WO2002056040A1

WO2002056040A1 - Pusher and electronic part tester with the pusher

Info

Publication number: WO2002056040A1
Application number: PCT/JP2001/011477
Authority: WO
Inventors: Keiichi Onodera
Original assignee: Advantest Corporation
Priority date: 2001-01-09
Filing date: 2001-12-26
Publication date: 2002-07-18
Also published as: CN1278130C; JP2002207063A; TWI224198B; KR20030068577A; KR100747076B1; CN1486430A

Abstract

A pusher, wherein sharp-pointed projected parts (312) are provided on the surface (311) of a pusher block (31) opposed to the pressed surface (211) of the body part (21) of an IC chip (2), whereby the external terminal of an electronic part can be connected to the connection terminal of a socket without concentratedly applying a load to the portion of the electronic part having deposit adhered thereto even if the deposit such as particles is adhered to the pressed surface thereof, and the electronic part can be tested without providing a damage such as cracking and chipping to the electronic part.

Description

Description Pusher and electronic component test equipment equipped with the pusher

The present invention relates to a pusher for pressing an electronic component mounted on a socket in testing an electronic component such as an IC chip, and to an electronic component test apparatus provided with the pusher. Background art

In the manufacturing process of semiconductor devices and the like, electronic component test equipment that tests the performance and functions of electronic components such as IC chips that are finally manufactured is required. As one example of such an electronic component test apparatus, an IC test apparatus that tests the performance and function of an IC device such as an IC chip under various temperature conditions such as a low temperature and a high temperature is known.

A test of an IC device using an IC test apparatus is performed, for example, as follows. After transporting the IC device under test above the test head with the IC socket attached, press the IC device under test to make the connection terminals of the IC socket and the external terminals of the IC device under test come into contact. As a result, the IC device under test has an IC socket, test head and cable.

—Electrically connected to the test main unit through the cable. Then, the test signal supplied from the test main unit to the test head through the cable is applied to the IC device under test, and the response signal read from the IC device under test is applied to the test device through the test head and the cable. By sending it to the main unit, the electrical characteristics of the IC device under test are measured.

When testing IC devices using IC test equipment, the IC When the chair is pressed, the pusher equipped with the pusher block descends, so that the pressed surface of the pusher block and the pressed surface of the IC device under test come into contact, and the IC device under test is connected to the connection terminal of the IC socket. A pressing force in the direction is applied. Disclosure of the invention

However, if small pieces such as silicon fragments adhere to the pressed surface of the IC device under test, the pressed surface of the pusher block and the pressed surface of the IC device come into contact with each other and push the IC device under test. When pressure is applied, a concentrated load is applied to the area where the small pieces are attached,

The IC device may be damaged, such as cracking or chipping. In particular, if the IC device under test is an IC device in which a bare chip mounted on a substrate is not sealed with a mold resin, the bare chip itself may be damaged.

Therefore, the present invention provides a method of manufacturing a semiconductor device under test without causing damage such as cracking or chipping of the electronic device under test even when small pieces such as silicon fragments adhere to the pressed surface of the electronic device under test. It is an object of the present invention to provide a pusher and an electronic component test device capable of applying a pressing force to a test electronic component in the direction of a connection terminal of a socket.

(1) In order to solve the above problems, a pusher provided by the present invention is a pusher for pressing a main body of an electronic component mounted on a socket, and the pusher faces a pressed surface of the electronic component. The electronic device is characterized in that a projection is provided on the surface to be pressed, which can press the electronic component in the direction of the connection terminal of the socket.

In the pusher of the present invention, “the main body of the electronic component” refers to the outside of the electronic component. Means electronic components such as bare chips mounted on a board and mold resin that seals the bare chips mounted on the board, when the electronic component is an IC chip. Main body ”. The “pressed surface of the electronic component” means an outer surface of the outer surface of the electronic component to which a pressing force is applied by a pusher. In the case of a surface mount type area array type IC chip such as (Land Grid Ar ray) type, the surface opposite to the surface on which the external terminals such as solder poles and lands are provided is `` the electronic component Pressed surface ".

In the pusher of the present invention, since the main body of the electronic component mounted on the socket is pressed by the projection provided on the surface of the electronic component facing the pressed surface, the pressed surface of the electronic component is made of silicon. Even if small pieces such as debris are attached, the probability of the pusher coming into contact with the small pieces is reduced. Even if the protrusion of the pusher comes into contact with the attached matter on the pressed surface of the electronic component, the protrusion is interposed between the pressed surface of the electronic component and the surface of the pusher facing the pressed surface. By doing so, a gap is formed, so that the attached matter that has been repelled in contact with the protrusion of the pusher can move to the gap. Accordingly, it is possible to prevent the attached matter from being sandwiched between the protrusion of the pusher and the pressed surface of the electronic component. Therefore, according to the pusher of the present invention, even when a small piece such as a piece of silicon is attached to the pressed surface of the electronic component, a load is concentrated on the portion where the small piece is attached. Therefore, the pressing force can be applied to the electronic component toward the connection terminal of the socket without causing damage such as cracking or chipping of the electronic component.

In the pusher of the present invention, the material of the protrusion provided on the surface of the electronic component facing the pressed surface is not particularly limited, but is a material exhibiting elasticity. (For example, rubber, plastic, etc.). If the protrusion is made of a material exhibiting elasticity, even if a small piece such as a piece of silicon adheres to the pressed surface of the electronic component, when the protrusion comes into contact with the above-mentioned adhering substance, the protrusion is formed. Since the part is deformed by itself and can reduce the pressing force applied to the attached matter, it is possible to prevent damage such as cracking or chipping of the electronic component which may occur when the protrusion contacts the attached matter. .

The electronic component that can be pressed by the pusher of the present invention is not particularly limited as long as it is an electronic component whose main body can be pressed, but the pusher of the present invention is a BGA (Ball Grid Array) type, It can be suitably used for surface mount area array type IC chips such as LGA (Land Grid Array) type, and especially for CSP (Chip Size Package) type IC chip.

In the pusher of the present invention, the shape, the number, the position, and the like of the projections provided on the surface of the electronic component facing the pressed surface are not particularly limited, but an embodiment described later is preferable.

(2) In the pusher of the present invention, it is preferable that the protrusion has a pointed shape.

In the pusher of this aspect, since the projection that presses the main body of the electronic component has a pointed shape, even if the projection of the pusher comes into contact with the attached matter on the pressed surface of the electronic component, the contact area is small. It will be small. As a result, a local force is applied to the attached matter that has come into contact with the pusher projection, and the attached matter is repelled by the pusher projection and faces the pressed surface of the electronic component and the pressed surface. It is easy to move to the gap formed between the pusher and the surface. Therefore, according to the pusher of this aspect, the attached matter is sandwiched between the protrusion of the pusher and the pressed surface of the electronic component. Can be prevented efficiently.

In the pusher of this aspect, the shape of the protrusion is not particularly limited as long as it is a pointed shape, and the shape of the protrusion may be a cone, a pyramid, a needle, or the like. In the pusher of this aspect, the term “pointed shape” refers to a shape that becomes thinner toward the tip (toward the pressing direction). In addition to the shape that has a sharp tip, the tip also has a rounded tip. It also includes a shape with a tinge and a flat end.

(3) In the pusher of the present invention, it is preferable that the protrusion is provided at a position corresponding to an external terminal of the electronic component.

In the pusher of this aspect, the pressing force required for connecting each external terminal of the electronic component to the corresponding connection terminal of the socket is provided at a position corresponding to each external terminal of the electronic component. Can be added by protrusions. Therefore, when the electronic component is pressed using the pusher of this aspect, the connection between the external terminal of the electronic component and the connection terminal of the socket can be reliably performed.

In the pusher of this aspect, it is not necessary that all the protrusions are provided at positions corresponding to the external terminals of the electronic component, and the number of the protrusions may be smaller or larger than the number of the external terminals of the electronic component. However, it is preferable that protrusions are provided at positions corresponding to all external terminals of the electronic component.

(4) In the pusher of the present invention, it is preferable that a flexible member is provided for urging the protrusion in the pressing direction of the electronic component.

When a plurality of protrusions are provided on the pusher, a dimensional error may occur in each protrusion. If a dimensional error occurs in each protrusion, the pressing force applied to the pressed surface of the electronic component by each protrusion may be uneven. There is. On the other hand, in the pusher of this aspect, since the elastic member is provided to urge the projection in the pressing direction of the electronic component, the elastic member can absorb a dimensional error of each projection, and The pressing force applied to the pressed surface of the electronic component can be made uniform by the parts. That is, in the pusher of this aspect, by controlling the stroke of each projection and the load of each projection, the pressing force applied to the pressed surface of the electronic component by each projection can be made uniform.

(5) An electronic component test apparatus provided by the present invention includes the pusher of the present invention.

In the electronic component test apparatus of the present invention, even when small pieces such as silicon fragments are attached to the pressed surface of the electronic component, a load is concentrated on the portion where the small pieces are attached. Applying a pressing force to the electronic component in the direction of the socket's connection terminal without causing damage such as cracking or chipping to the electronic component, the external component of the electronic component and the connection terminal of the socket can be prevented. Can be connected to test the electronic component. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an overall side view showing an IC test apparatus which is an embodiment of the electronic component test apparatus of the present invention.

FIG. 2 is a perspective view showing a handler in the IC test apparatus.

FIG. 3 is a flowchart of a tray showing a method of handling the IC under test.

FIG. 4 is a perspective view showing the structure of the IC storage force in the IC test apparatus.

FIG. 5 is a perspective view showing a customer tray used in the IC test apparatus. is there.

FIG. 6 is a cross-sectional view of a main part in a test chamber in the IC test apparatus. FIG. 7 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

FIG. 8 is an exploded perspective view showing a structure near a socket in a test head of the IC test apparatus. .

FIG. 9 is an exploded perspective view of a pusher in the IC device.

FIG. 10 is a sectional view of the vicinity of the socket in the IC device.

FIG. 11 is a cross-sectional view showing a state where the pusher is lowered in FIG.

FIG. 12 is a cross-sectional view showing a state of a substance adhering to the pressed surface of the IC chip before and after the pusher is lowered.

FIG. 13 is a cross-sectional view showing another embodiment of the protrusion of the pusher. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an overall side view showing an IC test apparatus which is an embodiment of the electronic component test apparatus of the present invention, FIG. 2 is a perspective view showing a handler in the IC test apparatus, and FIG. 3 shows a method of handling an IC under test. Fig. 4 is a flow chart of the tray, Fig. 4 is a perspective view showing the structure of the IC stopping force in the IC test apparatus, Fig. 5 is a perspective view showing the customer tray used in the IC test apparatus, and Fig. 6 is the IC test apparatus. Fig. 7 is a partial exploded perspective view showing a test tray used in the IC test equipment, and Fig. 8 is an exploded perspective view showing a structure near a socket in a test head of the IC test equipment. Fig. 9, Fig. 9 is an exploded perspective view of the pusher in the IC test apparatus, Fig. 10 is a cross-sectional view of the vicinity of the socket in the IC device, and Fig. 11 is the pusher in Fig. 10. FIG. 12 is a cross-sectional view showing the state of the IC chip being lowered, and FIG. 12 is a cross-sectional view showing the state of a substance adhering to the pressed surface of the IC chip before and after the pusher is lowered.

FIG. 3 is a diagram for understanding a method of handling the IC under test in the IC test apparatus according to the present embodiment. Actually, the members arranged vertically are shown in plan view. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be described with reference to FIG.

First, the overall configuration of the IC test apparatus according to the present embodiment will be described. As shown in FIG. 1, the IC test apparatus 10 according to the present embodiment includes a handler

1, a test head 5, and a main test device 6. The handler 1 sequentially transports an IC chip (an example of an electronic component), which is an electronic component to be tested, to the socket of the contact portion 9 provided on the upper side of the test head 5, and transfers the IC chip after the test to the test result. Perform the operation of classifying according to and storing in the specified tray.

The socket of the contact part 9 is electrically connected to the main test device 6 through the test head 5 and the cable 7, and the IC chip detachably mounted on the socket is connected to the test head. It is electrically connected to the test main unit 6 through 5 and the cable 7. A test electrical signal from the test main unit 6 is applied to the IC chip mounted on the socket,

The response signal read from the IC chip is sent to the test main unit 6 through the cable 7, and the performance and function of the IC chip are tested.

At the lower part of the handler 1, a control device for mainly controlling the handler 1 is incorporated, but a space portion 8 is provided in a part. The test head 5 is exchangeably arranged in this space 8, and the IC chip is inserted into the socket of the contact section 9 provided on the upper side of the test head 5 through a through hole formed in the handler 1. It is possible to attach and detach. The IC test device 10 is a device for testing an Ic chip as an electronic component to be tested at a temperature higher than normal temperature (high temperature) or lower than normal temperature (low temperature). As shown in FIG. 2 and FIG. 3, a chamber 100 including a constant temperature bath 101, a test chamber 102, and a heat removal bath 103 is provided. The contact part 9 provided on the upper side of the test head 5 shown in FIG. 1 is inserted into the test chamber 102 as shown in FIG. 6, where the IC chip is tested. I have.

As shown in FIGS. 2 and 3, the handler 1 in the IC test apparatus 100 stores an IC chip to be tested and an IC storage unit 200 for classifying and storing tested IC chips. The test is performed in the loader section 300 for sending the IC chip under test sent from the IC storage section 200 to the chamber section 100, the chamber section 100 including the test head 5, and the chamber section 100. And an unloader section 400 for sorting and extracting the tested IC chips. The IC chip is stored in a test tray and transported inside the handler 1.

A large number of IC chips before being stored in the handler 1 are stored in the customer tray KST shown in FIG. 5, and in that state, go to the IC storage section 200 of the handler 1 shown in FIGS. 2 and 3. The test tray TST (see Fig. 7) that is supplied from the waste tray KST and conveyed in the handler 1

The IC chip is replaced. As shown in Fig. 3, inside the handler 1, the IC chip moves while being placed on the test tray TST, and is subjected to high or low temperature stress to test whether it operates properly.

(Inspection) and classified according to the test results. Hereinafter, the inside of the handler 1 will be described in detail individually. First, a part related to the IC storage unit 200 will be described. As shown in FIG. 2, the IC storage unit 200 stores a pre-test IC stocker 201 for storing pre-test IC chips and a tested IC chip for storing IC chips classified according to test results. An IC stocker 202 is provided. As shown in FIG. 4, the pre-test IC stocker 201 and the tested IC stocker 202 enter a frame-shaped tray support frame 203 from the lower portion of the tray support frame 203 and enter the upper portion. It is equipped with an elevator 204 that can be moved up and down. A plurality of waste trays KST are stacked and supported on the tray support frame 203, and only the stacked waste trays KST are moved up and down by the elevator 204. I have.

The pre-test IC stocker 201 shown in Figure 2 will be tested

1 Customer trays KST containing C chips are stacked and held. In addition, the tested IC stocker 202 has a stack of trays KST containing IC chips that have been classified after the test. The pre-test IC stocker 201 and the tested IC Since the stocker 202 has substantially the same structure, the pre-test IC stocker 201 can be used as the tested IC stocker 202 and vice versa. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers 202 can be easily changed as needed.

As shown in FIGS. 2 and 3, in this embodiment, the pre-test IC stocker was used.

As 201, two stockers S TK-B are provided. Adjacent to the stocker STK-B, two empty stocking forces S TK-E to be sent to the unloader unit 400 are provided as tested IC stockers 202. Eight stockers S TK-1, S TK-1, · · ·, S TK-8 are provided next to them as tested IC stockers 202. It is structured so that it can be sorted and stored in one category. In other words, in addition to good and bad products, there are high-speed, medium-speed, and low-quality It is now possible to sort fast items or those that need retesting among defects. Second, a part related to the loader unit 300 will be described.

As shown in FIG. 4, the waste tray KST housed in the tray support frame 203 of the pre-test IC stocker 201 shown in FIG. It is carried from the lower side of the device substrate 105 to the window portion 300 of the loader portion 300 by the tray transfer arm 205 provided therebetween. Then, in the loader section 300, the IC chips to be tested loaded on the waste tray KST are once transferred to a pre-ciser (305) by the X_Y transfer device 30. Here, after correcting the mutual positions of the IC chips under test, the IC chips under test transferred to the precisor 305 are again stopped at the loader section 300 using the XY transfer device 304. Transfer the test tray to the TST.

As shown in Fig. 2, the X-Y transfer device 304 that reloads the IC chip under test from the waste tray KST to the test tray TST has two rails installed above the device substrate 105. And a movable arm 302 capable of moving back and forth (this direction is defined as a Y direction) between the test tray TST and the waste tray KST by means of the two rails 301. A movable head 303 supported by the arm 302 and movable in the X direction along the movable arm 302 is provided.

The movable head 303 of the X-Y transfer device 304 is provided with a suction head mounted downward, and the suction head moves while sucking air. The IC chip under test is sucked from the matley KST, and the IC chip under test is transferred to the test tray TST. For example, about eight such suction heads are mounted on the movable head 303, and eight at a time. The IC chip under test can be transferred to the test tray TST. Third, a portion related to the chamber 100 will be described.

The test tray T ST described above is loaded into the chamber 100 after the IC chips to be tested are loaded by the loader unit 300, and each IC chip to be tested is tested while being mounted on the test tray T ST.

As shown in FIGS. 2 and 3, the chamber 100 is provided with a constant temperature chamber 101 for applying a desired high or low temperature heat stress to the IC chip under test loaded on the test tray TST, and a constant temperature chamber. Test chamber 102 in which the IC chip under thermal stress is applied to 101 in the socket on test head 5, and IC chip under test in test chamber 102 And a heat removal tank 103 for removing the applied thermal stress.

In the heat removal tank 103, when the high temperature is applied in the constant temperature chamber 101, the IC chip under test is cooled by blowing air to return to room temperature, and when the low temperature is applied in the constant temperature chamber 101, the Heat the test IC chip with warm air or a heater to return it to a temperature that does not cause condensation. Then, the heat-removed IC chip under test is carried out to the unloader section 400.

As shown in FIG. 2, the constant temperature bath 101 and the heat removal bath 103 of the chamber 100 are arranged so as to protrude above the test chamber 102. As shown conceptually in Fig. 3, the thermostatic chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are used until the test chamber 102 becomes empty. Stand by while being supported by the vertical transport device. Mainly during this standby, a high or low temperature stress is applied to the IC chip under test.

As shown in Fig. 6, the test chamber 102 has a test The test head 5 is arranged, and the test tray TST is carried on the test head 5. There, all the IC chips 2 held by the test tray TST shown in FIG. 7 are brought into electrical contact with the test head 5 sequentially, and the test is performed on all the IC chips 2 in the test tray TST. On the other hand, the test tray TST that has completed the test is heat-removed in the heat-removal tank 103, and after returning the temperature of the IC chip 2 to room temperature, it is discharged to the unloader section 400 shown in FIGS. 2 and 3. You.

In addition, as shown in FIG. 2, the upper part of the constant temperature bath 101 and the heat removal bath 103 has an entrance opening for feeding the test tray TST from the device substrate 105, and the device substrate 105. An outlet opening for sending out the test tray TST is formed. A test tray transport device 108 for inserting and removing the test tray T ST from these openings is mounted on the device substrate 105. These transfer devices 108 are composed of, for example, rotating rollers. The test tray TST discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 is connected to the un-opening section 400 and the closing section 300. Returned to the thermostat 1 0 1 via 0.

FIG. 7 is an exploded perspective view showing the structure of the test tray T ST used in the present embodiment. The test tray TST has a rectangular frame 12 on which a plurality of bars 13 are provided in parallel and at equal intervals. A plurality of mounting pieces 14 are formed on both sides of the crosspiece 13 and on the inside of the side 12a of the frame 12 parallel to the crosspiece 13 so as to project at equal intervals in the longitudinal direction. Each of the insert storage sections 15 is constituted by two opposed mounting pieces 14 of the plurality of mounting pieces 14 provided between the crosspiece 13 and between the crosspiece 13 and the side 12a. I have.

Each insert storage section 15 contains one insert 16 The insert 16 is attached to the two mounting pieces 14 in a floating state by using a fastener 17. For example, about 16 x 4 such inserts 16 can be attached to one test tray TST. By storing the IC chip 2 under test in the insert 16, the IC chip 2 under test is loaded on the test tray TST. As shown in FIGS. 10 to 13, the IC chip 2 to be tested in the present embodiment has, in the form of a matrix, solder poles as external terminals 22 on the lower surface of the rectangular main body 21. It is a so-called BGA type IC chip arranged.

In the insert 16 of the present embodiment, as shown in FIGS. 8 and 10, a rectangular IC storage portion 19 for storing the IC chip 2 to be tested is formed. The lower end of the IC housing portion 19 is opened so that the external terminals 22 of the IC chip 2 are exposed, and an IC holding portion 195 for holding the IC chip 2 is provided at the periphery of the opening. .

Guide holes 20 into which the guide pins 32 of the pusher base 34 and the guide bushes 41 of the socket guide 41 are inserted from above and below are provided at the center of both sides of the insert 16. At the corners on both sides of the insert 16, mounting holes 21 for mounting the test tray TST to the mounting pieces 14 are formed.

As shown in FIGS. 10 and 11, the guide hole 20 is a hole for positioning. For example, if the guide hole 20 on the left side in the figure is used as a positioning hole and the inside diameter is smaller than the guide hole 20 on the right side, the guide hole 20 on the left side will have a pusher base 34 The guide pin 32 of the socket guide 41 is inserted to perform positioning, and the guide bush 4 11 of the socket guide 41 is inserted into the lower half thereof for positioning. On the other hand, the guide hole 20 on the right side of the figure, the guide bin 32 of the pusher base 34 and the socket guide The 4 1 guide bush 4 1 1 is loosely fitted.

As shown in FIG. 8, a socket board 50 is arranged on the test head 5. The socket boards 50 can be arranged in the test tray TST shown in FIG. 7, for example, in a row direction in every three rows in a number (4 rows × 4 columns) corresponding to a total of four columns of IC chips 2 to be tested. If the size of each socket pod 50 can be reduced, the test head 5 can be tested simultaneously so that all the IC chips 2 held in the test tray TST shown in FIG. 7 can be tested. On the top, a socket board 50 of 4 rows × 16 columns may be arranged.

As shown in FIG. 8, a socket 40 is provided on the socket board 50. As shown in FIGS. 10 and 11, the probe pins 44 provided on the socket 40 are provided. A socket guide 41 is fixed to the socket 40 so that (an example of a connection terminal of the socket) is exposed. The number and position of the probe pins 44 of the socket 40 are provided corresponding to the number of the external terminals 22 of the IC chip 2, and the spring is biased upward by a spring (not shown). On both sides of the socket guide 41, two guide pins 32 formed in the pusher base 34 are inserted, and guide bushings 41 for positioning between the two guide pins 32 are provided. 1 is provided.

The pushers 30 shown in FIG. 9 are provided on the upper side of the test head 5 corresponding to the number of the sockets 40. As shown in FIG. 6, each pusher 30 is elastically held on a match plate 60. The match plate 60 is mounted on the test head 5 so that the test tray TST can be inserted between the pusher 30 and the socket 40. The pusher 30 held by the match plate 60 is moved in the Z-axis direction with respect to the test head 5 or the driving plate (driving body) 72 of the Z-axis driving device 70. It is freely movable. The test tray TST is transported between the pusher 30 and the socket 40 in a direction (X axis) perpendicular to the paper of FIG. As a transport means of the test tray TST inside the chamber 100, a transport roller or the like is used. When the test tray TST is transported, the drive plate of the Z-axis drive device 70 is moved up and down along the Z-axis direction, and a test is carried out between the pusher 30 and the socket 40. There is enough clearance for the tray TST to be inserted.

As shown in FIG. 6, a number of pressing portions 74 corresponding to the number of pushers 30 are fixed to the lower surface of the driving plate 72 arranged inside the test chamber 102, and the match plate 60 The upper surface of the pusher 30 (the upper surface of the lead pusher base 35), which is held at the bottom, can be pressed. A drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78. The drive shaft 78 is moved up and down along the Z-axis direction. It can be moved and the pusher 30 can be pressed.

The match plate 60 is exchangeable with the pusher 30 according to the shape of the IC chip 2 to be tested and the number of sockets of the test head 5 (the number of IC chips 2 to be measured simultaneously). It has become. By thus making the match plate 60 freely replaceable, the Z-axis drive device 70 can be made a general-purpose one. In the present embodiment, the pressing portion 74 corresponds to the pusher 30 one-to-one.For example, when the number of sockets of the test head 5 is changed to half, the match plate 60 must be replaced. Accordingly, the pressing portion 74 and the pusher 30 can be associated with each other in a two-to-one correspondence.

As shown in FIG. 9, the pusher 30 is attached to the lead pusher base 35, which is attached to the above-described Z-axis driving device and moves up and down in the Z-axis direction, the pusher base 34, and the pusher base 34. Pushed pusher block And a spring 36 (an example of an elastic member) provided between the lead push base 35 and the push port 31.

As shown in FIG. 9, the lead pusher base 35 and the pusher base 34 are fixed by a port, and both sides of the pusher base 34 are provided with guide holes 20 of an insert 16 and a socket guide. A guide pin 32 is provided to be inserted into the guide bush 4 1 1. Further, the pusher base 34 is provided with a stoppage guide 33 for regulating the lower limit when the pusher base 34 is lowered by the Z-axis driving means, and the stopper guide 33 is provided with a socket. By contacting the stopper surface 4 1 2 of the guide 40, the reference dimension of the lower limit position of the pusher 30 is determined, whereby the pusher 30 breaks the IC chip 2 mounted on the socket 40. Can not be pressed with proper pressure.

As shown in FIG. 9, the pusher block 31 is attached to a through hole formed in the center of the pusher base 34, and a spring is provided between the pusher block 31 and the lead pusher base 35. 3 6 and, if necessary, 3 7 The spring 36 is a compression spring that urges the pusher block 31 in the direction of pressing the IC chip 2 mounted on the socket 40 (downward in FIGS. 10 and 11). It has an elastic coefficient corresponding to the reference load for the step 2.

The shim 37 adjusts the reference length in the mounted state of the spring 36, and adjusts the initial load acting on the pusher block 31. That is, even when the spring 36 having the same elastic modulus is used, the initial load acting on the pusher block 31 is increased by interposing the shim 37. In FIG. 9, the shim 37 is interposed between the spring 36 and the pusher block 31.However, it is sufficient if the reference length of the spring 36 can be adjusted. For example, the lead pusher base 35 and the spring Between 3 and 6 May be worn.

In the case where the spring 36 is used as the elastic member according to the present invention, a plurality of types of springs having different elastic coefficients are prepared, and an appropriate spring is selected from these according to the reference load on the IC chip under test. It can also be used. Further, the pusher block 31 may be structured so that a plurality of springs can be mounted in parallel, and the number of these mounted may be selected according to the reference load on the IC chip 2.

As shown in FIG. 10, the pusher block 31 faces the pressed surface 2 1 1 (the surface opposite to the surface on which the external terminals 22 are provided) of the main body 21 of the IC chip 2. A conical protruding portion 312 is provided on a rectangular surface 311 to be formed.

The protrusions 3 12 are provided in a number and a position corresponding to the external terminals 22 of the IC chip 2. Since the protrusions 3 1 2 are provided in the number and positions corresponding to the external terminals 22 of the IC chip 2, it is necessary to connect the external terminals 22 of the IC chip to the probe pins 44 of the socket 40. The required pressing force can be applied to each external terminal 22. The material of the protrusions 312 is a material exhibiting elasticity (for example, rubber, plastic, or the like).

To connect the external terminal 22 of the IC chip 2 under test to the probe pin 44 of the socket 40, as shown in FIG. 10, the IC chip 2 is stored in the IC storage section 19 of the insert 16 as shown in FIG. The IC holding section 195 holds the periphery of the lower surface of the main body 21 of the IC chip 2 (the surface on which the external terminals 22 are provided) and the IC from the lower end opening of the IC housing section 19. The external terminals 22 of chip 2 are exposed.

By mounting the insert 16 containing the IC chip 2 on the socket guide 41 in this manner, the IC chip 2 is mounted on the socket 40. In this state, the Z-axis driving device is driven, and the pusher 30 is pressed. So Then, the pusher block 31 of the pusher 30 pushes the main body 21 of the IC chip 2 into the socket 40 as shown in FIG. 11, and as a result, the external terminals 22 of the IC chip 2 0 Connected to probe pin 4 4. At this time, the probe pin 44 of the socket 40 retreats into the socket 40 while being urged upward by a spring, but the tip of the probe pin 44 slightly penetrates the external terminal 22.

When the main body 21 of the IC chip 2 is pressed by the pusher block 31, as shown in FIG. 12 (c), the pressed surface 2 11 of the main body 21 of the IC chip 2 and the pressed surface 2 1 A gap R is formed between 1 and the face 3 11 of the pusher block 3 1 opposed by the interposition of the projection 3 12. Therefore, as shown in Fig. 12 (a), there is an attached matter S such as silicon fragments on the pressed surface 211 of the main body 21 of the IC chip 2 mounted on the socket 40, as shown in Fig. 12 (a). When the IC chip 2 is pressed with the pusher 30 in this case, the adhered matter S comes into contact with the protrusion 3 12 provided on the pusher block 31 as shown in FIG. 12B. . Since the protruding portion 312 has a pointed shape, the protruding portion 312 and the attached matter S make a point contact (or a surface contact with a small contact area), and a local force is applied to the attached matter S . Therefore, the deposit S in contact with the protrusions 3 12 is repelled and moves to the gap R as shown in FIG. 12 (c). As a result, it is possible to prevent a concentrated load from being applied to the portion to which the deposit S is attached, and to prevent the IC chip 2 from being damaged by cracking or chipping, without causing the IC chip 2 to be damaged. A pressing force in the direction of the probe pin 44 of the probe 40 can be applied.

Also, depending on the position of the adhered substance S, the adhered substance S may not come into contact with the protruding portion 312. In this case, however, the adhered substance S exists in the gap R. This does not cause damage such as cracking or chipping of the IC chip 2 caused by the above. Since the material of the projection 312 is a material exhibiting elasticity, when the projection 312 comes into contact with the attachment S, the projection 312 itself deforms and reduces the pressing force applied to the attachment S. Since this can be reduced, damage such as cracking or chipping of the IC chip 2 that can occur when the protrusions 3 12 and the attached matter S come into contact can be prevented.

Even if there is a dimensional error between the projections 3 1 2 provided on the pusher block 31 of the pusher 30, the projections 3 1 2 are pressed by the spring 36 into the pressing direction of the IC chip 2. When the IC chip 2 is pressed, the springs 36 can absorb the dimensional errors of the projections 3 1 and 2, and the projections 3 1 2 allow the IC chip 2 to be pressed against the pressed surface 2 of the IC chip. The pressing force applied to 11 can be made uniform. In other words, by controlling the stroke of each protrusion 3 12 and the load of each protrusion 3 12, the pressing force applied to the pressed surface 2 11 of the IC chip by each protrusion 3 12 is made uniform. can do.

In the present embodiment, as shown in FIG. 6, in the champer 100 configured as described above, a temperature-controlling blower 90 is provided inside a closed casing 80 that forms the test chamber 102. Is installed. The temperature control blower 90 has a fan 92 and a heat exchanging unit 94, which draws air inside the casing by the fan 92 and discharges the air into the casing 80 through the heat exchanging unit 94. Thus, the inside of the casing 80 is set to a predetermined temperature condition (high temperature or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchange section 94 of the temperature control blower 90 is constituted by a heat-radiating heat exchanger or an electric heater through which a heating medium flows. For example, sufficient heat can be provided to maintain a high temperature of room temperature to about 160 ° C. Also, when the inside of the casing is to be cooled, the heat exchange section 94 is filled with a refrigerant such as liquid nitrogen. It consists of a circulating heat-exchanging heat exchanger, etc., and can absorb enough heat to maintain the inside of the casing at a low temperature of, for example, about 60 ° C to room temperature. The internal temperature of the casing 80 is detected by, for example, a temperature sensor 82, and the air flow of the fan 92 and the heat quantity of the heat exchange section 94 are maintained so that the inside of the casing 80 is maintained at a predetermined temperature. Is controlled.

The hot or cold air generated through the heat exchange section 94 of the temperature control blower 90 flows through the upper part of the casing 80 along the Y-axis direction, and descends along the casing side wall opposite to the apparatus 90, It returns to the device 90 through the gap between the match plate 60 and the test head 5 and circulates inside the casing. Fourth, a portion related to the unloader section 400 will be described.

The unloader section 400 shown in FIGS. 2 and 3 is also provided with an X—Y transfer apparatus 404 having the same structure as the XY transfer apparatus 304 provided in the mouth section 300. Then, the XY transfer device 404 transfers the tested IC chip from the test tray TST carried out to the unloader section 400 to the waste mat tray KST.

As shown in FIG. 2, the customer tray KST conveyed to the unloader unit 400 is arranged on the device substrate 105 of the unloader unit 400 so as to face the upper surface of the device substrate 105. A pair of windows 406 and 406 are provided.

Although not shown in the figure, a lifting table for raising and lowering the customer tray KST is provided below each window 406, and the tested IC chip under test is provided here. After loading the full tray, the tray is lowered and the tray is transferred to the tray transfer arm 205. The embodiments described above are described for facilitating the understanding of the present invention, but are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, the shape of the protruding portion 312 provided on the pusher block 31 of the pusher 30 can be changed within a range of making a point contact with the attached matter S or a surface contact having a small contact area. . For example, the shape of the protrusion 312 can be a pointed shape other than a cone shape such as a pyramid shape or a needle shape. As shown in FIG. 13, when the shape of the protrusion 3 12 is needle-shaped, the pressed surface 2 11 of the main body 21 of the IC chip 2 faces the pressed surface 2 1 1 Since the gap R formed between the pusher block 3 1 and the surface 3 1 1 becomes large, when the protrusion 3 1 2 comes into contact with the deposit S, the deposit S moves to the gap R. It will be easier. Further, when the shape of the projections 3 12 is needle-like, the probability that the projections 3 12 and the attached matter S come into contact with each other is low (that is, the attached matter S is initially formed in the gap R from the beginning). The probability of existence).

Further, the IC test apparatus 10 is not limited to the chamber type described in the above embodiment, and may be, for example, a chamberless type or a heat plate type. Industrial applicability

ADVANTAGE OF THE INVENTION According to the pusher and the electronic component test apparatus of this invention, even if a small piece, such as a piece of silicon, adheres to the pressed surface of the electronic component, the electronic component can be damaged or broken or chipped. Instead, a pressing force can be applied to the electronic device under test in the direction of the connection terminal of the socket.

Claims

The scope of the claims

1. A pusher for pressing a main body of an electronic component mounted on a socket, wherein the electronic component is pressed toward a connection terminal of the socket on a surface facing a pressed surface of the electronic component. A pusher characterized by being provided with a protruding portion for obtaining.

2. The pusher according to claim 1, wherein the protrusion has a pointed shape.

3. The pusher according to claim 1, wherein the protrusion is provided at a position corresponding to an external terminal of the electronic component.

4. The pusher according to any one of claims 1 to 3, wherein an elastic member is provided for urging the protrusion in the pressing direction of the electronic component.

5. An electronic component test apparatus comprising the pusher according to any one of claims 1 to 4.