[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2004060600A3 - Ablation methods and apparatus - Google Patents

Ablation methods and apparatus Download PDF

Info

Publication number
WO2004060600A3
WO2004060600A3 PCT/GB2003/005546 GB0305546W WO2004060600A3 WO 2004060600 A3 WO2004060600 A3 WO 2004060600A3 GB 0305546 W GB0305546 W GB 0305546W WO 2004060600 A3 WO2004060600 A3 WO 2004060600A3
Authority
WO
WIPO (PCT)
Prior art keywords
light source
ablating
width
laser ablation
materials
Prior art date
Application number
PCT/GB2003/005546
Other languages
French (fr)
Other versions
WO2004060600A2 (en
Inventor
Andrew Gilbert
Original Assignee
Cambridge Display Tech Ltd
Andrew Gilbert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Display Tech Ltd, Andrew Gilbert filed Critical Cambridge Display Tech Ltd
Priority to AU2003290283A priority Critical patent/AU2003290283A1/en
Priority to GB0513245A priority patent/GB2415090B/en
Publication of WO2004060600A2 publication Critical patent/WO2004060600A2/en
Publication of WO2004060600A3 publication Critical patent/WO2004060600A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Laser Beam Processing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention generally relates to methods and apparatus for ablating material using a light source (214), and more particularly to laser ablation of materials for molecular electronic devices, such as organic light emitting diodes. A method of ablating material using a light source is described. The method comprises shaping a beam from said light source (214) such that on a surface of said material the beam has a shape with portions of different widths comprising a first width and a second narrower width; applying said beam to said surface to ablate material; and moving said beam relative to said surace such that material under a portion of said beam with second said narrower width receives more energy than material under a portion of said beam with said first width. The method, and corresponding apparatus, facilitates reduced debris laser ablation, particularly when ablating layered materials.
PCT/GB2003/005546 2003-01-03 2003-12-18 Ablation methods and apparatus WO2004060600A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003290283A AU2003290283A1 (en) 2003-01-03 2003-12-18 Ablation methods and apparatus
GB0513245A GB2415090B (en) 2003-01-03 2003-12-18 Ablation methods and apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0300105.4 2003-01-03
GBGB0300105.4A GB0300105D0 (en) 2003-01-03 2003-01-03 Ablation methods & apparatus

Publications (2)

Publication Number Publication Date
WO2004060600A2 WO2004060600A2 (en) 2004-07-22
WO2004060600A3 true WO2004060600A3 (en) 2007-11-15

Family

ID=9950643

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2003/005546 WO2004060600A2 (en) 2003-01-03 2003-12-18 Ablation methods and apparatus

Country Status (3)

Country Link
AU (1) AU2003290283A1 (en)
GB (2) GB0300105D0 (en)
WO (1) WO2004060600A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2313806B1 (en) * 2004-12-30 2009-12-17 Universidad De Granada LASER CALIBRATION PROCEDURE CONSIDERING PULSE SOLUTION.
GB0511132D0 (en) 2005-06-01 2005-07-06 Plastic Logic Ltd Layer-selective laser ablation patterning
GB0518105D0 (en) * 2005-09-06 2005-10-12 Plastic Logic Ltd Step-and-repeat laser ablation of electronic devices
EP1922775B1 (en) * 2005-09-06 2017-05-10 Flexenable Limited Laser ablation of electronic devices
WO2012037468A1 (en) * 2010-09-16 2012-03-22 Raydiance, Inc. Singulation of layered materials using selectively variable laser output
US10363586B2 (en) * 2017-01-03 2019-07-30 The Boeing Company Large-area selective ablation methods
US10744539B2 (en) 2017-10-27 2020-08-18 The Boeing Company Optimized-coverage selective laser ablation systems and methods

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539507A (en) * 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
WO1990013148A1 (en) * 1989-04-20 1990-11-01 Cambridge Research And Innovation Limited Electroluminescent devices
WO1995006400A1 (en) * 1993-08-26 1995-03-02 Cambridge Display Technology Limited Electroluminescent devices
US5718036A (en) * 1994-05-10 1998-02-17 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a magnetic head
WO1999048160A1 (en) * 1998-03-13 1999-09-23 Cambridge Display Technology Ltd. Electroluminescent devices
DE19919009A1 (en) * 1999-04-27 2000-11-02 Inst Oberflaechenmodifizierung Mask for applying in laser ablation incorporates overlapping single impulses running in a scanning direction with a form arising from a contour mask.
WO2001039287A1 (en) * 1999-11-26 2001-05-31 Cambridge Display Technology Limited Method of producing an organic light-emissive device
US20010045419A1 (en) * 2000-03-30 2001-11-29 Dunsky Corey M. Laser system and method for single pass micromachining of multilayer workpieces

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539507A (en) * 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
WO1990013148A1 (en) * 1989-04-20 1990-11-01 Cambridge Research And Innovation Limited Electroluminescent devices
WO1995006400A1 (en) * 1993-08-26 1995-03-02 Cambridge Display Technology Limited Electroluminescent devices
US5718036A (en) * 1994-05-10 1998-02-17 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a magnetic head
WO1999048160A1 (en) * 1998-03-13 1999-09-23 Cambridge Display Technology Ltd. Electroluminescent devices
DE19919009A1 (en) * 1999-04-27 2000-11-02 Inst Oberflaechenmodifizierung Mask for applying in laser ablation incorporates overlapping single impulses running in a scanning direction with a form arising from a contour mask.
WO2001039287A1 (en) * 1999-11-26 2001-05-31 Cambridge Display Technology Limited Method of producing an organic light-emissive device
US20010045419A1 (en) * 2000-03-30 2001-11-29 Dunsky Corey M. Laser system and method for single pass micromachining of multilayer workpieces

Also Published As

Publication number Publication date
WO2004060600A2 (en) 2004-07-22
AU2003290283A8 (en) 2004-07-29
GB0300105D0 (en) 2003-02-05
GB2415090B (en) 2006-06-07
GB2415090A (en) 2005-12-14
GB0513245D0 (en) 2005-08-03
AU2003290283A1 (en) 2004-07-29

Similar Documents

Publication Publication Date Title
WO2008066646A3 (en) Reverse side film laser circuit etching
EP1609559A4 (en) Laser beam machining method
EP1634673A4 (en) Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
GB2389562A (en) Method for patterning a multilayered conductors/substrate structure
AU2002219183A1 (en) Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone
EP1589579A3 (en) A method for patterning an organic light emitting diode device
AU2001228195A1 (en) Method for locally removing a coat applied on a translucent or transparent substrate
WO2004033959A3 (en) Transparent light emitting members and method of manufacture
WO2005043699A3 (en) Laser processing of a locally heated target material
WO2003082146A3 (en) System and method for improved material processing using a laser beam
WO2004037069A3 (en) Dermatological apparatus and method
HK1052320A1 (en) Method and device for producing a printing block.
ATE282527T1 (en) METHOD AND DEVICE FOR PRODUCING A PRINTING FORM
EP1323505A3 (en) Method and apparatus for cutting prepreg
TW200511406A (en) Wafer processing method
WO2005010945A3 (en) Failure analysis methods and systems
CA2332820A1 (en) Use of ultrafast intense laser for processing lignocellulosic material
EP1422750A4 (en) Method and apparatus for splitting semiconducor wafer
EP1106299A3 (en) Laser etching method and apparatus therefor
EP1295649A3 (en) Repair coating method
WO2004060600A3 (en) Ablation methods and apparatus
EP1732371A3 (en) Method of forming a conductive pattern on a substrate
CA2377855A1 (en) Excimer laser ablation process control of multilaminate materials
EP1199127A3 (en) Underwater laser processing apparatus and underwater laser processing method
WO2000013470A8 (en) Material for organic electroluminescence device and method for producing the same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
ENP Entry into the national phase

Ref document number: 0513245

Country of ref document: GB

Kind code of ref document: A

Free format text: PCT FILING DATE = 20031218

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP