WO2003019736A1

WO2003019736A1 - Method for mounting socket, socket, and tape for mounting socket

Info

Publication number: WO2003019736A1
Application number: PCT/JP2001/007673
Authority: WO
Inventors: Shinobu Takeuchi
Original assignee: Moldec Co., Ltd.
Priority date: 2001-08-27
Filing date: 2001-09-05
Publication date: 2003-03-06
Also published as: TW497294B

Abstract

A method for mounting a socket accurately on a circuit board while sticking holding the socket surely by means of a sticking jig, and a socket and a tape suitable for implementing the method. At first, a tape (20) is stuck to the upper surface of a socket (10). A sticking jig (50) is then positioned at a sticking part (x) of the socket (10) and brought into tight contact with the tape (20) thus mounting the socket (10) on a circuit board (30) while sticking holding. Subsequently, the sticking jig (50) is separated from the tape (20) and the socket (10) is reflow-soldered to the circuit board (30). Thereafter, the tape (20) is stripped from the socket (10) and separated from the socket (10) at a coupling part (11) by raising a tongue (13) to form a central through hole (14).

Description

Description Socket mounting method, socket, and tape for socket mounting

The present invention relates to a method of mounting a socket having a pin through-hole for inserting a pin of a device on an outer portion of a circuit board, a method of mounting a socket having a pin through-hole for inserting a pin of a device on an outer portion, The present invention relates to a socket to be mounted, and a tape to be attached to an upper surface of the socket to be mounted on a circuit board.

Background art

The following methods are known as methods for mounting a socket on which a device such as a CPU is replaceably mounted on a circuit board. First, a tape is attached to the upper surface of the socket so that the central through-hole through which the device is attached and the pin through-hole through which the device pins are inserted are both covered. Next, the suction jig having a substantially suction cup shape is positioned on the suction portion of the socket, and is closely contacted with the tape from above, whereby the socket is suction-held and placed on the circuit board. Then, the suction jig is separated from the tape, the socket is reflow-soldered to the circuit board by the hang provided at the connection terminal of the socket, and then the tape is peeled off from the upper surface of the socket to complete the mounting. I do.

However, in general, the adsorption jig has a cross-sectional area substantially equal to or smaller than that of the central through hole. Therefore, when the socket is deformed due to factors such as temperature and humidity during transportation, the flatness of the tape attached to the upper surface of the socket, covering the central through hole, is impaired. For this reason, the suction holding force of the socket by the suction jig is reduced, and the position of the socket sucked by the suction jig is inclined, so that the mounting position of the socket on the circuit board is shifted and the mounting accuracy is reduced. May decrease.

Therefore, an object of the present invention is to provide a method of reliably holding a socket by a suction jig by suction and mounting the socket on a circuit board with high accuracy, and a socket and a tape suitable for implementing the method. Disclosure of the invention

The socket mounting method of the present invention for solving the above-mentioned problem is characterized in that the socket includes a tongue piece including a tongue piece formed by being surrounded by a slit made discontinuous by a connecting portion in an inner part of the socket. Then, the socket is sucked and held by a suction jig, and then placed on the circuit board, the suction jig is separated from the socket, the socket is reflow-soldered to the circuit board, and the tongue is lifted. A central through hole is formed by separating the socket from the socket at the connecting portion.

ADVANTAGE OF THE INVENTION According to this invention, the suction holding force of the socket by the suction jig in the suction part is strongly maintained by the tongue piece, and the mounting accuracy of the socket to the circuit board can be improved. Then, after mounting the socket, the tongue piece is separated from the socket at the connecting portion to form a central through-hole, and a device such as a CPU can be placed in a state where it can be mounted.

In addition, the mounting method of the present invention may further comprise, before holding the socket with the suction jig, attaching a tape to the upper surface of the socket at least in the suction portion, and reflow soldering the socket to the circuit board. From the upper surface of the socket.

According to the present invention, the tape attached to the upper surface of the socket is supported upward by the tongue at the suction portion of the socket. Therefore, it is possible to prevent a reduction in the vacuum suction force of the tape due to the suction jig, and to improve the mounting accuracy of the socket on the circuit board. Further, the mounting method according to the present invention further comprises the step of: mounting the tape having a first opening at a position corresponding to the slit in a state where the slit is at least partially opened by the first opening. It is affixed to the upper surface of the socket.

According to the present invention, hot air during reflow soldering flows below the socket through the first opening of the tape and the slit of the socket. Therefore, the socket and the circuit board are efficiently heated by the hot air, and reflow soldering can be performed quickly and reliably.

The mounting method of the present invention is characterized in that the tape is attached to the upper surface of the socket so as to close the pin through hole upward.

According to the present invention, since the upper portion of the pin through-hole is completely closed by the tape, even when the flux contained in the hang is vaporized during reflow soldering, the vaporized flux remains in the pin through-hole. Can be suppressed from rising. Therefore, the flux does not easily adhere to the upper portion of the connection terminal mounted in the pin through-hole, so that when the device is mounted on the socket after that, the connection between the pin of the device and the connection terminal is improved. can do.

Further, in the mounting method of the present invention, the socket includes an outer peripheral portion and an inner peripheral portion located above the surface where the pin through hole is formed over the entire outer peripheral edge and the inner peripheral edge of the outer peripheral portion. The tape is stuck on the upper surface of the outer peripheral portion and the upper surface of the inner peripheral edge portion, so that the formed portion is stuck on the upper surface of the socket while closing the entire portion above the formed portion.

Also in the present invention, since the surface where the pin through-holes are formed is completely closed by the tape above the tape, even if the flux contained in the hang is vaporized during reflow soldering, the vaporized flux Can be suppressed from rising in the pin through hole. The tape is a pin through hole Since it is located above the surface on which the tape is formed, it is possible to prevent the adhesive of the tape from adhering to the surface on which the tape is formed, and further to prevent dust from adhering to the pin through hole due to the adhesive.

Further, the mounting method of the present invention is characterized in that the tongue piece is lifted by using a grip formed at the tip of the tongue piece and located above the upper surface of the socket as a clue.

According to the present invention, when the tongue piece is separated from the socket, the tongue piece can be easily lifted from the socket by using the grip as a hand. Further, in the mounting method according to the present invention, the tape having the second open portion formed at a position corresponding to the grip portion is attached to the upper surface of the socket by removing the grip portion by the second open portion. It is characterized by.

According to the present invention, it is possible to avoid a situation in which the tape stuck on the upper surface of the socket is raised by the gripping portion above the upper surface of the socket, and the tongue piece weakens the supporting force of the tape upward. .

Further, the mounting method of the present invention is characterized in that the tape is peeled off from the upper surface of the socket by using a free piece formed by leaving a part of the peripheral portion of the tape unattached to the upper surface of the socket. Features.

ADVANTAGE OF THE INVENTION According to this invention, a tape can be easily peeled from a socket using a free piece part as a clue.

The method can be suitably implemented with the following sockets and tapes. A socket according to the present invention for solving the above-mentioned problems is characterized in that a central through-hole can be formed by being surrounded by a slit made discontinuous by a connecting part in an inner part and being removed after the connecting part is broken. It is characterized by having a tongue piece. Further, the socket according to the present invention is characterized in that the tongue piece is provided with a grip portion located above a top surface at a tip end thereof.

Further, in the socket according to the present invention, the outer peripheral portion and the inner peripheral And an outer peripheral portion and an inner peripheral portion located above the surface where the pin through-holes are formed.

In the tape of the present invention for solving the above-mentioned problems, the socket is provided with a pin through hole for inserting a pin of a device in an outer portion, and is surrounded by a slit in the inner portion which is discontinued by a connecting portion, When the tongue is provided with a central through-hole formed by being removed after the connection portion is broken, at least a part of the slit can be opened upward and attached to the upper surface of the socket. A first open portion is formed.

Further, when the tape of the present invention includes a gripping portion in which the tip of the tongue piece is located above the upper surface of the socket, a second opening portion that can be removed from the gripping portion and adhered to the upper surface of the socket is provided. It is characterized by being formed.

Further, the tape of the present invention is characterized in that a loose piece portion which is not adhered to the upper surface of the socket is provided in a part of a peripheral edge portion. BRIEF DESCRIPTION OF THE FIGURES

An embodiment of the socket, tape, and socket mounting method of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view of the configuration of the socket of the present embodiment, FIG. 2 is a partial cross-sectional view taken along the line II-II of FIG. 1, and FIGS. 3 to 5 are explanatory views of the socket mounting method of the present embodiment. BEST MODE FOR CARRYING OUT THE INVENTION

First, the configuration of the socket 1 to which the mounting method of the present embodiment is applied will be described with reference to FIGS. The socket 10 has a substantially rectangular plate shape, is mounted on a circuit board 30, and is provided with a substantially rectangular CPU (device) 40 in a replaceable manner. The socket 10 is composed of an upper portion 10a and a lower portion 10b covered by the upper portion 10a and facing the circuit board 30. I have.

The inner part of the upper part 10a is connected to the upper part 10a via the connecting part 11 at the base, and is surrounded by the substantially U-shaped slit 12 at the part other than the connecting part 11 A substantially rectangular tongue piece 13 is formed. The tongue piece 13 is provided with a flat portion 13X having substantially the same height as the upper surface of the upper portion 10a, and a grip portion 13y standing upright from the upper surface of the upper portion 10a at a tip thereof. I have. As will be described later, the tongue piece 13 is separated from the upper part 10a at the connecting part 11, so that a substantially rectangular upper central through hole 14a is formed in the inner part of the upper part 10a. You. In addition, a plurality of upper pin through holes 15a into which pins 41 protruding below CPU 40 are inserted are provided in the outer portion of the upper portion 10a. The outer peripheral edge and the inner peripheral edge of the outer peripheral part of the upper part 10a are provided with an outer peripheral part 16 and an inner peripheral part 17 of the same height extending all around at a position higher than the formation surface of the upper pin through-hole 15a. Is formed.

A lower central through hole 14b having a substantially rectangular shape and substantially the same size as the tongue piece 13 is provided in the inner portion of the lower portion 1Ob. A lower pin through hole 15b into which the pin 41 of the CPU 40 is inserted is provided in the outer periphery of the lower portion 10b. In the lower pin through hole 15b, a connection terminal 18 for connecting to the pin 41 of the CPU 40 and a substantially cylindrical solder 19 for being sandwiched between the connection terminal 18 and the lower portion of the connection terminal 18 for reflow soldering described later. Are provided. '' Upper central through hole 14a and lower central through hole 14b constitute central through hole 14, and upper pin through hole 15a and lower pin through hole 15b constitute pin through hole 15. . The socket 10 is provided with a lever L. The detailed mechanism is omitted, but the upper part 10a is slidable with respect to the lower part 10b when the lever L stands upright. The slide fixes the pin 41 of the CPU 40 to the connection terminal 18 of the socket 10.

Next, a method of mounting the socket 10 having the above configuration on the circuit board 30 will be described. This will be described with reference to FIGS.

First, as shown in FIG. 3 (a), the tape 20 is adhered to the upper surface of the upper portion 10 a of the tape 10 force socket 10 having substantially the same area and shape as the upper surface of the socket 10. A substantially U-shaped open part 21 is formed in the inner part of the tape 20. The open portion 21 is surrounded by three sides by a substantially U-shaped first open portion 2 11 corresponding to the base of the slit 12 of the socket 10 and the first open portion 2 1 1. It is composed of two substantially rectangular second opening portions 2 12 corresponding to the grip portions 13 y and divided by dotted lines in the drawing. As shown in FIG. 3 (b), the tape 20 is stuck on the upper surface of the socket 10 with the slit 12 partially open as shown in FIG. The tape 20 is attached to the upper surface of the socket 10 by removing the grip 13 y of the tongue 13 as shown in FIG. A free piece 22 having no adhesive force is provided on one side of the tape 20. Further, the tape 20 has heat resistance to hot air used for reflow soldering described later.

Also, as shown in FIG. 4 (a), the tape 20 is provided on the outer periphery of the upper part 10a of the socket 10 except for the upper pin through-hole 15a forming surface and the upper surface of the outer peripheral part 16a. It is stuck on the upper surface of the inner peripheral portion 17 over the entire circumference. As a result, the tape 20 floats from the surface on which the upper pin through-hole 15a is formed, and is adhered to the upper surface of the socket 10 with the pin through-hole 15 closed above.

Next, the suction jig 50 having a substantially sucker shape shown by a dotted line in FIG. 3B is brought into close contact with the tape 20 at the suction portion X including the base of the tongue piece 13, and the socket 10 is suction-held and held. It is moved to the predetermined position of 30 and placed. As a result, the lower end of the solder 19 of the socket 10 comes into contact with the circuit terminal 31 of the circuit board 30 as shown in FIG. The adsorbed part X is adsorbed From the viewpoint of maintaining the attitude of the socket 10 at the time of suction by the jig 50 substantially horizontal, it may be near the position of the center of gravity of the socket 10.

Subsequently, hot air is blown toward the mounting position of the socket 10. This hot air passes through the open portion 21 of the tape 20 and the slit 12 of the socket 10 to reach the lower portion of the socket 10 as shown by the arrow in FIG. 4 (a), and the heat melts the solder 19 to reflow the solder into the circuit terminal 31. It is ringed.

Thereafter, the tongue 13 is lifted up with the grip 13y as a clue as shown in FIG. 4 (b), whereby the connecting portion 11 is broken, and the tongue 13 is removed from the socket 10 at the connecting portion 11. Separated. Along with this, the tape 20 is peeled off from the upper surface of the socket 10 using the loose piece 22 as a clue as shown in FIG. 4 (b).

Thereby, the connection terminal 18 of the socket 10 is connected to the circuit terminal 31 of the circuit board 30 via the solder 19 as shown in FIG. Although not shown, the CPU 40 is mounted on the socket 10 by inserting the pins 41 of the CPU 40 into the pin through holes 15.

According to the present invention, the tape 20 attached to the upper surface of the socket 10 at the suction portion X of the socket 10 is supported upward by the flat portion 13X of the tongue piece 13 (FIG. 3 (b), FIG. (See (a)). Accordingly, it is possible to prevent the suction jig 50 from lowering the suction holding force of the socket 10 via the tape 20, and to improve the mounting accuracy of the socket 10 on the circuit board 30. After mounting, the tongue piece 13 is separated from the socket 10 at the connecting portion 11 to form the central through-hole 14 so that devices such as the CPU 40 can be attached thereto (FIG. 5). reference).

In addition, the hot air generated during the soldering of the riff opening through the first opening 21 1 formed on the tape 20 and the slit 12 of the socket 10 (See Fig. 4 (a)). Accordingly, the socket 10 and the circuit board 30 can be efficiently heated by hot air, and both can be quickly and reliably reflow soldered.

Further, the surface on which the pin through-holes 15 are formed is entirely closed by the tape 20 so that the movement of hot air from below to above the pin through-holes 15 is suppressed. Therefore, even when the flux contained in the solder is vaporized during the reflow soldering, the vaporized flux can be prevented from rising in the pin through hole 15. This makes it difficult for the flux to adhere to the upper part of the connection terminal 18 mounted in the pin through hole 15. Therefore, when the CPU 40 is mounted in the socket 10, the pin 40 And the connection terminal 18 can be made good (see Fig. 4 (a)).

Since the tape 20 is located above the surface of the socket 10 where the pin through-holes 15 are formed, the adhesive of the tape 20 is prevented from adhering to the surface on which the pins 20 are formed. It is possible to prevent dust from adhering to 15.

Further, the second open portion 2 12 formed on the tape 20 allows the grip portion 13 y of the tongue piece 13 to be removed and the tape 20 to be attached to the upper surface of the socket 10 (see FIG. 3 (b)). For this reason, the tape 20 attached to the socket 10 is prevented from rising at the grip portion 13 y above the upper surface of the socket 10, and the tongue piece 13 at the suction portion X of the socket 10 is prevented. A situation in which the supporting force of the tape 20 becomes weak due to this can be avoided. When the tongue piece 13 is separated from the socket 10, the tongue piece 13 can be easily lifted using the grip portion 13y as a clue.

Further, the tape 20 can be easily peeled from the upper surface of the socket 10 using the loose piece 22 as a clue. In this embodiment, the socket 10 is sucked and held by the suction jig 50 via the tape 20 stuck on the upper surface thereof. However, in another embodiment, the sticking of the tape 20 is omitted. The socket 10 may be directly sucked and held by the jig 50.

Claims

The scope of the claims

1. A method of mounting a socket having a pin through hole for inserting a pin of a device on an outer surface thereof on a circuit board,

At a suction portion including a tongue piece formed by being surrounded by a slit made discontinuous by a connecting portion at an inner portion of the socket, the socket is suction-held by a suction jig and then placed on the circuit board. And

Separating the suction jig from the socket,

Reflow soldering the socket to the circuit board,

A method of forming a central through-hole by lifting the tongue piece and separating it from the socket at a connection portion.

2. Before holding the socket with the suction jig, a tape is stuck on the upper surface of the socket at least in the suction portion,

2. The method according to claim 1, wherein said tape is peeled off from an upper surface of said socket after said socket is reflow soldered to said circuit board.

3. Affixing the tape having a first open portion formed at a position corresponding to the slit to the upper surface of the socket in a state where the slit is at least partially opened by the first open portion. The method according to claim 2, which is characterized in that:

4. The method according to claim 2, wherein the tape is attached to an upper surface of the socket so as to close the pin through hole upward.

5. The socket has an outer peripheral edge and an inner peripheral edge located over the entire outer peripheral edge and the inner peripheral edge in the outer peripheral portion, and is located above the surface where the pin through-hole is formed. The method according to claim 2, wherein the method is performed by attaching to the upper surface of the socket while attaching the upper surface to the upper surface of the socket and the upper surface of the inner periphery.

6. The method according to claim 1, wherein the tongue is lifted by using a grip formed at the tip of the tongue and located above the upper surface of the socket.

7. The tongue piece is lifted by a grip formed at the tip of the tongue piece and located above the upper surface of the socket as a clue.

The method according to 3, 4 or 5.

8. The tape having a second open portion formed at a position corresponding to the grip portion, the grip portion being removed by the second open portion, and being adhered to the upper surface of the socket. the method of.

9. The tape is peeled from the upper surface of the socket by using a loose piece formed by leaving a part of the peripheral portion of the tape unattached to the upper surface of the socket as a clue. , 4, 5, 7, or 8.

10. A socket mounted on a circuit board, provided with pin through holes for inserting device pins in the outer shell,

A socket comprising: a tongue that is surrounded by a slit that is discontinuous by a connecting portion and that is removed after the connecting portion is broken so that a central through hole can be formed.

11. The socket according to claim 10, further comprising: a grip portion located above an upper surface at a tip portion of the tongue piece.

12. The outer peripheral portion is provided with an outer peripheral portion and an inner peripheral portion located above the formation surface of the pin through-hole over the entire outer peripheral edge and the inner peripheral edge of the outer peripheral portion. 1 Socket described in 1.

13.Tape to be attached to the upper surface of a socket mounted on a circuit board, wherein the socket has a pin through hole for inserting a device pin in an outer portion, and the inner portion has a discontinuity due to a connecting portion. Provided with a tongue which is surrounded by the slit and which can be removed after the connecting portion is broken to form a central through-hole. Tosa,

A tape characterized in that at least a part of the slit is opened upward to form a first open portion that can be attached to the upper surface of the socket.

1 4. When the tip of the tongue has a gripper located above the upper surface of the socket,

14. The tape according to claim 13, wherein a second opening is formed on the upper surface of the socket by removing the gripping portion.

15. The tape according to claim 13, wherein a free piece that is not adhered to the upper surface of the socket is provided on a part of the peripheral edge.