit einer Elektronikeinheit (70) in Sandwich-Bauweise, welche ein erstes elektrisch leitfähiges Substrat (71) und ein zweites elektrisch leitfähiges Substrat (72) aufweist, zwischen denen Leistungsbauelemente angeordnet und mit beiden Substraten (71, 72) elektrisch verbunden sind, und das zweite Substrat (72) auf einer dem ersten Substrat (71) abgewandten Seite (84) mit weiteren elektronischen Bauteilen (56) bestückt ist, wobei das erste Substrat (71) als ein leitfähiges Stanzgitter (44) ausgebildet ist, das mit dem zweiten Substrat (72) derart mit einem Kunststoffkörper (95) umspritzt ist, dass aus dem Kunststoffkörper (95) Fortsätze (97) des Stanzgitters (44) ragen, die eine elektrische und/oder mechanische Schnittstelle (98) zur Anbindung weiterer Motorbauteile (99, 38, 40, 104, 102, 80) bilden.
PCT/EP2004/052720 2003-11-08 2004-10-29 Elektromotor, sowie verfahren zur herstellung eines solchen WO2005046020A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006536101A JP4217742B2 (ja) 2003-11-08 2004-10-29 電動モータならびにこのような電動モータを製作するための方法
US10/577,965 US7687947B2 (en) 2003-11-08 2004-10-29 Electric motor comprising an electronic unit with a punched grid
EP04791344A EP1685596A2 (de) 2003-11-08 2004-10-29 Elektromotor, sowie verfahren zur herstellung eines solchen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10352079.1 2003-11-08
DE10352079A DE10352079A1 (de) 2003-11-08 2003-11-08 Elektromotor, sowie Verfahren zur Herstellung eines solchen

Publications (2)

Publication Number Publication Date
WO2005046020A2 WO2005046020A2 (de) 2005-05-19
WO2005046020A3 true WO2005046020A3 (de) 2005-08-04

Family

ID=34530160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/052720 WO2005046020A2 (de) 2003-11-08 2004-10-29 Elektromotor, sowie verfahren zur herstellung eines solchen

Country Status (6)

Country Link
US (1) US7687947B2 (de)
EP (1) EP1685596A2 (de)
JP (1) JP4217742B2 (de)
CN (1) CN100449756C (de)
DE (1) DE10352079A1 (de)
WO (1) WO2005046020A2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005062783A1 (de) 2005-12-28 2007-07-05 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zur Herstellung eines solchen
US7894205B2 (en) * 2007-04-05 2011-02-22 Mitsubishi Electric Corporation Variable device circuit and method for manufacturing the same
DE102008040290A1 (de) 2008-07-09 2010-01-14 Robert Bosch Gmbh Hybridschaltungsstruktur mit keramischen Schaltungsträgern
DE102009045911A1 (de) * 2009-10-22 2011-04-28 Robert Bosch Gmbh Koppelvorrichtung, Anordnung mit einer Koppelvorrichtung, Verfahren zur Herstellung einer Anordnung mit einer Koppelvorrichtung
DE102009047621A1 (de) * 2009-12-08 2011-06-09 Robert Bosch Gmbh Positionssensor
DE102009054967A1 (de) * 2009-12-18 2011-06-22 Robert Bosch GmbH, 70469 Werkzeugmaschine mit elektrischem Antriebsmotor
DE102010002950A1 (de) * 2010-03-17 2011-09-22 Robert Bosch Gmbh Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug
DE202010010285U1 (de) * 2010-06-29 2010-10-14 Webasto Ag Gehäuse für eine elektrische Vorrichtung, elektrische Geräteanordnung und Fahrzeugschiebedach
DE102013001339A1 (de) * 2013-01-26 2014-07-31 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Rotierende elektrische Maschine
TW201527070A (zh) * 2014-01-06 2015-07-16 Prior Company Ltd 裝飾薄膜及其製造方法以及加飾成型品的製造方法
DE102014008853B4 (de) * 2014-06-14 2016-05-04 Audi Ag Kunststoffumspritzte Leiterbahnstruktur sowie Verfahren zur Herstellung der kunststoffumspritzten Leiterbahnstruktur
US9525832B1 (en) * 2015-06-16 2016-12-20 Stmicroelectronics Pte Ltd Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods
DE102015216008A1 (de) * 2015-08-21 2017-02-23 IGARASHI MOTOREN GmbH Leiterplatte, Elektromotor mit einer derartigen Leiterplatte sowie Verwendung einer Leiterplatte in einem Elektromotor
CN105720447A (zh) * 2016-03-22 2016-06-29 安徽孟凌精密电子有限公司 一种电机碳刷的制作方法
US11405569B2 (en) * 2017-07-25 2022-08-02 Sony Semiconductor Solutions Corporation Solid-state imaging device
DE102019107901A1 (de) * 2019-03-27 2020-10-01 Lock Antriebstechnik Gmbh Getriebemotor
DE102019204290A1 (de) * 2019-03-27 2020-10-01 Mahle International Gmbh Stellantriebsvorrichtung zum Verstellen eines Stellglieds, Antriebsschaltung für einen Stellantrieb, Fertigungsverfahren zur Herstellung einer Antriebsschaltung und ein gemäß dem Verfahren hergestelltes Kraftfahrzeugbauteil
DE102019204291A1 (de) * 2019-03-27 2020-10-01 Mahle International Gmbh Antriebsschaltung für einen Stellantrieb, Stellantriebsvorrichtung zum Verstellen eines Stellglieds, Fertigungsverfahren zur Herstellung einer Antriebsschaltung und ein gemäß dem Verfahren hergestelltes Kraftfahrzeugbauteil
KR20230046097A (ko) * 2021-09-29 2023-04-05 해성디에스 주식회사 리드 프레임

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4337390A1 (de) * 1993-10-26 1995-04-27 Brose Fahrzeugteile Antriebseinheit für Verstellsysteme in Kraftfahrzeugen
US6060795A (en) * 1998-03-18 2000-05-09 Intersil Corporation Semiconductor power pack
US6127727A (en) * 1998-04-06 2000-10-03 Delco Electronics Corp. Semiconductor substrate subassembly with alignment and stress relief features
WO2001027997A2 (de) * 1999-10-09 2001-04-19 Robert Bosch Gmbh Leistungshalbleitermodul
WO2001063671A1 (de) * 2000-02-26 2001-08-30 Robert Bosch Gmbh Stromrichter und sein herstellverfahren

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589195A (en) * 1981-02-27 1986-05-20 Motorola, Inc. Method of fabricating a high current package with multi-level leads
US4563811A (en) * 1983-10-28 1986-01-14 At&T Technologies, Inc. Method of making a dual-in-line package
DE3406528A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
US4734753A (en) * 1985-04-01 1988-03-29 American Telephone And Telegraph Company Thermocompression bonding of copper leads to a metallized ceramic substrate
DE3728081A1 (de) * 1987-08-22 1989-03-02 Bosch Gmbh Robert Gleichrichterlagereinrichtung
US5213748A (en) * 1991-06-27 1993-05-25 At&T Bell Laboratories Method of molding a thermoplastic ring onto a leadframe
DE4421358B4 (de) * 1994-06-18 2009-04-09 Robert Bosch Gmbh Gleichrichteranordnung, vorzugsweise für einen Drehstromgenerator für Kraftfahrzeuge
US5640746A (en) * 1995-08-15 1997-06-24 Motorola, Inc. Method of hermetically encapsulating a crystal oscillator using a thermoplastic shell
US5697811A (en) * 1996-04-25 1997-12-16 Krone Ag Mounting assembly for electrical termination blocks
CN1134064C (zh) * 1996-05-17 2004-01-07 西门子公司 半导体芯片用的载体元件
US6440750B1 (en) * 1997-06-10 2002-08-27 Agere Systems Guardian Corporation Method of making integrated circuit having a micromagnetic device
US6180261B1 (en) * 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board
EP1000215B1 (de) * 1998-02-05 2003-05-07 Robert Bosch Gmbh Elektronikmodul für eine elektromotorisch betriebene antriebseinheit
JP3604066B2 (ja) * 1998-12-28 2004-12-22 松下電器産業株式会社 起振機保持装置およびこれを備えた携帯用電子機器
US6256200B1 (en) * 1999-05-27 2001-07-03 Allen K. Lam Symmetrical package for semiconductor die
US6432749B1 (en) * 1999-08-24 2002-08-13 Texas Instruments Incorporated Method of fabricating flip chip IC packages with heat spreaders in strip format
WO2002069374A2 (en) * 2001-02-27 2002-09-06 Chippac, Inc. Tape ball grid array semiconductor package structure and assembly process
US20030080772A1 (en) * 2001-08-31 2003-05-01 Davide Giacomini Programmable compact motor drive module
US6724079B2 (en) * 2002-01-04 2004-04-20 Motorola, Inc. Wire bond-less electronic component for use with an external circuit and method of manufacture
TW517368B (en) * 2002-01-22 2003-01-11 Via Tech Inc Manufacturing method of the passivation metal on the surface of integrated circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4337390A1 (de) * 1993-10-26 1995-04-27 Brose Fahrzeugteile Antriebseinheit für Verstellsysteme in Kraftfahrzeugen
US6060795A (en) * 1998-03-18 2000-05-09 Intersil Corporation Semiconductor power pack
US6127727A (en) * 1998-04-06 2000-10-03 Delco Electronics Corp. Semiconductor substrate subassembly with alignment and stress relief features
WO2001027997A2 (de) * 1999-10-09 2001-04-19 Robert Bosch Gmbh Leistungshalbleitermodul
WO2001063671A1 (de) * 2000-02-26 2001-08-30 Robert Bosch Gmbh Stromrichter und sein herstellverfahren

Also Published As

Publication number Publication date
EP1685596A2 (de) 2006-08-02
JP2007509594A (ja) 2007-04-12
CN100449756C (zh) 2009-01-07
DE10352079A1 (de) 2005-06-02
JP4217742B2 (ja) 2009-02-04
CN1879217A (zh) 2006-12-13
US20070133183A1 (en) 2007-06-14
US7687947B2 (en) 2010-03-30
WO2005046020A2 (de) 2005-05-19

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