METHOD FOR LAYING FLOOR PANELS
The invention relates to a method for laying floor boards, particularly parquet, laminate flooring or wood. In addition the invention relates to a fill band.
In practice it is customary when laying floor boards, in particularly parquet, laminate flooring or wood, to first lay a dampproof layer on a floor. This dampproof layer can for example consist of a synthetic foil. If desired, a subfloor can be placed on the dampproof layer, among other things for levelling the floor. Subsequently the floor boards are placed.
When laying the floor boards a gap must be left open between the walls of the room, where the floor boards are being placed, and the floor boards to allow for the floor boards to expand. Problems that may occur here are that first of all the correct gap width is not always kept up. Furthermore damp may reach the floor boards trough the gap. Moreover noise can be transferred, the so-called structure born sound, when the floor boards touch the wall due to expansion.
It is an object of the invention to at least partially overcome the above- mentioned drawbacks.
The invention to that end provides a method for laying floor boards, particularly parquet, laminate flooring or wood, on a floor of a room with at least one wall, wherein a fill band comprising a dampproof foil band and a compressible filling strip, which has been arranged at one side of the foil band, is laid along a wall of the room on the floor with the filling strip near
the wall and facing upwards, after which the floor boards are laid against the filling strip on the dampproof foil band.
The invention additionally provides as a fill band, comprising a dampproof foil band and a compressible filling strip, which has been arranged at one side on the foil band along one of its edges, wherein the foil band is wider than the compressible filling strip.
By choosing to arrange a fill band according to the invention, a reliable and quick way of placing is supported. The filling strip here fills the gap between the wall and the floor boards. As a result, among other things, structure born sound insulation is achieved. Floor boards here can also be products on a roll.
In addition the application relates to a fill band suitable as fill band in the method according to the invention.
In an embodiment of the method according to the invention a dampproof synthetic foil is placed on the floor, which synthetic foil overlaps the foil band of the fill band. The fill band can then be placed first and the dampproof synthetic foil is subsequently placed over the foil band. Another possibility is to first place the dampproof synthetic foil and only then the fill band.
The foil band can be a (possibly plasticized) aluminum foil or something similar. In a further or alternative embodiment of the method according to the invention, the foil band is a synthetic foil, preferably polyethylene, preferably 0,1 -2 mm thick. In general the foil band will be approximately 5- 30 cm wide. Another dampproof synthetic foil is also possible.
The filling strip can be made of all kinds of compressible material, for example felt. In an embodiment of the method according to the invention,
the filling strip is a synthetic foam band, preferably made of a compressible resilient synthetic foam that returns to its original shape after compression. Furthermore it is possible that the synthetic foam band is a foam band rectangular in cross-section, preferably made from an open cell polyurethane, preferably 5-15 mm high and 5-20 mm wide. The synthetic foam may however also be PVC, PP (polypropylene), PE (polyethylene) or polyester foam, but also natural or synthetic rubber, neoprene, latex EPDM cellular rubber or something similar. The compressible filling strip is attached to the dampproof foil band in a durable manner, for instance by means of heat (fused), gluing or durably attached in another way.
In an embodiment of the method according to the invention the foil band is provided with at least one adhesive at the side facing away from the foam band for attaching the fill band to the floor. This adhesive can be a glue band, if desired prior to use protected by a protective band. A double sided adhesive tape or glue can also be used. This can be supplied separately with the filling strip if necessary.
In an embodiment of the method according to the invention, the foam band is laterally pressed in by means of the floor boards when placing the floor boards. The band only needs to be pressed in a little, enough to achieve a reliable placing and a good insulation.
The invention is further explained on the basis of an exemplary em- bodiment of a fill band arranged according to the invention, in which:
Figure 1 shows the fill band and its placing;
Figure 2 shows the subsequent placing of a dampproof under-layer;
Figure 3 shows the placing of the floor boards;
Figure 4 shows the placing of a finishing skirting board;
Figure 5 shows a cross-section of the fill band.
Figure 1 shows how first of all a fill band 1 according to the invention, is applied from a roll 2. The fill band consists of a dampproof foil 3, in this case a transparent polyethylene. Here said foil is approximately 10 cm wide. It is also possible that the foil, in this case approximately 200 micron thick, is thicker or thinner. The foil may be made of a synthetic material, such as polyethylene (PE), but also of polyester, PVC or another suitable dampproof synthetic material. The foil could also be a thin metal foil or an otherwise thin dampproof foil.
Along the edge of the band a foam band 4 has been arranged. The foam band is placed near the wall 5, in this case neatly against the wall, on the floor 6.
The foam band is made of a synthetic foam that is resilient and compressible here. In this exemplary embodiment an open cell polyurethane foam is used, but also PVC foam or a similar open or closed cell foam is possible.
The foam band has a filling strip width 1 1 of approximately 5-20 mm and a filling strip height 10 of approximately 5-15 mm, in this example a filling strip is chosen having a filling strip width of approximately 9 mm and a filling strip height of approximately 12 mm. The foam band is laminated on the foil. If desired the foam band can also be glued on the foil band, but other ways of attachment are possible as well.
Figure 2 shows how a subfloor 7 has been placed on the floor and on the foil band 3 against the foam band 4. This subfloor has been provided with a dampproof layer at the bottom side. The subfloor among other things serves as a floor leveller and for noise and heat insulation. It also happens that a dampproof foil layer is first placed on a floor and on top of that the
subfloor is placed. By means of the foam band and the foil band a noiseless, tight and reliable placing of the subfloor 7 is achieved. The height of the foam band is such that it extends above the subfloor. In this example the subfloor is flexible and comes from a roll, but the subfloor can also consist of sheets.
Figure 3 shows how a floor board 12 has been placed. This example clearly shows how the foam band first of all serves as a placement aid to guarantee a certain distance to the wall. Furthermore the foil band 3 together with the foam band 4 ensures a good damp barrier. In addition the foam band 4 ensures noise isolation to prevent structure born sound.
It can also be seen that the foam band 4 in this example is lower than the surface of the floor board 1 2. It is it is also possible to make the foam band higher so that it extends above the surface of the floor boards.
Figure 4 shows how finally a finishing skirting board 13 has been placed. It is possible to conceal cables behind it.
Figure 5 shows a cross-section of a fill band 1 according to the invention.
This embodiment clearly shows that the foam band 4 is rectangular in cross-section with a filling strip height 10 and a filling strip width 1 1 . The foam band extends over the full length (perpendicular in the figure) of the dampproof band 3. The foam band is arranged at the edge and along the edge by means of gluing, but can also be arranged in another way known per se.