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WO2000003073A3 - Paced chemical replenishment system - Google Patents

Paced chemical replenishment system Download PDF

Info

Publication number
WO2000003073A3
WO2000003073A3 PCT/US1999/015752 US9915752W WO0003073A3 WO 2000003073 A3 WO2000003073 A3 WO 2000003073A3 US 9915752 W US9915752 W US 9915752W WO 0003073 A3 WO0003073 A3 WO 0003073A3
Authority
WO
WIPO (PCT)
Prior art keywords
replenishment
condition
product
chemical bath
replenishment condition
Prior art date
Application number
PCT/US1999/015752
Other languages
French (fr)
Other versions
WO2000003073A2 (en
Inventor
Todd A Balisky
Original Assignee
Dj Parker Company Inc D B A Pa
Todd A Balisky
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dj Parker Company Inc D B A Pa, Todd A Balisky filed Critical Dj Parker Company Inc D B A Pa
Priority to JP2000559286A priority Critical patent/JP2003527477A/en
Priority to EP99933935A priority patent/EP1099013A2/en
Priority to KR1020017000554A priority patent/KR20010053520A/en
Priority to US09/743,729 priority patent/US6521112B1/en
Priority to AU49881/99A priority patent/AU4988199A/en
Publication of WO2000003073A2 publication Critical patent/WO2000003073A2/en
Publication of WO2000003073A3 publication Critical patent/WO2000003073A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Non-Electrical Variables (AREA)

Abstract

A method of controlling the content of a chemical bath includes the steps of: determining a replenishment condition for the chemical bath; defining a unit of the replenishment condition; establishing a pacing factor corresponding to a replenishment volume of a replenishment medium per unit of the replenishment condition; and defining a replenishment threshold corresponding to the product of a predetermined number of the defined units of the replenishment condition and the pacing factor. The rate of continued replenishment of the predetermined constituent of the chemical bath is determined in response to the replenishment condition, which may be elapsed time, ampere-hours (or coulombs), number of product loads, product surface area, line speed over time, etc. The method replenishes constituents as they actually are consumed. It also prevents depletion (or buildup in the case of decanting a by-product) and the associated time delay related to detection and correction. The system permits the operator to set the replenishment delivery calculations. Once these settings are established, the system will automatically adjust the replenishment amount based on the replenishment condition by analysis of the plating bath.
PCT/US1999/015752 1998-07-13 1999-07-13 Paced chemical replenishment system WO2000003073A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000559286A JP2003527477A (en) 1998-07-13 1999-07-13 Regular chemical replenishment system
EP99933935A EP1099013A2 (en) 1998-07-13 1999-07-13 Paced chemical replenishment system
KR1020017000554A KR20010053520A (en) 1998-07-13 1999-07-13 Paced chemical replenishment system
US09/743,729 US6521112B1 (en) 1999-07-13 1999-07-13 Paced chemical replenishment system
AU49881/99A AU4988199A (en) 1998-07-13 1999-07-13 Paced chemical replenishment system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9255198P 1998-07-13 1998-07-13
US60/092,551 1998-07-13

Publications (2)

Publication Number Publication Date
WO2000003073A2 WO2000003073A2 (en) 2000-01-20
WO2000003073A3 true WO2000003073A3 (en) 2000-11-16

Family

ID=22233781

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/015752 WO2000003073A2 (en) 1998-07-13 1999-07-13 Paced chemical replenishment system

Country Status (5)

Country Link
EP (1) EP1099013A2 (en)
JP (1) JP2003527477A (en)
KR (1) KR20010053520A (en)
AU (1) AU4988199A (en)
WO (1) WO2000003073A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4766579B2 (en) * 1998-11-30 2011-09-07 アプライド マテリアルズ インコーポレイテッド Electrochemical deposition equipment
JP3860111B2 (en) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 Plating apparatus and plating method
CN115613018A (en) * 2022-09-26 2023-01-17 深圳惠科新材料有限公司 Copper foil anti-oxidation treatment system and treatment method
CN118373954B (en) * 2024-06-21 2024-09-27 山东创康生物科技有限公司 Preparation method of antibacterial polyurethane based on preparation parameter control

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US5182131A (en) * 1985-02-28 1993-01-26 C. Uyemura & Co., Ltd. Plating solution automatic control
EP0564780A1 (en) * 1992-04-06 1993-10-13 Shipley Company Inc. Methods and apparatus for maintaining electroless plating solutions
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
US5450870A (en) * 1992-04-17 1995-09-19 Nippondenso Co., Ltd. Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof
EP0768589A2 (en) * 1995-10-10 1997-04-16 Ford Motor Company Limited Method and system for controlling phosphate bath constituents

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182131A (en) * 1985-02-28 1993-01-26 C. Uyemura & Co., Ltd. Plating solution automatic control
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
EP0564780A1 (en) * 1992-04-06 1993-10-13 Shipley Company Inc. Methods and apparatus for maintaining electroless plating solutions
US5450870A (en) * 1992-04-17 1995-09-19 Nippondenso Co., Ltd. Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
EP0768589A2 (en) * 1995-10-10 1997-04-16 Ford Motor Company Limited Method and system for controlling phosphate bath constituents

Also Published As

Publication number Publication date
EP1099013A2 (en) 2001-05-16
KR20010053520A (en) 2001-06-25
JP2003527477A (en) 2003-09-16
AU4988199A (en) 2000-02-01
WO2000003073A2 (en) 2000-01-20

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