WO2004053955A1 - 露光装置及びデバイス製造方法 - Google Patents
露光装置及びデバイス製造方法 Download PDFInfo
- Publication number
- WO2004053955A1 WO2004053955A1 PCT/JP2003/015675 JP0315675W WO2004053955A1 WO 2004053955 A1 WO2004053955 A1 WO 2004053955A1 JP 0315675 W JP0315675 W JP 0315675W WO 2004053955 A1 WO2004053955 A1 WO 2004053955A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- exposure apparatus
- liquid
- optical system
- projection optical
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Definitions
- the present invention relates to an exposure apparatus and a device manufacturing method, and more particularly, to an exposure apparatus used in a lithographic process in manufacturing electronic devices such as semiconductor devices and liquid crystal display elements, and a device manufacturing method using the exposure apparatus.
- an exposure apparatus used in a lithographic process in manufacturing electronic devices such as semiconductor devices and liquid crystal display elements, and a device manufacturing method using the exposure apparatus.
- a reticle In the lithography process for manufacturing electronic devices such as semiconductor devices (integrated circuits) and liquid crystal display devices, an image of a pattern of a mask or reticle (hereinafter collectively referred to as a “reticle”) is projected through a projection optical system to a resist (A projection exposure apparatus is used that transfers the image onto each shot area on a photosensitive substrate (hereinafter, referred to as a “substrate” or a “wafer”) such as a wafer or a glass plate coated with a photosensitive agent.
- a step-and-repeat type reduction projection exposure apparatus (a so-called stepper) has been widely used as this type of projection exposure apparatus, but recently, a reticle and a wafer are synchronously scanned and exposed. Attention is also attracting attention to the projection and exposure system of the step-and-scan method (so-called scanning 'stepper).
- the resolution of the projection optical system provided in the projection exposure apparatus increases as the exposure wavelength used decreases and as the numerical aperture (NA) of the projection optical system increases. For this reason, with the miniaturization of integrated circuits, the exposure wavelength used in projection exposure apparatuses has become shorter year by year, and the numerical aperture of projection optical systems has also increased.
- the exposure wavelength of the mainstream is 248 nm of a KrF excimer laser, but a shorter wavelength of 193 nm of an ArF excimer laser is also in practical use.
- the depth of focus (DOF) becomes important as well as the resolution.
- the resolution R and the depth of focus 5 are respectively expressed by the following equations.
- ⁇ is the exposure wavelength
- ⁇ is the numerical aperture of the projection optical system
- ki and k 2 are process coefficients.
- the focal depth is becoming narrower due to the shorter wavelength of the exposure light and the enlargement of the projection optical system.
- the exposure wavelength will be further shortened in the future.
- the margin may be insufficient.
- the immersion method has been proposed as a method of substantially shortening the exposure wavelength and increasing the depth of focus ⁇ (wider) than in air.
- the space between the lower surface of the projection optical system and the wafer surface is filled with a liquid such as water or an organic solvent, and the wavelength of the exposure light in the liquid is 1 ⁇ times that in air (where ⁇ is the The resolution is improved by utilizing the fact that the refractive index is usually about 1.2 to 1.6).
- the immersion method has a substantially smaller depth of focus than a projection optical system that can obtain the same resolution as the resolution without using the immersion method (assuming that such a projection optical system can be manufactured). It enlarges by a factor of ⁇ , that is, the depth of focus is increased by a factor of ⁇ compared to that in the air (for example, see WO99 / 49504 pamphlet).
- bubbles are mixed in the supplied liquid or bubbles are generated in the liquid, and these bubbles enter between the projection optical system and the substrate, and Not only did the transmittance of the exposure light partially decrease, causing exposure unevenness, but also there was the possibility of causing poor imaging of the projected image of the pattern.
- the present invention has been made under the circumstances described above, and, from a first viewpoint, an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system.
- a first exposure apparatus comprising: a mechanism; a recovery mechanism for recovering the liquid; and an auxiliary recovery mechanism for recovering the liquid that could not be recovered by the recovery mechanism.
- the liquid is supplied between the projection optical system and the substrate on the substrate stage by the supply mechanism, and the liquid is recovered by the recovery mechanism.
- a predetermined amount of liquid is held (filled) between (the tip of) the projection optical system and the substrate on the substrate stage. Therefore, by performing the exposure (transfer of the pattern onto the substrate) in this state, the immersion method is applied, and the exposure light on the substrate surface is exposed.
- the wavelength can be shortened to 1 / n times the wavelength in air (n is the refractive index of the liquid), and the depth of focus is about n times wider than in air.
- the liquid between the projection optical system and the substrate is constantly exchanged, so that foreign matter adheres to the substrate. If so, the foreign matter is removed by the flow of liquid. As a result, exposure is performed at a high resolution and a wider depth of focus than in air. If, for example, a liquid cannot be completely recovered by the recovery mechanism, the liquid that could not be recovered is recovered by the auxiliary recovery mechanism. As a result, the liquid does not remain on the substrate, and the above-described various inconveniences caused by the remaining (residual) liquid can be avoided.
- the pattern can be transferred onto the substrate with high accuracy, and the liquid can be prevented from remaining on the substrate.
- it is not always necessary to simultaneously perform liquid supply by the supply mechanism and liquid recovery by the recovery mechanism.
- a plate provided on at least a part of the periphery of the substrate mounting area on the substrate stage and having a surface substantially the same height as the surface of the substrate mounted on the mounting area is further provided. Can be provided. In such a case, even if the substrate stage is moved to a position where the projection optical system deviates from the substrate in a state where the liquid is locally held between the projection optical system and the substrate, the liquid remains between the projection optical system and the plate. Since the liquid can be held in the liquid, the outflow of the liquid can be prevented.
- the auxiliary recovery mechanism may recover the residual liquid behind the moving direction of the substrate with respect to the projection optical system.
- the residual liquid may be collected ahead of the projection optical system in the moving direction of the substrate.
- the auxiliary recovery mechanism may include a suction mechanism for sucking a fluid.
- an air supply mechanism for suppressing an environmental change around the liquid caused by suction by the suction mechanism may be further provided.
- an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and the substrate is held.
- a substrate stage that moves in a two-dimensional plane, and; a supply mechanism that supplies the liquid between the projection optical system and the substrate on the substrate stage so as to locally fill the liquid with the liquid;
- a collecting mechanism that is provided on at least a part of a periphery of the mounting area of the substrate on the substrate stage and whose surface is substantially the same height as the surface of the substrate mounted on the mounting area.
- the liquid is supplied between the projection optical system and the substrate on the substrate stage by the supply mechanism, and the liquid is recovered by the recovery mechanism. It is not necessary to supply the liquid by the supply mechanism and collect the liquid by the recovery mechanism during exposure, but at least during the exposure, a predetermined amount of liquid is placed between the projection optical system and the substrate on the substrate stage. The liquid will be retained locally. Therefore, by the immersion method, exposure is performed with high resolution and a wider depth of focus than in air. Then, for example, when exposing the peripheral portion of the substrate, or when exchanging the substrate on the substrate stage after the exposure is completed, the projection optical system projects the liquid while holding the liquid between the projection optical system and the substrate.
- the liquid can be held between the projection optical system and the plate, and the outflow of the liquid can be prevented.
- liquid can be held between the projection optical system and the plate, for example, during substrate replacement, exposure of the substrate can be started without time for liquid supply. It becomes. Therefore, according to the exposure apparatus of the present invention, a pattern can be accurately transferred onto a substrate, and the throughput can be improved particularly because the liquid supply time is not required after the replacement of the substrate. In this case, the gap between the plate and the substrate can be set to 3 mm or less.
- the liquid immersion part on the image plane side of the projection optical system is formed between the substrate and the plate. Even at the boundary between the two, the outflow of the liquid into the gap between the substrate and the plate is prevented by the surface tension of the liquid.
- the second exposure apparatus of the present invention further includes: an interferometer for measuring a position of the substrate stage; and an air-conditioning mechanism for air-conditioning around the liquid between the projection optical system and the substrate. be able to.
- the supply of the liquid by the supply mechanism can be started on the plate.
- an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and the substrate is held.
- a substrate stage that moves in a two-dimensional plane; an interferometer that measures the position of the substrate stage; and a supply mechanism that supplies liquid between the projection optical system and the substrate on the substrate stage.
- a third exposure apparatus comprising: a collecting mechanism for collecting the liquid; and an air conditioner for air-conditioning around the liquid between the projection optical system and the substrate.
- the liquid is supplied between the projection optical system and the substrate on the substrate stage by the supply mechanism, and the liquid is recovered by the recovery mechanism.
- the liquid is supplied between the projection optical system and the substrate on the substrate stage by the supply mechanism, and the liquid is recovered by the recovery mechanism.
- it is not always necessary to supply the liquid by the supply mechanism and collect the liquid by the recovery mechanism during exposure, but at least during the exposure, there is a gap between the projection optical system and the substrate on the substrate stage.
- a predetermined amount of liquid is locally held. Therefore, the immersion method allows exposure with high resolution and a wider depth of focus than in air.
- air conditioning around the liquid is performed by the air conditioning mechanism, which prevents the flow of gas in the atmosphere around the liquid from being disturbed when the liquid is collected by the recovery mechanism.
- the air conditioning mechanism may include a suction mechanism for sucking a fluid.
- the suction mechanism can also serve to collect the liquid that has not been completely collected by the collection mechanism.
- the suction mechanism can also serve to collect the liquid that has not been completely collected by the collection mechanism.
- the suction mechanism for example, when a situation occurs in which the liquid cannot be completely recovered by the recovery mechanism, the liquid that could not be recovered is recovered by the suction mechanism.
- the liquid does not remain on the substrate, and the above-described various inconveniences caused by the remaining (residual) liquid can be prevented.
- the air conditioning mechanism may locally perform air conditioning around the liquid independently of air conditioning in a chamber in which the exposure apparatus is housed.
- the projection optical system includes a plurality of optical elements, and among the plurality of optical elements, an optical element located closest to the substrate is used for exposure.
- a hole is formed in a portion not to be used, and at least one operation of supplying the liquid, collecting the liquid, and collecting bubbles (bubbles in the liquid) can be performed through the hole.
- an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and the substrate is held. And a supply mechanism for supplying a liquid between the projection optical system and the substrate on the substrate stage; and a recovery mechanism for recovering the liquid.
- the projection optical system includes a plurality of optical elements, and among the plurality of optical elements, an optical element located closest to the substrate. Is characterized in that a hole is formed in a portion not used for exposure, and at least one operation of supplying the liquid, collecting the liquid, and collecting bubbles (bubbles in the liquid) is performed through the hole. This is the fourth exposure apparatus.
- a hole is formed in a portion not used for exposure in the optical element located closest to the substrate constituting the projection optical system, and the supply of the liquid by the supply mechanism or the collection of the liquid by the recovery mechanism is performed through the hole.
- the liquid is collected or the bubbles in the liquid are collected. For this reason, it is possible to save space compared to a case where the supply mechanism and the recovery mechanism are arranged outside the projection optical system. Also in this case, the liquid is supplied to the supply mechanism between the projection optical system and the substrate on the substrate stage, and the liquid is recovered by the recovery mechanism.
- the immersion method enables exposure with high resolution and a wider depth of focus than in air. Therefore, according to the exposure apparatus of the present invention, the pattern can be transferred onto the substrate with high accuracy, and the degree of freedom in the arrangement of the components around the projection optical system is improved.
- a control device that stops both the liquid supply operation by the supply mechanism and the liquid recovery operation by the recovery mechanism when the substrate stage is stopped. Further provisions may be made.
- an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and the substrate is held. And a supply mechanism for supplying a liquid between the projection optical system and the substrate on the substrate stage; and a recovery mechanism for recovering the liquid.
- a fifth exposure apparatus wherein when the substrate stage is stopped, both the liquid supply operation by the supply mechanism and the liquid recovery operation by the recovery mechanism are stopped.
- both the liquid supply operation by the supply mechanism and the liquid recovery operation by the recovery mechanism are stopped.
- the distance between the projection optical system and the substrate is small.
- the liquid is retained by its surface tension.
- a predetermined amount of liquid is held between the projection optical system and the substrate on the substrate stage. Therefore, exposure with high resolution and a wider depth of focus than in air is performed by the immersion method. Therefore, according to the exposure apparatus of the present invention, it is possible to transfer a pattern onto a substrate with high accuracy and to reduce the amount of liquid used. It is particularly suitable when an expensive liquid is used as the liquid.
- the supply mechanism supplies the liquid between the projection optical system and the substrate on the substrate stage from the front side in the moving direction of the substrate.
- the supply mechanism may supply the liquid between the projection optical system and the substrate on the substrate stage from the rear side in the moving direction of the substrate.
- a driving system that drives the substrate stage in a predetermined scanning direction with respect to the energy beam. Further provisions may be made.
- the supply mechanism has a plurality of supply ports separated in a non-scanning direction orthogonal to the scanning direction, and the plurality of supply ports are provided in accordance with a size of a section area to be exposed on the substrate.
- the liquid can be supplied from at least one supply port selected from the mouth.
- an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern to a plurality of partitioned areas on the substrate via a projection optical system, wherein the substrate is mounted.
- a substrate stage that holds the substrate and moves in a two-dimensional plane; and a substrate stage that surrounds at least the periphery of the optical element closest to the substrate that constitutes the projection optical system and is in contact with the substrate surface on the substrate stage.
- a sixth exposure apparatus comprising: a peripheral wall separated by a predetermined clearance therebetween; and at least one supply mechanism for supplying a liquid into the peripheral wall from a rear side in a moving direction of the substrate.
- the supply mechanism moves the inside of the peripheral wall including between the projection optical system and the substrate on the substrate stage from the rear side in the moving direction of the substrate.
- the liquid is supplied, and the liquid is filled between the projection optical system and the substrate when the substrate is moved.
- the liquid is reliably supplied above the partitioned area before reaching the lower part of the projection optical system. That is, when the substrate is moved in a predetermined direction, the space between the projection optical system and the surface of the substrate is filled with the liquid.
- the above-described immersion method is applied, and a higher resolution and a wider depth of focus than in air are achieved. Is performed. As a result, the pattern can be accurately transferred to each of the plurality of partitioned areas on the substrate.
- a recovery mechanism for recovering the liquid ahead of the projection optical system in the moving direction of the substrate may be further provided.
- the supply mechanism supplies the liquid to the inside of the peripheral wall from the rear side in the moving direction of the substrate, and the liquid is collected by the collecting mechanism in front of the projection optical system in the moving direction of the substrate.
- the supplied liquid flows between the projection optical system and the substrate along the moving direction of the substrate. Therefore, if foreign matter is attached to the substrate, the foreign matter is removed by the flow of the liquid.
- the supply mechanism has a plurality of supply ports around an irradiation area on the substrate to which the energy beam is irradiated via the pattern and the projection optical system during exposure. The supply port used for supplying the liquid may be switched according to the moving direction of the substrate.
- the sixth exposure apparatus of the present invention further comprises a drive system for driving the substrate stage in a predetermined scanning direction with respect to the energy beam in order to transfer the pattern onto the substrate by a scanning exposure method. can do.
- the supply mechanism is provided on one side and the other side in the scanning direction with respect to the irradiation area, and the supply mechanism used for supplying the liquid is switched according to the scanning direction of the substrate stage. It can be.
- the supply mechanism has a plurality of supply ports separated in a non-scanning direction orthogonal to the scanning direction, and the supply mechanism is arranged in accordance with a size of a region to be exposed on the substrate.
- the liquid may be supplied from at least one supply port selected from the plurality of supply ports.
- the exposure apparatus is provided on at least a part of a periphery of the mounting area of the substrate on the substrate stage, and has a surface having substantially the same height as the surface of the substrate mounted on the mounting area. May further be provided.
- Each of the first to sixth exposure apparatuses of the present invention may further include at least one bubble collection mechanism that collects bubbles in the liquid behind the projection optical system in the moving direction of the substrate. it can.
- an adjustment apparatus that adjusts exposure conditions based on at least one of an actually measured value and a predicted value of temperature information of a liquid between the projection optical system and the substrate May be further provided.
- a pattern is illuminated with an energy beam, the substrate is moved in a predetermined scanning direction, and the pattern is projected onto a plurality of partitioned areas on the substrate via a projection optical system.
- Exposure devices that transfer in A substrate stage on which the substrate is placed, the substrate stage holding the substrate and moving in a two-dimensional plane; a supply mechanism for supplying a liquid between the projection optical system and the substrate on the substrate stage; And a collection mechanism for collecting, wherein the supply of the liquid by the supply mechanism and the collection of the liquid by the collection mechanism are performed in synchronization with an exposure operation on each of the divided areas on the substrate.
- the scanning exposure is performed on the divided area to be exposed on the substrate.
- a predetermined amount of liquid (which is constantly replaced) is placed between the projection optical system and the substrate while the defined area passes through the irradiation area of the energy beam through the projection optical system.
- the immersion method provides high-resolution exposure with a wider depth of focus than in air.
- the liquid can be made not to exist on the substrate except during the time when the sectioned area to be exposed passes through the irradiation area of the energy beam, or in addition to a short time after the passage.
- the supply of the liquid between the projection optical system and the substrate and the total recovery of the liquid are repeatedly performed each time the exposure of the partitioned area is performed.
- the time during which the liquid is present on the substrate can be shortened, the deterioration of the components of the photosensitive agent (resist) on the substrate can be suppressed, and the environmental deterioration of the atmosphere around the substrate can be suppressed.
- the liquid warmed by the exposure light during the exposure of the previous section does not affect the exposure of the next section.
- the supply of the liquid by the supply mechanism and the total recovery of the liquid by the recovery mechanism may be performed every time the divided areas are exposed.
- the supply mechanism starts supplying the liquid. Can be done.
- the supply of the liquid by the supply mechanism is started after the movement of the substrate stage between the divided areas between the transfer of the pattern to the divided area to be exposed and the transfer of the pattern to the previous divided area is completed.
- the supply of the liquid by the supply mechanism is started when the front end of the section area to be exposed reaches the supply position, as in the exposure apparatus according to claim 36. It can also be done.
- the rear end of the partitioned area to be exposed is moved by the movement of the substrate stage in the scanning direction via the pattern and the projection optical system at the time of exposure.
- the supply of the liquid by the supply mechanism may be stopped at the time when the energy beam is emitted from the irradiation area on the substrate to be irradiated.
- the rear end of the partitioned area to be exposed is moved by the movement of the substrate stage in the scanning direction via the pattern and the projection optical system at the time of exposure.
- the supply of the liquid by the supply mechanism may be stopped before the energy beam is completely emitted from the irradiation area on the substrate on which the energy beam is irradiated.
- the supply of the liquid by the supply mechanism may be stopped when the rear end of the section area to be exposed reaches the supply position. Further, after the transfer of the pattern to the exposure target partitioned area, before the start of the movement operation between the partitioned areas of the substrate stage, which is performed prior to the transfer of the pattern to the next partitioned area, the liquid collection by the collection mechanism is performed. That the collection is completed it can.
- each of the fifth and seventh exposure apparatuses of the present invention at least a periphery of an optical element closest to the substrate constituting the projection optical system is surrounded and a predetermined clearance is provided between the optical element and the substrate surface on the substrate stage.
- the supply mechanism may supply the liquid to the inside of the peripheral wall facing the substrate-side end of the projection optical system.
- a pattern is illuminated by an energy beam, the substrate is moved in a predetermined scanning direction, and the pattern is projected onto a plurality of partitioned areas on the substrate via a projection optical system.
- a supply mechanism for supplying a liquid to the inside of the peripheral wall; and a collecting mechanism for collecting the liquid. 8 is an exposure apparatus.
- the liquid is supplied to the inside of the peripheral wall including between the projection optical system and the substrate on the substrate stage by the supply mechanism, and the liquid is recovered by the recovery mechanism. Therefore, when the supply of liquid by the supply mechanism and the collection of liquid by the collection mechanism are performed in parallel, a predetermined amount of liquid (permanent replacement) is contained inside the peripheral wall, including between the projection optical system and the substrate. Is kept. Therefore, when performing exposure (transfer of the pattern onto the substrate) using the partitioned area on the substrate as an exposure target area, the above-described liquid immersion method is performed by performing the supply and recovery of the liquid in parallel. The result is a high resolution exposure with a wider depth of focus than in air.
- the projection optical system is provided with a peripheral wall that at least surrounds the periphery of the optical element closest to the substrate and that is separated from the surface of the substrate on the substrate stage by a predetermined clearance, the clearance is reduced.
- the contact area between the liquid and the outside air is set to be extremely small, and the liquid will pass through the clearance due to the surface tension of the liquid. Leakage outside the peripheral wall of the body is prevented. Therefore, for example, it is possible to reliably recover the liquid used for the liquid immersion after the exposure is completed. Therefore, according to the exposure apparatus of the present invention, it is possible to accurately transfer a pattern to each of a plurality of divided areas on a substrate and to avoid various adverse effects caused by the liquid remaining on the substrate. Becomes possible.
- the inside of the peripheral wall may be in a negative pressure state. In such a case, it is possible to more reliably prevent the liquid from leaking to the outside of the peripheral wall due to the weight of the liquid.
- the supply of the liquid by the supply mechanism and the collection of the liquid by the recovery mechanism may be performed while the substrate stage holding the substrate is moving.
- the liquid supply operation by the supply mechanism and the liquid recovery operation by the recovery mechanism are not performed, and the liquid remains inside the peripheral wall. Is maintained.
- the predetermined clearance may be set to 3 mm or less.
- a pattern is illuminated by an energy beam, the substrate is moved in a predetermined scanning direction, and the pattern is projected onto a plurality of partitioned areas on the substrate via a projection optical system.
- the substrate on the substrate stage and the projection optical system from at least one supply port selected from the plurality of supply ports according to the position of the divided area to be exposed on the substrate.
- a supply mechanism for supplying a liquid along a scanning direction to a predetermined space area including at least a space between the exposure apparatus and the ninth exposure apparatus. For example, when at least the size in the non-scanning direction of the exposure target partitioned area differs depending on the position of the exposure target partitioned area on the substrate, the supply mechanism determines the position of the exposure target partitioned area on the substrate according to the position thereof. As a result, selecting the supply port is equivalent to selecting the supply port in accordance with the size of the partitioned area to be exposed in the non-scanning direction. Therefore, according to the present invention, it is possible to select a supply port corresponding to the range in the non-scanning direction of the section area to be exposed.
- the pattern is accurately transferred to the exposed area. It becomes possible.
- the size in the non-scanning direction of some of the partitioned areas on the substrate may be different from the size of the remaining partitioned areas in the non-scanning direction, or when there is a chipped partitioned area in the periphery of the board. May have the same size in the non-scanning direction of all the remaining partitioned areas.
- the supply mechanism may be configured such that, when the divided area to be exposed is a peripheral divided area on the substrate, only a part of the plurality of supply ports separated in the non-scanning direction is used.
- the liquid can be supplied.
- a pattern is illuminated by an energy beam, the substrate is moved in a predetermined scanning direction, and the pattern is scanned and exposed to a plurality of partitioned areas on the substrate via a projection optical system.
- An exposure apparatus for transferring images by a method wherein the substrate is mounted on the substrate stage, and the substrate stage holds the substrate and moves in a two-dimensional plane; and a plurality of supplies separated in a non-scanning direction orthogonal to the scanning direction.
- the supply mechanism selects the supply port corresponding to the range in the non-scanning direction of the sectioned area according to the size of the sectioned area to be exposed in the non-scanning direction. Scanning using the liquid immersion method while supplying liquid along the scanning direction between the area to be exposed on the substrate and the projection optical system without flowing the liquid outside the area to be partitioned. By performing the exposure, it is possible to transfer a pattern with high accuracy to the section area to be exposed.
- the size in the non-scanning direction of some of the partitioned areas on the substrate may be different from the size of the remaining partitioned areas in the non-scanning direction, or the size of all the partitioned areas in the non-scanning direction may be different.
- Each of the ninth and tenth exposure apparatuses of the present invention further includes at least one bubble collection mechanism that collects bubbles in the liquid on the upstream side of the liquid flowing along the scanning direction with respect to the projection optical system. It can be.
- the supply mechanism may supply the liquid from a rear side in a moving direction of the substrate.
- the present invention is an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and A substrate stage that holds and moves in a two-dimensional plane; a supply mechanism that supplies a liquid to a predetermined space region including at least between the substrate on the substrate stage and the projection optical system; And at least one bubble collection mechanism for collecting bubbles in the liquid on the upstream side of the projection optical system.
- the immersion method when exposure (transfer of a pattern onto a substrate) is performed in a state in which a liquid is present in a predetermined space region including at least between the substrate on the substrate stage and the projection optical system, the immersion method is used. Is applied, and exposure is performed with high resolution and a wider depth of focus than in air.
- bubbles in the liquid are collected by the bubble collection mechanism on the upstream side of the projection optical system of the flow of the liquid. That is, bubbles in the liquid reach the optical path of the energy beam (exposure beam) between the projection optical system and the substrate. Without being collected by the air bubble collection mechanism. For this reason, it is possible to prevent a partial decrease in the transmittance of the energy beam (exposure light) due to bubbles entering between the projection optical system and the substrate, and a deterioration of a projected image.
- the bubble collection mechanism may discharge bubbles together with the liquid (recovered liquid).
- the eleventh exposure apparatus of the present invention a plurality of the bubble collecting mechanisms are provided, and the bubble collecting mechanism used for collecting the bubbles is switched according to a moving direction of the substrate. Can be. In such a case, no matter which direction the substrate moves, bubbles can be prevented from entering between the projection optical system and the substrate during the movement.
- exposure conditions are adjusted based on at least one of an actually measured value and a predicted value of temperature information of a liquid between the projection optical system and the substrate.
- An adjusting device may be further provided.
- an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and A substrate stage that holds and moves in a two-dimensional plane; a supply mechanism that supplies a liquid to a predetermined space region including at least between the substrate on the substrate stage and the projection optical system; a projection optical system; And an adjusting device for adjusting exposure conditions based on temperature information of the liquid between the substrate and the substrate.
- the supply mechanism supplies the liquid to a predetermined space region including at least the space between the substrate on the substrate stage and the projection optical system.
- the immersion method is applied, and exposure is performed with high resolution and a wider depth of focus than in air.
- the adjustment device adjusts the exposure condition based on at least one of the actually measured value and the predicted value of the temperature information of the liquid between the projection optical system and the substrate.
- the liquid for immersion described above Factors that deteriorate the exposure accuracy due to the temperature distribution, such as the distribution of aberrations (for example, focus) in the projection area of the pattern (the area on the substrate irradiated with the energy beam via the pattern and the projection optical system), that is, the image plane shape Exposure conditions can be appropriately adjusted in consideration of changes in the exposure. Therefore, according to the exposure apparatus of the present invention, it is possible to transfer a pattern onto a substrate with high accuracy.
- the apparatus may further include a prediction device for predicting a temperature change of the liquid that occurs while the liquid passes through the region.
- the twelfth exposure apparatus of the present invention further comprises a drive system for driving the substrate stage in a predetermined scanning direction with respect to the energy beam, in order to transfer the pattern onto the substrate by a scanning exposure method.
- the adjusting device may adjust the exposure condition in consideration of the temperature distribution in the scanning direction of the liquid between the projection optical system and the substrate.
- the adjusting device can adjust the positional relationship between the image plane and the substrate surface in consideration of the image plane inclination caused by the temperature distribution in the scanning direction.
- the adjusting device may tilt the substrate in accordance with the image plane tilt in the scanning direction caused by the temperature distribution in the scanning direction, and may scan the substrate in the tilt direction.
- the supply mechanism may flow the liquid along a moving direction of the substrate.
- the supply mechanism may flow the liquid from a rear side in the moving direction of the substrate.
- the temperature information may include at least one of an actually measured value and a predicted value.
- the exposure apparatus further comprises a temperature sensor capable of detecting a temperature of a liquid between the projection optical system and the substrate, and adjusting the exposure condition based on a detection result of the temperature sensor. Can be done.
- force control for adjusting a positional relationship between an image plane formed by the projection optical system and the substrate surface is performed based on the temperature information. can do.
- the present invention is an exposure apparatus for transferring a predetermined pattern onto the substrate via the projection optical system in a state where the liquid is filled between the projection optical system and the substrate.
- the second pattern is transferred onto the substrate while the liquid is held between the projection optical system and the substrate.
- a thirteenth exposure apparatus wherein the image is transferred to the divided area.
- the first pattern when performing multiple exposure, after the first pattern is transferred to the divided area on the substrate in a state where the liquid is filled between the projection optical system and the substrate, the first pattern is transferred between the projection optical system and the substrate.
- the second pattern is transferred to the partition area on the substrate while holding the liquid therebetween. For this reason, multiple exposure using the immersion method is applied, and high-resolution exposure with high resolution and practically a large depth of focus is performed.
- the transfer of the second pattern should be started without waiting for the supply of the liquid. Is possible.
- the present invention is an exposure apparatus that exposes the substrate by projecting an image of a pattern onto the substrate via a projection optical system, wherein the substrate is placed, A substrate stage that moves in a two-dimensional plane while holding the substrate; a supply mechanism that supplies a liquid to a space region including at least a region between the substrate on the substrate stage and the projection optical system; And an adjusting device for adjusting exposure conditions based on pressure information between the substrate and the substrate.
- the supply mechanism supplies the liquid between the substrate on the substrate stage and the projection optical system.
- the adjustment device adjusts the exposure condition based on the pressure information between the projection optical system and the substrate. For this reason, factors that deteriorate the exposure accuracy due to the pressure distribution between the projection optical system and the substrate due to the flow of the liquid described above, such as a pattern projection area (energy beam is irradiated through the pattern and the projection optical system) It is possible to appropriately adjust exposure conditions in consideration of changes in aberrations (for example, focus), changes in image plane shape, and errors in surface position control of the substrate surface.
- the pressure distribution between the projection optical system and the substrate may be an actually measured value directly measured using a pressure sensor or the like, or may be an estimated value based on information obtained in advance through experiments or the like. Is also good.
- the exposure apparatus of the present invention it is possible to transfer a pattern onto a substrate with high accuracy.
- the substrate is exposed while moving in a predetermined scanning direction, the liquid between the projection optical system and the substrate flows in parallel with the scanning direction, and the adjusting device controls the pressure in the scanning direction. Exposure conditions can be adjusted based on the distribution.
- the substrate can be exposed while moving in the same direction as the direction in which the liquid flows.
- the adjusting device is adapted to a scanning speed of the substrate.
- the exposure condition can be adjusted based on the adjusted exposure condition adjustment information.
- the adjusting device may adjust the exposure condition based on adjustment information of the exposure condition according to the supply amount of the liquid by the supply mechanism.
- the present invention is an exposure apparatus that illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system, wherein the substrate is placed, and A substrate stage that holds and moves in a two-dimensional plane; a supply mechanism that supplies liquid between the projection optical system and the substrate on the substrate stage; a recovery mechanism that recovers the liquid; And a liquid removing mechanism that removes the liquid on the substrate that cannot be recovered by the method described above.
- the liquid is supplied between the projection optical system and the substrate on the substrate stage by the supply mechanism, and the liquid is recovered by the recovery mechanism.
- a predetermined amount of liquid is held (filled) between (the tip of) the projection optical system and the substrate on the substrate stage. Therefore, by performing exposure (transfer of the pattern onto the substrate) in this state, the immersion method is applied, and the wavelength of the exposure light on the substrate surface is set to one time the wavelength in air (n is the refractive index of the liquid) ), And the depth of focus is about n times wider than in air.
- the supply of the liquid by the supply mechanism and the recovery of the liquid by the recovery mechanism are performed in parallel, the liquid between the projection optical system and the substrate is constantly replaced. Also, for example, when a situation occurs in which the liquid cannot be completely recovered by the recovery mechanism, the liquid that could not be recovered is removed by the liquid removal mechanism.
- a liquid is locally held on an image plane side of a projection optical system, a pattern is illuminated with an energy beam, and the pattern is transmitted through the projection optical system and the liquid.
- An exposure apparatus for transferring onto the substrate A substrate stage on which the substrate is mounted and which moves in a two-dimensional plane while holding the substrate; a supply mechanism for supplying a liquid to an image plane side of the projection optical system; and an outside of a projection area of the projection optical system And a second collection mechanism for collecting the liquid outside of the projection area with respect to the projection area than the first collection mechanism.
- the projection area of the projection optical system refers to a projection area of a target to be projected by the projection optical system, for example, a pattern image.
- the liquid is supplied to the image plane side of the projection optical system by the supply mechanism, and the liquid is recovered by the first recovery mechanism.
- the pattern is illuminated by the energy beam while the liquid is locally held on the image plane side of the projection optical system, and the pattern is transferred onto the substrate via the projection optical system and the liquid. That is, immersion exposure is performed. Therefore, the wavelength of the exposure light on the substrate surface can be shortened to 1Zn times the wavelength in air (n is the refractive index of the liquid), and the depth of focus is expanded to about n times that in air.
- the liquid that could not be recovered by the second recovery mechanism located outside the projection area from the first recovery mechanism Is collected.
- a liquid is locally held on an image plane side of a projection optical system, a pattern is illuminated by an energy beam, and the pattern is transmitted through the projection optical system and the liquid.
- An exposure apparatus for transferring an image onto a substrate by mounting the substrate, moving the substrate in a two-dimensional plane while holding the substrate, wherein the substrate stage is held by the substrate stage.
- An exposure apparatus according to a seventeenth aspect further comprising a flat portion substantially flush with the surface of the substrate around the substrate.
- the pattern is illuminated by the energy beam while the liquid is locally held on the image plane side of the projection optical system, and the pattern is transferred onto the substrate via the projection optical system and the liquid. That is, immersion exposure is performed.
- immersion exposure is performed.
- the projection optical system Even when exposing the peripheral part of the plate or exchanging the substrate on the substrate stage after the exposure is completed, with the liquid held between the projection optical system and the substrate on the image side, the projection optical system Even when the substrate stage moves to a position where the projection area deviates from the substrate, the liquid can be held between the projection optical system and the flat portion provided around the substrate held on the substrate stage, and the liquid can be held. Can be prevented.
- a liquid is locally held on an image plane side of a projection optical system, a pattern is illuminated by an energy beam, and the pattern is transmitted through the projection optical system and the liquid.
- An exposure apparatus for transferring an image onto a substrate by mounting the substrate, moving the substrate in a two-dimensional plane while holding the substrate, wherein the substrate stage is held by the substrate stage.
- An exposure apparatus according to an eighteenth aspect, wherein the exposure apparatus keeps holding the liquid.
- the pattern is illuminated by the energy beam while the liquid is locally held on the image plane side of the projection optical system, and the pattern is transferred onto the substrate via the projection optical system and the liquid. That is, immersion exposure is performed.
- the projection optical system and the flat portion provided on the substrate stage are opposed to each other, and the liquid is continuously held on the image plane side of the projection optical system.
- the liquid can be kept on the image plane side of the projection optical system during the substrate exchange, and the substrate after the exchange can be kept without the time for liquid supply. Exposure can be started.
- the present invention provides a liquid crystal device that locally holds a liquid on an image plane side of a projection optical system, illuminates a pattern with an energy beam,
- An exposure apparatus for transferring onto a substrate via the projection optical system and the liquid comprising: a substrate stage on which the substrate is mounted; and a substrate stage that holds the substrate and moves in a two-dimensional plane.
- the substrate stage has a flat portion substantially flush with the surface of the substrate held by the substrate stage, and after the exposure of the substrate held by the substrate stage is completed, the substrate stage is moved to a predetermined position.
- a ninth exposure apparatus wherein the liquid on the image plane side of the projection optical system is collected, and after the liquid is completely collected, the substrate after the exposure is unloaded from the substrate stage. .
- the pattern is illuminated by the energy beam while the liquid is locally held on the image plane side of the projection optical system, and the pattern is transferred onto the substrate via the projection optical system and the liquid. That is, immersion exposure is performed.
- the substrate stage is moved to a predetermined position to collect the liquid on the image plane side of the projection optical system.
- the substrate stage is moved to a predetermined position, even if the substrate stage moves to a position where the projection area of the projection optical system deviates from the substrate, the projection optical system and the flat portion provided on the substrate stage are not moved. Liquid can be held in between.
- the predetermined position may be a position where the projection optical system and the flat portion provided on the substrate stage face each other to hold the liquid.
- the liquid is collected after moving to the predetermined position, and after the liquid is completely collected, the substrate after the exposure is unloaded from the substrate stage.
- the present invention provides a liquid crystal device that locally holds a liquid on an image plane side of a projection optical system, illuminates a pattern with an energy beam, and illuminates the pattern through the projection optical system and the liquid.
- the energy is The pattern is illuminated by the lugi beam, and the pattern is transferred onto the substrate via the projection optical system and the liquid. That is, immersion exposure is performed. Also, the supply of the liquid from the supply mechanism to the image plane side of the projection optical system is started in parallel with the exhaust of the gas in the space on the image plane side of the projection optical system by the exhaust mechanism. The liquid can be quickly filled, and undesired bubbles and lump of air can be prevented from remaining on the image plane side of the projection optical system.
- the present invention is an exposure apparatus that irradiates an energy beam onto a substrate via a projection optical system and a liquid to expose the substrate, and the substrate is held in two dimensions.
- a second exposure apparatus comprising: a substrate stage movable in a plane; and a control device for controlling movement of the substrate stage based on at least one of temperature information of the liquid and pressure information of the liquid. It is.
- the substrate is irradiated with the energy beam through the projection optical system and the liquid, and the substrate is exposed. That is, immersion exposure is performed. Further, since the movement of the substrate stage is controlled based on at least one of the temperature information of the liquid and the pressure information of the liquid by the control device, the temperature change of the water between the projection optical system and the substrate can be controlled. The occurrence of defocus and the like during exposure due to the pressure of water is effectively suppressed, and deterioration of transfer accuracy can be prevented.
- the present invention can be said to be a device manufacturing method using any of the first to 21st exposure apparatuses of the present invention.
- FIG. 1 is a view schematically showing a configuration of an exposure apparatus according to a first embodiment of the present invention.
- FIG. 2 is a perspective view showing a Z ⁇ tilt stage and a wafer holder.
- FIG. 3 is a cross-sectional view showing the liquid supply / discharge unit together with the lower end of the lens barrel and a piping system.
- FIG. 4 is a sectional view taken along line BB of FIG.
- FIG. 5 is a diagram for explaining the focus position detection system.
- FIG. 6 is a block diagram showing a control system of the exposure apparatus of the first embodiment with a part of the configuration omitted.
- FIGS. 7A and 7B are diagrams for explaining the reason why the irradiation area of the wafer causes an aberration change due to the irradiation of the illumination light.
- FIG. 8A is a diagram showing a state when the wafer stage is moved to the water supply position
- FIG. 8B is a diagram showing the position of the wafer stage and the projection unit in the step-and-scan exposure process on the wafer
- FIG. 8C is a diagram showing an example of the relationship
- FIG. 8C is a diagram showing a state when the wafer stage has moved to the drain position.
- FIG. 9 is a view showing a state in which water has accumulated to a desired depth inside the liquid supply / drainage unit.
- Fig. 10A is a simplified view of the vicinity of the liquid supply / drainage unit during the exposure for the first shot.
- Fig. 10 OB shows the wafer scanned in the opposite direction to Fig. 1 OA.
- FIG. 4 is a simplified view showing a state in the vicinity of a liquid supply unit when the liquid supply unit is closed.
- FIGS. 11A to 11F are views showing the flow of a water supply / drain operation during scanning of a wafer stage for exposure to one shot area in the exposure apparatus according to the second embodiment.
- FIG. 12 shows an exposure apparatus of the second embodiment, which employs a liquid supply / discharge unit according to a modification in which a plurality of partitions extending parallel to the scanning direction are provided, and exposes an edge shot on a wafer. It is a figure for explaining a case.
- FIGS. 13 to 13F are views for explaining a modification of the second embodiment, and show a flow of water supply / drainage operation during scanning of a wafer stage for exposure to one shot area.
- FIGS. 14A and 14B are diagrams showing modified examples of the liquid supply / drainage unit.
- FIG. 15 is a view showing a modification in which a hole is provided in a part of the projection lens, and the liquid is recovered through the hole.
- FIG. 16 is a flowchart for explaining the device manufacturing method according to the present invention.
- FIG. 17 is a flowchart showing a specific example of step 204 in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIGS. 1 to 1OB a first embodiment of the present invention will be described with reference to FIGS. 1 to 1OB.
- FIG. 1 shows a schematic configuration of an exposure apparatus 100 according to the first embodiment.
- the exposure apparatus 100 is a step-and-scan projection exposure apparatus (a so-called “scanning” stepper).
- the exposure apparatus 100 includes an illumination system 100, a reticle stage RST holding a reticle R as a mask, a projection unit PU, and a Z on which a wafer W as a substrate is mounted.
- a device 50 and a control system for these devices are provided.
- the illumination system 10 includes a light source and an optical system as disclosed in, for example, Japanese Patent Application Laid-Open No. 6-349701 and the corresponding US Pat. No. 5,534,970. It is configured to include an illuminance uniforming optical system including a cal integrator, a beam splitter, a relay lens, a variable ND filter, a reticle blind, etc. (all not shown).
- an illuminance uniforming optical system including a cal integrator, a beam splitter, a relay lens, a variable ND filter, a reticle blind, etc. (all not shown).
- a reticle R on which a circuit pattern and the like are drawn
- the slit-shaped illumination area defined by the reticle blind is illuminated with illumination light (exposure light) IL as an energy beam with substantially uniform illuminance.
- the illumination light I an ArF excimer laser light (wavelength: 193 nm) is used as an example.
- far ultraviolet light such as KrF excimer laser light (wavelength 248 nm) or an ultraviolet bright line (g-ray, ⁇ -ray, etc.) from an ultra-high pressure mercury lamp may be used.
- the optical integrator a fly-eye lens, a rod integrator (an internal reflection type integrator), a diffractive optical element, or the like can be used. To the extent permitted by the national laws of the designated or designated elected States in this International Application, the disclosures in the above US Patents will be incorporated by reference into this description.
- a beam splitter having a high transmittance and a small reflectance is disposed on the optical path of the illumination light IL in the illumination system 10, and an integrator sensor (optical device) including a photoelectric conversion element is disposed on the optical path reflected by the beam splitter.
- Sensors) 14 are arranged (not shown in FIG. 1, see FIG. 6). The photoelectric conversion signal of the integrator sensor 14 is supplied to the main controller 20 (see FIG. 6).
- Reticle stage RS # is driven by reticle stage drive section 11 including, for example, a linear motor (not shown in FIG. 1; see FIG. 6) to provide the optical axis of illumination system 10 (optical axis of projection optical system PL described later). It can be driven finely in a plane that is perpendicular to ()), and can be driven in a predetermined scanning direction (here, the ⁇ axis direction) at a specified scanning speed.
- reticle stage drive section 11 including, for example, a linear motor (not shown in FIG. 1; see FIG. 6) to provide the optical axis of illumination system 10 (optical axis of projection optical system PL described later). It can be driven finely in a plane that is perpendicular to ()), and can be driven in a predetermined scanning direction (here, the ⁇ axis direction) at a specified scanning speed.
- the position of the reticle stage RS in the stage movement plane is determined by a reticle laser interferometer (hereinafter referred to as “reticle interferometer J”) 16 via a movable mirror 15 through a resolution of, for example, about 0.5 to 1 nm.
- reticle interferometer J a reticle laser interferometer
- a movable mirror having a reflective surface orthogonal to the Y-axis direction and a movable mirror having a reflective surface orthogonal to the X-axis direction are actually provided on reticle stage RST.
- a reticle Y interferometer and a reticle X interferometer are provided, and these are typically shown as a moving mirror 15 and a reticle interferometer 16 in FIG.
- the end surface of reticle stage RS # may be mirror-finished to form a reflection surface (corresponding to the reflection surface of movable mirror 15).
- at least one corner cube type mirror (for example, a retroreflector) is used instead of the reflecting surface extending in the X-axis direction used for detecting the position of the reticle stage RST in the scanning direction ( ⁇ -axis direction in the present embodiment). May be.
- the reticle ⁇ interferometer is a two-axis interferometer having two measurement axes, and the reticle stage RS In addition to the ⁇ position of ⁇ , rotation in the 0 ⁇ direction (rotation direction around the ⁇ axis) can be measured.
- the position information of the reticle stage R ST from the reticle interferometer 16 is supplied to the stage control device 19 and the main control device 20 via the stage control device 19.
- the stage control device 19 drives and controls the reticle stage R S ⁇ ⁇ via the reticle stage drive unit 11 based on the position information of the reticle stage R S ⁇ in response to an instruction from the main control device 20.
- the projection unit PU is disposed below the reticle stage RS # in FIG.
- the projection unit PU includes a lens barrel 40 and a plurality of optical elements held in a predetermined positional relationship within the lens barrel, specifically, a plurality of lenses (lens elements) having a common optical axis AX in the ⁇ -axis direction. ) And a projection optical system PL.
- the projection optical system PL for example, a refracting optical system with a predetermined projection magnification (for example, 14 times or 15 times) which is telecentric on both sides is used.
- the illumination area IL on the reticle R is illuminated by the illumination light IL from the illumination system 10
- the illumination light IL passing through the reticle R passes through the projection unit PU (projection optical system PL).
- a reduced image of the circuit pattern of the reticle R in the illumination area is formed on the wafer W having a surface coated with a resist (photosensitive agent).
- a specific one of a plurality of lenses constituting the projection optical system P is formed by an imaging characteristic correction controller 8 based on a command from the main controller 20. 1 (see Fig.
- the imaging characteristic correction controller 81 may adjust the characteristics of the image projected through the projection optical system PL by moving the reticle R or finely adjusting the wavelength of the illumination light IL. Yes, or they may be used in combination as appropriate.
- a lens 4 as an optical element closest to the image plane (wafer side) constituting the projection optical system PL is used.
- a liquid supply / drain unit 32 is mounted in the vicinity of 2 (see FIG. 3 etc.) so as to surround the distal end of the lens barrel 40 holding the lens. The liquid supply / discharge unit 32 and the configuration of the piping system connected thereto will be described later in detail.
- the stage device 50 includes a wafer stage WS T as a substrate stage, a wafer holder 0 provided on the wafer stage WS, a wafer stage drive unit 24 for driving the wafer stage WS and the wafer holder 70, and the like. ing.
- the wafer stage WS # is disposed on a base (not shown) below the projection optical system PL in FIG. 1, and is driven in the X ⁇ ⁇ ⁇ ⁇ direction by a linear motor or the like (not shown) constituting the wafer stage drive unit 24.
- the X stage 31 and the not shown stage (not shown) which is mounted on the stage 31 and constitutes the wafer stage driving unit 24.
- the tilt driving mechanism allows the ⁇ axis direction and the tilt direction with respect to the ⁇ surface.
- the wafer holder 70 holding the wafer W is mounted on the Z ′ tilt stage 30. As shown in the perspective view of FIG. 2, the wafer holder 70 is located on one diagonal of a square Z ′ tilt stage 30 in a peripheral portion of a region (central circular region) on which the wafer W is placed.
- the main body part has a specific shape, in which two corners projecting from each other protrude, and the two corners located on the other diagonal line form an arc of 14 which is once larger than the above-mentioned circular area.
- auxiliary plates 22a to 22d arranged around the region where the wafer W is placed so as to substantially overlap the main body 70A.
- the surfaces (flat portions) of these auxiliary plates 22a to 22d are almost the same height as the surface of the wafer W (the difference between the heights is about 1 mm or less).
- the dimension of the gap D is 3 mm or less. It is set as follows.
- the wafer W has a notch (a V-shaped notch) in a part thereof, but the notch is not illustrated because the size of the notch is smaller than the gap D and is about 1 mm. .
- a circular opening is formed in a part of the auxiliary plate 22a, and a reference mark plate FM is fitted into the opening such that there is no gap.
- the reference mark plate FM has the same surface as the auxiliary plate 22a.
- various reference marks (all not shown) used for a baseline measurement of a reticle alignment / alignment detection system described later are formed.
- the auxiliary plates 22 a to 22 d do not necessarily have to be plate-shaped, and the upper surface of the Z ′ tilt stage 30 may be approximately the same height as the wafer W. The point is that a flat portion having substantially the same height as the surface of the wafer W should be formed around the wafer W.
- the XY stage 31 not only moves in the scanning direction (Y-axis direction), but also converts a plurality of shot areas on the wafer W into exposure areas that serve as the illumination areas.
- Non-scanning direction perpendicular to the scanning direction so that it can be positioned In the direction (X-axis direction), and scans each shot area on the wafer W (scan) Exposure operation and moves to the acceleration start position (scanning start position) for the next shot exposure Step 'and' scan operation is repeated.
- the position of the wafer stage WST in the XY plane (including the rotation around the Z axis (0z rotation)) is adjusted via a moving mirror 17 provided on the top surface of the Z ⁇ tilt stage 30 through the wafer laser interferometer ( Hereinafter, this is referred to as “wafer interferometer” 18), and is always detected with a resolution of, for example, about 0.5 to 1 nm.
- wafer interferometer the Z movable mirror 17 Y having a reflecting surface orthogonal to the scanning direction (Y-axis direction) as shown in FIG.
- An X-moving mirror 17 X having a reflecting surface orthogonal to the direction (X-axis direction) is provided.
- the wafer interferometer irradiates the interferometer beam perpendicularly to the X-moving mirror 17 X.
- An interferometer and one Y-moving mirror are provided, and a Y-interferometer that irradiates the interferometer beam perpendicularly to Y is provided.
- these are typically shown as a moving mirror 17 and a wafer interferometer 18.
- the X interferometer and the Y interferometer of the wafer interferometer 18 are both multi-axis interferometers having a plurality of measurement axes.
- the wafer stage WST (more precisely, the Z In addition to the X and Y positions of 3 0), rotation (rotation (0 z rotation around Z axis), pitching (SX rotation around X axis), mouth ring (around Y axis)
- the rotation of 0 y rotation) can also be measured.
- a reflection surface (corresponding to the reflection surfaces of the moving mirrors 17X and 17Y) may be formed by mirror-finishing the end surface of the Z ⁇ tilt stage 30.
- the multi-axis interferometer tilts the laser beam by 45 ° through a reflecting surface provided on the wafer table 18 to a reflecting surface provided on a mount (not shown) on which the projection optical system PL is mounted.
- Irradiation may be used to detect relative position information in the optical axis direction (Z-axis direction) of the projection optical system PL.
- the position information (or speed information) of wafer stage WST is supplied to stage controller 19 and main controller 20 via the same.
- stage controller 19 In response to an instruction from main controller 20, wafer stage WST is controlled via wafer stage drive section 24 based on the position information (or speed information) of wafer stage WST.
- FIG. 3 is a cross-sectional view of the liquid supply / drainage unit 32 together with the lower end of the lens barrel 40 and the piping system.
- FIG. 4 is a sectional view taken along line BB of FIG.
- the liquid supply / discharge unit 32 is configured to be detachable from the lens barrel 40, and can be replaced if the liquid supply / discharge unit 32 fails or breaks. It is.
- a small-diameter portion 40a having a smaller diameter than other portions is formed at the end (lower end) on the image plane side of the lens barrel 40 of the projection unit PU.
- the small diameter portion 40a is a tapered portion 40b in which the diameter decreases as the tip of the small diameter portion 40a goes downward.
- the lens 42 closest to the image plane that constitutes the projection optical system PL is held inside the small diameter portion 40a.
- the lower surface of the lens 42 is parallel to the XY plane orthogonal to the optical axis AX.
- the liquid supply / discharge unit 32 has a stepped cylindrical shape when viewed from the front (and side), and has a small-diameter portion 40 a of the lens barrel 40 at the center thereof from above.
- a circular cross-section opening 32a that can be inserted is formed vertically.
- the opening diameter of the opening 32a (the diameter of the inner peripheral surface of the outer annular side wall 32c forming the opening) is constant from the upper end to the vicinity of the lower end, and is lower at the lower part. It is tapered so that it becomes smaller as it goes.
- the outer surface of the tapered portion 40 of the lens barrel 40a and the inner surface of the annular side wall 32c form a kind of nozzle of a suehiro (tapered from the bottom) as viewed from above. Part) is formed.
- annular concave portion 32b is formed outside the opening 32a when viewed from below.
- the annular side wall 32c having a predetermined thickness is formed between them.
- the lower end surface of the annular side wall 32c is flush with the lower surface of the lens 42 (the lowermost end surface of the lens barrel 40).
- the diameter of the outer peripheral surface of the annular side wall 32c is constant from the upper end portion to the vicinity of the lower end portion, and is tapered so as to become smaller as it goes downward in a portion below the lower end.
- annular gap is formed in plan view (when viewed from above or below).
- One end of each of the plurality of collection tubes 52 is inserted into the space at substantially equal intervals around the entire circumference in an up-down direction.
- the bottom surface (upper surface) inside the above-mentioned recess 3 2b of the liquid supply / drainage unit 32 has through holes in the vertical direction at both sides in the X-axis direction and both sides in the Y-axis direction of the annular side wall 32c. 34 are formed, and one end of an exhaust pipe 54 is inserted into each through hole 34. (In FIG. 3, the exhaust pipe 54 on one side in the X-axis direction and the other side are not shown, see FIG. 4.) .
- round holes are formed at a plurality of locations (for example, two locations) in the bottom surface (upper surface) inside the concave portion 3 2 b of the liquid supply / discharge unit 32, and all the collecting nozzles 5 are formed through the respective round holes. The lower end of 6 is inserted.
- annular concave groove 32d is formed outside the concave portion 32b when viewed from below.
- annular side wall 32e having a predetermined thickness is formed between the concave groove 32d and the concave portion 32b.
- the lower end surface of the annular side wall 32e is flush with the lower surface of the aforementioned lens 42 (the lowermost end surface of the lens barrel 40).
- the diameter of the inner peripheral surface of the annular side wall 32 e is constant from the upper end to the lower end, but the diameter of the outer peripheral surface is constant from the upper end to the vicinity of the lower end, and becomes smaller as it goes downward from the lower part.
- Such a tapered shape is
- the depth of the groove 3 2 d is somewhat shallower (predetermined distance) than the depth of the recess 3 2 b, and the bottom (upper surface) inside the groove 3 2 d of the liquid supply / drain unit 32 has a plurality of grooves. Stepped through-holes are formed at predetermined intervals, and one end of the supply pipe 58 is positioned in each through-hole. Five
- the outer wall of the concave groove 32d of the liquid supply / drain unit 32 that is, the peripheral wall 32f has a protruding portion 3 in which a part on the inner peripheral side protrudes downward by a predetermined distance AH from the remaining part.
- the lower end surface of the protruding portion 32g is parallel to the lower surface of the lens 42, and the clearance ⁇ h between itself and the surface of the wafer W is 3 mm or less, for example, about 1 to 2 mm. In this case, the distal end surface of the protruding portion 32 g is located approximately ⁇ below the surface of the lens 42.
- the diameter of the lower end of the inner peripheral surface of the peripheral wall 32f (the portion near the protruding portion 32g) is tapered so that it increases as it goes downward.
- a kind of nozzle of Suehiro (tapered from the bottom) as viewed from above (hereinafter referred to as "Suehiro for convenience") Nozzle section) is configured.
- Two pairs of arc-shaped slits 32 of a predetermined depth are provided in the annular area outside the projection 32 g of the peripheral wall 32 f on one side and the other side in the X-axis direction and on one side and the other side in the Y-axis direction.
- each slit is considerably smaller than the width of the concave groove 32d, and it is assumed that a capillary phenomenon occurs inside the slit.
- At least one liquid supply / discharge unit 32 is formed on the upper surface of the liquid supply / discharge unit 32, and one end of the auxiliary recovery pipe 60 is inserted into each intake hole.
- each of the supply pipes 58 is connected to the other end of a supply pipe 64 whose one end is connected to the liquid supply device 72 via a valve 62a.
- the liquid supply device 72 includes a liquid tank, a pressure pump, a temperature control device, and the like, and is controlled by the main control device 20.
- the liquid supply device 72 is actuated when the corresponding valve 62a is open, for example, the temperature in the chamber (not shown) in which the (exposure device 100) is housed (not shown).
- a predetermined liquid for immersion temperature controlled by the temperature control device to the same level is supplied through the supply port 36 into the substantially closed space defined by the liquid supply / drain unit 32 and the wafer W surface. Supplied.
- the valves 62 a provided in each supply pipe 58 are collectively described as a valve group 62 a (see FIG. 6).
- ultrapure water through which ArF excimer laser light (light having a wavelength of 193 ⁇ 3 nm) is transmitted (hereinafter simply referred to as “water” unless otherwise required).
- water ArF excimer laser light (light having a wavelength of 193 ⁇ 3 nm) is transmitted
- water unless otherwise required.
- Ultrapure water has the advantage that it can be easily obtained in large quantities at semiconductor manufacturing plants and the like, and that it has no adverse effects on the photoresist on the wafer, optical lenses, and the like.
- ultrapure water has no adverse effect on the environment and has an extremely low impurity content, so that an effect of cleaning the surface of the wafer and the surface of the lens 42 can be expected.
- each of the recovery pipes 52 is connected to the other end of a recovery pipe line 66 whose one end is connected to the liquid recovery device 74 via a valve 62b.
- the liquid recovery device 74 includes a liquid tank, a suction pump, and the like, and is controlled by the main control device 20.
- the valves 62b provided in each recovery pipe 52 will be collectively described as a valve group 62b (see FIG. 6).
- each of the collecting nozzles 56 is connected to a collecting pipe 68 for relay and a common valve. It is connected to another branch end of the above-mentioned recovery line 66 through a valve 62c.
- each of the all-collection nozzles 56 is configured to be vertically movable by a drive mechanism 63 (not shown in FIG. 3; see FIG. 6) controlled by the main controller 20.
- Each total recovery nozzle 56 is configured to be movable to a predetermined distance below the surface of the wafer W. Therefore, when the valves 62c are in the open state, all the collecting nozzles 56 are lowered to a position substantially at the same level as the wafer surface, and the liquid collecting device 56 is moved through those collecting nozzles 56. The water is completely recovered from the wafer (or the auxiliary plates 22a to 22d described above) according to 74.
- each exhaust pipe 54 is connected to the other end of a vacuum piping system 69 connected to a vacuum exhaust device 76 as a suction mechanism having a built-in vacuum pump via a valve 62d. It is connected.
- the evacuation device 76 is controlled by the main control device 20.
- the valves 62 d provided in each exhaust pipe 54 will be collectively described as a valve group 62 d (see FIG. 6).
- this vacuum pipe system 6 9, the auxiliary described above through a common valve 6 2 e times Osamukan 6 0 ⁇ 6 0 4 are connected.
- the lens 42 is placed on the wafer W (or the auxiliary plate 22a to 22d described above).
- the water is filled up to the position above the lower end surface (see Fig. 8), the upper space in the recess 32b becomes negative pressure, and the water is lifted.
- the evacuation device 76 When the evacuation device 76 is in operation when the valve 62 e is open, for example, when water leaks (flows out) to the outside of the above-mentioned peripheral wall 32 f, the water is removed by a slit. (Any of 32 hi to 32 h 4 ) is sucked up by capillary action and is sucked up by the vacuum suction force of the vacuum evacuation device 76 and is discharged to the outside.
- an adjustment valve for example, a flow control valve that can adjust the opening degree in addition to opening and closing is used.
- These valves are the main controller 20 (See Figure 6).
- the liquid supply / drain unit 32 is formed by a screw 80 through a plurality of holes formed in the upper surface of the liquid supply unit 32 at a plurality of positions on the upper surface toward the bottom surface (upper surface) inside the concave portion 32b. (See Fig. 4).
- a pair of temperature sensors 38A and 38B are fixed to one side and the other side of the tapered portion 40b of the lens barrel 40 in the Y-axis direction, respectively. The outputs of these temperature sensors are supplied to the main controller 20 (see FIG. 6).
- the air supply nozzle 8 5 3 8 5 in the vicinity of each slit 3 2 h 3, 3 2 h 4 described above, the air supply nozzle 8 5 3 8 5 4, respectively.
- one air supply nozzle is also provided in the vicinity of each of the slits 3 2 3 2 h 2 .
- These air supply nozzles are connected to an air conditioning mechanism 86 (not shown in FIG. 3; see FIG. 6) controlled by the main controller 20.
- the exposure apparatus 100 of the present embodiment is further provided with a focus position detection system for so-called auto-focus and auto-leveling of the wafer W.
- a focus position detection system for so-called auto-focus and auto-leveling of the wafer W.
- a pair of prisms 44A and 44B made of the same material as the lens 42 between the lens 42 and the tapered portion 40b of the lens barrel 40 are provided. Is provided.
- Right-angle prisms 46 A and 46 B are arranged at the inner ends of the through holes 40 d and 4 O e (at the above-mentioned gap side), and are fixed to the lens barrel 40. .
- An irradiation system 90a is disposed outside the lens barrel 40 so as to face one of the through holes 40d.
- the outside of the lens barrel 40 faces the other through-hole 40 e, and the irradiation system
- a light receiving system 90 b that forms a focal position detection system together with 90 a is arranged.
- the illumination system 90a has a light source whose on / off is controlled by the main controller 20 in FIG. 1, and forms images of many pinholes or slits toward the imaging plane of the projection optical system PL. An image forming light beam is emitted in the horizontal direction.
- the emitted image-forming light beam is reflected vertically downward by the right-angle prism 46A, and is irradiated on the surface of the wafer W obliquely with respect to the optical axis AX by the above-described prism 44A.
- the reflected luminous flux of the imaging luminous flux reflected on the wafer W surface is reflected vertically upward by the above-described prism 44B, and further reflected horizontally by the right-angle prism 46B.
- the light is received by the light receiving system 90b.
- the irradiation system 90a, the light receiving system 90b, the prisms 44A and 44B, and the right-angle prisms 46A and 46B are included.
- a focus position detection system comprising an oblique incidence type multi-point focus position detection system similar to that disclosed in Japanese Patent No. 34033 and U.S. Patent Nos. 5,448,332 corresponding thereto. Is configured.
- the focus position detection system will be referred to as a focus position detection system (90a, 90b).
- the defocus signal (defocus signal) output from the light receiving system 90b of the focus position detection system (90a, 90b) is supplied to the main controller 20.
- the main controller 20 controls the stage controller so that the defocus becomes zero based on a defocus signal (defocus signal) from the light receiving system 60b, for example, an S-curve signal at the time of scanning exposure to be described later.
- the movement of the Z ′ tilt stage 30 and the wafer holder 70 in the Z-axis direction and the inclination in the two-dimensional direction (that is, rotation in the 0x and 0y directions) via the 19 and the wafer stage drive unit 24 are performed. Control. That is, the main controller 20 controls the movement of the Z-tilt stage 30 and the wafer holder 70 by using the focus position detection system (90a, 90b), thereby irradiating the illumination light IL.
- the image plane of the projection optical system P C Perform autofocus (autofocus) and autoleveling that substantially match the surface of W. This will be further described later.
- FIG. 6 is a block diagram showing a configuration of a control system of exposure apparatus 100 with a part omitted.
- This control system mainly includes a main controller 20 including a workstation (or a microcomputer) and a stage controller 19 under the main controller 20.
- the main controller 20 is connected to a memory 21 in addition to the components described above.
- the memory 21 stores the temperature difference obtained from the measurement results of the temperature sensors 38A and 38B and information on the flow of water below the lens 42 (flow velocity and flow rate) during scanning exposure, which will be described later.
- the projection area of the pattern on the wafer W optically conjugate to the illumination area where the reticle R is illuminated with the illumination light IL, that is, the illumination light IL is radiated through the pattern and the projection optical system PL during exposure.
- For calculating the temperature distribution of water in the irradiated area on the wafer for example, an arithmetic expression or table data), and the aberration of the pattern image projected into the irradiated area based on this temperature distribution.
- the temperature of the water changes due to the absorption of the illumination light IL into the water, and the water near the tip of the projection optical system PL. It is conceivable that the temperature of the wafer becomes higher than the temperature of the water near the wafer W surface.
- the best focus position at the other end point P 2 is a point shifted upward by ⁇ Z from the surface of the ueno or W surface.
- the best focus position at point P 2 is eliminated coincide with the surface of the wafer W is because the water warmed by the heat from the wafer moves from point P i to point P 2.
- the cold water flowing from the upstream becomes dominant on the upstream side (position near point P i), and the warmed water becomes dominant on the downstream side (position near point P 2 ).
- the point P The difference occurs in the L and the point P 2 Debe strike focus position, the temperature change (temperature distribution), the change in refractive index of water (distribution ). So, in this sense, other Aberration, spherical aberration, astigmatism, distortion, etc. are also considered to change according to the temperature distribution. As described above, the temperature of the water changes due to the absorption of the illumination light IL into the water, and the temperature of the water near the tip of the projection optical system PL is higher than the temperature of the water near the surface of the wafer W. Therefore, the temperature distribution of the flowing water is not limited to Fig. 7B.
- the aberration distribution (eg, focus distribution) due to the temperature distribution of water in the illumination area depends on the direction of the flow of water.
- a pressure difference occurs between the upstream side and the downstream side. That is, the downstream side has a negative pressure compared to the upstream side. That is, the pressure of the water between the projection optical system PL and the wafer W changes, and the position of the lens 42 and the wafer W fluctuates due to such pressure, and the aberration according to the position in the illumination area For example, a change in the best focus position is caused, or a control error in auto focus and auto leveling is caused. Further, the pressure distribution in the scanning direction is closely related to the above-mentioned water speed, and changes according to the scanning speed of the wafer W, the supply amount of water (liquid), and the like.
- the memory 21 includes the scanning speed of the wafer and the amount of supplied water as data (or parameters), and aberrations in the irradiation area (for example, the best focus position, the curvature of field (including the inclination of the image plane).
- the table data (or calculation formula) for calculating the pressure change coefficient corresponding to the change in the, spherical aberration, etc.) is stored. It is obtained based on the results, etc.
- the pressure change coefficient also includes an aberration change corresponding to the surface position control error of the wafer W.
- the memory 21 further includes the above-described temperature change coefficient and pressure change coefficient as parameters, and also stores equations for calculating the above-described aberrations.
- reticle R has been loaded on reticle stage RST. Further, it is assumed that wafer stage WST is at a wafer exchange position and wafer W is loaded on wafer holder 70.
- a reticle alignment system similarly to the ordinary scanning stepper, a reticle alignment system, an alignment detection system (not shown), and a baseline measurement of the alignment system (not shown) using the above-described reference mark plate FM, etc.
- Preparatory work such as wafer alignment such as EGA (enhanced 'global' alignment) is also performed.
- FIG. 8A shows a state when wafer stage WST has moved to this water supply position.
- reference numeral PU indicates the position of the distal end of the lens barrel 40 of the projection unit PU.
- the position where the projection unit PU is located just above the reference mark plate FM is set as the water supply position.
- the main control device 20 starts the operation of the liquid supply device 72, opens the valve group 62a at a predetermined opening, and starts water supply from all the supply ports 34. Immediately after that, the main controller 20 starts the operation of the vacuum exhaust device 76, opens the valve group 62 d and the valve 62 e fully, and sets each exhaust pipe 54, auxiliary recovery pipe 60i. Initiate evacuation via SC. At this time, the main controller 20 controls the air conditioning mechanism 86 to start local air conditioning in the vicinity of the liquid supply / discharge unit 32. As described above, by supplying water to the space while exhausting the gas in the space on the image plane side of the projection optical system P, not only can the space be quickly filled with water, but also the space can be quickly filled. However, it is also possible to prevent undesired bubbles and gas lumps from remaining on the image plane side of the projection optical system PL.
- a predetermined amount of water accumulates in a substantially closed space defined by the liquid supply / drainage unit 32 and the reference mark plate FM surface.
- the water supply rate low so that the water does not leak to the outside with its momentum.
- Such a setting of the water supply amount may be performed by the main controller 20 adjusting the opening of each valve of the valve group 62 a, or the water supply from the liquid supply device 72 may be performed.
- the supply amount itself may be controlled. Immediately after the start of the supply, the amount of water supplied may be gradually increased or may be increased stepwise.
- the main controller 20 gives an instruction to the stage controller 19 to place the projection unit PU at a predetermined position on the wafer W.
- the wafer stage WST is moved so that the tip of the wafer comes.
- the wafer stage WST is moved from the water supply start position shown in FIG. 8A, the liquid immersion area below the projection unit PU passes through the boundary between the auxiliary plate 22a and the wafer W.
- the gap between the auxiliary plate 22a and the wafer W is about 1 mm, keep the water under the lens 42. Can be.
- FIG. 9 shows a state in which water has accumulated inside the liquid supply / drain unit 32 to a desired depth on the wafer W, and a portion of the liquid on the wafer W including the projection area of the projection optical system PL is shown. An immersion area is formed. Then, the exposure operation of the step-and-scan method is performed as follows.
- the stage controller 19 sends the first shot as the first partitioned area on the wafer W held by the wafer holder 70 based on the result of the wafer alignment under the instruction of the main controller 20.
- the wafer stage WST is moved to the acceleration start position for the exposure of the area (first shot) via the wafer stage drive unit 24.
- main controller 20 starts operation of liquid recovery device 74 and at least one of valve groups 62b.
- the valve 62 is opened at a predetermined opening, and the water inside the liquid supply / drainage unit 32 is recovered through the recovery pipe 52.
- a valve 6 2b used for collecting water is provided inside the liquid supply / drainage unit 32 so that a certain amount of water, whose height is higher than the lower surface of the lens 42, is always filled. Select and adjust the opening of each valve 6 2 b.
- main controller 20 completely closes valve 62 a corresponding to supply port 36 located at a position other than the rear in the movement direction of wafer stage WST (wafer W) with respect to projection unit PU, Only the valve 62b corresponding to the recovery pipe 52 located forward in the moving direction with respect to the projection unit PU may be opened at a predetermined opening. In this way, during the movement of the wafer stage WST, a flow of water moving from the rear side to the front side of the projection unit PU is generated below the lens 42 in the same direction as the movement direction of the wafer stage WS. Also at this time, The main controller 20 sets the amount of water supply and recovery so that a constant amount of water, whose height is higher than the lower surface of the lens 42, is constantly filled inside the unit 32 It is desirable to do.
- the stage controller 19 controls the reticle stage drive unit 11 and the wafer in accordance with the instruction of the main controller 20.
- the relative scanning in the Y-axis direction between the reticle stage RST and the wafer stage WST via the stage driving section 24 is started.
- the pattern area of reticle R starts to be illuminated by illumination light IL (ultraviolet pulse light) from illumination system 10. Scanning exposure is started.
- the stage controller 19 monitors the measured values of the wafer interferometer 18 and the reticle interferometer 16 described above in accordance with the instruction of the main controller 20 while the reticle stage driving unit 11 1 This is performed by controlling the wafer stage drive unit 24.
- the stage control device 19 determines that the moving speed Vr of the reticle stage RST in the Y-axis direction and the moving speed Vw of the wafer stage WST in the Y-axis direction correspond to the projection magnification of the projection optical system PL. Synchronous control is performed so that the speed ratio is maintained.
- the main control unit 20 operates in the scanning direction, that is, the moving direction of the wafer W, similarly to the movement from the water supply position to the acceleration start position.
- the valve group 6 2 a With respect to the valve group 6 2 a, the flow of water moving in the same direction (+ Y direction) as the moving direction of the wafer W from the rear side to the front side of the projection unit PU occurs below the lens 42.
- Make up 6 2b Adjust the opening of each valve (including fully closed and fully open).
- FIG. 1OA shows a simplified view of the vicinity of the liquid supply / drainage unit 32 at this time.
- the direction of the flow of water is the same as the scanning direction S D (+ Y direction) of the wafer W, and the flow velocity of the water is higher than the scanning speed of the wafer W. Therefore, water flows on the wafer W from the left side to the right side in the figure, and reaches the illumination area on the wafer surface of the illumination light IL (the projection area of the pattern on the reticle R via the projection optical system PL). Is always filled during scanning exposure (this water is constantly changing).
- water may leak to the outside from the front in the scanning direction of the projection 32 g of the peripheral wall 32 f depending on the flow velocity and flow rate of the water.
- together is sucked up by capillary action into the 2 h 3, are evacuated by the vacuum exhaust device 7 6 via an auxiliary recovery pipe 6 0 3, it is discharged to the outside. That is, with respect to the scanning direction of the wafer W, the liquid that has not been completely collected by the collection pipe 52 provided on the opposite side of the supply pipe 58 and has flowed out of the peripheral wall 32 g is transferred to the wafer by the auxiliary collection pipe 60 3. Collected (removed) from above W.
- Fig. 1 OA there may be cases where bubbles are mixed in the supplied water, or bubbles may be generated in the water immediately after the supply, but the upstream of the lens 42 Since the space (negative pressure space) described above exists on the side, when the relative speed of water to the wafer is lower than a certain value (normal use condition), bubbles are collected in the space and the lens 4 2 is so as not to reach below. That is, air bubbles in the water are collected between the supply pipe 58 and the lens 42, so that the air bubbles do not reach between the lens 42 and the wafer W, and the air bubbles are collected by the air bubbles. The image of the pattern projected on W does not deteriorate.
- a groove may be provided in an unused portion of the lower surface of the lens 42, that is, in a portion through which exposure light does not pass. In this case, even if an air bubble reaches between the lens 42 and the wafer W, the air bubble is trapped in the groove, so that the air bubble reaches the optical path of the exposure light. Can be more reliably prevented.
- the main controller 20 captures the measured values of the temperature sensors 38 A and 38 B during the scanning exposure, and scans the upstream and downstream ends of the irradiation area on the wafer in the scanning direction.
- the temperature difference ⁇ ⁇ from the end of is calculated.
- the main controller 20 uses the information (for example, the arithmetic expression or the table data) for calculating the temperature distribution of water in the irradiation area on the wafer, which is stored in the memory 21, as described above. Based on the temperature difference ⁇ and the flow rate of the water flowing below the lens 42, the above-mentioned temperature distribution of the water is calculated.
- main controller 20 uses the above-mentioned information (for example, an arithmetic expression or table data) stored in memory 21 to determine the temperature in the irradiation area based on the obtained water temperature distribution. For example, a temperature change coefficient corresponding to a change in the best focus position at one side and another point in the scanning direction is calculated.
- information for example, an arithmetic expression or table data
- the main controller 20 uses the above-described table data or the calculation formula stored in the memory 21 to determine, for example, the scanning direction in the irradiation area based on the scanning speed of the wafer W and the supply amount of water.
- the pressure change coefficient corresponding to the change of the best focus position at the point on one side and the other side is calculated.
- the main controller 20 calculates the above-mentioned aberration stored in the memory 21, for example, b. and c. in the calculation formula for calculating the best focus position, respectively.
- the best focus position at, for example, one side and the other side in the scanning direction in the irradiation area is calculated.
- the main controller 20 determines at that time based on the result calculated in d. Calculation of the image plane shape (inclination of the image plane) of the projection optical system, and setting of the target position (detection offset) at each detection point (irradiation point of the imaging light beam) of the focus position detection system based on the calculation result ), And focus control and leveling control of the wafer W are performed based on the target value. That is, the movement of the Z ⁇ tilt stage 30 and the wafer holder 70 is controlled such that the surface of the wafer W substantially matches the image plane.
- Main controller 20 repeatedly performs the above processes a. to e. at predetermined intervals during scanning exposure. As a result, each point on the wafer W is driven along the image plane of the projection optical system PL, and changes in the temperature of the water between the lens 42 and the wafer W and the pressure change caused by the water flow. The occurrence of defocus during exposure is effectively suppressed. In this way, when the scanning exposure for the first shot on the wafer W is completed, the stage controller 19 responds to an instruction from the main controller 20 to control the wafer stage WST through the wafer stage driving unit 24. Is moved in the X-axis direction, for example, to an acceleration start position for exposure of a second shot (a shot area as a second section area) on the wafer W.
- a second shot a shot area as a second section area
- the main control unit 20 also operates from the above-described water supply position.
- Each valve is opened and closed in the same way as when the wafer stage WST is moved to the acceleration start position for the first shot exposure.
- the same scanning exposure as described above is performed on the second shot on the wafer W.
- the scanning direction (moving direction) of the reticle stage RST and the wafer stage WST is far during the exposure of the second shot.
- the direction is opposite to the shot.
- the processing of the main controller 20 and the stage controller 19 during the scanning exposure for this second shot is basically the same as described above.
- the main controller 20 operates so that the flow of water moving from the rear side to the front side of the projection unit PU is generated below the lens 42 in the moving direction of the wafer W opposite to that during the first shot exposure.
- FIG. 1 OB shows a simplified view of the vicinity of the liquid supply / discharge unit 32 at this time, and scanning exposure of the second shot is performed while the wafer W moves in the Y direction, and the lens It is shown that water flows in the same direction (one Y direction) as wafer W between 42 and wafer W.
- the scanning exposure of the shot area on the wafer W and the stepping operation between the shot areas are repeatedly performed, and the circuit pattern of the reticle R is sequentially transferred to the shot area as a plurality of partitioned areas on the wafer W. Is done.
- FIG. 8B shows an example of a positional relationship between the wafer stage WST and the projection unit PU during the exposure process of the step 'and' scan method for the wafer W.
- FIG. 8C shows a state in which wafer stage WST has moved to the drain position.
- reference numeral PU indicates the position of the distal end of the lens barrel 40 of the projection unit PU. In this case, the position where the tip of the lens barrel 40 is located directly above the auxiliary plate 22c is the drainage position.
- the main controller 20 brings all the valves of the valve group 62 a into the fully closed state and brings all the valves of the valve group 62 b into the fully opened state.
- the main control unit 20 uses the drive mechanism 63 to drive all the collection nozzles 56, 56 Lower to the position where it contacts the port 22b, and open the valve 62c.
- the water under the lens 42 is completely recovered by the liquid recovery device 74.
- the wafer stage WS moves to the above-described wafer exchange position, and the wafer exchange is performed.
- the liquid supply device 72, the supply conduit 64 connected to the liquid supply device 72, and the supply conduit 64 Supply pipes 58 connected to each other via valves 62a, liquid supply units 32 connected to the plurality of supply pipes 58, respectively.
- a supply mechanism for supplying a liquid (water) between the projection optical system PL and the wafer W on the wafer stage WST is configured by the above-mentioned divergent nozzle portion and the like communicating with the wafer.
- a collection mechanism for collecting liquid (water) is constituted by the plurality of collection pipes 52 and the above-mentioned tapered nozzle portion to which the tip of each collection pipe 52 communicates.
- a vacuum exhaust device 76, a vacuum piping system 69 connected to the vacuum exhaust device 76, and an auxiliary recovery device connected to the vacuum piping system 69 via a valve 62 e tube 6 ( ⁇ 6 0 4, and respective auxiliary recovery pipe is liquid supply and discharge unit 3 2 connected respectively slits 3 2 Hi ⁇ 3 by the like 2 h 4 connexion auxiliary recovery mechanism is constituted.
- the auxiliary recovery mechanism can remove (recover) the liquid on the wafer W that has not been completely recovered by the liquid recovery mechanism.In this embodiment, the auxiliary recovery mechanism remains on the wafer W.
- the liquid is suctioned and removed (recovered) from the top of the wafer.
- the liquid may be dried by blowing dry air, or may be blown off.
- an air supply mechanism that suppresses a change in the environment around water (liquid) caused by suction by the evacuation device 76 is configured.
- the reticle stage drive unit 11, the wafer stage drive unit 24, and the stage control unit 19 transfer the reticle pattern onto the wafer W by the scanning exposure method.
- a drive system is configured to drive the reticle stage RST and the wafer stage WST in synchronization with each other in the scanning direction.
- annular side wall 3 2 c that defines an opening 32 a at the center of the liquid supply / discharge unit 32 (the lens 42 on the image plane side of the projection optical system P is disposed at the center of the opening 32 a).
- An annular recess 32b is provided outside the annular side wall 32c of the bracket. The height of the ceiling of the annular recess 32b is higher than other portions, and water (liquid) is supplied and discharged. Even when supplied to the inside of the unit 32, a space is left inside the annular recess 32b.
- annular side wall 32c, the annular side wall 32e, and the exhaust pipe 54 connected to the upper space of the annular concave part 32b formed by the both An air bubble collection mechanism is configured. Also, in this case, the annular side wall 32c and the annular recess 32b are formed around the entire circumference of the projection unit PU, so that a large number of air bubbles substantially extend in all directions. This is equivalent to providing a collection mechanism.
- the main controller 20 includes an adjustment device that adjusts the offset of (2) and the conditions (imaging conditions) related to the focus / leveling control of the wafer W.
- the main control unit 20 is configured to predict the temperature change of the water occurring in the water.
- two temperature sensors are not necessarily required, and one may be used as long as the temperature change of water is known, or three or more temperature sensors may be provided to obtain a more detailed temperature distribution.
- the projection unit PU ( The operation of supplying water between the projection optical system PL) and the wafer W on the wafer stage WST and the water collecting operation of the above-described collecting mechanism are performed in parallel. That is, a predetermined amount of water (this water is constantly being replaced) is always filled (held) between the lens 42 at the tip of the projection optical system PL and the wafer W on the wafer stage WST. In this state, exposure (transfer of the reticle pattern onto the wafer) is performed.
- the immersion method is applied, and the wavelength of the illumination light IL on the surface of the wafer W can be shortened to 1Zn times the wavelength in air (n is the refractive index of water 1.4). This improves the resolution of the projection optical system. Further, since the supplied water is constantly replaced, if foreign matter is attached on the wafer W, the foreign matter is removed by the flow of water.
- the depth of focus of the projection optical system PL is about n times wider than in air, the focus and leveling operation of the wafer W using the focus position detection system (90a, 90b) There is an advantage that defocus hardly occurs.
- the numerical aperture (N A) of the projection optical system PL can be further increased, and the resolution is also improved in this respect.
- the bubble collection position of the bubble collection mechanism used for collecting bubbles is in the moving direction of the wafer W (in the scanning direction as an example in FIG. 1OA and FIG. 1OB). Are switched in accordance with. Therefore, even when the wafer W moves in any direction, it is possible to prevent bubbles from entering between the lens 42 and the wafer W during the movement.
- the wafer interferometer 18 that measures the position of the wafer stage WST by suppressing the temperature distribution in the atmosphere due to the heat of vaporization when the remaining water evaporates or the change in the refractive index of the atmosphere is suppressed. Measurement errors can be effectively suppressed. In addition, it is possible to prevent water remaining on the wafer from flowing to the back side of the wafer, thereby preventing the wafer from sticking to the transfer arm and becoming difficult to separate.
- the projection optical system PL is used when exposing a shot area around the wafer W or exchanging the wafer on the wafer stage WST after the exposure is completed. Even if the wafer stage WST moves to a position where the projection unit PU (projection area of the projection optical system PL) deviates from the wafer W while water is held between the (lens 42) and the wafer W, However, water can be held between the projection optical system and the auxiliary plate (any of 22a to 22d), and the outflow of the water can be prevented. This can avoid various inconveniences caused by the outflow of water.
- the wafer W is moved from a state where the wafer W is below the projection unit PU (projection optical system PL).
- the wafer stage WST moves to a position outside the projection unit PU, water is prevented from flowing out into the gap between the wafer W and the auxiliary plate during the movement due to the surface tension of the water.
- the water is held between the projection unit PU (the lens 42 of the projection optical system PL) and the auxiliary plate before the exposure. Exposure can be started without the need for time, and throughput can be improved accordingly.
- the resist is set by water pressure or the like as in the case of starting the supply of water on the wafer W. There is no risk that some of the birds will be removed.
- the air supply mechanism 86 (including the air supply nozzle) supplies liquid to hold water. Because the air around the drain unit 32 is being air-conditioned, when the water is collected by the above-mentioned recovery mechanism or auxiliary recovery mechanism, the water around the water held inside the Disturbance of the flow of gas (for example, air in the chamber in which the main body of the exposure apparatus is housed) is prevented, and thereby the turbulence of the flow of gas (fluctuations in the temperature of the gas, changes in the refractive index, etc. caused by this) is prevented. This prevents the measurement error of the wafer interferometer 18 from being caused by the above, and makes it possible to accurately measure the position of the wafer stage WST.
- the air supply mechanism 86 (including the air supply nozzle) supplies liquid to hold water.
- the exposure apparatus 100 of the present embodiment it is possible to transfer the pattern of the reticle R to each of the plurality of shot areas on the wafer W with extremely high accuracy by the various effects described above. In addition, exposure at a wider depth of focus than in air can be performed.
- each unit described in the first embodiment is merely an example, and the present invention is not limited to this.
- the main control device 20 moves the flow of water moving forward from the rear of the projection unit PU to the front in the movement direction of the wafer unit WST below the lens 42 during the movement of the wafer stage WST.
- the opening degree adjustment (including full closing and full opening) of each valve constituting the valve groups 62 a and 62 b was performed so as to occur, on the contrary, during the movement of the wafer stage WST, The opening degree of each of the valves constituting the valve groups 62 a and 62 b is adjusted so that the flow of water moving from the front to the rear of the projection unit PU in the moving direction is generated below the lens 42.
- the above-described auxiliary recovery mechanism recovers the residual liquid ahead of the projection unit PU (projection optical system P L) in the moving direction of the wafer W. That is, the residual liquid is recovered via the slit 32 h i located in front of the wafer moving direction and the auxiliary recovery pipe 6 O i (i is any one of 1 to 4) communicating therewith.
- the air conditioning mechanism 86 may be configured to include a suction mechanism that suctions fluid (liquid and gas). That is, a vacuum pump may be built in the air-conditioning mechanism 86, and the intake nozzle connected to the vacuum pump may be arranged near each of the above-described air supply nozzles.
- the vacuum pump as a suction mechanism may also serve to collect water that could not be completely collected by the above-described collection mechanism (leaked outside the liquid supply / drainage unit 32). good.
- water is supplied and collected during exposure of the wafer W. However, if water can be held by surface tension, supply and collection during exposure may not be performed.
- dry air or hot air is supplied from the air conditioning mechanism 86, and cannot be recovered by the recovery mechanism, but flows out of the 32 g of the peripheral wall, and the water remaining on the wafer W is dried to form a wafer. It may be removed from above.
- the fiducial mark plate FM is arranged on a part of the auxiliary plate.
- the focus position detection system (90a, A reference reflector used for the calibration in 90 b) may be arranged.
- the reflection plate and the reference mark plate may be used.
- the auxiliary plate is provided around the entire periphery of the wafer W, but may be provided partially at a necessary place or at predetermined intervals.
- the main controller 20 controls the water (liquid) supplied by the supply mechanism described above. It is also possible to stop both the supply operation of water and the water recovery operation by the above-mentioned recovery mechanism. Even in this case, the water inside the liquid supply / discharge unit 32 is maintained by the above-described negative pressure and the surface tension of the water. While the wafer stage WST is stopped, during the stepping operation between shots or during scanning exposure Since the need to replace water is lower than at times, the liquid supply operation by the supply mechanism and the liquid recovery operation by the recovery mechanism are performed at the same time (even while the wafer stage WST is moving and while it is stopped).
- Liquid usage can be reduced compared to when it is done.
- water supply and drainage may be continued to prevent contamination of the lower surface of the lens 42.
- the description is given on the assumption that the water supply position and the drainage position shown in FIGS. 8A and 8C are positions that are unrelated to the wafer exchange position (unload position and load position).
- the present invention is not limited to this.
- the water supply position may be the wafer load position
- the drain position may be the wafer unload position.
- water supply and drainage may be continued or stopped at the wafer unloading position and wafer loading position.
- the alignment position of the wafer and the unloading position are made to coincide with each other.
- the reference mark plate FM is positioned directly below the projection unit PU, and during the wafer alignment,
- the area of the wafer stage WST (more precisely, the auxiliary plate) may be set so that the tip of the projection unit PU always exists above any of the auxiliary plates 22a to 22d.
- the water can always be held below the lens 42, so that the above-described water supply and drainage can be continued even during the exposure operation of the step-and-scan method. You may go. In this case, it is possible to realize a continuous exposure operation for a plurality of wafers without once supplying water below the lens 42 and without completely draining water below the lens 42.
- the liquid supply / drain unit 32 having the peripheral wall 32 f is used in order to hold water below the lens 42 of the projection unit PU.
- the present invention is not limited to this. That is, for example, the liquid supply unit 32 may not be used. Even in such a case, since the distance (working distance) between the lens 42 of the projection optical system P and the wafer W is about 3 mm, the distance between the lens 42 and the wafer W is approximately 3 mm. This is because water is retained by surface tension. In this case, a mechanism similar to the liquid supply mechanism and the liquid recovery mechanism as disclosed in Patent Document 1 described above may be provided.
- the water supply / drainage valve and the nozzle of the liquid supply / drainage unit 32 are directly connected via a pipe, but a flexible tube is used as these pipes. Further, it is desirable to mechanically separate the valve and the tube connected to the factory piping from the main body of the exposure apparatus and the projection unit PU via a panel so that vibration is not transmitted. By doing so, it is possible to prevent vibrations and water hammer accompanying the opening and closing of the knurling from being transmitted and affecting the projection unit PU and the exposure apparatus main body and causing various errors.
- the liquid when performing multiple exposure, for example, double exposure, the liquid is filled between the projection unit PU (the lens 42 of the projection optical system PL) and the wafer W.
- the lens 4 The second pattern may be transferred to the plurality of shot areas on the wafer W while holding the liquid between the wafer 2 and the wafer W.
- reticle stage RST a stage of a so-called double reticle holder system capable of holding two reticles, for example, disclosed in Japanese Patent Application Laid-Open No. 2-166717.
- the projection unit PU projection optical system
- Double exposure can be performed without any problem while the liquid is filled between the system PL lens 42 2) and the wafer W.
- multiple exposure using an immersion method is applied, and high-resolution exposure with high resolution and a substantially large depth of focus is performed.
- the transfer of the second pattern is started, since the liquid is held between the lens 42 and the wafer W, the transfer of the second pattern should be started without waiting for the supply of the liquid. Is possible.
- the reticle alignment may be performed between the projection unit PU (the lens 42 of the projection optical system PL) and the reference mark plate FM while being filled with water.
- the main controller 20 as the adjusting device is configured to control the measurement results of the temperature sensors 38 A and 38 B (the temperature of the water between the projection optical system PL (lens 42) and the wafer W). Based on the actual measured values of the information, the aberration in the irradiation area of the illumination light IL on the wafer W, for example, the temperature change coefficient corresponding to the change of the best focus position was obtained. 20 may determine the above-mentioned temperature change coefficient based on the predicted value of the temperature information of the water between the projection optical system PL (lens 42) and the wafer W.
- information such as the measured transmittance of the reticle R and the reflectance of the wafer W are stored in the memory 21 in advance, and the output of the integrator sensor 14 and the transmittance of the reticle R during exposure are stored.
- a predetermined calculation is performed using the reflectance and the reflectance of the wafer W to obtain the heat absorption amount of the wafer, and the obtained heat absorption amount
- the temperature rise (temperature distribution) of the water in the irradiation area is predicted based on the information (flow rate and flow velocity) of the water flow under the lens 42 due to the water supply, drainage, and scanning operation. Then, main controller 20 can determine the temperature change coefficient based on the prediction result in the same manner as in the above embodiment.
- the main controller 20 uses the actual measured value of the temperature information of the water between the projection optical system PL (lens 42) and the wafer W and the value of the integrator sensor 14. A predicted value based on output or the like may be used at the same time.
- the main control device 20 obtains the temperature change coefficient and the pressure change coefficient, and obtains the best focus position in the irradiation area based on an expression including both of the coefficients as parameters. It was taken. Not limited to this, only one of the temperature change coefficient and the pressure change coefficient is obtained, and the other change coefficient is set to zero, and the best focus position in the irradiation area is obtained using the above equation. It may be. In this case, a temperature change coefficient, a pressure change coefficient, or the like may not be included as a parameter. For example, an equation for directly obtaining the best focus position from the temperature distribution or pressure distribution of water in the irradiation region may be used.
- the main controller 20 sets the focus condition detection system as an exposure condition based on the best focus positions of the one end point and the other end point in the scanning direction in the irradiation area obtained as described above.
- the focus and leveling of the wafer W are performed by adjusting the offset
- the present invention is not limited to this, and the reticle is determined based on the obtained best focus positions at one end and the other end in the scanning direction within the irradiation area.
- the pattern surface of R may be adjusted, or the image plane inclination of the projection optical system PL itself may be adjusted as the exposure condition via the imaging characteristic correction controller 81. If the image plane tilt cannot be completely corrected, based on the corrected image plane state, the offset adjustment of the focus position detection system and the forcing force leveling of the Ueno described in the above-described embodiment are performed. Control may be performed.
- water temperature change (temperature distribution) force focus detection system (90a, 90b) measurement If this is expected, focus-leveling control may be performed in consideration of measurement errors caused by water temperature changes (temperature distribution). , 38B, the detection result of the focus detection system (90a, 90b) is corrected, and the focus leveling control is performed based on the corrected detection result. good.
- the change in pressure (pressure distribution) of water is determined in advance by simulation or experiment, and the movement of the tilt stage 30 is controlled based on the result.
- a pressure sensor may be attached to the liquid supply / discharge unit, the pressure of water may be measured, and the movement of the tilt stage 30 may be controlled based on the result.
- the force-leveling control error is prevented from being caused by the change in water temperature or pressure.
- the wafer W is not changed by the change in water temperature or pressure. If various aberrations (spherical aberration, astigmatism, distortion, magnification, etc.) of the pattern image projected in the upper irradiation area fluctuate, changes in water temperature (temperature information) and pressure changes (pressure information) Based on the above, correction may be performed by adjusting the projection optical system PL, adjusting the wavelength of the illumination light IL, or moving the reticle R.
- FIGS. 11A to 11F a second embodiment of the present invention will be described with reference to FIGS. 11A to 11F.
- the same or equivalent components as those in the above-described first embodiment are denoted by the same reference numerals, and the description thereof will be simplified or omitted.
- the method of supplying and draining water through the liquid supply and discharge unit 32 by the main controller 20 is different from that of the first embodiment described above.
- the configuration is the same. Therefore, the following description focuses on the differences from the viewpoint of avoiding redundant description.
- a predetermined preparation work reticle alignment, baseline measurement of alignment detection system,
- the wafer replacement and the predetermined preparation are performed in the same manner as in the first embodiment, except that the water is not supplied onto the wafer W and the associated water is not collected (drained) at all. Work is performed.
- FIGS. 11A to 11F show a flow of water supply / drainage operation during scanning of the wafer stage WS for exposure to one shot area in the exposure apparatus according to the second embodiment.
- a water supply / drainage method according to the second embodiment will be described with reference to these drawings.
- the wafer stage WST is driven by the stage controller 19 under the instruction of the main controller 20 to expose the shot area SA on the wafer W (at this time, the reticle stage RST is Direction is driven at a speed corresponding to the projection magnification), so that the shot area SA to be exposed is on the wafer W to which the illumination light IL is irradiated via the projection area of the projection unit PU (the reticle R and the projection optical system PL).
- Main controller 20 operates such that water is supplied onto wafer W through supply pipe 58 on the rear side of projection unit PU in the movement direction (scanning direction) during movement of wafer stage WST. Adjust the opening of each valve constituting the water supply side valve group 62a.
- a gray area (WTR) indicates an area covered with water on the surface of the wafer W.
- the valves constituting the drain side (collection side) valve group 62b are set to the fully closed state.
- the state shown in FIG. 11B is a state immediately before the start of exposure to the shot area S A to be exposed.
- the portion of the shot area SA that passes through the projection area IA is always covered with water.
- Main controller 20 configures drain valve group 62b so as to collect the water covering the exposed portion at the time of (or before) in FIG. 11C. Adjust the opening of the valve.
- the valves constituting the valve group 62 a opened for water supply and the valves constituting the valve group 62 b provided at substantially symmetric positions with respect to the projection unit PU are opened.
- the wafer stage WS is driven by the stage controller 19 while exposing the SA and collecting the water covering the exposed portion, and as shown in FIG. Exposure to SA ends.
- the main control unit 20 fully closes the valves constituting the water supply valve group 62 a. Then, as shown in FIG. 11F, when all the water on the wafer W has been drained, the main control unit 20 fully closes each valve constituting the valve group 62b.
- the exposure operation for one shot area SA and the water supply / recovery operation that is, the water supply / drain operation performed in synchronization with the exposure operation are completed.
- the stage controller 19 performs an inter-shot stepping operation of the wafer stage WST in the same manner as in the first embodiment. However, no water is supplied onto the wafer W during the stepping operation between shots.
- each part is controlled by the main controller 20 so that the moving direction of the wafer W and the flowing direction of the water supplied onto the wafer are opposite to those in FIGS. 11A to 11E. Is done.
- the scanning exposure of the shot area on the wafer W and the stepping operation between the shot areas are repeatedly performed, and the circuit pattern of the reticle R is sequentially transferred to the shot areas as a plurality of partitioned areas on the wafer W. Is done.
- the exposure unit including the projection unit PU (the lens 42 of the projection optical system PL) and the wafer W on the wafer stage WST by the above-described supply mechanism are included.
- the supply of water to the inside of the peripheral wall 32 f and the recovery of water by the above-described recovery mechanism are performed in synchronization with the exposure operation for each shot area on the wafer W. For this reason, scanning is performed on the shot area to be exposed on the wafer W. 3 015675
- the supply mechanism has a plurality of supply ports 36 around the irradiation area IA, and supplies the supply ports 36 used for supplying water in the scanning direction of the wafer W ( (Moving direction). Specifically, each time a shot area is exposed, water is supplied from the supply mechanism from the rear side in the scanning direction of the wafer W, and accordingly, water is supplied from the collection mechanism on the front side in the scanning direction. All collections are taking place. Therefore, regardless of the scanning direction, the immersion method is applied when exposing any shot area.
- the water supplied from the rear side in the scanning direction of the wafer W to the inside of the peripheral wall 32,000 by the above-mentioned supply mechanism is collected by the above-mentioned recovery mechanism in front of the projection unit PU in the scanning direction.
- the supplied water flows between the lens 42 and the wafer W along the scanning direction of the wafer W. Therefore, if foreign matter is attached to the wafer W, the foreign matter is removed by the flow of water.
- bubbles mixed into the supplied water are also separated from the projection unit PU in the scanning direction of the wafer with respect to the projection unit PU by the above-described bubble collection mechanism, similarly to the first embodiment. Collected behind. In this case, the wafer W When the scanning direction is switched, the bubble collection mechanism used for collecting bubbles is switched accordingly.
- the exposure apparatus of the second embodiment when transferring the pattern, when the rear end of the shot area to be exposed comes out of the irradiation area IA due to the movement of the wafer stage in the scanning direction, water is supplied by the supply mechanism. The supply is stopped. For this reason, it is possible to effectively suppress the occurrence of vibration due to the driving of the valve and the accompanying water hammer, which is transmitted to the projection unit PU, and the imaging performance of the projection optical system PL is degraded. In addition, water supply can be minimized to shorten the time required for water recovery.
- the exposure apparatus of the second embodiment after the transfer of the pattern to the shot area to be exposed, before the start of the inter-shot stepping operation of the wafer stage WST performed prior to the transfer of the pattern to the next shot area. Recovery of water by the recovery mechanism has been completed. Therefore, the components of the photosensitive agent (resist) on the wafer W do not dissolve into the water and do not adversely affect the exposure of the next shot area. Also, the water supply and recovery mechanism in the stepping direction can be omitted.
- the present invention is not limited to this.
- water supply by the supply mechanism starts at some point until the front end in the scanning direction of the shot area to be exposed reaches the supply position. It is good to be done.
- the moving direction (scanning direction) of the wafer W is set inside the peripheral wall 32 f including the space between the projection unit PU (the lens 42 of the projection optical system PL) and the wafer W on the wafer stage WST by the supply mechanism.
- Water is supplied from the rear side of the lens, and water is filled between the lens 42 and the wafer W when the wafer W is moved.
- the shot area S to be exposed on the wafer W When A moves below the lens 42, water is surely supplied above the shot area SA before reaching below the lens 42. That is, when the wafer W is moved in the scanning direction, the space between the lens 42 and the surface of the wafer W is filled with water.
- the above-described liquid immersion method is applied, and the resolution is wider than that in air. Exposure at the depth of focus is performed.
- the lower end of the liquid supply / discharge unit 32 is provided with a plurality of supply ports 36 spaced apart in the non-scanning direction (the pattern projection area (irradiation area)).
- a plurality of partitions 87a and 87b extending parallel to the scanning direction may be provided at positions on both sides in the non-scanning direction of (area corresponding to the range of the IA in the non-scanning direction).
- one recovery pipe 52 is arranged corresponding to the supply port 36 in each area partitioned by one of the supply ports 36 and one of the partitions 87a and 87b.
- the main controller 20 switches the supply port 36 used for supplying water by the above-described supply mechanism according to the position of the shot area to be exposed on the wafer, and in response to this, collects water.
- the used recovery pipe 52 may be switched.
- the switching of the supply port 36 and the recovery pipe 52 is realized by the selective opening and closing of the valves of the valve groups 62a and 62b.
- chipped shots some of which are chipped, and in such chipped shots, the non-scanning direction as shown in the shot area SArichin FIG.
- Some shot areas are shorter in size than other shot areas (internal shot areas on wafer W), because the position and shot shape (including size) of the wafer soil of this missing shot SA n are known.
- the main controller 20 supplies water, for example, from a supply port 36 Q indicated by a sword in FIG. 12 and collects water by a collection pipe 52 Q indicated by a mark.
- the opening and closing of each valve of the valve groups 62 a and 62 b may be controlled.
- water supply and drainage is performed in the chipped portion of the shot area SA n.
- the auxiliary plates 22a to 22d of the wafer holder 70 cannot be increased as a result. Even in this case, it is possible to minimize the occurrence of water leakage during exposure to the missing shot.
- main controller 20 sets supply port 36 used for supplying water by the above-described supply mechanism according to the size of the shot area in the non-scanning direction, not the position of the shot area to be exposed on the wafer. It is good also as switching, and the recovery pipe 52 used for water recovery is switched accordingly. In such a case, even when patterns of different sizes are transferred onto the same or different wafers, it is possible to cope with such a case.
- the present invention is not limited to this, and for example, it is also possible to adopt a sequence as shown in FIGS. 1338 to 13F.
- FIGS. 13A to 13C are performed in the same manner as in FIGS. 11A to 11C described above.
- main controller 20 fully closes valve group 62a, and thereafter does not supply any water until the end of exposure. I have to do that.
- the range of water supply is narrower than in the case of Figs. 11A to 11F described above, and the time until drainage can be shortened (Fig. 13E, See Figure 13F).
- the shot area SA After the transfer of the pattern, the water collection by the collecting mechanism is completed before the start of the inter-shot stepping operation of the wafer stage WST, which is performed prior to the transfer of the pattern to the next shot area (see Fig. 13F) ).
- liquid supply / discharge unit is not limited to the configuration described in each of the above embodiments, and various configurations can be adopted.
- tapered nozzle unit constitutes a recovery mechanism for recovering the water recovery pipe 5 2
- a tapered nozzle portion and a collection pipe 52 are provided around the lens 42 around the lens 42, and a divergent nozzle portion, a supply port 36, and a supply pipe 58 are provided outside the lens.
- the water supply pipe 58 on the left side connects to the supply port 3.
- Water is supplied through the nozzle 6 and the divergent nozzle, and a part of the supplied water is discharged by the tapered nozzle on the left of the lens 42 and the collection pipe 52, and the air bubbles mixed with the water are discharged. Suppress air bubbles from passing under the lens 42.
- water that has passed under the lens 42 is collected by the tapered nozzle portion on the right side of the lens 42 and the collection pipe 52.
- the above-described tapered nozzle portion, collection pipe, divergent nozzle portion, supply port 36 and supply pipe 58 need not necessarily be provided around the lens 42 as a whole, for example, One each may be provided on one side and the other side in the scanning direction. In this regard, the same applies to the liquid supply / discharge unit 32 described above.
- the recovery and collection may be performed through the water supply / drainage nozzle 52 '.
- water may be supplied from a water supply / drainage nozzle located rearward in the scanning direction, and water may be collected from a water supply / drainage nozzle located forward in the scanning direction.
- the air bubbles mixed in the water gather near the ceiling on the front side in the scanning direction of the lens 42 inside the liquid supply / drainage unit 3 2 ", the scanning direction is reversed, and the water supply and drain nozzles are cut off. When it is changed, it is discharged from the water supply / drain nozzle on the drain side.
- a hole is formed in a portion of the lens 42 that is the closest to the wafer W and that is not used for exposure as shown in FIG.
- the supply of the liquid by the supply mechanism, the collection of the liquid by the collection mechanism, or the operation of collecting bubbles in the liquid may be performed through the holes.
- the liquid is collected through a hole formed in the lens 42. This makes it possible to save space compared to a case where the supply mechanism and the recovery mechanism are all arranged outside the projection optical system.
- ultrapure water water
- a liquid which is chemically stable and has a high transmittance of the illumination light IL and which is safe for example, a fluorine-based inert liquid
- a fluorine-based inert liquid may be used as the liquid.
- the fluorinated inert liquid for example, Fluorinert (trade name of Three America, Inc.) can be used. This fluorine-based inert liquid is also excellent in the cooling effect.
- a liquid that has a high refractive index as much as possible because it is transparent to the illumination light IL and that is stable against the projection optical system and the photoresist applied to the wafer surface should be used.
- the collected liquid may be reused.
- a filter for removing impurities from the collected liquid should be provided in the liquid recovery device or the recovery pipe. Is desirable.
- the optical element closest to the image plane of the projection optical system PL is a lens.
- the optical element is not limited to a lens, but an optical plate (parallel) used to adjust the optical characteristics of the projection optical system PL, for example, aberrations (spherical aberration, coma, etc.). (A flat plate, etc.) or a simple cover glass.
- the optical element closest to the image plane side of the projection optical system PL (the lens 42 in each of the above-mentioned embodiments) is a liquid element due to scattered particles generated from the resist by the irradiation of the illumination light IL or adhesion of impurities in the liquid.
- water the surface of which may be soiled. Therefore, the optical element may be fixed to the lowermost part of the lens barrel 40 so that it can be freely attached and detached (replaced), and may be replaced periodically.
- the optical element that comes into contact with the liquid is the lens 42, the cost of the replacement part is high and the time required for replacement is long, so that the maintenance cost (running cost) increases and the throughput decreases. Invite. Therefore, the optical element that comes into contact with the liquid may be, for example, a parallel flat plate that is less expensive than the lens 42.
- the range in which the liquid (water) flows may be set so as to cover the entire projection area of the reticle pattern image (irradiation area of the illumination light IL), and the size is arbitrary. However, in controlling the flow velocity, flow rate, etc., it is desirable to make it slightly larger than the irradiation area and make the range as small as possible.
- the auxiliary plates 22 a to 22 d are provided around the region of the wafer holder 70 on which the wafer W is placed. , An auxiliary plate or a flat plate having the same function Some of them need not necessarily be provided on the substrate stage.
- the exposure apparatus that locally fills the space between the projection optical system PL and the wafer W with a liquid is employed.
- an ArF excimer laser is used as a light source.
- an ultraviolet light source such as a KrF excimer laser (output wavelength: 248 nm) may be used.
- the laser light output from each of the above light sources as ultraviolet light, but also a single-wavelength laser light in the infrared or visible range oscillated from a DFB semiconductor laser or a fiber laser, for example, erbium (Er)
- Fiber (or both erbium and ytterbium (Yb)) is amplified by a single-amplifier fiber and converted to ultraviolet light using a nonlinear optical crystal, using harmonics (for example, wavelength 193 nm). Is also good.
- the projection optical system PL is not limited to a refraction system, but may be a catadioptric system (a catadioptric system). Further, the projection magnification is not limited to 14 times, 15 times, or the like, and may be 110 times or the like.
- the present invention can be suitably applied to a step-and-repeat type reduction projection exposure apparatus.
- a configuration basically similar to that of the first embodiment described above can be used. of The effect can be obtained.
- the present invention can be applied to a twin-stage type exposure apparatus having two wafer stages.
- the illumination optical system composed of a plurality of lenses and the projection unit PU are incorporated in the exposure apparatus body, and the liquid supply / drain unit is attached to the projection unit PU.
- the reticle stage and wafer stage consisting of many mechanical parts are attached to the exposure apparatus main body, wiring and piping are connected, and overall adjustment (electrical adjustment, operation confirmation, etc.) is performed.
- the exposure apparatus of each embodiment can be manufactured. It is desirable that the exposure apparatus be manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
- the present invention is not limited to this.
- a liquid crystal for transferring a liquid crystal display element pattern to a square glass plate for example, for a liquid crystal for transferring a liquid crystal display element pattern to a square glass plate.
- the present invention can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, an imaging device, a micromachine, an organic EL, a DNA chip, and the like.
- glass substrates or silicon wafers are used to manufacture reticles or masks used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc.
- the present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a substrate.
- a transmission type reticle is generally used, and a reticle substrate is made of quartz glass, fluorine-doped quartz glass, or fluorite. , Magnesium fluoride, quartz, or the like is used.
- FIG. 16 shows a flowchart of an example of manufacturing devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). ing.
- a function of the device and a performance design for example, a circuit design of a semiconductor device
- a pattern for realizing the function is performed.
- step 202 mask manufacturing step
- step 203 wafer manufacturing step
- a wafer is manufactured using a material such as silicon.
- step 204 wafer processing step
- step 204 wafer processing step
- step 205 device assembling step
- step 205 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.
- step 206 inspection step
- inspections such as an operation confirmation test and a durability test of the device created in step 205 are performed. After these steps, the device is completed and shipped.
- FIG. 17 shows a detailed flow example of step 204 in the semiconductor device.
- step 2 11 oxidation step
- step 2 12 CVD step
- step 2 13 electrode formation step
- step 2 14 ion implantation step
- steps 211 to 214 constitutes a pre-processing step in each stage of wafer processing, and is selected and executed according to a necessary process in each stage.
- Step 2 In 15 resist formation step
- step 2 16 exposure step
- step 217 development step
- Step 218 etching step
- the exposure apparatus of the above embodiment is used in the exposure step (Step 2 16), so that the reticle pattern can be transferred onto the wafer with high accuracy. .
- the productivity including yield
- the exposure apparatus of the present invention is suitable for transferring a pattern onto a plate. Further, the device manufacturing method of the present invention is suitable for producing micro devices.
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Abstract
Description
Claims
Priority Applications (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004558437A JP4362867B2 (ja) | 2002-12-10 | 2003-12-08 | 露光装置及びデバイス製造方法 |
KR1020137000412A KR20130010039A (ko) | 2002-12-10 | 2003-12-08 | 노광 장치 및 디바이스 제조 방법 |
EP03777352A EP1571697A4 (en) | 2002-12-10 | 2003-12-08 | EXPOSURE SYSTEM AND DEVICE PRODUCTION METHOD |
AU2003289239A AU2003289239A1 (en) | 2002-12-10 | 2003-12-08 | Exposure system and device producing method |
US11/147,285 US8004650B2 (en) | 2002-12-10 | 2005-06-08 | Exposure apparatus and device manufacturing method |
US11/338,826 US7446851B2 (en) | 2002-12-10 | 2006-01-25 | Exposure apparatus and device manufacturing method |
US11/339,505 US7436486B2 (en) | 2002-12-10 | 2006-01-26 | Exposure apparatus and device manufacturing method |
US11/356,000 US20060164615A1 (en) | 2002-12-10 | 2006-02-17 | Exposure apparatus and device manufacturing method |
US11/655,083 US7639343B2 (en) | 2002-12-10 | 2007-01-19 | Exposure apparatus and device manufacturing method |
US11/656,550 US7505111B2 (en) | 2002-12-10 | 2007-01-23 | Exposure apparatus and device manufacturing method |
US11/822,807 US8294876B2 (en) | 2002-12-10 | 2007-07-10 | Exposure apparatus and device manufacturing method |
US11/878,076 US7589821B2 (en) | 2002-12-10 | 2007-07-20 | Exposure apparatus and device manufacturing method |
US12/010,824 US7911582B2 (en) | 2002-12-10 | 2008-01-30 | Exposure apparatus and device manufacturing method |
US12/230,988 US20090015807A1 (en) | 2002-12-10 | 2008-09-09 | Exposure apparatus and device manufacturing method |
US12/926,278 US20110051106A1 (en) | 2002-12-10 | 2010-11-05 | Exposure apparatus and device manufacturing method |
US13/137,121 US20110279794A1 (en) | 2002-12-10 | 2011-07-21 | Exposure apparatus and device manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002358556 | 2002-12-10 | ||
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US7868998B2 (en) | 2003-10-28 | 2011-01-11 | Asml Netherlands B.V. | Lithographic apparatus |
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US7898642B2 (en) | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7898643B2 (en) | 2003-06-27 | 2011-03-01 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
US7907254B2 (en) | 2003-02-26 | 2011-03-15 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US7907255B2 (en) | 2003-08-29 | 2011-03-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7924402B2 (en) * | 2003-09-19 | 2011-04-12 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7929110B2 (en) | 2003-04-10 | 2011-04-19 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
JP2011086968A (ja) * | 2011-01-31 | 2011-04-28 | Nikon Corp | 露光装置及びデバイス製造方法 |
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US7969548B2 (en) | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
US7993008B2 (en) | 2003-08-26 | 2011-08-09 | Nikon Corporation | Optical element and exposure apparatus |
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US8004652B2 (en) | 2004-10-18 | 2011-08-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8023106B2 (en) | 2007-08-24 | 2011-09-20 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US8040491B2 (en) | 2003-06-13 | 2011-10-18 | Nikon Corporation | Exposure method, substrate stage, exposure apparatus, and device manufacturing method |
US8045137B2 (en) | 2004-12-07 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8045134B2 (en) | 2006-03-13 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
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US8045136B2 (en) | 2004-02-02 | 2011-10-25 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
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US8054445B2 (en) | 2005-08-16 | 2011-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8072576B2 (en) | 2003-05-23 | 2011-12-06 | Nikon Corporation | Exposure apparatus and method for producing device |
JP2011258999A (ja) * | 2005-01-31 | 2011-12-22 | Nikon Corp | 露光装置及びデバイス製造方法 |
US8085381B2 (en) | 2003-04-11 | 2011-12-27 | Nikon Corporation | Cleanup method for optics in immersion lithography using sonic device |
US8089610B2 (en) | 2003-04-10 | 2012-01-03 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US8089616B2 (en) | 2007-07-13 | 2012-01-03 | Nikon Corporation | Pattern forming method and apparatus, exposure method and apparatus, and device manufacturing method and device |
US8102502B2 (en) | 2003-10-28 | 2012-01-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8111373B2 (en) | 2004-03-25 | 2012-02-07 | Nikon Corporation | Exposure apparatus and device fabrication method |
US8125610B2 (en) | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
JP4888388B2 (ja) * | 2005-03-31 | 2012-02-29 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
US8149381B2 (en) | 2003-08-26 | 2012-04-03 | Nikon Corporation | Optical element and exposure apparatus |
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US8164736B2 (en) | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US8164734B2 (en) | 2004-06-16 | 2012-04-24 | Asml Netherlands B.V. | Vacuum system for immersion photolithography |
US8194232B2 (en) | 2007-07-24 | 2012-06-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method |
US8203693B2 (en) | 2005-04-19 | 2012-06-19 | Asml Netherlands B.V. | Liquid immersion lithography system comprising a tilted showerhead relative to a substrate |
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US8208124B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8218125B2 (en) | 2003-07-28 | 2012-07-10 | Asml Netherlands B.V. | Immersion lithographic apparatus with a projection system having an isolated or movable part |
JP2012134553A (ja) * | 2004-02-03 | 2012-07-12 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2012134554A (ja) * | 2004-09-17 | 2012-07-12 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2012134557A (ja) * | 2005-04-28 | 2012-07-12 | Nikon Corp | 露光方法及び露光装置、並びにデバイス製造方法 |
US8237919B2 (en) | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
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US8264669B2 (en) | 2007-07-24 | 2012-09-11 | Nikon Corporation | Movable body drive method, pattern formation method, exposure method, and device manufacturing method for maintaining position coordinate before and after switching encoder head |
JP2013016876A (ja) * | 2012-10-26 | 2013-01-24 | Nikon Corp | 露光装置、露光方法、及びデバイス製造方法 |
US8373843B2 (en) | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
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US8390780B2 (en) | 2006-06-09 | 2013-03-05 | Nikon Corporation | Movable-body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8400614B2 (en) | 2005-12-28 | 2013-03-19 | Nikon Corporation | Pattern formation method and pattern formation apparatus, exposure method and exposure apparatus, and device manufacturing method |
US8421994B2 (en) | 2007-09-27 | 2013-04-16 | Nikon Corporation | Exposure apparatus |
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US8462317B2 (en) | 2007-10-16 | 2013-06-11 | Nikon Corporation | Illumination optical system, exposure apparatus, and device manufacturing method |
US8482716B2 (en) | 2004-06-10 | 2013-07-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8488099B2 (en) | 2004-04-19 | 2013-07-16 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8508713B2 (en) * | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8520187B2 (en) | 2003-09-03 | 2013-08-27 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
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US8547519B2 (en) | 2003-11-14 | 2013-10-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8547527B2 (en) | 2007-07-24 | 2013-10-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method |
US20130271945A1 (en) | 2004-02-06 | 2013-10-17 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
US8634053B2 (en) | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2014027320A (ja) * | 2008-12-29 | 2014-02-06 | Nikon Corp | 露光装置、及びデバイス製造方法 |
US8654305B2 (en) | 2007-02-15 | 2014-02-18 | Asml Holding N.V. | Systems and methods for insitu lens cleaning in immersion lithography |
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US8705008B2 (en) | 2004-06-09 | 2014-04-22 | Nikon Corporation | Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate |
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US8749762B2 (en) | 2004-05-11 | 2014-06-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2014104107A1 (ja) * | 2012-12-27 | 2014-07-03 | 株式会社ニコン | 露光装置、露光方法、デバイス製造方法、プログラム、及び記録媒体 |
JP2014132357A (ja) * | 2006-09-07 | 2014-07-17 | Leica Microsystems Cms Gmbh | 液浸対物レンズ、液浸膜を形成する装置及び方法 |
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US20140307238A1 (en) * | 2005-01-31 | 2014-10-16 | Nikon Corporation | Exposure apparatus and method for producing device |
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JP2015212827A (ja) * | 2005-03-23 | 2015-11-26 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
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US9304412B2 (en) | 2007-08-24 | 2016-04-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method |
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US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
JP2018055111A (ja) * | 2006-05-09 | 2018-04-05 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学結像装置 |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
Families Citing this family (115)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7997288B2 (en) | 2002-09-30 | 2011-08-16 | Lam Research Corporation | Single phase proximity head having a controlled meniscus for treating a substrate |
EP1420299B1 (en) | 2002-11-12 | 2011-01-05 | ASML Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method |
EP1429188B1 (en) * | 2002-11-12 | 2013-06-19 | ASML Netherlands B.V. | Lithographic projection apparatus |
WO2004053955A1 (ja) | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
CN1316482C (zh) | 2002-12-19 | 2007-05-16 | 皇家飞利浦电子股份有限公司 | 照射层上斑点的方法和装置 |
KR101345474B1 (ko) * | 2003-03-25 | 2013-12-27 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
JP4582089B2 (ja) | 2003-04-11 | 2010-11-17 | 株式会社ニコン | 液浸リソグラフィ用の液体噴射回収システム |
JP4025683B2 (ja) * | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | パターン形成方法及び露光装置 |
CN100541717C (zh) | 2003-05-28 | 2009-09-16 | 株式会社尼康 | 曝光方法、曝光装置以及器件制造方法 |
US7675000B2 (en) | 2003-06-24 | 2010-03-09 | Lam Research Corporation | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology |
EP1667210A4 (en) * | 2003-09-03 | 2008-11-05 | Nikon Corp | EXPOSURE DEVICE AND COMPONENTS MANUFACTURING METHOD |
JP2005150533A (ja) * | 2003-11-18 | 2005-06-09 | Canon Inc | 露光装置 |
KR101119813B1 (ko) | 2003-12-15 | 2012-03-06 | 가부시키가이샤 니콘 | 스테이지 장치, 노광 장치, 및 노광 방법 |
JP2005191393A (ja) * | 2003-12-26 | 2005-07-14 | Canon Inc | 露光方法及び装置 |
US20050153424A1 (en) * | 2004-01-08 | 2005-07-14 | Derek Coon | Fluid barrier with transparent areas for immersion lithography |
JP5076497B2 (ja) * | 2004-02-20 | 2012-11-21 | 株式会社ニコン | 露光装置、液体の供給方法及び回収方法、露光方法、並びにデバイス製造方法 |
JPWO2005096354A1 (ja) * | 2004-03-30 | 2008-02-21 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法、並びに面形状検出装置 |
EP1768169B9 (en) * | 2004-06-04 | 2013-03-06 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US20070103661A1 (en) * | 2004-06-04 | 2007-05-10 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
KR101261063B1 (ko) * | 2004-11-25 | 2013-05-06 | 가부시키가이샤 니콘 | 이동체 시스템, 노광 장치 및 디바이스 제조 방법 |
US20080192222A1 (en) * | 2004-12-02 | 2008-08-14 | Nikon Corporation | Exposure Apparatus, Exposure Method, and Device Manufacturing Method |
JP4752473B2 (ja) | 2004-12-09 | 2011-08-17 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
TW200644079A (en) * | 2005-03-31 | 2006-12-16 | Nikon Corp | Exposure apparatus, exposure method, and device production method |
WO2006107549A1 (en) | 2005-04-01 | 2006-10-12 | Fsi International, Inc. | Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluids |
US20080186466A1 (en) * | 2005-04-12 | 2008-08-07 | Sirat Gabriel Y | Element for defocusing tm mode for lithography |
EP1881520A4 (en) * | 2005-05-12 | 2010-06-02 | Nikon Corp | OPTICAL PROJECTION SYSTEM, EXPOSURE DEVICE, AND EXPOSURE METHOD |
US7583358B2 (en) * | 2005-07-25 | 2009-09-01 | Micron Technology, Inc. | Systems and methods for retrieving residual liquid during immersion lens photolithography |
EP1918983A4 (en) * | 2005-08-05 | 2010-03-31 | Nikon Corp | STAGE EQUIPMENT AND EXPOSURE DEVICE |
US7456928B2 (en) * | 2005-08-29 | 2008-11-25 | Micron Technology, Inc. | Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography |
JP2007096050A (ja) * | 2005-09-29 | 2007-04-12 | Canon Inc | 露光装置 |
JP4125315B2 (ja) * | 2005-10-11 | 2008-07-30 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
JP4735186B2 (ja) | 2005-10-21 | 2011-07-27 | 株式会社ニコン | 液浸顕微鏡装置 |
CN1963675B (zh) * | 2005-11-11 | 2012-12-05 | 台湾积体电路制造股份有限公司 | 浸没式微影设备及制程 |
KR20080071552A (ko) * | 2005-12-06 | 2008-08-04 | 가부시키가이샤 니콘 | 노광 방법, 노광 장치 및 디바이스 제조 방법 |
US8472004B2 (en) * | 2006-01-18 | 2013-06-25 | Micron Technology, Inc. | Immersion photolithography scanner |
JP4889331B2 (ja) * | 2006-03-22 | 2012-03-07 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
CN100590173C (zh) * | 2006-03-24 | 2010-02-17 | 北京有色金属研究总院 | 一种荧光粉及其制造方法和所制成的电光源 |
CN101907733B (zh) * | 2006-04-03 | 2013-06-19 | 株式会社尼康 | 对浸没液体为疏溶的入射表面和光学窗 |
WO2007129753A1 (ja) | 2006-05-10 | 2007-11-15 | Nikon Corporation | 露光装置及びデバイス製造方法 |
US7928366B2 (en) | 2006-10-06 | 2011-04-19 | Lam Research Corporation | Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access |
WO2008008154A2 (en) | 2006-07-07 | 2008-01-17 | Fsi International, Inc. | Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids |
US7443483B2 (en) * | 2006-08-11 | 2008-10-28 | Entegris, Inc. | Systems and methods for fluid flow control in an immersion lithography system |
US8813764B2 (en) | 2009-05-29 | 2014-08-26 | Lam Research Corporation | Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer |
US8330936B2 (en) * | 2006-09-20 | 2012-12-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4357514B2 (ja) * | 2006-09-29 | 2009-11-04 | 株式会社東芝 | 液浸露光方法 |
US8208116B2 (en) * | 2006-11-03 | 2012-06-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion lithography system using a sealed wafer bath |
US8253922B2 (en) | 2006-11-03 | 2012-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion lithography system using a sealed wafer bath |
US8146902B2 (en) | 2006-12-21 | 2012-04-03 | Lam Research Corporation | Hybrid composite wafer carrier for wet clean equipment |
US9529275B2 (en) * | 2007-02-21 | 2016-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography scanner throughput |
US7684011B2 (en) * | 2007-03-02 | 2010-03-23 | Asml Netherlands B.V. | Calibration method for a lithographic apparatus |
US8237911B2 (en) | 2007-03-15 | 2012-08-07 | Nikon Corporation | Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine |
US7975708B2 (en) | 2007-03-30 | 2011-07-12 | Lam Research Corporation | Proximity head with angled vacuum conduit system, apparatus and method |
US8464736B1 (en) | 2007-03-30 | 2013-06-18 | Lam Research Corporation | Reclaim chemistry |
US7948616B2 (en) * | 2007-04-12 | 2011-05-24 | Nikon Corporation | Measurement method, exposure method and device manufacturing method |
US20080304025A1 (en) * | 2007-06-08 | 2008-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for immersion lithography |
US8141566B2 (en) | 2007-06-19 | 2012-03-27 | Lam Research Corporation | System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
JP4922858B2 (ja) * | 2007-07-30 | 2012-04-25 | 株式会社東芝 | パターン形成方法及び洗浄装置 |
US7708289B2 (en) * | 2007-09-07 | 2010-05-04 | Jaime Sr Richard A | Removable tubular variable lighting system for a skateboard |
US9013681B2 (en) * | 2007-11-06 | 2015-04-21 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
US9256140B2 (en) * | 2007-11-07 | 2016-02-09 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction |
US8665455B2 (en) * | 2007-11-08 | 2014-03-04 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
US8422015B2 (en) | 2007-11-09 | 2013-04-16 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
US8385950B1 (en) | 2007-11-09 | 2013-02-26 | Google Inc. | Capturing and automatically uploading media content |
US8115906B2 (en) | 2007-12-14 | 2012-02-14 | Nikon Corporation | Movable body system, pattern formation apparatus, exposure apparatus and measurement device, and device manufacturing method |
NL1036273A1 (nl) * | 2007-12-18 | 2009-06-19 | Asml Netherlands Bv | Lithographic apparatus and method of cleaning a surface of an immersion lithographic apparatus. |
US8151619B2 (en) * | 2008-02-04 | 2012-04-10 | Standard Lifters, Inc. | Guided keeper assembly and method for metal forming dies |
KR20100135215A (ko) * | 2008-04-30 | 2010-12-24 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법과, 디바이스 제조 방법 |
EP2284865B1 (en) | 2008-04-30 | 2015-09-02 | Nikon Corporation | Stage apparatus, patterning apparatus, exposure apparatus, stage drive apparatus, exposure method, and device fabrication method |
KR101690047B1 (ko) | 2008-05-09 | 2016-12-27 | 티이엘 에프에스아이, 인코포레이티드 | 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 장치 및 방법 |
US8817236B2 (en) | 2008-05-13 | 2014-08-26 | Nikon Corporation | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
JP2010098172A (ja) * | 2008-10-17 | 2010-04-30 | Canon Inc | 液体回収装置、露光装置及びデバイス製造方法 |
NL2003333A (en) * | 2008-10-23 | 2010-04-26 | Asml Netherlands Bv | Fluid handling structure, lithographic apparatus and device manufacturing method. |
JP5215812B2 (ja) * | 2008-10-29 | 2013-06-19 | キヤノン株式会社 | 照明条件の決定方法、プログラム、露光方法及びデバイス製造方法 |
US8599359B2 (en) | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8760629B2 (en) | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
US8902402B2 (en) | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US20100196832A1 (en) | 2009-01-30 | 2010-08-05 | Nikon Corporation | Exposure apparatus, exposing method, liquid immersion member and device fabricating method |
US20100195083A1 (en) * | 2009-02-03 | 2010-08-05 | Wkk Distribution, Ltd. | Automatic substrate transport system |
US8659746B2 (en) | 2009-03-04 | 2014-02-25 | Nikon Corporation | Movable body apparatus, exposure apparatus and device manufacturing method |
TW201100975A (en) * | 2009-04-21 | 2011-01-01 | Nikon Corp | Moving-object apparatus, exposure apparatus, exposure method, and device manufacturing method |
TW201115280A (en) * | 2009-05-15 | 2011-05-01 | Nikon Corp | Exposure apparatus and device manufacturing method |
US20100323303A1 (en) * | 2009-05-15 | 2010-12-23 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, and device fabricating method |
US8294878B2 (en) | 2009-06-19 | 2012-10-23 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8355114B2 (en) * | 2009-06-19 | 2013-01-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US20110008734A1 (en) * | 2009-06-19 | 2011-01-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8472008B2 (en) * | 2009-06-19 | 2013-06-25 | Nikon Corporation | Movable body apparatus, exposure apparatus and device manufacturing method |
US8446569B2 (en) | 2009-06-19 | 2013-05-21 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
US8355116B2 (en) * | 2009-06-19 | 2013-01-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8488109B2 (en) | 2009-08-25 | 2013-07-16 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8514395B2 (en) | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8493547B2 (en) | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
NL2005322A (en) | 2009-09-11 | 2011-03-14 | Asml Netherlands Bv | A shutter member, a lithographic apparatus and device manufacturing method. |
US8508919B2 (en) | 2009-09-14 | 2013-08-13 | Microsoft Corporation | Separation of electrical and optical components |
WO2011052703A1 (en) | 2009-10-30 | 2011-05-05 | Nikon Corporation | Exposure apparatus and device manufacturing method |
NL2005528A (en) * | 2009-12-02 | 2011-06-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
US20110134400A1 (en) * | 2009-12-04 | 2011-06-09 | Nikon Corporation | Exposure apparatus, liquid immersion member, and device manufacturing method |
JP6394967B2 (ja) | 2012-10-02 | 2018-09-26 | 株式会社ニコン | 移動体装置、露光装置、及びデバイス製造方法 |
US9678433B2 (en) | 2012-10-02 | 2017-06-13 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method |
US20160336101A1 (en) | 2013-09-04 | 2016-11-17 | Ckd Corporation | Armature coil for electromagnetic actuator, electromagnetic actuator, exposure apparatus, and device manufacturing method |
KR20150085224A (ko) * | 2014-01-15 | 2015-07-23 | 코닝정밀소재 주식회사 | 기판의 에지부 검사장치 |
DE102014104028B4 (de) * | 2014-03-24 | 2016-02-18 | Sick Ag | Optoelektronische Vorrichtung und Verfahren zum Justieren |
DE112014005277T5 (de) * | 2014-06-12 | 2016-10-06 | Fuji Electric Co., Ltd. | Vorrichtung zum Einbringen von Verunreinigungen, Verfahren zum Einbringen von Verunreinigungen und Verfahren zur Herstellung eines Halbleiterelements |
JP2017520792A (ja) * | 2014-07-01 | 2017-07-27 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びリソグラフィ装置を製造する方法 |
JP6537194B2 (ja) * | 2014-07-04 | 2019-07-03 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びリソグラフィ装置を用いてデバイスを製造する方法 |
JP6344623B2 (ja) | 2014-12-24 | 2018-06-20 | 株式会社ニコン | 移動体の制御方法、露光方法、デバイス製造方法、移動体装置、及び露光装置 |
EP3239776B1 (en) | 2014-12-24 | 2021-07-07 | Nikon Corporation | Measurement device and measurement method, exposure device and exposure method, and device production method |
JP6631871B2 (ja) * | 2015-08-31 | 2020-01-15 | 株式会社リコー | 光加工装置 |
JP6399037B2 (ja) * | 2016-05-18 | 2018-10-03 | 横河電機株式会社 | 対物レンズユニット及び液浸顕微鏡 |
DE102017217389A1 (de) | 2017-09-29 | 2019-04-04 | Carl Zeiss Microscopy Gmbh | Optische Linse zur Verwendung in einer Medienzuführungsvorrichtung sowie Objektiv, Medienzuführungsvorrichtung und Mikroskop |
KR102075714B1 (ko) | 2018-08-01 | 2020-02-10 | (주)메드로메디칼디비젼 | 고주파를 이용한 여드름제거용 핸드피스 |
KR102168432B1 (ko) | 2018-08-31 | 2020-10-21 | (주)메드로메디칼디비젼 | 고주파를 이용한 여드름제거용 핸드피스 |
KR102168435B1 (ko) | 2018-08-31 | 2020-10-21 | (주)메드로메디칼디비젼 | 고주파를 이용한 여드름제거용 핸드피스 |
CN111781220A (zh) * | 2020-07-03 | 2020-10-16 | 中国科学院上海应用物理研究所 | 一种多功能同步辐射干涉曝光实验平台及实验方法 |
DE102021104475A1 (de) | 2021-02-25 | 2022-08-25 | LIDROTEC GmbH | System und Verfahren für die Laserbearbeitung von Werkstücken in Flüssigkeit |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6365326A (ja) * | 1986-09-05 | 1988-03-23 | Sharp Corp | 光量検出回路 |
JPS63157419A (ja) * | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
JPH05304072A (ja) * | 1992-04-08 | 1993-11-16 | Nec Corp | 半導体装置の製造方法 |
JPH06124873A (ja) * | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
JPH06168866A (ja) * | 1992-11-27 | 1994-06-14 | Canon Inc | 液浸式投影露光装置 |
JPH07220990A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
EP0834773A2 (en) | 1996-10-07 | 1998-04-08 | Nikon Corporation | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
JPH10255319A (ja) * | 1997-03-12 | 1998-09-25 | Hitachi Maxell Ltd | 原盤露光装置及び方法 |
JPH10303114A (ja) * | 1997-04-23 | 1998-11-13 | Nikon Corp | 液浸型露光装置 |
JPH10340846A (ja) * | 1997-06-10 | 1998-12-22 | Nikon Corp | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
JPH11176727A (ja) * | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
WO1999049504A1 (fr) * | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
JP2000058436A (ja) * | 1998-08-11 | 2000-02-25 | Nikon Corp | 投影露光装置及び露光方法 |
Family Cites Families (119)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2005013A (en) * | 1931-02-26 | 1935-06-18 | Teves Alfred | Evaporator for refrigeration machines |
GB1242527A (en) * | 1967-10-20 | 1971-08-11 | Kodak Ltd | Optical instruments |
JPS5919912Y2 (ja) | 1978-08-21 | 1984-06-08 | 清水建設株式会社 | 複合熱交換器 |
US4346164A (en) | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
JPS5919912A (ja) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
DD221563A1 (de) | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
US4650983A (en) | 1983-11-07 | 1987-03-17 | Nippon Kogaku K. K. | Focusing apparatus for projection optical system |
DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
JPS6265326A (ja) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
JPS6265326U (ja) | 1985-10-16 | 1987-04-23 | ||
JPS63157419U (ja) | 1987-03-31 | 1988-10-14 | ||
JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH0562877A (ja) | 1991-09-02 | 1993-03-12 | Yasuko Shinohara | 光によるlsi製造縮小投影露光装置の光学系 |
KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
US5534970A (en) | 1993-06-11 | 1996-07-09 | Nikon Corporation | Scanning exposure apparatus |
JPH08316125A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JPH08316124A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JP3526042B2 (ja) * | 1995-08-09 | 2004-05-10 | 株式会社ニコン | 投影露光装置 |
JPH09232213A (ja) * | 1996-02-26 | 1997-09-05 | Nikon Corp | 投影露光装置 |
US5938922A (en) | 1997-08-19 | 1999-08-17 | Celgard Llc | Contactor for degassing liquids |
EP1126510A4 (en) | 1998-09-17 | 2003-03-26 | Nikon Corp | METHOD FOR ADJUSTING AN OPTICAL PROJECTION SYSTEM |
AU2325900A (en) | 1999-03-12 | 2000-10-04 | Nikon Corporation | Exposure device, exposure method, and device manufacturing method |
US6970228B1 (en) | 1999-07-16 | 2005-11-29 | Nikon Corporation | Exposure method and system |
EP1206540A2 (en) * | 1999-08-09 | 2002-05-22 | CA*TX, Inc. | Dna sequences isolated from human colonic epithelial cells |
US6790228B2 (en) * | 1999-12-23 | 2004-09-14 | Advanced Cardiovascular Systems, Inc. | Coating for implantable devices and a method of forming the same |
US6995930B2 (en) | 1999-12-29 | 2006-02-07 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
US7187503B2 (en) | 1999-12-29 | 2007-03-06 | Carl Zeiss Smt Ag | Refractive projection objective for immersion lithography |
JP2001308003A (ja) | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP2001244177A (ja) | 2000-02-28 | 2001-09-07 | Nikon Corp | ステージ装置とホルダ、および走査型露光装置並びに露光装置 |
JP2001345263A (ja) | 2000-03-31 | 2001-12-14 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
TW591653B (en) | 2000-08-08 | 2004-06-11 | Koninkl Philips Electronics Nv | Method of manufacturing an optically scannable information carrier |
KR100866818B1 (ko) | 2000-12-11 | 2008-11-04 | 가부시키가이샤 니콘 | 투영광학계 및 이 투영광학계를 구비한 노광장치 |
JP4085813B2 (ja) | 2000-12-28 | 2008-05-14 | 株式会社ニコン | 露光装置 |
US20020163629A1 (en) | 2001-05-07 | 2002-11-07 | Michael Switkes | Methods and apparatus employing an index matching medium |
US7154676B2 (en) | 2002-03-01 | 2006-12-26 | Carl Zeiss Smt A.G. | Very-high aperture projection objective |
DE10229249A1 (de) | 2002-03-01 | 2003-09-04 | Zeiss Carl Semiconductor Mfg | Refraktives Projektionsobjektiv mit einer Taille |
US7190527B2 (en) | 2002-03-01 | 2007-03-13 | Carl Zeiss Smt Ag | Refractive projection objective |
DE10210899A1 (de) | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refraktives Projektionsobjektiv für Immersions-Lithographie |
US7092069B2 (en) | 2002-03-08 | 2006-08-15 | Carl Zeiss Smt Ag | Projection exposure method and projection exposure system |
DE10229818A1 (de) | 2002-06-28 | 2004-01-15 | Carl Zeiss Smt Ag | Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem |
JPWO2003085708A1 (ja) | 2002-04-09 | 2005-08-18 | 株式会社ニコン | 露光方法及び露光装置、並びにデバイス製造方法 |
US7324436B2 (en) * | 2002-04-30 | 2008-01-29 | Lg Electronics Inc. | Determining useable combinations of variables for transmitting a subpacket of an encoder packet |
KR20040104691A (ko) | 2002-05-03 | 2004-12-10 | 칼 짜이스 에스엠테 아게 | 높은 개구를 갖는 투영 대물렌즈 |
JP4158453B2 (ja) * | 2002-08-22 | 2008-10-01 | 株式会社デンソー | 半導体装置及びその製造方法 |
JP2005536775A (ja) | 2002-08-23 | 2005-12-02 | 株式会社ニコン | 投影光学系、フォトリソグラフィ方法および露光装置、並びに露光装置を用いた方法 |
US7093375B2 (en) | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
US6954993B1 (en) | 2002-09-30 | 2005-10-18 | Lam Research Corporation | Concentric proximity processing head |
US7367345B1 (en) | 2002-09-30 | 2008-05-06 | Lam Research Corporation | Apparatus and method for providing a confined liquid for immersion lithography |
US6988326B2 (en) | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Phobic barrier meniscus separation and containment |
US6788477B2 (en) | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
CN100470367C (zh) | 2002-11-12 | 2009-03-18 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
DE60335595D1 (de) | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
KR100588124B1 (ko) | 2002-11-12 | 2006-06-09 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피장치 및 디바이스제조방법 |
US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN101470360B (zh) | 2002-11-12 | 2013-07-24 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
DE10253679A1 (de) | 2002-11-18 | 2004-06-03 | Infineon Technologies Ag | Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren |
SG131766A1 (en) | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE10258718A1 (de) | 2002-12-09 | 2004-06-24 | Carl Zeiss Smt Ag | Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives |
DE10257766A1 (de) * | 2002-12-10 | 2004-07-15 | Carl Zeiss Smt Ag | Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage |
WO2004053955A1 (ja) | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
WO2004055803A1 (en) | 2002-12-13 | 2004-07-01 | Koninklijke Philips Electronics N.V. | Liquid removal in a method and device for irradiating spots on a layer |
EP1732075A3 (en) | 2002-12-19 | 2007-02-21 | Koninklijke Philips Electronics N.V. | Method and device for irradiating spots on a layer |
CN1316482C (zh) | 2002-12-19 | 2007-05-16 | 皇家飞利浦电子股份有限公司 | 照射层上斑点的方法和装置 |
US7010958B2 (en) | 2002-12-19 | 2006-03-14 | Asml Holding N.V. | High-resolution gas gauge proximity sensor |
US6781670B2 (en) | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
KR100498632B1 (ko) * | 2002-12-31 | 2005-07-01 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널 및 그 제조방법 |
TWI247339B (en) | 2003-02-21 | 2006-01-11 | Asml Holding Nv | Lithographic printing with polarized light |
US7206059B2 (en) | 2003-02-27 | 2007-04-17 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
US6943941B2 (en) | 2003-02-27 | 2005-09-13 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
US7029832B2 (en) | 2003-03-11 | 2006-04-18 | Samsung Electronics Co., Ltd. | Immersion lithography methods using carbon dioxide |
US20050164522A1 (en) | 2003-03-24 | 2005-07-28 | Kunz Roderick R. | Optical fluids, and systems and methods of making and using the same |
KR20110104084A (ko) | 2003-04-09 | 2011-09-21 | 가부시키가이샤 니콘 | 액침 리소그래피 유체 제어 시스템 |
KR101129213B1 (ko) | 2003-04-10 | 2012-03-27 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 액체를 수집하는 런-오프 경로 |
JP4656057B2 (ja) | 2003-04-10 | 2011-03-23 | 株式会社ニコン | 液浸リソグラフィ装置用電気浸透素子 |
CN104597717B (zh) | 2003-04-10 | 2017-09-05 | 株式会社尼康 | 包括用于沉浸光刻装置的真空清除的环境系统 |
EP1611486B1 (en) | 2003-04-10 | 2016-03-16 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
JP4582089B2 (ja) | 2003-04-11 | 2010-11-17 | 株式会社ニコン | 液浸リソグラフィ用の液体噴射回収システム |
KR101525335B1 (ko) | 2003-04-11 | 2015-06-03 | 가부시키가이샤 니콘 | 액침 리소그래피에 의한 광학기기의 세정방법 |
KR101498405B1 (ko) * | 2003-04-11 | 2015-03-04 | 가부시키가이샤 니콘 | 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법 |
WO2004095135A2 (en) | 2003-04-17 | 2004-11-04 | Nikon Corporation | Optical arrangement of autofocus elements for use with immersion lithography |
US6898938B2 (en) * | 2003-04-24 | 2005-05-31 | General Electric Company | Differential pressure induced purging fuel injector with asymmetric cyclone |
JP4146755B2 (ja) | 2003-05-09 | 2008-09-10 | 松下電器産業株式会社 | パターン形成方法 |
JP4025683B2 (ja) | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | パターン形成方法及び露光装置 |
JP4084710B2 (ja) | 2003-06-12 | 2008-04-30 | 松下電器産業株式会社 | パターン形成方法 |
JP4054285B2 (ja) | 2003-06-12 | 2008-02-27 | 松下電器産業株式会社 | パターン形成方法 |
US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
EP1635382B1 (en) | 2003-06-19 | 2009-12-23 | Nikon Corporation | Exposure device and device producing method |
JP4084712B2 (ja) | 2003-06-23 | 2008-04-30 | 松下電器産業株式会社 | パターン形成方法 |
JP4029064B2 (ja) | 2003-06-23 | 2008-01-09 | 松下電器産業株式会社 | パターン形成方法 |
JP4343597B2 (ja) | 2003-06-25 | 2009-10-14 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
US6809794B1 (en) | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
EP1498778A1 (en) | 2003-06-27 | 2005-01-19 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1494074A1 (en) | 2003-06-30 | 2005-01-05 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR20060027832A (ko) | 2003-07-01 | 2006-03-28 | 가부시키가이샤 니콘 | 광학 엘리먼트로서 동위원소적으로 특정된 유체를 사용하는방법 |
US7384149B2 (en) | 2003-07-21 | 2008-06-10 | Asml Netherlands B.V. | Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system |
US7006209B2 (en) | 2003-07-25 | 2006-02-28 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
US7700267B2 (en) | 2003-08-11 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
US7061578B2 (en) | 2003-08-11 | 2006-06-13 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
US7579135B2 (en) | 2003-08-11 | 2009-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus for manufacture of integrated circuits |
US7085075B2 (en) | 2003-08-12 | 2006-08-01 | Carl Zeiss Smt Ag | Projection objectives including a plurality of mirrors with lenses ahead of mirror M3 |
US6844206B1 (en) | 2003-08-21 | 2005-01-18 | Advanced Micro Devices, Llp | Refractive index system monitor and control for immersion lithography |
US6954256B2 (en) | 2003-08-29 | 2005-10-11 | Asml Netherlands B.V. | Gradient immersion lithography |
US7070915B2 (en) | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
US7014966B2 (en) | 2003-09-02 | 2006-03-21 | Advanced Micro Devices, Inc. | Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems |
KR101748923B1 (ko) | 2003-09-03 | 2017-06-19 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
US6961186B2 (en) | 2003-09-26 | 2005-11-01 | Takumi Technology Corp. | Contact printing using a magnified mask image |
US7369217B2 (en) | 2003-10-03 | 2008-05-06 | Micronic Laser Systems Ab | Method and device for immersion lithography |
US7678527B2 (en) | 2003-10-16 | 2010-03-16 | Intel Corporation | Methods and compositions for providing photoresist with improved properties for contacting liquids |
US7352433B2 (en) | 2003-10-28 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7924397B2 (en) | 2003-11-06 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Anti-corrosion layer on objective lens for liquid immersion lithography applications |
KR100611394B1 (ko) * | 2003-11-20 | 2006-08-11 | 주식회사 하이닉스반도체 | 유기 반사 방지막 조성물 및 이를 이용한 포토레지스트의패턴 형성 방법 |
US7545481B2 (en) | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8854602B2 (en) | 2003-11-24 | 2014-10-07 | Asml Netherlands B.V. | Holding device for an optical element in an objective |
US7125652B2 (en) | 2003-12-03 | 2006-10-24 | Advanced Micro Devices, Inc. | Immersion lithographic process using a conforming immersion medium |
SG124351A1 (en) | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
-
2003
- 2003-12-08 WO PCT/JP2003/015675 patent/WO2004053955A1/ja active Application Filing
- 2003-12-08 SG SG2011031200A patent/SG2011031200A/en unknown
- 2003-12-08 CN CN2010102146620A patent/CN101872135B/zh not_active Expired - Fee Related
- 2003-12-08 CN CNB2003801054672A patent/CN100446179C/zh not_active Expired - Fee Related
- 2003-12-08 EP EP03777352A patent/EP1571697A4/en not_active Withdrawn
- 2003-12-08 AU AU2003289239A patent/AU2003289239A1/en not_active Abandoned
- 2003-12-08 JP JP2004558437A patent/JP4362867B2/ja not_active Expired - Fee Related
- 2003-12-08 KR KR1020057009835A patent/KR20050085235A/ko not_active IP Right Cessation
- 2003-12-08 KR KR1020137000412A patent/KR20130010039A/ko not_active Application Discontinuation
- 2003-12-08 KR KR1020117012626A patent/KR20110086130A/ko not_active Application Discontinuation
- 2003-12-08 CN CN2008101751375A patent/CN101424883B/zh not_active Expired - Fee Related
- 2003-12-10 TW TW092134798A patent/TW200428482A/zh not_active IP Right Cessation
-
2005
- 2005-06-08 US US11/147,285 patent/US8004650B2/en not_active Expired - Fee Related
-
2006
- 2006-01-25 US US11/338,826 patent/US7446851B2/en not_active Expired - Fee Related
- 2006-01-26 US US11/339,505 patent/US7436486B2/en not_active Expired - Fee Related
- 2006-02-17 US US11/356,000 patent/US20060164615A1/en not_active Abandoned
-
2007
- 2007-01-19 US US11/655,083 patent/US7639343B2/en not_active Expired - Fee Related
- 2007-01-23 US US11/656,550 patent/US7505111B2/en not_active Expired - Fee Related
- 2007-07-10 US US11/822,807 patent/US8294876B2/en not_active Expired - Fee Related
- 2007-07-20 US US11/878,076 patent/US7589821B2/en not_active Expired - Fee Related
-
2008
- 2008-01-30 US US12/010,824 patent/US7911582B2/en not_active Expired - Fee Related
- 2008-09-09 US US12/230,988 patent/US20090015807A1/en not_active Abandoned
-
2009
- 2009-02-23 JP JP2009039347A patent/JP4978641B2/ja not_active Expired - Fee Related
- 2009-04-10 JP JP2009096258A patent/JP5353397B2/ja not_active Expired - Fee Related
- 2009-04-10 JP JP2009096274A patent/JP5055589B2/ja not_active Expired - Fee Related
- 2009-04-10 JP JP2009096268A patent/JP5110029B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-05 US US12/926,278 patent/US20110051106A1/en not_active Abandoned
-
2011
- 2011-07-21 US US13/137,121 patent/US20110279794A1/en not_active Abandoned
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6365326A (ja) * | 1986-09-05 | 1988-03-23 | Sharp Corp | 光量検出回路 |
JPS63157419A (ja) * | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
JPH05304072A (ja) * | 1992-04-08 | 1993-11-16 | Nec Corp | 半導体装置の製造方法 |
JPH06124873A (ja) * | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
JPH06168866A (ja) * | 1992-11-27 | 1994-06-14 | Canon Inc | 液浸式投影露光装置 |
EP0605103A1 (en) | 1992-11-27 | 1994-07-06 | Canon Kabushiki Kaisha | Projection apparatus for immersed exposure |
JPH07220990A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
EP0834773A2 (en) | 1996-10-07 | 1998-04-08 | Nikon Corporation | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
JPH10255319A (ja) * | 1997-03-12 | 1998-09-25 | Hitachi Maxell Ltd | 原盤露光装置及び方法 |
JPH10303114A (ja) * | 1997-04-23 | 1998-11-13 | Nikon Corp | 液浸型露光装置 |
JPH10340846A (ja) * | 1997-06-10 | 1998-12-22 | Nikon Corp | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
JPH11176727A (ja) * | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
WO1999049504A1 (fr) * | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
JP2000058436A (ja) * | 1998-08-11 | 2000-02-25 | Nikon Corp | 投影露光装置及び露光方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1571697A4 |
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JP2012134553A (ja) * | 2004-02-03 | 2012-07-12 | Nikon Corp | 露光装置及びデバイス製造方法 |
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JP2005302880A (ja) * | 2004-04-08 | 2005-10-27 | Canon Inc | 液浸式露光装置 |
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JP2009164623A (ja) * | 2004-05-18 | 2009-07-23 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
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US20060250593A1 (en) * | 2004-06-10 | 2006-11-09 | Nikon Corporation | Exposure apparatus and device fabricating method |
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JP2008503088A (ja) * | 2004-06-17 | 2008-01-31 | 株式会社ニコン | 液浸リソグラフィレンズの流体圧力補正 |
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JP2008505485A (ja) * | 2004-07-01 | 2008-02-21 | 株式会社ニコン | 液浸リソグラフィのための動的流体制御システム |
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US9104117B2 (en) | 2004-07-07 | 2015-08-11 | Bob Streefkerk | Lithographic apparatus having a liquid detection system |
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JP2009088563A (ja) * | 2004-07-07 | 2009-04-23 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
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WO2006013806A1 (ja) * | 2004-08-03 | 2006-02-09 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法 |
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EP1628161A3 (en) * | 2004-08-13 | 2006-06-07 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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JPWO2006041091A1 (ja) * | 2004-10-12 | 2008-05-15 | 株式会社ニコン | 露光装置のメンテナンス方法、露光装置、デバイス製造方法、液浸露光装置のメンテナンス用の液体回収部材 |
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US8934082B2 (en) | 2004-10-18 | 2015-01-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP2108990A1 (en) | 2004-10-18 | 2009-10-14 | Nikon Corporation | Projection optical system, exposure system, and exposure method |
US7119876B2 (en) | 2004-10-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9436097B2 (en) | 2004-10-18 | 2016-09-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9753380B2 (en) | 2004-10-18 | 2017-09-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7710537B2 (en) | 2004-11-12 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7251013B2 (en) | 2004-11-12 | 2007-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9645507B2 (en) | 2004-11-12 | 2017-05-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7852457B2 (en) | 2004-11-12 | 2010-12-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10620546B2 (en) | 2004-11-12 | 2020-04-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US10274832B2 (en) | 2004-11-12 | 2019-04-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9964861B2 (en) | 2004-11-12 | 2018-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9798247B2 (en) | 2004-11-12 | 2017-10-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9261797B2 (en) | 2004-11-12 | 2016-02-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US7414699B2 (en) | 2004-11-12 | 2008-08-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7583357B2 (en) | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7423720B2 (en) | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8817231B2 (en) | 2004-11-12 | 2014-08-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9188882B2 (en) | 2004-11-17 | 2015-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7978306B2 (en) | 2004-11-17 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9581916B2 (en) | 2004-11-17 | 2017-02-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411657B2 (en) | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101437298B1 (ko) | 2004-11-18 | 2014-09-02 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
US7648819B2 (en) | 2004-11-18 | 2010-01-19 | International Business Machines Corporation | Method and apparatus for cleaning a semiconductor substrate in an immersion lithography system |
KR20150112038A (ko) * | 2004-11-18 | 2015-10-06 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
KR101421849B1 (ko) | 2004-11-18 | 2014-07-24 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
CN103149803A (zh) * | 2004-11-18 | 2013-06-12 | 尼康股份有限公司 | 曝光装置、及元件制造方法 |
JP2019066887A (ja) * | 2004-11-18 | 2019-04-25 | 株式会社ニコン | 露光装置及び露光方法、並びに半導体デバイス製造方法 |
US7362412B2 (en) * | 2004-11-18 | 2008-04-22 | International Business Machines Corporation | Method and apparatus for cleaning a semiconductor substrate in an immersion lithography system |
US9857692B2 (en) | 2004-11-18 | 2018-01-02 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
JP2016040624A (ja) * | 2004-11-18 | 2016-03-24 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
US9298108B2 (en) | 2004-11-18 | 2016-03-29 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US8576379B2 (en) | 2004-11-18 | 2013-11-05 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
CN103149803B (zh) * | 2004-11-18 | 2016-03-30 | 尼康股份有限公司 | 曝光装置、及元件制造方法 |
US9223230B2 (en) | 2004-11-18 | 2015-12-29 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US8054465B2 (en) | 2004-11-18 | 2011-11-08 | Nikon Corporation | Position measurement method |
US8059260B2 (en) | 2004-11-18 | 2011-11-15 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
EP2772803A1 (en) | 2004-11-18 | 2014-09-03 | Nikon Corporation | Positioning and loading a substrate in an exposure apparatus |
EP2772804A1 (en) | 2004-11-18 | 2014-09-03 | Nikon Corporation | Positioning and loading a substrate in an exposure apparatus |
US9223231B2 (en) | 2004-11-18 | 2015-12-29 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
KR101493641B1 (ko) | 2004-11-18 | 2015-02-13 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
JP2016075955A (ja) * | 2004-11-18 | 2016-05-12 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
US9348238B2 (en) | 2004-11-18 | 2016-05-24 | Niko Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
WO2006054682A1 (ja) * | 2004-11-18 | 2006-05-26 | Nikon Corporation | 位置計測方法、位置制御方法、計測方法、ロード方法、露光方法及び露光装置、並びにデバイス製造方法 |
KR101578629B1 (ko) | 2004-11-18 | 2015-12-17 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
JP2014131082A (ja) * | 2004-11-18 | 2014-07-10 | Nikon Corp | 露光装置 |
JP2011155285A (ja) * | 2004-11-18 | 2011-08-11 | Nikon Corp | 露光装置及びデバイス製造方法 |
KR101689100B1 (ko) | 2004-11-18 | 2017-01-02 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
KR101861949B1 (ko) | 2004-11-18 | 2018-07-02 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
JP2012103269A (ja) * | 2004-11-18 | 2012-05-31 | Nikon Corp | 位置計測方法、位置制御方法、計測方法、ロード方法、露光方法及び露光装置、並びにデバイス製造方法 |
EP3346486A1 (en) | 2004-11-18 | 2018-07-11 | Nikon Corporation | Exposure method and exposure apparatus, and semiconductor device manufacturing methods |
TWI588872B (zh) * | 2004-11-18 | 2017-06-21 | 尼康股份有限公司 | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
JP2012084927A (ja) * | 2004-11-18 | 2012-04-26 | Nikon Corp | 位置計測方法、位置制御方法、露光装置、及びデバイス製造方法 |
JP2017142538A (ja) * | 2004-11-18 | 2017-08-17 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
KR20150010775A (ko) * | 2004-11-18 | 2015-01-28 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
KR101452483B1 (ko) | 2004-11-18 | 2014-10-21 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법,노광 방법, 노광 장치, 및 디바이스 제조 방법 |
JP2018067014A (ja) * | 2004-11-18 | 2018-04-26 | 株式会社ニコン | 露光装置及び露光方法、並びに半導体デバイス製造方法 |
JP2016173607A (ja) * | 2004-11-18 | 2016-09-29 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
US10222708B2 (en) | 2004-11-18 | 2019-03-05 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
JP4877653B2 (ja) * | 2004-11-18 | 2012-02-15 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
JP2015111682A (ja) * | 2004-11-18 | 2015-06-18 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
KR101670571B1 (ko) | 2004-11-18 | 2016-10-28 | 가부시키가이샤 니콘 | 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
JP2006148093A (ja) * | 2004-11-18 | 2006-06-08 | Internatl Business Mach Corp <Ibm> | 浸漬リソグラフィ・システムにおいて半導体基板を洗浄する方法及び装置 |
JPWO2006054682A1 (ja) * | 2004-11-18 | 2008-06-05 | 株式会社ニコン | 位置計測方法、位置制御方法、計測方法、ロード方法、露光方法及び露光装置、並びにデバイス製造方法 |
US8072578B2 (en) | 2004-11-18 | 2011-12-06 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
JP2010118684A (ja) * | 2004-11-18 | 2010-05-27 | Nikon Corp | 位置計測方法、位置制御方法、計測方法、ロード方法、露光方法及び露光装置、並びにデバイス製造方法 |
US7674324B2 (en) * | 2004-11-19 | 2010-03-09 | International Business Machines Corporation | Exposures system including chemical and particulate filters containing chemically modified carbon nanotube structures |
US7922796B2 (en) | 2004-11-19 | 2011-04-12 | International Business Machines Corporation | Chemical and particulate filters containing chemically modified carbon nanotube structures |
US7145630B2 (en) | 2004-11-23 | 2006-12-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7812924B2 (en) | 2004-12-02 | 2010-10-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7161654B2 (en) | 2004-12-02 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006165550A (ja) * | 2004-12-02 | 2006-06-22 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US7764356B2 (en) | 2004-12-03 | 2010-07-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7446850B2 (en) | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2011233914A (ja) * | 2004-12-03 | 2011-11-17 | Asml Netherlands Bv | リソグラフィ装置及びリソグラフィ装置において液体を除去する方法 |
US7248334B2 (en) | 2004-12-07 | 2007-07-24 | Asml Netherlands B.V. | Sensor shield |
US7643127B2 (en) | 2004-12-07 | 2010-01-05 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US7196770B2 (en) | 2004-12-07 | 2007-03-27 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US8045137B2 (en) | 2004-12-07 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8115905B2 (en) | 2004-12-08 | 2012-02-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8860926B2 (en) | 2004-12-08 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7365827B2 (en) | 2004-12-08 | 2008-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9182222B2 (en) | 2004-12-10 | 2015-11-10 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US9740106B2 (en) | 2004-12-10 | 2017-08-22 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US8077291B2 (en) | 2004-12-10 | 2011-12-13 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US10345711B2 (en) | 2004-12-10 | 2019-07-09 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US8441617B2 (en) | 2004-12-10 | 2013-05-14 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
EP1669808A3 (en) * | 2004-12-10 | 2007-06-06 | ASML Netherlands BV | Substrate placement in immersion lithography |
US7403261B2 (en) | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7751032B2 (en) | 2004-12-15 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1672432A1 (en) * | 2004-12-15 | 2006-06-21 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8233135B2 (en) | 2004-12-15 | 2012-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006173377A (ja) * | 2004-12-16 | 2006-06-29 | Nikon Corp | 光学部品及び投影露光装置 |
JP2008227548A (ja) * | 2004-12-20 | 2008-09-25 | Asml Netherlands Bv | リソグラフィ装置とデバイス製造方法 |
US9703210B2 (en) | 2004-12-20 | 2017-07-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8638419B2 (en) | 2004-12-20 | 2014-01-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9116443B2 (en) | 2004-12-20 | 2015-08-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10248035B2 (en) | 2004-12-20 | 2019-04-02 | Asml Netherlands B.V. | Lithographic apparatus |
US10509326B2 (en) | 2004-12-20 | 2019-12-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7880860B2 (en) | 2004-12-20 | 2011-02-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8941811B2 (en) | 2004-12-20 | 2015-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2008277854A (ja) * | 2004-12-20 | 2008-11-13 | Asml Netherlands Bv | リソグラフィ装置とデバイス製造方法 |
JP2008263221A (ja) * | 2004-12-20 | 2008-10-30 | Asml Netherlands Bv | リソグラフィ装置とデバイス製造方法 |
US8115899B2 (en) | 2004-12-20 | 2012-02-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9835960B2 (en) | 2004-12-20 | 2017-12-05 | Asml Netherlands B.V. | Lithographic apparatus |
US8233137B2 (en) | 2004-12-20 | 2012-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9417535B2 (en) | 2004-12-20 | 2016-08-16 | Asml Netherlands B.V. | Lithographic apparatus |
US9329494B2 (en) | 2004-12-20 | 2016-05-03 | Asml Netherlands B.V. | Lithographic apparatus |
JP2008227547A (ja) * | 2004-12-20 | 2008-09-25 | Asml Netherlands Bv | リソグラフィ装置とデバイス製造方法 |
US7405805B2 (en) | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7763355B2 (en) | 2004-12-28 | 2010-07-27 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US8913225B2 (en) | 2004-12-28 | 2014-12-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8013978B2 (en) | 2004-12-28 | 2011-09-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7491661B2 (en) | 2004-12-28 | 2009-02-17 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US8354209B2 (en) | 2004-12-30 | 2013-01-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7670730B2 (en) | 2004-12-30 | 2010-03-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8102507B2 (en) | 2004-12-30 | 2012-01-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2011018925A (ja) * | 2004-12-30 | 2011-01-27 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
US7705962B2 (en) | 2005-01-14 | 2010-04-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010109395A (ja) * | 2005-01-14 | 2010-05-13 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US7924403B2 (en) | 2005-01-14 | 2011-04-12 | Asml Netherlands B.V. | Lithographic apparatus and device and device manufacturing method |
US8675173B2 (en) | 2005-01-14 | 2014-03-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1681596A1 (en) * | 2005-01-14 | 2006-07-19 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
JPWO2006080250A1 (ja) * | 2005-01-25 | 2008-08-07 | Jsr株式会社 | 液浸型露光システム、液浸型露光用液体のリサイクル方法及び供給方法 |
WO2006080250A1 (ja) * | 2005-01-25 | 2006-08-03 | Jsr Corporation | 液浸型露光システム、液浸型露光用液体のリサイクル方法及び供給方法 |
JPWO2006080427A1 (ja) * | 2005-01-31 | 2008-06-19 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
US8692973B2 (en) * | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
WO2006080427A1 (ja) * | 2005-01-31 | 2006-08-03 | Nikon Corporation | 露光方法、露光装置、及びデバイス製造方法 |
JP4565271B2 (ja) * | 2005-01-31 | 2010-10-20 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
JP2007053329A (ja) * | 2005-01-31 | 2007-03-01 | Nikon Corp | 露光装置及びデバイス製造方法 |
US20070252964A1 (en) * | 2005-01-31 | 2007-11-01 | Nikon Corporation | Exposure apparatus and method for producing device |
JP2011258999A (ja) * | 2005-01-31 | 2011-12-22 | Nikon Corp | 露光装置及びデバイス製造方法 |
US20140307238A1 (en) * | 2005-01-31 | 2014-10-16 | Nikon Corporation | Exposure apparatus and method for producing device |
US9746781B2 (en) | 2005-01-31 | 2017-08-29 | Nikon Corporation | Exposure apparatus and method for producing device |
US20170329239A1 (en) * | 2005-01-31 | 2017-11-16 | Nikon Corporation | Exposure apparatus and method for producing device |
US9164391B2 (en) | 2005-02-10 | 2015-10-20 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US9454088B2 (en) | 2005-02-10 | 2016-09-27 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US10712675B2 (en) | 2005-02-10 | 2020-07-14 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US8859188B2 (en) | 2005-02-10 | 2014-10-14 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US9772565B2 (en) | 2005-02-10 | 2017-09-26 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US8902404B2 (en) | 2005-02-22 | 2014-12-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8246838B2 (en) | 2005-02-22 | 2012-08-21 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7914687B2 (en) | 2005-02-22 | 2011-03-29 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7378025B2 (en) | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7224431B2 (en) | 2005-02-22 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US8958051B2 (en) | 2005-02-28 | 2015-02-17 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
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US8514369B2 (en) | 2005-03-04 | 2013-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10495981B2 (en) | 2005-03-04 | 2019-12-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US9477159B2 (en) | 2005-03-04 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10495980B2 (en) | 2005-03-04 | 2019-12-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7843551B2 (en) | 2005-03-04 | 2010-11-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7684010B2 (en) | 2005-03-09 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing |
KR100790634B1 (ko) | 2005-03-18 | 2008-01-02 | 캐논 가부시끼가이샤 | 액침노광장치, 액침노광방법 및 디바이스 제조방법 |
EP1703329A1 (en) * | 2005-03-18 | 2006-09-20 | Canon Kabushiki Kaisha | Immersion exposure apparatus, immersion exposure method, and device manufacturing method |
JP2015212827A (ja) * | 2005-03-23 | 2015-11-26 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
US7859644B2 (en) | 2005-03-28 | 2010-12-28 | Asml Netherlands B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
US7330238B2 (en) | 2005-03-28 | 2008-02-12 | Asml Netherlands, B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
JPWO2006106833A1 (ja) * | 2005-03-30 | 2008-09-11 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
WO2006106833A1 (ja) * | 2005-03-30 | 2006-10-12 | Nikon Corporation | 露光装置及び露光方法、並びにデバイス製造方法 |
JP4544303B2 (ja) * | 2005-03-30 | 2010-09-15 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
EP1865541A4 (en) * | 2005-03-31 | 2017-06-14 | Nikon Corporation | Exposure method, exposure apparatus and device manufacturing method |
EP1865542A4 (en) * | 2005-03-31 | 2010-08-18 | Nikon Corp | EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD |
EP1865542A1 (en) * | 2005-03-31 | 2007-12-12 | Nikon Corporation | Exposure apparatus, exposure method, and device production method |
JP4888388B2 (ja) * | 2005-03-31 | 2012-02-29 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
US8988651B2 (en) | 2005-04-05 | 2015-03-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9857695B2 (en) | 2005-04-05 | 2018-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1710630A2 (en) * | 2005-04-05 | 2006-10-11 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9429853B2 (en) | 2005-04-05 | 2016-08-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10495984B2 (en) | 2005-04-05 | 2019-12-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8259287B2 (en) | 2005-04-05 | 2012-09-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10209629B2 (en) | 2005-04-05 | 2019-02-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8976334B2 (en) | 2005-04-05 | 2015-03-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
USRE45576E1 (en) | 2005-04-08 | 2015-06-23 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
USRE44446E1 (en) | 2005-04-08 | 2013-08-20 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
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US7582881B2 (en) | 2005-04-08 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE46933E1 (en) | 2005-04-08 | 2018-07-03 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7291850B2 (en) | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8203693B2 (en) | 2005-04-19 | 2012-06-19 | Asml Netherlands B.V. | Liquid immersion lithography system comprising a tilted showerhead relative to a substrate |
JP2012134557A (ja) * | 2005-04-28 | 2012-07-12 | Nikon Corp | 露光方法及び露光装置、並びにデバイス製造方法 |
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US7317507B2 (en) | 2005-05-03 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10025196B2 (en) | 2005-05-03 | 2018-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10353296B2 (en) | 2005-05-03 | 2019-07-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10684554B2 (en) | 2005-05-03 | 2020-06-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9229335B2 (en) | 2005-05-03 | 2016-01-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9081300B2 (en) | 2005-05-03 | 2015-07-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9146478B2 (en) | 2005-05-03 | 2015-09-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9606449B2 (en) | 2005-05-03 | 2017-03-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US10488759B2 (en) | 2005-05-03 | 2019-11-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10451973B2 (en) | 2005-05-03 | 2019-10-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8115903B2 (en) | 2005-05-03 | 2012-02-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8860924B2 (en) | 2005-05-03 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11016394B2 (en) | 2005-05-03 | 2021-05-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9310696B2 (en) | 2005-05-12 | 2016-04-12 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9891539B2 (en) | 2005-05-12 | 2018-02-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
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US9360763B2 (en) | 2005-05-12 | 2016-06-07 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9429851B2 (en) | 2005-05-12 | 2016-08-30 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US8212991B2 (en) | 2005-05-23 | 2012-07-03 | Carl Zeiss Smt Gmbh | Optical system of a microlithographic projection exposure apparatus |
WO2006125538A1 (en) * | 2005-05-23 | 2006-11-30 | Carl Zeiss Smt Ag | Optical system of a microlithographic projection exposure apparatus |
US8253924B2 (en) | 2005-05-24 | 2012-08-28 | Nikon Corporation | Exposure method, exposure apparatus and device manufacturing method |
US7652746B2 (en) | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9268236B2 (en) | 2005-06-21 | 2016-02-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method having heat pipe with fluid to cool substrate and/or substrate holder |
US7751027B2 (en) | 2005-06-21 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007005731A (ja) * | 2005-06-27 | 2007-01-11 | Jsr Corp | 液浸露光用液体およびその精製方法 |
US8120749B2 (en) | 2005-06-28 | 2012-02-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20150055104A1 (en) * | 2005-06-28 | 2015-02-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9952514B2 (en) | 2005-06-28 | 2018-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US10386725B2 (en) | 2005-06-28 | 2019-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20190369502A1 (en) * | 2005-06-28 | 2019-12-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9766556B2 (en) | 2005-06-28 | 2017-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7468779B2 (en) | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11327404B2 (en) | 2005-06-28 | 2022-05-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9099501B2 (en) | 2005-06-28 | 2015-08-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8687168B2 (en) | 2005-06-28 | 2014-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2007004567A1 (ja) | 2005-07-01 | 2007-01-11 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法、並びにシステム |
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JP2007053193A (ja) * | 2005-08-17 | 2007-03-01 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2007067376A (ja) * | 2005-08-31 | 2007-03-15 | Taiwan Semiconductor Manufacturing Co Ltd | 半導体製造におけるフォトリソグラフィのシステム及びその方法 |
EP1760531A1 (en) * | 2005-09-06 | 2007-03-07 | ASML Netherlands B.V. | Lithographic method |
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JP2009508327A (ja) * | 2005-09-13 | 2009-02-26 | カール・ツァイス・エスエムティー・アーゲー | 光学撮像特性設定方法および投影露光装置 |
JP2006093721A (ja) * | 2005-10-04 | 2006-04-06 | Canon Inc | 露光装置及び露光方法 |
US8004654B2 (en) | 2005-10-06 | 2011-08-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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JPWO2007055373A1 (ja) * | 2005-11-14 | 2009-04-30 | 株式会社ニコン | 液体回収部材、露光装置、露光方法、及びデバイス製造方法 |
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WO2007058240A1 (ja) | 2005-11-16 | 2007-05-24 | Nikon Corporation | 基板処理方法、フォトマスクの製造方法及びフォトマスク、並びにデバイス製造方法 |
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US7656501B2 (en) | 2005-11-16 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus |
US8421996B2 (en) | 2005-11-16 | 2013-04-16 | Asml Netherlands B.V. | Lithographic apparatus |
US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
US9618853B2 (en) | 2005-11-16 | 2017-04-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10126664B2 (en) | 2005-11-16 | 2018-11-13 | Asml Netherlands, B.V. | Lithographic apparatus and device manufacturing method |
US10768536B2 (en) | 2005-11-16 | 2020-09-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9140996B2 (en) | 2005-11-16 | 2015-09-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8481978B2 (en) | 2005-11-23 | 2013-07-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7928407B2 (en) | 2005-11-23 | 2011-04-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8456611B2 (en) | 2005-11-29 | 2013-06-04 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US7773195B2 (en) | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US10061207B2 (en) | 2005-12-02 | 2018-08-28 | Asml Netherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
US8125610B2 (en) | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
US8232540B2 (en) | 2005-12-27 | 2012-07-31 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
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US10761433B2 (en) | 2005-12-30 | 2020-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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EP2857902A1 (en) | 2006-01-19 | 2015-04-08 | Nikon Corporation | Immersion exposure apparatus, immersion exposure method, and device fabricating method |
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WO2007083758A1 (ja) | 2006-01-19 | 2007-07-26 | Nikon Corporation | 移動体駆動方法及び移動体駆動システム、パターン形成方法及びパターン形成装置、露光方法及び露光装置、並びにデバイス製造方法 |
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WO2007097380A1 (ja) | 2006-02-21 | 2007-08-30 | Nikon Corporation | パターン形成装置及びパターン形成方法、移動体駆動システム及び移動体駆動方法、露光装置及び露光方法、並びにデバイス製造方法 |
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WO2007097466A1 (ja) | 2006-02-21 | 2007-08-30 | Nikon Corporation | 測定装置及び方法、処理装置及び方法、パターン形成装置及び方法、露光装置及び方法、並びにデバイス製造方法 |
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JP2018055111A (ja) * | 2006-05-09 | 2018-04-05 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学結像装置 |
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EP2993524A2 (en) | 2006-09-01 | 2016-03-09 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
KR101770082B1 (ko) * | 2006-09-01 | 2017-08-21 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법 |
WO2008029757A1 (en) | 2006-09-01 | 2008-03-13 | Nikon Corporation | Mobile object driving method, mobile object driving system, pattern forming method and apparatus, exposure method and apparatus, device manufacturing method and calibration method |
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KR101764094B1 (ko) * | 2006-09-01 | 2017-08-14 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
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KR101892410B1 (ko) * | 2006-09-01 | 2018-08-27 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
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JP2014132357A (ja) * | 2006-09-07 | 2014-07-17 | Leica Microsystems Cms Gmbh | 液浸対物レンズ、液浸膜を形成する装置及び方法 |
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JP2008235620A (ja) * | 2007-03-22 | 2008-10-02 | Utsunomiya Univ | 液浸露光装置 |
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JP2009111349A (ja) * | 2007-09-13 | 2009-05-21 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
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