WO2002013264A1

WO2002013264A1 - Cooling device for electronic components and method for producing said cooling device

Info

Publication number: WO2002013264A1
Application number: PCT/DE2001/002890
Authority: WO
Inventors: Steffen Kröhnert; Jens Pohl
Original assignee: Infineon Technologies Ag
Priority date: 2000-08-04
Filing date: 2001-08-01
Publication date: 2002-02-14
Also published as: DE10038161A1

Abstract

The invention relates to a cooling device for electronic components. Said cooling device (5) comprises a cooling surface (3) and is larger than the sum of the top surfaces of the electronic components to be cooled. To this end, the cooling device (5) comprises at least one cooling panel (6) coated with a thermoconducting material (7) and a pressing device by means of the which the contours of the top surfaces to be cooled are pressed into the thermoconducting coating (7). The invention further relates to a method for producing a cooling device (5).

Description

description

Cooling device for electronic components and method for producing the cooling device

The invention relates to a cooling device for electronic components and a method for producing the same.

With the increasing density of electronic components on printed circuit boards, in particular for electronic computers and electronic computer and memory modules, the natural heat dissipation and heat radiation of the electronic components to the environment from still air is not sufficient, so that fans often have to be used in order to prevent air movement to cool the electronic components. However, cooling fans of this type have the disadvantage that they have electromechanically moved parts which have a limited service life. In addition, an unpleasant noise level develops for the user, which disturbs the working atmosphere, particularly in offices.

The object of the invention is to provide a cooling device which improves the dissipation of the heat of electronic components on a printed circuit board and to specify a method for producing such a cooling device.

This object is achieved by the subject matter of the independent claims. Features of preferred embodiments result from the dependent claims.

According to the invention, a cooling device for electronic components is provided on printed circuit boards with a cooling surface, the cooling surface of the cooling device being greater than the sum of the tops of the electronic components to be cooled, and wherein the cooling device has at least one cooling plate with the components having a thermally conductive coating and a pressing device, by means of the contours of the cooling tops of the electronic components are pressed into the heat-conducting coating.

Such a cooling device has the advantage that it significantly improves the cooling possibility for electronic components on a printed circuit board. The heat source of such electronic components is formed by the heat-generating active and passive components, in particular the resistors of a chip. The dissipation of the power loss of these circuit elements of a chip essentially takes place via the heat paths:

1. Circuit elements of the chip - chip surface - packaging top - heat conduction to the environment,

2. Circuit elements of the chip - chip surface - packaging underside - circuit board underside - heat conduction to the environment,

3. Circuit elements of the chip - chip surface - external connections, such as pins of the chip - circuit board top (if not covered by chips) - heat conduction to the environment,

4. Circuit elements of the chip - chip surface - packaging surface - heat radiation to the environment to a lesser extent than by heat conduction.

From the chip surface to the packaging surfaces with packaging top and bottom, there is a high thermal resistance due to the plastic packaging, which could only be reduced by using expensive and difficult to process ceramic packaging. In addition, the heat dissipation is limited by the available packaging and / or module surface of a printed circuit board equipped with electronic components.

It can be assumed that the underside of the packaging or the underside of the housing of electronic components is covered by the circuit board in such a way that the underside of the packaging of an electronic component is not can participate significantly in the heat exchange. Thus, for cooling a densely packed, possibly double-sided printed circuit board, there is hardly more than the sum of the actual packaging tops of the electronic components available for heat exchange with the environment.

The advantage of the present invention is that a cooling surface is made available which is larger than the sum of the upper sides of the electronic components to be cooled and thus improves the cooling of the components. In addition, the heat transfer from the component surfaces to be cooled to the cooling device is reduced by a cooling plate with a thermally conductive coating, because a pressing device provided for the cooling plate presses the thermally conductive coating onto the tops of the electronic components in such a way that the contours of the tops to be cooled in the heat-conducting coating is pressed in.

In this way, an intensive heat transfer contact between the cooling device and the upper sides of the electronic components to be cooled is advantageously made, so that on the one hand a relatively quick heat exchange can take place between the electronic components via the cooling plate according to the invention with a thermally conductive coating, and also the cooling plate itself their larger surface than the sum of the tops of the electronic components to be cooled can emit considerably more heat into the environment than the components themselves.

The heat can be released to the environment in particular by

Blackening and / or roughening at least the outside of the cooling device can be increased according to one embodiment of the invention, so that the contribution of the heat radiation to the environment is increased compared to the heat conduction.

In a further embodiment of the invention, the cooling plate can be removed from the printed circuit board at any time. cash and can therefore be replaced at any time for maintenance and repair work.

In one embodiment of the invention, the cooling plate has a plurality of contact surfaces which are adapted to the dimensions of individual electronic components to be cooled. On the one hand, the contact surfaces are pressed together onto the total number of electronic components. On the other hand, the different contact surfaces can optimally create individual components, especially since, in a further preferred embodiment, the contact surfaces are separated from one another by slot holes in the cooling plate.

In a cooling device according to the invention, it is also provided that only one cooling plate is pressed against a component-equipped side of a printed circuit board if the rear side of the printed circuit board is not equipped with components. In this embodiment of the invention, the cooling plate has a spring element which is supported on the back of the circuit board. This spring element can be a U-shaped leaf spring which presses at least one individual cooling plate against the electronic components to be cooled on a front side of a printed circuit board with a first leg of the U-shaped profile and is supported on the back of the printed circuit board with its second leg.

This embodiment has the advantage that the space requirement of the cooling device is minimized, so that the cooling device can also be subsequently inserted by the customer or customer in the standardized spaces between printed circuit boards of a computer or a storage unit. The U-shaped leaf spring itself can be molded into the cooling plate, so that the cooling plate and the leaf spring form an integral unit.

In a further embodiment of the invention, the cooling plate is arranged plane-parallel to the circuit board. This Embodiment is particularly suitable for printed circuit boards with electronic components which are mounted on the printed circuit board at the same distance, so that the upper sides of the electronic components to be cooled lie in a plane extending parallel to the printed circuit board.

In a further embodiment of the invention, it is provided to use the cooling device for a printed circuit board equipped with electronic components on both sides. In this case, the cooling device has a front cooling plate for a front side equipped with electronic components and a rear cooling plate for a rear side of a printed circuit board equipped with electronic components. The cooling plate pair has the advantage that its front and rear cooling plates can be pressed onto one another with a single spring element.

Here, too, it is possible to provide a leaf spring as a clamp, which at the same time forms an articulated axis via which the cooling plates can be pivoted and / or spread. The spring element, which can either form the hinge axis itself as in the case of a leaf spring, or which is arranged in the region of the hinge axis, exerts a contact pressure on the front and rear cooling plates, so that both plates can be pressed against one another. This has the advantage that the cooling plates are self-aligning against the upper sides of the electronic components to be cooled and the contours of the upper sides of the circuit elements to be cooled are pressed into the heat-conducting coating of the cooling plates.

If a U-shaped leaf spring is used as the spring element, the leaf spring can be preformed as a clamp, its legs pressing the front and rear cooling plates against one another.

In a further embodiment of the invention, the spring element is a torsion bar, which at the same time is a cardan shaft forms for the front and rear cooling plate. For this purpose, a cylindrical torsion bar has angular profiles at its ends, which are in engagement with correspondingly shaped sections of the rear and front cooling plates. This has the advantage that the spring element can simultaneously perform two functions, namely the function of a propeller shaft and the function of the pressing device, which is associated with a considerable saving in space.

In a further embodiment of the invention, the spring element is a helical spring which is arranged around an articulated shaft. In this embodiment, the helical spring and the cardan shaft are two elements which are adapted in their geometry to the cooling plates in order to press them against one another from an axis region.

In a further embodiment of the invention, the front and rear cooling plates are coupled in a clamp-like manner and themselves have a clamp-like cross section. For this purpose, the coupling takes place via a cardan shaft and the front and rear cooling plates have bulges encompassing the cardan shaft, the front and rear cooling plates alternately having a bulge and a recess in the joint axis direction. The bulges and recesses of the cooling plates are arranged such that they can engage in such a way that bulges of the front cooling plate protrude into recesses of the rear cooling plate and vice versa, so that they form a common axis area in which only the cardan shaft is to be arranged in order to form a clamp profile form.

In a further embodiment of the invention, the front and rear cooling plates have plate-shaped clamp handles which protrude beyond the drive shaft or the drive axis. In this embodiment, the plate-like design of clamp handles of the cooling device, which is clamp-like in profile, creates additional surfaces for heat dissipation into the surroundings. This is the cooling surface of the Cooling device not only depends on the surface area of the circuit board, but the cooling surface can also protrude and be adapted to the cooling requirement.

In addition, the upper part of the cooling device, which protrudes beyond the plate size, can have cooling fins in the region of the clamp handles, which are introduced in such a way that they do not change the external dimensions of the cooling device, which is clip-like in profile. This has the advantage that the cooling intensity can be further improved and increased. It is also possible to arrange cooling fins on the outer surfaces of the cooling plates, including the outer surfaces of the clamp handles. However, this would at the same time increase the external dimensions of the cooling device considerably with the enlargement of the cooling surface, so that a coordination between the cooling surface requirement and the spacing of the individual printed circuit boards from one another is necessary in an electronic device.

Aluminum sheets are provided for the cooling device. In particular, the cooling plates have a heat-conducting aluminum alloy. Aluminum has the advantage that it does not tarnish like copper and nevertheless has approximately the same good heat conductivity as copper, provided that suitable heat-conducting aluminum alloys are used. Aluminum alloys have the property that they are covered with an increasingly protective oxide layer which prevents further corrosion and oxidation even in a humid atmosphere. Furthermore, aluminum sheets can be anodized black, so that the heat radiation is improved.

In one embodiment of the invention, the heat-conducting coating is a spacer filling material with a low heat transfer coefficient to the top sides of the electronic components to be cooled and to the top sides of the cooling plate. The low heat transfer coefficient can also be achieved by an additional, for example metallic coating of the heat-conducting coating of the cooling plates. Layers reducing the heat transfer coefficient in this way are vapor-deposited or dusted-on metal layers made of aluminum alloys or bronze alloys.

In a further embodiment, the heat-conducting coating on the cooling plates has a foam with a heat-conducting impregnation. In such cases, the heat-conductive impregnation consists of a binder with a metallic filling material, so that the foam remains compressible, but at the same time its heat-conducting property is improved.

In a further embodiment of the heat-conducting coating, it has an open-pore foam, the pore surfaces of which are coated with heat-conducting metallic thin films. Such metallic thin films are applied to the pore surfaces by infiltrating an emulsion of dusty metal particles in an evaporable liquid, for which purpose the open-cell foam is immersed in such an emulsion.

Another embodiment of the invention provides that the cooling device has a height stop. The height stop is adapted to the size of the circuit board and is supported on an edge of the circuit board when mounting the cooling device on the circuit board.

Furthermore, in one embodiment, side guides can be provided in order to ensure the lateral positioning of the cooling device in relation to the printed circuit board.

As an embodiment of the invention, an arrangement of the cooling device on storage components and / or a storage module is provided. Such an arrangement has the advantage that the different heat peaks of the memory components of a memory module are compensated for by the cooling device and additionally an increased power loss for a memory module can be approved. For this purpose, in this embodiment, the arrangement can comprise the storage module on both sides by means of a rear and front cooling plate.

In a further embodiment of the invention, the arrangement of the cooling device on a memory module has a base in which the memory module is arranged with contact connections and the hinge axis of the cooling device is arranged above an edge of the memory module opposite the base. This results in a compact arrangement for a memory module with intensive filling options.

A method for producing a cooling device has the following method steps:

Manufacture of at least one cooling plate from a heat-conducting sheet metal strip for covering component tops to be cooled, blackening and / or roughening at least the outside of the cooling plate facing away from the component tops to be cooled,

Coating the inside of the cooling plate facing the component tops to be cooled with a heat-conducting coating, forming or arranging at least one spring element on the cooling plate for pressing the cooling plate onto the component tops to be cooled

This method has the advantage that a cooling device can be produced in a cost-effective manner, which only has a cooling plate with a spring element and can be easily positioned on the component tops to be cooled. With a simple stamping press process, the cooling plates can first be stamped out of the sheet metal strip. The outside of the cooling plate can be roughened and / or blackened by chemical treatment and / or by coating the metallic cooling plate. In a further implementation of the manufacturing process of a cooling device, the following process steps are carried out in succession:

Producing a profiled sheet for forming clip halves with bulges which are molded into the profiled sheet in a predetermined axis area between a clip area with a cooling plate and a grip area,

Making recesses in the axis area alternating with bulges

Separating the profiled sheet into clip halves Blackening and / or roughening at least the outside of the clip halves facing away from the component tops to be cooled

Coating the inner surfaces of the cooling plates in the clamp area with a heat-conducting coating, providing a spring element in the axis area, - joining two clip halves in the area of the bulges or the cutouts, aligning the spring element in the axial direction and inserting a cardan shaft into the bulges in the axis area with placement of the Spring element under pre-tension in the axis area of the cooling device.

This method has the advantage that, with a simple extrusion process or with a stamping press method, clamp halves are first produced, which are then aligned with one another in a simple manner and are connected to a clamp profile via a common cardan shaft. When inserting the cardan shaft, the spring element can be placed at the same time, so that a pretension occurs in the axis area of the cooling device. In this way, a pressure device is implemented in a simple manner in the interaction of the propeller shaft and the spring element. This results in a relatively simple method for producing a cooling device according to the invention.

A heat-conducting coating can be applied to the inner surfaces of the cooling plates directly after the extrusion process or after the stamping and before joining the clip halves, by spraying the coating onto the inner surfaces of the cooling plates.

A further implementation of the method provides that the coating is cut from a supply of coating material and then glued in the intended clamp area on the inner surfaces of the cooling plates. In addition, heat-conducting adhesives with, for example, metallic filling materials are used in order to keep the heat resistance of the adhesive layer and the heat transfer from the coating to the cooling plate as low as possible.

If the heat-conducting coating is an open-cell foam material, the heat conduction can be improved by depositing thin metal layers on the surface of the pores. Infiltrating a binder with powdered metal particles can also improve the thermal conductivity of a foam applied as a coating.

Before, for example, an axle bolt is positioned as a connecting cardan shaft in the axis area of the cooling device, the clip halves created with the extrusion process or the stamping press process can be aligned with one another with their bulges and recesses, in order then to be able to push the cardan shaft through the aligned axis area. If a coil spring is provided as the spring element, it must be brought into position in good time so that a corresponding pretension can form between the front and rear cooling plates after the propeller shaft has been positioned. In a further preferred implementation of the method it is provided that slot holes are made in the clamp region of the clamp halves by means of a stamping press in order to produce individual contact surfaces for individual electronic components. Such slot holes are not intended to disassemble a cooling plate into individual parts, but rather to allow the cooling plate to individually give in at the positions of the contact surfaces, for example to compensate for differences in height of the components.

To assemble the cooling device on a printed circuit board, one implementation of the method provides that, after the drive shaft has been inserted, the clamp area is spread out under a pivoting movement around the drive shaft by compressing the grip area and is placed on the top sides of electronic components of a printed circuit board to be cooled under pretension. This mounting or attachment method is so advantageous and simple that the cooling device both at the manufacturer of memory modules and at the customer of

Memory modules can be positioned. The heat-conducting coating will compensate for different distances between the surfaces of the components and the cooling plates when placed on the tops of electronic components, the coating adapting itself to the contour of the electronic components to be cooled.

This is a considerable advantage of the invention, since usually the electronic components positioned on a printed circuit board differ in their height or distance from the surface of the printed circuit board and the heat transfer is already considerably reduced if there are micrometer-sized distances between the cooling plate and the top surfaces of the electronic components to be cooled occur.

The invention thus relates to the cooling of memory components, in particular memory modules (DIMM, RIMM), and solves the technical problem of dissipating the resulting power loss or reducing the heating of the components due to this power loss. This is compounded by the fact that the chip of a memory chip is very small in relation to the package or packaging (eg 256M in TSOP54). This results in a high thermal resistance of the package. In addition, however, the available package and module surface for heat transfer to the environment (ambient) is limited, so that essentially with a densely packed double-sided memory module, hardly more than the projected package surface is available for heat exchange.

The thermal resistance for this available surface per component in the ambient desire (without thermal resistance of the package) is> 220 ° C / W, whereby the heat transfer coefficient is 10W / m ² ° C for still air, with an area of 16x28mm ² per component.

To dissipate the heat output, a heat spreader or a cooling device in the form of a clamp is placed on the storage module. The heat spreader consists of two sheets, preferably made of aluminum. These sheets are bent and recessed so that they can be inserted into one another and assembled with an axis to form a bracket. Gapfiller materials are applied to the inside of the heat spreader, which touch the component surfaces, which ensure good heat transfer from the component surface into the brackets. One or more springs, for example torsion springs, ensure that the clips are pressed against the memory components.

The upper parts ("handle") of the heat spreader plates serve as additional surfaces for heat dissipation into the environment. An additional height of around 16 mm can double the convection surface for a 31 mm high module. By further fanning out and / or surface By increasing the handles, the effect can be increased.

Both height and side guides can be included in the sheets for easy and safe assembly, so that positioning of the heat spreader on the module is made easier.

Materials in the prior art can be used as gap filler materials, e.g. Bergquist HiFlow (phase change material with particularly low thermal resistance) or Aavid CSP pad, which has the advantage that the surface of the material is dry, i.e. the heatspreader can be easily removed from the module.

To ensure good contact between the heat spreader and the components, the heat spreader can e.g. can also be designed with slots so that the contact surfaces for the individual components are decoupled from one another.

With the solution according to the invention, there is a considerable reduction in the module thermal resistance with only a small additional height and, moreover, simple assembly of the heat spreader on the module both at the manufacturer and at the end user.

Embodiments of the invention will now be explained in more detail with reference to the accompanying figures.

Figure 1 shows a schematic three-dimensional view of a first embodiment of the invention, Figure 2 shows a schematic plan view of the first

Embodiment of the invention, FIG. 3 shows a schematic side view of the first embodiment of the invention,

FIG. 4 shows a schematic top view of a second embodiment of the invention, FIG. 5 shows a schematic side view of the second embodiment of the invention,

FIG. 6 shows a schematic plan view of a memory module with nine memory elements, FIG. 7 shows a schematic plan view of an arrangement of a memory module with a cooling device attached,

FIG. 8 shows a schematic side view of an arrangement of a plurality of memory modules with attached cooling devices.

FIG. 1 shows a schematic three-dimensional view of a first embodiment of the invention, which represents a cooling device 5 for electronic components on printed circuit boards with a cooling surface 3, the cooling surface 3 being greater than the sum of the top sides of the electronic components to be cooled. In this exemplary embodiment, the cooling device 5 shows a cooling plate 6 with a heat-conducting coating 7. In this exemplary embodiment, the cooling device 5 is divided into three areas, a bracket area 31, which essentially corresponds to the area of the heat-conducting coating 7, and a handle area 30, which The cooling plate 6 is extended in a plate-like manner beyond the clamp region 31, and an axis region 29, which connects two cooling plates 12 and 14, which are pressed onto one another with a pressing device, in a pivotable and spreadable manner via a cardan shaft 17.

The heat-conducting coating 7 is arranged on the inner surfaces 33 of the cooling plates 12 and 14. Such a cooling device according to FIG. 1 is provided for a printed circuit board equipped with electronic components on both sides, so that the cooling plate 12 covers a front side of a printed circuit board equipped with electronic components and the rear cooling plate 14 covers a rear side of a printed circuit board equipped with electronic components. Both cooling plates 12 and 14 are coupled like a clamp and have a clamp ω ω r NJ

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PPP Φ P tr CΛ rt ιP P ¹ HPPP ⁾ N φ t- <H iQ * P tr * P CΛ P ⁾ P tp Φ Φ s- rt φ φ P ιP P>: Hi N φ Φ rt P- P HZ H Φ P ⁾ ^ φ • d P Φ P- Ω P p Φ PPP = Φ

P rt φ P "o Φ PPH Ω φ Φ cn P- P- rt Φ tr P ¹ φ P- CΛ tr Hi tr 3 P- tr

P ¹ Φ P> o Hi n P- O tr P- P- ω <et rt P o P ⁾ P rt Ω Φ £ φ P- P tr P. P ¹ P>

P> t P 00 p. rt 3 ιQ P> ιP P rt PP Φ Ω ⁾ φ Φ ιQ rt Φ tr P Φ ti P cn Φ Φ φ P

3 φ Qπ φ rt P Φ P- P φ P- tr HHP φ rt H Φ * - P- P ¹ α Φ P- HP cn

3 NNP sQ cn cn PHP Φ P- • d Hl PP φ Φ Ό P φ cn P- Φ P- Q. φ P 2 Q φ ω Φ Φ Φ O Ω ιQ Φ φ PP ⁾ P- φ HP ¹ P "rt φ cn rt cn ^ φ

H ιP Φ Φ rt ro P> P- 0 ti tr Qπ P- HP ⁾ X Φ P ⁾ P ⁾ tö ^ iQ rt P- Φ p: P P- tr cn P- Φ PH Φ Φ tr φ Φ P. rt rt P- V P- ti rt P> Qπ Φ Φ ιp P- tr P

CD: N rt O: P w Φ P- p- H φ t-i P J φ Φ rt Φ P-: P rt rt P Φ Qπ P P rt \ - o α

P "Φ Φ HNPHP tsi P- ⁾ f 1 ti Φ H Φ P sQ p- Φ rt ω P- Qπ cn tr P- <tr Φ

Hl P- P Φ s Qπ Hi cn Φ rt tö 3 M Hi Qπ Φ α φ iQ Φ φ Φ φ ιP o Φ 3 rt Ω P Φ P- Ω rt P ⁾ rt tr O: <1 φ PJ P w φ Hi Φ 3 P- CJ P Φ cn ti H

Φ tr «P- P- P tr • PP P- P- H 0 ι-i P p: H, O P- 1 Φ P- rt tr ti cn CΛ φ P" N rt tr α Φ P rt P iQ P 3 H cn tr H α rt Φ Hi P- ta P p: Φ P- φ P- ω P ⁾ P φ ti P 3 Qπ φ Hi Φ P P- Qπ sQ cn P- ^J J 3 1 O: P Cu: Φ Ω cn Ω P- Ω ro 3 Φ P p ⁾ p- cn PP ^ 3 Φ P φ o Ό P rt Hi P- ^• d H Φ P f rt tr rt tr

P ¹ 3 Qπ P ιQ rt ⁾ P ¹ Φ cn Φ ti CΛ ti P "Hi O: tr H 3 H t rt p: rt Φ Q 00 Φ Φ P ¹ P-

Bf P φ rt HP Φ Hl P- Qπ P ⁾ S s: HH Φ P- cn Φ p: Φ Ω PP Qπ

Φ HH ⁾ P cn cn NPP ⁾ P p: Ω) rt Φ Φ 3 Φ CΛ sQ Φ H tr PP P- tr N tr ■ 3; r P ⁾ Ω Ω φ Φ cn iQ ω tr tr E rt P- H P- P CΛ Φ P- P ¹ rt sQ Qπ Φ

O: P P>: P J3 o Ω tr tr P- P Hi Φ P H rt Φ CΛ P. iQ rt P rt • tτ <Φ φ

HP "P Φ • d tr Φ P ^J PP = PP ⁾ PP φ Qπ rt Φ Φ N CΛ P" Φ) H Cd

Φ Hi rt H Ό P- φ P> tr rt Qπ P rt P- P ⁾ - • P s: ^ Φ P ⁾ P- er ¹ P Φ

P Φ rt Φ tr P ¹ ^ α Φ li PH Φ rt Q Φ P tö Φ PH Qπ H rt rt Φ Hi φ cn

H Φ H CD: P P- H εo Hl P Hi Qπ CΛ P- Hi α P- PO P- rt Φ P- P "Ω tr P ¹ P ι P ⁾ Φ f P x, Φ Φ Hi cn! ^ P - cn P ⁾ rt Qπ Hi φ «Φ H rt Φ φ tr

P- ω cυ Hi ιp PPP Φ Qπ υq P ¹ Qπ HO rt p: Φ Φ O rt Φ P- p: • d Φ P- ts ¹ P-

P cn P- rt p. Hi P- P- cn J Φ H • tr P- rt P Qπ r tr cn P ¹ ti P et Ω

^ Tr Φ P> cn rt φ Hi 3 ti tr 3 P ¹ ^PP) Qπ Hι P CΛ ^p:) • d Φ H tr p. P P> P- P> Φ O § P- Ό Φ - P> Φ CΛ φ tr OP ⁾ rt P ¹ O rt

Φ s: • Ω P ti NH φ ιQ PH CΛ 03 Qπ Ω IQ P ¹ P- P rt p ⁾ 3 PP

P> P): Φ PJ φ tr Hi OP 3 H Φ rt Φ p ⁾ Φ tr CΛ Φ Ό p ⁾ Hi Φ rt P- P- P tr H ti P- H rt P ¹ iQ tr Φ H rt Φ cι \ P- H Φ P- vQ P ¹ rt * _* P rt rt CΛ sQ tö P> ι PP p ⁾ I - P. P- H rt P- 1 P- PP Ω Φ J rt Φ Ω

P ⁴ φ tsi Φ φ P ⁾ Φ rt p: P- P- -> Φ ^ φ P Hi φ tr P rt Φ Qπ Ξ Φ tr P-

P> P φ cn f *. PP rt tr H Hi Qπ P P- cn 0: P- φ rt P- φ Φ P ¹ Φ P rt P- rt P P- Hi Φ P ¹ P- Hi Φ ιQ Ch φ H t PP "p ⁾ P ^ Φ α Φ P- P- φ P rt Ω Φ P ιP N φ Φ rt P P- 3 P: PP P- 1 cn PP ¹

Φ tr P "rt P Qπ P 3 P Φ p: H Ό rt P- tr Qπ Hi φ σ. Hi tr rt α rt tö P- P - ^> Φ H P- P- Qπ P- <! CΛ tr P "P- iQ P« PJ P ⁾ O: Φ HHJ Φ φ Φ P rt H φ - rt φ PO Φ P>P> iQ Φ * d cn tr Qπ N 3 H P- p: OP

P tr • ro p: P φ H, P- * d PP ¹ CΛ Φ P P- 3 cn P- Ω P rt π φ P Qπ φ tr ö ιQ P • d tr tö P ⁾ S rt n rt P- * φ X P- Φ o

P- P> α Φ P- HP ¹ P- o Φ * • P ⁾ P> PJ Φ P ¹ rt ⁾ P = K iQ P- et cn P- P

Qπ Ω rt P- H cn cn φ - tr Φ cn rt P ι- (cn P ⁾ rt rt rt ap: Φ Φ φ ^• x • Ω P ¹ rt

P> tr rt φ rt rt P Hi Φ H φ O rt P PJ rt rt Φ Φ N p: tr P- P: tr Φ P

H rt φ Cd Φ Φ HP ⁾ tr tr Φ P ¹ p: rt H Φ Ω P ¹ P tö cn tr φ P, iQ tr P ¹ Φ Φ cn H φ P α P ¹ Ω Hi P- P? Sr φ Φ P ¹ s: P ¹ P tr φ

Φ sQ Φ P ⁾ P- P <! Φ rt P Φ P ¹ P> Φ X Φ 1 ⁾ . CΛ P 3 ⁾ Φ Φ P

1 Φ P cn rt PP o P- P- ro CΛ P "rt 1 P ¹ Φ rt P- o P- 1 Φ 1 rt Φ cn P 1 Φ P- Φ rt cn p. 3

1 1 Φ P 1 P 1 Φ 1

o ro ro t- ^π P> cπ o Cπ o Cn o π

rt P. K o t-d H α et CΛ P i Cn ^ Hi ^ O: cn P Qπ t α α P rt rt P "o s: l-i ^ σ

P P- O: tr O: PJ Φ * d P P> P- P ¹ P: P- Hi P ⁾ P P- p: P- Φ φ φ φ P ¹ Φ PP ro Φ φ P ¹ P-

P φ tr Φ tr PHPP, P. P- rt p ⁾ tr SQ Hi 3 rt φ tr φ P rt PPP CΛ cn P ¹ P- P ⁾ φ vp φ H Φ ιp p: Qπ Φ Hi P- 3 HPP Φ P ¹ Φ cn ^ s: cn Φ Ω 3 φ P cn P CΛ tr φ P- φ Hi O § P ti P 3 p, Ό> ^ PH rt s: O: Η P Φ tr 3 r

P ⁾ P- P ⁾ rt PJ Hi Φ PNH tr P φ PP P- tr PP ^« PP ¹ P P <p: Φ P ⁾ rt φ p:

PPP Φ P o ti Φ 3 Φ ιp CO ιq rt P ⁾ cn P ⁾ CΛ P ⁾ ^ P ⁾ rt H tr ^p . cn P ¹ ro H tr

Hi Φ cn P cn li tö PO: H tr cn P ¹ Ξ rt s: 3 P ¹ φ 3 NP "PP • d -J o tr P-

Ω Ω 3 tr φ ιp φ Φ p): Hi N t 0- tr O: rt O: 3 P ⁾ 3 rt Φ PPH • Φ • d

P- cn tr W t P- cn Qπ P- H 0 Φ P- Φ Φ P "φ ιq φ ιP ιp P- PJ H

Φ Φ P ¹ P> P ¹ Qπ P Ω Φ P- Ω Hi P, P- P ¹ P α tr tr H 3 φ ι- (CΛ P "Φ Ω PH φ P>

P P- P> PP ⁾ Φ PJ tr H Ω tr Q rt 3 ι CL. Φ PP ¹ P tr Φ sQ tr P- - ~ JP tr ιP 3 P- rt rt vv HP P- tr Φ φ Φ rt Φ> ti P ro P pi: ti Φ p>: Ω 00 rt φ Ω rt

NP "CΛ Ω * Φ - ¹ P Qπ PP ιP ι P ¹ tr PP ¹ tr P>P> • O tr Φ

P P- ro Φ ro W tr P ¹ P ro φ φ φ cn 03 φ P ⁾ φ Hi PJ: P: Hi P ¹ P- co H Ω

Ω -j P- -j HN et P) o P co ^p , P- Ξ φ P r P rt P- tr rt 3 CΛ cn α tr co

P tr P 'Hi Φ P 3 P- f ro P P- O: P- • Φ Hi φ Φ P- rt P P- P CΛ P "ro p: Φ x Φ P- P- P 3 PP ⁾ M φ PP "Ω P> P rt li rt CΛ P Φ Φ φ tr O: HP ιp sQ Φ P Ω P ι-i tr tr co α 00 Φ CO Ω φ α rt P P-

P "P Φ rt HN tr P Hi cn P Φ _** P co α ro P- tr P- π tr Φ cn φ o P t → HP tr P cn Qπ P- Ω Φ PPH £ ro CO Φ tr P. P r ~ Φ P- rt

P ts Φ Φ P Qπ P>: cn ro Φ P tr H ιp φ Ω φ «cn HP ⁾ H PJ PP ⁾ ti P ti P P- Φ ι Φ Qπ P ¹⁾ ω Φ Φ tr Φ tr Ω tr Φ P ^ 1 cn 3 Φ Φ φ P- φ Φ rt P- H Φ Hi P ¹ cn P 3 Qπ P Φ H tr o P ⁾ P 3 tr Φ s: 3 H P- PP

P ρ * r CΛ φ PPH rt | 3 H cn PP) P- P Qπ CΛ cn tr PP Φ Qπ O: φ Φ Ω et Φ ti Φ P lO Φ Φ p ⁾ P: ιq rt Φ P> Φ P P- Φ rt P φ P φ ti P tr cn & o Φ P- ^> d rt PPP ιp 3 tr P- co P- φ φ φ Qπ P- Hi H tr tr H ti tr rt P ¹ ιp Φ Φ p: s: φ P- Φ cn Q Qπ Ω P P- cn HP Φ Φ P PJ: t- "ro P- Φ

Φ ^t -d Φ p ⁾ Φ HH p- CO P- P rt ^p . Ω Φ φ P tr f PO tr 3 Φ

P tr cn P ¹ ro li Φ P tr P ¹ P- ι-i rt P cn Φ PJ P- P α P ¹ PP): UD Hi P- li o P rt Φ Φ ιP Hi P Hi cn cn Hi rt p ⁾ PJ Ω OX p: P- Φ φ φ P Ω cn P- α - rt li 3 Φ rt sQ P- tr tö φ P- p: Φ PP "tr P" P tr P P- P φ tr cn CΛ Ω D tr M φ P φ Φ Λ Φ φ

P- rt tr φ tr PP ⁾ o P φ PJ P P- CΛ? R sQ P- Ό tr & P- P p P rt li H rt P- H ι P- rt cn sQ HP Φ φ φ s: P ^ φ Ω P) Η P. tr Qπ 3 rt P> co α Φ Φ φ OP Φ ^t ö P. rt rt P- cn P- Φ PJ cn tr H 3 H cn Φ H Φ ≤. 00 ro Φ φ P- P-

P P P ≤ o Φ rt Φ P- 3 Φ Q φ rt P rt et P P- Φ P- t-i φ P- P> H P- Ω Ω

P- sQ CÜ: cn HP 3 P- P- H Φ ^p , Φ ι Φ tr P rt cn Φ 3 co PP »J s: P tr tr

Qπ Φ Φ P 'P- Qπ rt Φ P "P Φ ι Ω J ι cn ri ^ 1 Qπ P Φ tö φ φ

Φ HPH rt cn PP ¹ tö ιp Φ CΛ D Φ ϊ * r H Φ P- Φ P Φ P ⁾ Hl P- ti co

HPP ¹ P- Φ H ro φ P. Q Φ P φ P> cn t φ PPO 3 P- P- sQ rt P • CΛ Φ Qπ o P

P <3 Φ o - ¹ Ω H Φ Φ Λ- r P- cn -J rt P cn H Ω Ω Φ • ιP rl- P- PP φ p O P- P Φ tr φ HP "O s: rt P- HP »cn H tsi tr tr ιq Φ Pt rt ti P rt

P ¹ H CΛ PP ¹ P- Φ ^> Φ Ω PJ Φ cn tK> 1 O P- PP rt φ α OP P- Φ Ω P Φ φ ιP rt p- P. £ -. Ω QPOP "P tr P Ω OP ¹ P ⁾ Ω cn PP P- H r 3 tr ^p . W φ Φ Φ P s. P- _* t Φ PS ¹ Φ P- p ⁾ rt ιq Ϊ ⁾ tr HP ^{^} P ⁾ P CΛ p: Φ P. Qπ sQ rt rt ι-i cn rt φ φ s: P "φ P φ rt α P- P rt s ιq P- tr P Φ Φ Φ Φ Φ

H Φ • tö P> Φ Φ rt cn Qπ o Φ J 3 P P P 3 cn Ω Φ CΛ Φ H Ω H tr P- P-

OX tr Φ P ¹ φ Φ PP ¹ • h- P- φ ^p , to φ P. ιP P Φ φ tr H Ω rt tr φ P

P p: Φ ≥; N Φ ti H Xr P ¹ l Ω HN ^p , P Φ ιQ P tr rt tr 3 CΛ ^ P Φ rt

P- tr P Φ P cn s: φ ö tr P ^ cn tr HP 2. φ tr H P- Φ P ¹ Qπ P • cn r-> tr ιp P ¹ rt s: Φ P- J rt Φ Φ P ⁴ P- P): Ω 00 P- PP ⁾ Φ PJ rt PP ⁾ φ

Ω <Ξ Φ -j φ PJ: P ¹ P ¹ φ PH rt P- φ P * tr P> H φ ti HPP ⁾ rt tr 3 φ tr o φ P PJ HP ¹ -J cn cn P Hi to tr P Φ tr to ¹ Φ 3 Q Ω P-

Φ li ι-i P φ 3 φ ^ α P- rt P- Qπ sQ rt P- Φ P ⁾ P ιP Φ Φ li Φ Φ tr P

P ι-i Qπ Φ Hi P- P Φ tr 'Φ P Φ cn ti φ Φ CΛ P- PP Φ P α H Φ HP ¹ cn Φ

P- φ P- P cn P ¹ P-) H Qπ P rt P- 3 P- P Qπ ιq NN Hi P- φ P- tr φ φ P tö Ω PP P- φ Hi φ -JP 3 • CΛ φ OP φ 3 φ s; Φ φ Φ P Ω CD: PP

P> tr φ φ P p: P- PJ § ^t ö Qπ Ω P- cn Qπ α P P- O Φ P- Qπ tr P ¹ W tr

P 1 P t 1 Φ P φ o P- P tr P Φ rt H P- sQ Φ Hi 1 φ 1 3 1 P- cn p, 1 φ cn Φ 1 H α 1 1 H Φ ro rt 1

P 1 l 1 1 φ

ensure parts. The schematic side view of FIG. 3 also shows the ends 37 and 38 of the helical spring, which press the two clamp halves 32, 36 against one another in the region of the heat-conducting coating 7.

The spring element 11 can also be a torsion bar at one point of a helical spring, which at the same time forms the drive shaft 17 for the front and rear cooling plates 12, 14. For this purpose, a torsion bar, which is cylindrical per se, will have angular cross sections at its two ends, which cross with the

Clip halves 32, 36 are engaged in such a way that the two clip halves are pressed onto one another in the clip region 31 or pressed onto the upper sides of the components.

Figure 4 shows a schematic plan view of a second

Embodiment of the invention. Insofar as they represent the same elements, the reference numerals are identical to the reference numerals in FIGS. 2 and 3. In particular, the entire axis region 29 is the same as in FIGS. 2 and 3. However, the clamp region has contact surfaces 9 that correspond to the

Dimensions of individual electronic components 1 to be cooled are adjusted in their width and height. These contact surfaces 9 in the clamp region 31 are separated from one another by slot holes 10, so that in addition to the molding of the heat-conducting coating 7 in the clamp region 31 into the contours of the electronic components 1, the contact surfaces 9 can adapt to individual height differences due to their spring action. If there are considerable differences in height, offsets can also be provided for the individual contact surfaces 9, which compensate for corresponding differences in height of the components.

FIG. 5 shows a schematic side view of the second embodiment of the invention from FIG. 4. The reference numerals for identical elements of the embodiment according to FIG. 5 are identical to the embodiment according to FIG. 3. The side view according to FIG. co ω ro ro P *

Cπ o cπ o Cπ o "Cπ

P tr P ¹ 3 P rt Qπ Q cn ö P- rt Qπ tr <P- cn P cn tö tr α l → P CΛ tö 3 ^ Hl CΛ ⁾ cn Φ Po

PJ o φ φ P- P tr 0 P- P Φ Φ P- P ⁾ φ P P- Φ P- φ Φ P- Φ P- P- P ⁾ O p- O rt P Ω P ¹ P

3 P ¹ tr POH Φ Φ ti φ P li PP φ CΛ Hi Φ P- Ω PP Q. iP li p, Hl tr Φ P

P- tr φ P ⁾ P Ω p, Qπ Qπ P- cn rt φ Qπ tr rt P- rt tr Qπ rt PP 3 P Ξ P- P - ιP rt ι-i P CD: tr cn P ⁾ t → P- P φ <Φ P P- P rt p. PN Φ et Φ H? T Φ Φ et rt PJ = Hi ß PJ φ Φ φ p- φ p- CΛ P t P • Ω P P- rt p- P- ti co

Φ P - <- so tr S3 P- P- ta rt t-i rt Φ o rt Ps- Φ O N ≤ P "ro cn Φ P ω O <x>

P ^> J P>: P- Φ ιq C: rt P- rt P- cn Ό cn P> P Φ σ Φ P? r- <PO Φ co ti H rt NP tr φ Ω φ ti Φ H Φ 3 Φ 3 Ω PJ φ CΛ rt H P- P p: J σ N • P P- φ p ⁾ ti tr cn ιq 3 ι- < v tr <Ω ro P- rt P ⁾ Φ Φ 'rt CΛ Φ P ¹ 3 φ M cn P-

H CΛ Φ c! rt Φ Φ, t »z * d Φ et OP ro ω φ ^ P ≤: rt Φ P- P- P- P, £ P) P- Ω P rt 3 tr cn φ P ¹ tr PPP rt Ω rt t → Φ Φ Φ Φ tr PJ rt ι Hi p- 3 φ tr Φ J P- tP tp φ rt J cn tu PPP φ PP - P> ϊö Φ li PP φ Qπ P rt P- φ P Φ i

P tr CΛ φ Φ P ti P φ rt P vP Qπ vP PP φ P ⁾ P- P a ro P P- Hi PP = cn φ rt tr HP ⁾ P rt * Q Φ cn rt ιp H CΛ P rt tr <Φ φ Φ Φ P- ω tr p: φ ιP P P- ≤ tr α rt Φ P ⁾ 3 O CΛ P ¹ Ω P- Φ Φ 3 P Φ P- Φ P P- P P- H tr tö P-

Φ li Hi PP P- P "P- b- P ⁾ P tr rt φ tr ti P- P> P- CΛ JÖ P- PPP Φ P- P, PJ P

3 φ p: ιp ιp HP φ P- ro tr Hi ffi Φ Φ Qπ P- P ¹ • t> * d rt P o P rt P = P Φ ιP »q P- PN

PH Φ Qπ P Ω ιp P ⁾ ι- (t P- cn p: o P ^< Φ tr Φ • Ω Φ CΛ P> φ iP rt Φ

Sl NP ι α tr Cn Φ cn et Φ rt CΛ PJ ι- (Φ? R H • d cn tr PP φ Φ P- ¹ D: rt Qπ σ 3 Φ rt iP P- tr Φ φ cn P ⁾ rt O o ρ H α cn Φ Ω Φ Ω P P- P

H • P- P- B σ P p P Φ Φ φ P ¹ P- P- Φ P rt p ^j P cn Φ P- Φ tT »P- tr P. tr NP ¹ φ

3 φ Φ P- P Φ P ¹ tr φ rt s: P Φ Hl Φ PJ Φ - Φ P- Φ Ω φ <! Φ CΛ>. P φ α rt Φ Qn tr Qπ Φ tr ¹ P- φ P- P- ro. rt Hi P- ⁾ rt P- P ^* 3 o P> P- Ω

PJ P> -3 <l Φ P P- rt P Φ rt ι-i Qπ P 00 ro rt φ rt rt ω Φ rt Φ P> t-i P ιq Qπ

P PJ = Φ P- Sl tr P φ • p- Φ .t »α Φ Φ H Φ H Φ P- * d Φ l-i et ιP cn rt PJ PJ

CΛ Qπ H ti CD: φ ι l_l. rt HP cn Qπ 3 2 rt P <! Φ P- H Φ p- Φ P ⁴ cn BP ¹ rt P- 3 Hi li P- S Φ Φ Ω PJ Φ φ Φ ro P- P- POP ¹ cn tr ^ r * l rt PJ

P ⁾ φ Φ p: tr 3 Φ C: α H tr P P- K CΛ H tö P- ιP * »v Ω Φ Ω rt p- p- P Φ iP

P p: ιP Φ Φ tr P P, o O P- P PJ O Φ CΛ 3 P tr Qπ PJ 3 tr. t ιP P P- Φ

CΛ CJ tr tr P- cn rt 3 o P- Ό Qπ Φ P ¹ Ω tr ¹ H rt P- P Φ Φ P- rt Φ Φ PP sQ P Hi

Ω P φ P ⁾ rt s: s: Φ tr P ⁾ P- H tr Ps- φ Φ rt ι Φ P- H φ rt PHH cn Φ P ¹ tr rt li H P- ti Φ Φ rt p: φ CΛ P - φ p- P- Φ CΛ ti Ω tr cn Φ rt u Φ P PJ:

Φ rt Φ Φ PJ ιP Qπ P. Φ rt tr Φ Φ P ¹ rt Ω P- rt W PJ Φ Φ li O Cπ P ¹ Ω et H ti H tr rt Φ φ P- Φ • φ g P- P- CΛ Φ tr P Φ Φ Φ § PH ro P PJ Φ Φ -

Φ CΛ P ⁾ Φ H cn P li 3 rt rt H Φ P Ω P ¹ Cu: rt P Hl Qπ 3 H Φ

P- Φ ιP Φ s P H Φ ro t CΛ Φ ro • d P- P tr φ & 3 Φ cn tr ro Hl P- φ tr

P "P- PHP 0- ffi P Qπ φ ii cπ Φ CΛ PP ¹ P- P- Ω Φ ro ω H Φ P φ < ⁾

P rt P> d Hi tp tr "P p ⁾ P- tr <1 Ω P> cn o • d P- et tp - tr P- P- rt tr

Φ Φ ιP PJ p: P p. * -3 P φ PO tr Φ rt tr Φ cn p. φ Φ Φ Q. Ω ιp Φ P "Hi g ¹ Ω r tr Hi Ω tr P: PP 3 p- P- rt P Φ P- Ω o 3 CΛ tr P- P ¹ P P- p:

§ Qπ P> ps- P, P ⁾ rt tr P> Qπ <: ιP • d P Φ PH Ω tr P w tr P ⁾ φ P- rt φ φ Ω ti φ Φ PPP rt Φ 3 φ m CΛ i rt Φ tr Φ P- θ: P ⁾ rt P- φ P- Φ tr

PHPP P- S P- Φ Qπ HP ⁾ P ⁾ Φ ro Φ P Φ P CΛ ⁴ tr P- rt P ⁾ φ Ω P- Φ Φ

Qπ iP sQ P CD: rt s: P> • d tr P ¹ l_l. cn ι- (ti Ω Φ Φ CΛ p- P ⁾ P ti tr PP P-

<P- cn P ⁾ ι- <H Φ P- PP ⁾ sQ tr φ rt P ⁾ φ ta tr H-3 tr P Ω vp P ¹ Hi cn Φ Φ P

P> φ Φ 1 tr Ω 3 HP Ω Φ Qπ Φ PPP ⁾ P ⁾ o Φ tr cn rt ti tα

P ti Φ Φ tr Φ Ω Φ ¹ sQ Φ Φ Ω tP PPP ⁴ P P- ιp Φ PJ φ Φ s ¹ O: N

P • d α P ti P- P * tr H <! P Φ P- CΛ P - Φ 7- rt φ P Φ PP φ P- P ¹ tr ¹ tr P

P> 3 P s φ P- cn o P tr rt et O P> Φ li tö iP sQ PP ⁾ φ Φ

Ω ιP PL- <! l_l. p: P- O rt P ι Φ Φ CΛ HP ro P- PJ P ⁾ Qπ Φ σ Φ φ P 3 p- P PS "

N ps- φ φ φ Ö rt cn P ⁾ cn P li Ό cn Qπ Qπ cn PP Φ P li O Ps- CΛ CΛ rt P p: p P tr s H Qπ 3 PP Qπ P Ω Φ P- P φ Φ N et ^H) ti et • d Hi tr φ φ P

3 PP o P ¹ o Φ P p: P- o PO tr P- P Φ cn PP Φ Φ er P P. li Φ p: H ti rt P "

P> ιP P P. P Ω * "ι tr H et Qπ P- Ω Qπ rt P P P- CΛ Φ Hi P O P- tr Hi V Φ φ

P "ιP P cn tr O Φ P- rt Φ Φ O tr» c P- ro P- p. CΛ Φ P Ω H O: H P

P! rt P 0 H ⁾ HH Φ o ro tr Φ Ω P- rt P- tr P ti P> 1 α s: P- p * ≤ φ HP ⁾ cn p: P, σ Qπ φ Φ tr Qπ Ω cn Φ P 3 rt Φ

Φ Ω φ CD: P- Φ Φ α P Φ PJ tr 1 p- P- P- P> P- φ tr Ω H tq P- rt cn

P tr cn H 1; v p. P- CΛ P- P φ Φ Φ 1 tr 3 P, et tr 1 cn ιP Φ

P rt 1 1 1 Φ l 1 ti 1 Φ 1 Φ

ω co ro ro, P ¹ cπ o Cπ o Cn o Cπ

CO co ro ro P ¹

Cπ o cπ o Cπ O Cπ

that the cooling device 5 can be easily removed again from a memory module 23.

For easy and safe installation, the cooling device 5 according to FIG. 8 has a height stop 27 which is seated on the uppermost edges 26 of the memory modules 23. In addition, the cooling device can also have side guides in order to hold the cooling devices 5 in position relative to the memory modules 23.

Thus, as the above FIGS. 1 to 6 show, the thermal resistance for dissipating the heat loss is reduced considerably with only a small additional height, and the cooling device can be easily installed both by the manufacturer and by the end user.

Claims

Patent claims

1. Cooling device for electronic components (1) on circuit boards (2) with a cooling surface (3), the cooling surface (3) being larger than the sum of the top sides (4) of the electronic components (1) to be cooled and where the Cooling device (5) has at least one cooling plate (6) with a heat-conducting coating (7) and a pressing device (8), by means of which the contours of the top sides (4) of the electronic components (1) to be cooled are pressed into the heat-conducting coating (7). .

2. Cooling device according to claim 1, characterized in that at least the outer sides of the cooling device (5) have blackening and / or roughening.

3. Cooling device according to claim 1 or 2, characterized in that the cooling plate (6) can be removed from the populated circuit board (2) and / or the electronic components to be cooled.

4. Cooling device according to one of the preceding claims, characterized in that the cooling plate (6) has a plurality of contact surfaces (9) which are adapted to the dimensions of individual electronic components (1) to be cooled.

5. Cooling device according to one of the preceding claims, characterized in that the contact surfaces (9) are separated from one another by slots (10) in the cooling plate (6).

6. Cooling device according to one of the preceding claims, characterized in that the cooling plate (6) has a spring element (11) which is supported on the back of the circuit board (2).

7. Cooling device according to claim 6,

5, characterized in that the spring element (11) is a U-shaped leaf spring, which has at least one individual cooling plate (6) against the electronic components (1) to be cooled on a front side (13) of a circuit board (2) with a first 10 legs of the U-shaped profile and is supported on a back side (15) of the circuit board (2) with its second leg.

8. Cooling device according to one of the preceding claims, -15 characterized in that the cooling plate (6) is arranged plane-parallel to the circuit board (2).

9. Cooling device according to one of the preceding claims, 20 characterized in that the cooling device (5) is provided for a printed circuit board (2) equipped on both sides with electronic components (1).

25 10. Cooling device according to one of the preceding claims, characterized in that the cooling device (5) has a front cooling plate (12) for a front side (13) equipped with electronic components (1) and a rear cooling plate (14) for one

30 electronic components (1) equipped back (15) of a circuit board (2).

11. Cooling device according to claim 10, characterized in that the front and rear cooling plates (12, 14) are connected to one another in a pivotable and / or expandable manner via a joint axis (16).

12. Cooling device according to claim 11, characterized in that in the area of the joint axis (16) a spring element (11) 5 is arranged, which exerts a contact pressure on the front and rear cooling plates (12, 14), so that both can be pressed against each other.

13. Cooling device according to one of claims 10 to 12, 10 characterized in that the spring element (11) is a torsion bar, which at the same time has a cardan shaft (17) for the front and rear cooling plates (12,

14) forms.

-15 14. Cooling device according to claim 13, characterized in that the spring element (11) is a helical spring which is arranged around a cardan shaft (17).

20 15. Cooling device according to claim 12, characterized in that the spring element (11) is a U-shaped leaf spring which is preformed as a clamp, with its legs pressing the front and rear cooling plates (12, 14) together.

25

16. Cooling device according to one of claims 9 to 15, characterized in that a front and a rear cooling plate (12, 14) are coupled like a clip and have a clip-like cross section.

17. Cooling device according to one of claims 9 to 16, characterized in that a front and a rear cooling plate (12, 14) are coupled via a cardan shaft (17) and have bulges (18) surrounding the cardan shaft (17), whereby the front and rear cooling plates (12, 14) alternately Have a bulge (18) and a recess (19) in the direction of the joint axis and the bulges (18) and the recesses (19) mesh with one another.

18. Cooling device according to one of the preceding claims, characterized in that a front and a rear cooling plate (12, 14) have plate-shaped clamp handles (20, 21) which protrude beyond a cardan shaft (17).

19. Cooling device according to claim 18, characterized in that the cooling device (5) has cooling fins in its upper part in the area of the clamp handles (20, 21).

20. Cooling device according to one of the preceding claims, characterized in that the cooling device (5) has aluminum sheets.

21. Cooling device according to one of the preceding claims, characterized in that the cooling plate (6, 12, 14) has a heat-conducting aluminum alloy.

22. Cooling device according to one of the preceding claims, characterized in that the heat-conducting coating (7) is a spacer filling material with a low heat transfer coefficient to the top sides of the electronic components (1) to be cooled and to the surfaces of the cooling plate (6, 12, 14). having.

23. Cooling device according to one of the preceding claims, characterized in that the heat-conducting coating (7) has a foam with a heat-conducting impregnation.

4. Cooling device according to one of the preceding claims, characterized in that the heat-conducting coating (7) has an open-pore foam, the pore surfaces of which are coated with heat-conducting metallic thin films.

25. Cooling device according to one of the preceding claims, characterized in that the cooling device (5) has side guides.

26. Cooling device according to one of the preceding claims, characterized in that the cooling device (5) has a height stop (27).

27. Arrangement of the cooling device according to one of claims 1 to 26 on memory components (22) and / or a memory module (23).

28. Arrangement according to claim 27, characterized in that the rear and front cooling plates (12, 14).

Include storage module (23) on both sides.

29. Arrangement according to claim 27 or claim 28, characterized in that the storage module (23) is arranged in a base (25) with contact connections (28) and the joint axis (16) of the cooling device (5) above one of the base (25) opposite edge (26) is arranged.

30. Process for producing a cooling device (5), which has the following process steps:

Producing at least one cooling plate (5) from a heat-conducting sheet metal strip to cover the top sides of components to be cooled, Blackening and/or roughening at least the outer sides of the cooling plate (6) facing away from the component tops to be cooled,

Coating the inside of the cooling plate (6) facing the component tops to be cooled with a heat-conducting coating,

Forming or arranging at least one spring element (11) on the cooling plate (6) for pressing the cooling plate (6) onto the top sides of the component to be cooled.

31. The method according to claim 30, further comprising the following method steps:

Producing a profile sheet for forming clamp halves with bulges (18), which are formed into the profile sheet in a predetermined axis area (29) between a clamp area (31) with a cooling plate (6) and a grip area (30), - producing recesses ( 19) in the axis area (29) alternating with bulges (18), separating the profile sheets into clamp halves (32, 36),

Blackening and/or roughening at least the outside of the clamp halves (32, 36) facing away from the component tops to be cooled, coating the inner surfaces (33) of the cooling plates (6, 12, 14) in the clamp area (31) with a heat-conducting coating (7) , - Providing a spring element (11) in the axis area (29),

Joining together two clamp halves (32) in the area of the bulges (18) or the recesses (19), - Aligning the spring element (11) in the axial direction and Inserting a cardan shaft (17) into the bulges (19) in the axis area (29) with placing the spring element (11) under pretension in the axis area (29) of the cooling device (5).

32. The method according to claim 30 or claim 31, characterized in that the coating is carried out by spraying the heat-conducting coating (7) onto the inner surfaces (33) of the cooling plates (6, 12, 14).

33. The method according to claim 30 or claim 31, characterized in that the coating of the inner surfaces 33 of the cooling plates (6, 12, 14) is carried out by cutting and gluing a heat-conducting coating material.

34. The method according to one of claims 30 to 33, characterized in that when two clamp halves (32) are joined together, a front and a rear cooling plate (6, 12, 14) are aligned with their corresponding bulges (18) and recesses (19). before an axle bolt is positioned as a connecting cardan shaft (17) in the axle area (29) of the cooling device (5).

35. The method according to one of claims 30 to 34, characterized in that elongated hole slots (19) are introduced into the clamp area (31) of the clamp halves (32) by means of punching presses in order to create individual contact surfaces (9) for individual electronic components (1). to produce.

36. The method according to one of claims 30 to 35, characterized in that the cooling device (5) after inserting the cardan shaft (17) by compressing the handle area (30) is spread in the clamp area (31) with a pivoting movement around the cardan shaft (17) and is placed under pretension onto the surfaces (4) of electronic components (1) of a circuit board (2) to be cooled.

37. The method according to one of claims 30 to 36, characterized in that the heat-conducting coating (7) when placed on the top sides (4) of electronic components (1) has different distances between the top sides (4) and the cooling plates (6, 12, 14) and adapts itself in a self-adjusting manner to the contour of the electronic components (1) to be cooled.