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WO2004093147B1 - Wafer carrier cleaning system - Google Patents

Wafer carrier cleaning system

Info

Publication number
WO2004093147B1
WO2004093147B1 PCT/US2004/011159 US2004011159W WO2004093147B1 WO 2004093147 B1 WO2004093147 B1 WO 2004093147B1 US 2004011159 W US2004011159 W US 2004011159W WO 2004093147 B1 WO2004093147 B1 WO 2004093147B1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
door
hand
carrier body
robot
Prior art date
Application number
PCT/US2004/011159
Other languages
French (fr)
Other versions
WO2004093147A3 (en
WO2004093147A2 (en
Inventor
Yasukatsu Nishikata
Kenji Ishii
Kazufumi Otsuki
Katsuhiro Kurusu
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Priority to EP04749998A priority Critical patent/EP1615735A2/en
Publication of WO2004093147A2 publication Critical patent/WO2004093147A2/en
Publication of WO2004093147A3 publication Critical patent/WO2004093147A3/en
Publication of WO2004093147B1 publication Critical patent/WO2004093147B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Disclosed is a system and method for automating the handling of wafer carriers (1) for a washing procedure. The system according to one embodiment comprises disposing a robot (20) between a loading and unloading section (10) and the washing apparatus (6). The robot (1) includes a hand (21) that may comprise a first engaging component (23) and a second engaging component (30) for operably engaging the carrier door. In one embodiment, the robot removes the carrier door from the carrier body and grasps the body while maintaining possession of the door. The carrier door and carrier body are then placed in respective positions within the washing apparatus. This procedure is reversed for retrieval of the clean wafer container components.

Claims

AMENDED CLAIMS [received by the International Bureau on 27 December 2004 (27.12.04); original claims 1, 4-5, 8-10, 13-14 amended; ; remaining claims unchanged (7 pages)]
1. An automated wafer carrier washing system for wafer carriers comprising a carrier body and a carrier door securably disposed in the carrier body, the automated wafer carrier washing system comprising: a washing apparatus including one or more wash bays, each wash bay including a carrier body washing portion and a carrier door washing portion; and a robot operably disposed adjacent to the washing apparatus, the robot comprising a multi-segmented body and a_hand joined to the multi-segmented body, the hand being configured to separate the carrier door from the carrier body and to grasp the carrier body while maintaining possession of the carrier door, and to move both the carrier body and separated carrier door into a carrier washing apparatus at the same time with said hand.
2. The automated wafer carrier washing system of claim 1, further comprising: a loading and unloading station operably disposed adjacent the robot.
3. The automated wafer carrier washing system of claim 2, wherein the loading and unloading station includes a holding table.
4. The automated wafer carrier washing system of claim 1, wherein the multi- segmented body comprises six segments.
5. The automated wafer carrier washing system of claim 1, wherein the hand comprises: a first engaging component configured to grasp the carrier body; and a second engaging component configured to grasp the carrier door.
6. The automated wafer carrier washing system of claim 5, wherein the first engaging component comprises: a pair of opposed grasping members pivotally coupled to a base; and an actuator fastened to each of the opposed grasping members.
7. The automated wafer earner washing system of claim 5, wherein the second engaging component comprises a holding board comprising: a plurality of suction cups disposed thereon; and at least two key members disposed thereon and aligned relative to a respective at least two latchs provided in the carrier door.
8. The automated wafer carrier washing system of claim 1, wherein the hand comprises: means for grasping the carrier body and means for grasping the carrier door.
19
9. A robot for an automated wafer carrier washing system, the wafer carrier to be washed comprising a carrier body and a carrier door securably sealable within the carrier body, the robot comprising: a multi-segmented body; and a hand joined to the body, the hand including a first engaging component configured to grasp the carrier body; and a second engaging component configured to grasp the carrier door while maintaining possession of the carrier body for moving both the carrier body and carrier door at the same time with the hand.
10. The automated wafer carrier washing system of claim 9, wherein the multi- segmented body comprises six segments.
11. The automated wafer carrier washing system of claim 5, wherein the first engaging component comprises: a pair of opposed grasping members pivotally coupled to a base; and a linear actuator pivotally fastened to each of the opposed grasping members.
12. The automated wafer carrier washing system of claim 5, wherein the second engaging component comprises a holding board comprising: a plurality of suction cups disposed thereon; and at least two key members disposed thereon and aligned relative to a respective at least two latch key holes provided in the carrier door.
20
13. A robot for an automated wafer carrier washing system, the wafer carrier to be washed comprising a carrier body and a carrier door securably sealable within the carrier body, the robot comprising: a multi-segmented body; and a hand joined to the multi-segmented body, the hand including means for grasping the carrier door and separating it from the carrier body, means for grasping the carrier body while maintaining possession of the carrier door and with the carrier door separated from the carrier body, and means for moving both the carrier door and the carrier body at the same time into a carrier washing apparatus.
14. A robot hand for manipulating wafer carrier components in an automated cleaning system, the robot hand comprising a first engaging component for grasping a carrier body and a second engaging component for grasping and separating a carrier door from the carrier body while maintaining possession of the carrier body, the first engaging component comprising: a pair of opposed grasping members pivotally coupled to a base; and a linear actuator pivotally fastened to at least one of the opposed grasping members; and the second engaging component comprising a holding board including: a plurality of suction cups disposed thereon; and at least two key members disposed thereon and aligned relative to a respective at least two latchs key holes provided in the carrier door,. whereby both the container body and the separated door can be moved at the same time with the robot hand.
15. The robot hand of claim 14, wherein the second engaging portion further comprises
21 a linkage operably connected to a first end of each of the key members; a crank member having a first end and a second end, the first end of the crank member operably connected to the linkage; and an actuator operably connected to the crank member and pivotally connected to the holding board.
16. A method of automated washing of wafer carriers, the wafer carriers to be washed comprising a carrier body and a carrier door securably sealable within the carrier body, the method comprising the steps of: removing the carrier door from the carrier body with a first engaging component of a robotic hand, the robotic hand operably connected to a robot body; grasping the carrier body with a second engaging component of the robotic hand; placing the carrier door into a portion of a carrier washing apparatus with the robotic hand, wherein the carrier washing apparatus is configured to wash both the carrier door and the carrier body; placing the carrier body into a portion of the carrier washing apparatus with the robotic hand; removing the washed carrier body from the washing apparatus using the second engaging component of the robotic hand; removing the carrier door from the washing apparatus using the first engaging component of the robotic hand; and securing the carrier door to the carrier body.
22
17. The method of claim 16, further comprising the step of placing the carrier body on a loading and unloading station.
18. The method of claim 16, further comprising the step of rotating the robot body.
19. A method of automated washing of wafer carriers, the wafer carriers to be washed comprising a carrier body and a carrier door securably sealable within the carrier body, the method comprising the steps of: grasping the carrier door secured to the carrier body with a robotic hand, the robotic hand operably connected to a robot body; unsecuring the carrier door from the carrier body using the robotic hand; removing the carrier door with the robotic hand; rotating the robotic hand into position to grasp the carrier body while maintaining grasp on the carrier door; placing the carrier door into a portion of a carrier washing apparatus with the robotic hand, wherein the carrier washing apparatus is configured to wash both the carrier door and the carrier body; and placing the carrier body into a portion of the carrier washing apparatus with the robotic hand.
23
20. The method of claim 19, further comprising the steps of:
grasping the washed carrier body in the washing apparatus using the robotic hand;
placing the washed carrier body on a loading and unloading station;
grasping the washed carrier door in the washing apparatus using the robotic hand; and
securing the carrier door to the carrier body.
24
PCT/US2004/011159 2003-04-10 2004-04-12 Wafer carrier cleaning system WO2004093147A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04749998A EP1615735A2 (en) 2003-04-10 2004-04-12 Wafer carrier cleaning system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US46242803P 2003-04-10 2003-04-10
US60/462,428 2003-04-10
US82064604A 2004-04-08 2004-04-08
US10/820,646 2004-04-08

Publications (3)

Publication Number Publication Date
WO2004093147A2 WO2004093147A2 (en) 2004-10-28
WO2004093147A3 WO2004093147A3 (en) 2005-01-27
WO2004093147B1 true WO2004093147B1 (en) 2005-03-17

Family

ID=33303086

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011159 WO2004093147A2 (en) 2003-04-10 2004-04-12 Wafer carrier cleaning system

Country Status (2)

Country Link
EP (1) EP1615735A2 (en)
WO (1) WO2004093147A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7520286B2 (en) * 2005-12-05 2009-04-21 Semitool, Inc. Apparatus and method for cleaning and drying a container for semiconductor workpieces
US11443962B2 (en) 2009-06-17 2022-09-13 Brooks Automation Us, Llc Integrated handling system for semiconductor articles
US10043651B2 (en) 2011-06-23 2018-08-07 Brooks Automation (Germany) Gmbh Semiconductor cleaner systems and methods
US10714364B2 (en) * 2017-08-31 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting wafer carriers
CN110369400A (en) * 2018-04-12 2019-10-25 津伦（天津）精密机械股份有限公司 A kind of Full-automatic plasma cleaning equipment
US11813649B2 (en) * 2020-05-29 2023-11-14 Taiwan Semiconductor Manufacturing Company Limited Semiconductor arrangement and method for making
TWI762273B (en) 2021-04-16 2022-04-21 科嶠工業股份有限公司 Material transfer box cleaning method and equipment
CN114194776B (en) * 2021-12-15 2023-04-21 上海世禹精密设备股份有限公司 Apparatus for transferring wafer carrier cassettes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4627785A (en) * 1984-05-14 1986-12-09 Monforte Robotics, Inc. Exchangeable multi-function end effector tools
US6704998B1 (en) * 1997-12-24 2004-03-16 Asyst Technologies, Inc. Port door removal and wafer handling robotic system
JPH11274282A (en) * 1998-03-23 1999-10-08 Toshiba Corp Substrate housing vessel, substrate housing vessel cleaner, substrate housing cleaning method and substrate treating apparatus
US6412502B1 (en) * 1999-07-28 2002-07-02 Semitool, Inc. Wafer container cleaning system

Also Published As

Publication number Publication date
WO2004093147A3 (en) 2005-01-27
EP1615735A2 (en) 2006-01-18
WO2004093147A2 (en) 2004-10-28

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