WO2002027782A3 - Fault detection method and apparatus using multiple dimension measurements - Google Patents
Fault detection method and apparatus using multiple dimension measurements Download PDFInfo
- Publication number
- WO2002027782A3 WO2002027782A3 PCT/US2001/024685 US0124685W WO0227782A3 WO 2002027782 A3 WO2002027782 A3 WO 2002027782A3 US 0124685 W US0124685 W US 0124685W WO 0227782 A3 WO0227782 A3 WO 0227782A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- dimension
- manufactured items
- feature
- items
- identify
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Factory Administration (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001281127A AU2001281127A1 (en) | 2000-09-27 | 2001-08-07 | Fault detection method and apparatus using multiple dimension measurements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67184800A | 2000-09-27 | 2000-09-27 | |
US09/671,848 | 2000-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002027782A2 WO2002027782A2 (en) | 2002-04-04 |
WO2002027782A3 true WO2002027782A3 (en) | 2003-09-04 |
Family
ID=24696108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/024685 WO2002027782A2 (en) | 2000-09-27 | 2001-08-07 | Fault detection method and apparatus using multiple dimension measurements |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001281127A1 (en) |
WO (1) | WO2002027782A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI20041525A (en) | 2004-11-26 | 2006-03-17 | Imbera Electronics Oy | Electronics module and manufacturing process |
US10290088B2 (en) | 2014-02-14 | 2019-05-14 | Kla-Tencor Corporation | Wafer and lot based hierarchical method combining customized metrics with a global classification methodology to monitor process tool condition at extremely high throughput |
CN113042599A (en) * | 2021-03-29 | 2021-06-29 | 成都腾达模具有限公司 | Processing method of qualified grid cell tube |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4571685A (en) * | 1982-06-23 | 1986-02-18 | Nec Corporation | Production system for manufacturing semiconductor devices |
US5385629A (en) * | 1993-10-14 | 1995-01-31 | Micron Semiconductor, Inc. | After etch test method and apparatus |
EP0720216A2 (en) * | 1994-12-29 | 1996-07-03 | AT&T Corp. | Linewidth metrology of integrated circuit structures |
US5715181A (en) * | 1995-04-03 | 1998-02-03 | Horst; Robert L. | Isogrammetric analysis method for high-yield processes |
US5991699A (en) * | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
WO2000045424A1 (en) * | 1999-01-29 | 2000-08-03 | Unaxis Usa Inc. | Morphed processing of semiconductor devices |
-
2001
- 2001-08-07 WO PCT/US2001/024685 patent/WO2002027782A2/en active Application Filing
- 2001-08-07 AU AU2001281127A patent/AU2001281127A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4571685A (en) * | 1982-06-23 | 1986-02-18 | Nec Corporation | Production system for manufacturing semiconductor devices |
US5385629A (en) * | 1993-10-14 | 1995-01-31 | Micron Semiconductor, Inc. | After etch test method and apparatus |
EP0720216A2 (en) * | 1994-12-29 | 1996-07-03 | AT&T Corp. | Linewidth metrology of integrated circuit structures |
US5715181A (en) * | 1995-04-03 | 1998-02-03 | Horst; Robert L. | Isogrammetric analysis method for high-yield processes |
US5991699A (en) * | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
WO2000045424A1 (en) * | 1999-01-29 | 2000-08-03 | Unaxis Usa Inc. | Morphed processing of semiconductor devices |
Non-Patent Citations (1)
Title |
---|
JOHN R. TAYLOR: "Fehleranalyse", 1988, VCH VERLAGSGESELLSCHAFT, WEINHEIM, XP002223636 * |
Also Published As
Publication number | Publication date |
---|---|
AU2001281127A1 (en) | 2002-04-08 |
WO2002027782A2 (en) | 2002-04-04 |
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