WO1999029797A1

WO1999029797A1 - Hot-melt adhesive composition and resin-laminated ic cards

Info

Publication number: WO1999029797A1
Application number: PCT/JP1998/005501
Authority: WO
Inventors: Makoto Imahori; Masashi Yamada; Shin Takahashi; Shuta Nakagawa
Original assignee: Toagosei Co., Ltd.
Priority date: 1997-12-09
Filing date: 1998-12-04
Publication date: 1999-06-17
Also published as: TW528787B

Abstract

A hot-melt adhesive composition for resin-laminated IC cards, mainly comprising a saturated copolyester resin having a weight-average molecular weight ranging from 8,000 to 100,000; and resin-laminated IC cards wherein resin sheets are layered by means of the adhesive composition.

Description

Specifications-Hot-melt adhesive composition for resin-laminated IC card and resin-layered IC card

Technical field

The present invention relates to a resin-laminated Ic card and a hot-melt adhesive composition used for producing the resin-laminated card. More specifically, the present invention relates to a resin laminated card manufactured by laminating one or more resin sheets on an IC card body on which components such as LSIs, capacitors, and coils are mounted, and an adhesive used for the laminate. It belongs to the electronic material manufacturing technology. Background art

Conventionally, as a resin IC card on which electronic components are mounted, there is one disclosed in Japanese Patent Application Laid-Open No. 6-122977. In this case, UV curable liquid resin is injected into the part of the card body where electronic components are stored, a transparent sheet is placed on top of this, and then a UV lamp is irradiated to cure the liquid resin and bond the sheets together. Like that. In addition, for example, Japanese Patent Application Laid-Open No. 6-248187 discloses that when an electronic component is bonded to a resin sheet, a double-sided pressure-sensitive adhesive sheet provided with a release paper layer on both sides of an adhesive layer is used as the electronic component. There is also disclosed a method in which a half-cut product is peeled off, a release paper on one side is peeled off and attached to an electronic component, and then the other release paper is peeled off and pasted on a plastic card. The adhesive used for the double-sided adhesive sheet used at this time is generally an acrylic adhesive or an epoxy adhesive.

Japanese Patent Application Laid-Open No. 9-216485 discloses the use of a hot-melt adhesive, and Japanese Patent Application Laid-Open No. 9-124078 discloses an acrylic-based hot-melt adhesive. A hot-melt adhesive is disclosed in Japanese Patent Application Laid-Open No. Hei 9-188077, which discloses a specific random copolymerized polyester as a hot-melt adhesive. As is recognized in the gazette, at present, an adhesive suitable for a resin-laminated IC card has not been provided.

Use of UV-curable resins requires expensive UV irradiation equipment and In addition, the UV curable resin has a high Tg after curing, which is higher than room temperature, causing problems such as lack of bending flexibility and cracking. Distortion is likely to occur, causing damage to electronic components and causing distortion on the surface.

The use of pressure-sensitive adhesives has a problem in that sufficient adhesive strength cannot be obtained due to low cohesive strength and adhesiveness of the resin, and heat resistance is also low. In addition, the use of release paper is essential, which complicates the work. In addition, there is a problem that reliability is poor because dust easily adheres. Disclosure of the invention

The present inventors have noted that hot melt adhesives do not have the above-mentioned problems, and prepared various types of hot melt adhesives to form a resin chip as an IC card body on which electronic components were mounted. The research was conducted to find a hot melt adhesive that can provide an IC card with high adhesive strength between the resin sheet and the resin sheet to be laminated and excellent heat resistance and flexibility in a simple manufacturing process.

As a result of intensive studies to achieve the above-mentioned problems, the resin sheet as the Ic force body on which the electronic components are mounted, and the resin sheet and design sheet as the surface layer are mainly composed of a specific saturated copolymerized polyester resin. It has been found that the above-mentioned problems can be solved by bonding with a hot-melt adhesive, and the present invention has been completed.

That is, the present invention is characterized in that a resin-laminated IC force is mainly composed of a saturated copolymerized polyester resin having a weight average molecular weight of not less than 8,000 and not more than 100,000.

A hot-melt adhesive composition for use with a hot-melt adhesive, wherein a resin sheet is laminated and bonded with the hot-melt adhesive composition to an IC card body on which electronic components are mounted. It concerns IC cards.

Examples of the acid component of the saturated copolymerized polyester resin include an aromatic dibasic acid, an aliphatic dibasic acid, an alicyclic dibasic acid, and those derived from an ester formed product thereof. And those derived from aliphatic glycols or alicyclic glycols. Further, it is preferable that 30 mol% or more of the acid component of the saturated copolymerized polyester resin is an aromatic dibasic acid or an ester-forming product thereof. It is preferable that 30 mol% or more of the riol component is ethylene glycol and Z or 1,4-butanediol. Further, as the saturated copolymerized polyester resin, those having a main endothermic peak temperature of 50 ° C. or more and 200 ° C. or less with a heat of fusion of 1 J Zg or more as measured by a differential scanning calorimeter may be mentioned.

Further, the composition of the present invention may include polyethylene or a derivative thereof (a melt flow rate is preferably 0.5 g / 10 min or more and 100 g / 10 min or less), an epoxy resin (for example, bisphenol A type epoxy resin). , A terpene resin (for example, an aromatic terpene resin), a phenoxy resin, a petroleum resin, a phenol resin, and a rosin resin. May also be included.

Hereinafter, the present invention will be described in detail.

〇Resin sheet

As a resin sheet such as a card body sheet, a design sheet, and a surface protection sheet used in the present invention, a resin sheet made of PET, PVC, polycarbonate, ABS, nylon, or the like, or a metal such as A1 is used for these resin sheets. A sheet laminated with foil can be used.

The electronic component may be formed on a circuit board, or may be made of a thermosetting or light-curing resin or the like. As a material of the substrate, PET, polyolefin sulfide, PVC, polyimide, glass epoxy film, BT resin film, and the like can be used.

〇Polyester resin

The adhesive used in the present invention is a hot melt adhesive containing a saturated copolymerized polyester resin having a weight average molecular weight of 8,000 or more and 100,000 or less as a main component. When the weight average molecular weight (measured by gel permeation chromatography (GPC) in terms of polystyrene) of the polyester resin is smaller than 8,000, the polyester resin lacks cohesive strength, and the adhesive strength, particularly at high temperatures, decreases. And the softening temperature also decreases. When the weight average molecular weight is more than 100,000, the melt viscosity at the time of coating is As a result, it is difficult to spread and spread sufficiently on the unevenness of the electronic component, and it is not sufficiently filled, resulting in unevenness on the surface and a high coating temperature to reduce the viscosity of the coating resin. Problems such as damaging the product and significantly reducing the production speed occur. Preferred saturated copolymerized polyester resins for the present invention are those having a weight-average molecular weight of from 10,000 to 800,000.

As the copolymerized monomer component constituting the saturated copolymerized polyester resin, various ones are exemplified, and specific examples include the following monomer components.

Acid component

For example, as the acid component, aromatic dibasic acids such as terephthalic acid, isophthalic acid, phthalic anhydride, α-naphthalenedicarboxylic acid, / 3-naphthalenedicarboxylic acid and their ester-forms, succinic acid, dartaric acid Aliphatic dibasic acids such as adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, pendecilenic acid, dodecandioic acid and their ester-formers, 1,4-cyclohexanedicarboxylic acid, tetrahydrogen Alicyclic dibasic acids such as phthalic anhydride and hexahydrophthalic anhydride;

Among these compounds, aromatic dibasic acids, particularly terephthalic acid and its ester-forms, are preferred for the present invention in terms of adhesive strength. It is preferable that the content ratio of the aromatic dibasic acid be 30 mol% or more based on the total acid components. By blending in such a manner, the cohesive strength and hardness of the resin are improved, and the adhesion is improved. Strength and threading strength increase. Polycarboxylic acids such as trimellitic acid and pyromellitic acid can also be used together within the range that does not impair gelation or adhesive strength during polyester synthesis. Can be used in the range.

Polyol component

The polyol components include ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6-hexane. Diol, 1,8-octanediol, 1,9-nonanediol, neopentyl glycol, 3-methylpentanediol, 2,2,3-trimethylpentanediol, methylene glycol, triethylene glycol, zip mouth Aliphatic glycols such as pyrendalcol, 1,4-cyclohexanedimethanol, water And alicyclic glycols such as bisphenol A.

In addition, polyols such as glycerin, trimethylol-l-ethane, trimethylolpropane, and pentaerythritol can be used in an amount of 5 mol% or less based on all polyol components.

It is preferred according to the invention that ethylene glycol and 1,4-butanediol are used as these polyols. Further, the ratio of ethylene glycol and / or 1,4-butanediol to all polyol components is preferably 30 mol% or more. The polyester resin obtained by adjusting the content to 30 mol% or more has excellent cohesive strength, adhesive strength, heat resistance and the like.

The polyester resin preferably has a melting point (a main endothermic peak temperature at which the heat of fusion measured by a differential scanning calorimeter is 1 J / g or more) of 50 to 200 ° C., and is preferably 70 to 200 ° C. A temperature of 150 ° C. is more preferable. If it is smaller than this range, the heat resistance of the resin will be insufficient.If it is larger than this range, if the coating temperature or the bonding temperature increases, the electronic circuit will be degraded or damaged, or the resin sheet will not be thermally degraded. Or may cause poor adhesion.

Such a saturated copolymerized polyester resin is produced by a usual method. For example, there are a melt polymerization method in which raw materials and a catalyst are charged in a polymerization reaction vessel and heating at a temperature higher than the melting point of the product, a solid phase polymerization method in which polymerization is performed at a temperature lower than the melting point of the product, and a solution polymerization method using a solvent. Either method may be adopted. However, in order to obtain a polyester having an appropriate degree of polymerization in accordance with the object of the present invention and from the economical viewpoint, a melt polymerization method is preferred, and the polyester is produced by an ester exchange method or a direct esterification method. The production of a polyester resin by such a melt polymerization method is a known method.

〇Polyethylene resin

The adhesive used in the present invention is a hot-melt adhesive containing the above-mentioned saturated copolymerized polyester resin as a main component, but it is preferable in the present invention that a polyethylene resin is used in combination as a resin component. As the polyethylene resin to be used in combination, an ordinary polyethylene resin is used.For example, any of ordinary polyethylene resins obtained by radical polymerization of ethylene can be used, and a low-density polyethylene produced by a high-pressure method, a medium-pressure method High-density polyethylene, linear low-density polyethylene, etc., produced by a pressure method are used. Particularly preferred among these polyethylene resins are low-density polyethylene and linear low-density polyethylene.

In the polyethylene resin used in the present invention, it-olefins such as propylene and styrene were copolymerized, and maleic anhydride, vinyl acetate, acrylic acid, acrylate, methacrylic acid, and methacrylate were copolymerized. Although it is possible to use a monomer, the proportion of the monomer copolymerized with ethylene is preferably less than 10% by weight so as not to impair the effects of the present invention.

For polyethylene resin, the melt flow rate (test temperature: 190 ° C, test load: 2.16 kgf, according to JIS-K7660-1981) is 0.5 g / 10 min or more and 100 g / 10 min or less. Some are preferred. If it is less than 0.5 g / 10 minutes, the mixing property with the polyester resin is not sufficient, and the adhesive performance tends to decrease. On the other hand, if the amount exceeds lO Og / 10 minutes, the adhesive strength and the adhesive durability tend to decrease. More preferably, it is a polyethylene resin having a melt flow rate of lg / 10 minutes or more and 5 Og / 10 minutes or less.

In the present invention, the preferable blending amount of the polyethylene resin is 5 parts by weight or more and 100 parts by weight or less based on 1.00 part by weight of the polyester resin. Adhesion strength, adhesion durability and the like are improved by such a blending. More preferably, the blending amount of the polyethylene resin is from 10 parts by weight to 50 parts by weight.

〇Organic alkoxysilane

The hot melt adhesive used in the present invention is preferably one in which an organic alkoxysilane is used as an additive. As the organic alkoxysilane, those usually called a silane coupling agent can be used. .

Specific examples of the organoalkoxysilane include, for example, γ-glycidoxypropyl trimethoxysilane, γ-glycidoxytriethoxysilane, ^-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-aminobutyl pilltri Ethoxysilane, Ν- / 3- (aminoethyl) -γ-aminobutyral trimethoxysilane, γ-mercaptobutyrotrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyl trimethoxysilane, γ -Methacryloki Cypropyl-tri (; 3-methoxyethoxy) silane and the like.

Of these, organic alkoxysilanes containing an epoxy group in the molecule are preferred.

The compounding amount of the organic alkoxysilane is preferably from 0.1 to 10 parts by weight based on 100 parts by weight of the polyester resin. Within this range, the adhesion durability, particularly the water resistance, can be improved without causing a problem in the stability after mixing. A more preferred compounding amount of the organic alkoxysilane is from 0.3 to 5 parts by weight.

〇Additives

The adhesive composition of the present invention can contain various resins, inorganic fillers, various stabilizers, etc. for various purposes in addition to the organic alkoxysilane within a range that does not impair the performance of the present invention. It is.

As the resin, a polyester resin, a polypropylene resin, a polystyrene resin, a polyurethane resin, an epoxy resin, a phenoxy resin, a phenol resin, a petroleum resin, a terpene resin, a rosin resin and the like other than the present invention can be blended.

Particularly useful of the above resins are terpene resins. Particularly, an aromatic modified terpene resin is preferable because it has good compatibility with the polyester resin of the present invention and improves the adhesive strength. Similarly, the epoxy resin is also highly compatible with the polyester resin of the present invention, and is preferably an epoxy resin having a melting point of 40 ° C. or more and containing two or more glycidyl groups in one molecule, and in particular, bisphenol A Epoxy resins and cresol novolak epoxy resins are preferred. Bisphenol A type epoxy resin is obtained by reacting bisphenol A with epichlorohydrin. And the like (above, manufactured by Yuka Shell Epoxy Co., Ltd.). The cresol novolak epoxy resin is obtained by reacting cresol and formaldehyde as starting materials and epichlorohydrin. 9 (above, manufactured by Novarteis Co., Ltd.). The amount of the epoxy resin is preferably based on 100 parts by weight of the polyester resin. Is 50 parts by weight or less, more preferably 25 parts by weight or less. -As the inorganic filler, powders such as calcium carbonate, zinc oxide, titanium oxide, talc, clay, fumed silica and the like having a particle size of 10 tm or less can be used. It is preferably at most 30 parts by weight based on 0 parts by weight. As a stabilizer, an antioxidant such as hindered phenol can be added. These additives may further improve the characteristics of the present invention, and can be used as appropriate.

Among the hot-melt adhesives composed of the above components, the hot-melt adhesive preferred for the present invention has a Tg of 30 ° C. or less, which can more efficiently exhibit the effects intended by the present invention. It is a hot melt adhesive having a melting point of 70 ° C. or more and 150 ° C. or less.

〇Adhesive manufacturing method

In the present invention, the adhesive composition is preferably melt-mixed at a temperature equal to or higher than the softening temperature of the saturated copolyester resin to be used, or when a polyethylene resin is blended, to form an adhesive. As the mixing device, a single-shaft or twin-shaft screw-type melt kneader, or a normal thermoplastic resin mixer represented by a twin-head heating mixer is used.

Following kneading, it is possible to use pelletized by a granulation step, or to apply the kneaded product directly onto a resin sheet for use.

The most preferred apparatus in these steps is an extruder of the twin screw type, and it is preferable to operate the cylinder at the time of processing at a temperature higher by 10 to 100 ° C. than the softening temperature of the polyester resin.

〇Adhesion method

In bonding using the adhesive composition of the present invention, for example, using a pellet granulated by the above-described production method, extrusion molding as a sheet on a release film by a melt extruder having a T die is used. Then, the film from which the release sheet has been peeled off is sandwiched between resin sheets and bonded by hot pressing. At this time, all the constituent materials are stacked and heated at once. It may be formed by pressing or by several times hot pressing some constituent materials. Further, the constituent material may be inserted between the rolls heated by the heat laminator to perform lamination. The heating press can be performed once or in several times. The bonding temperature is set so that the temperature of the adhesive layer is 100 ° C. (: up to 200 ° C.), and the time is adjusted according to the constituent materials of the base material and the temperature of the atmosphere.

The thickness of the adhesive after coating is 2! 11 thigh, preferably 5 to 400 zm, which is a thickness necessary to fill the unevenness of the electronic component. 〇Application

The resin-laminated IC card manufactured using the adhesive composition of the present invention includes a credit card, a bank card, an ID card, a commuter pass, a telephone card, a driver's license, a highway toll collection card, a passport, It is used for purposes such as insurance cards. Action

The adhesive of the present invention is a hot-melt adhesive. In the production of a resin-laminated IC card, an adhesive is sandwiched between films to be laminated, and the films are bonded by hot pressing. It provides good heat resistance, heat-resistant adhesion, and excellent filling and sealing properties.

The material of the resin sheet to which the adhesive of the present invention is used is, for example, PET, PVC, polycarbonate, ABS, nylon, or a resin laminate composed of a sheet in which a metal foil such as A1 is laminated on these resins. It is widely used for die IC cards, and when applied to them, exhibits high adhesive strength and long-term durability. Further, the hot melt adhesive composition of the present invention has excellent electrical properties and high electrical insulation. The reason why high adhesive strength and durability can be obtained is considered as follows.

(1) The polyester resin adheres firmly to the resin used for the above card.

(2) By blending the polyethylene resin, shrinkage due to crystallization of the polyester resin is suppressed, which contributes to the relaxation of the internal stress of the adhesive layer, and the adhesive strength does not change with time. (3) The compounding of the organic alkoxysilane increases the adhesiveness to the resin surface, improves the compatibility between the organic group and the polyester resin, and expresses high adhesive strength.

(4) Due to the crystallinity of the polyester resin generated by an appropriate molecular weight, the cohesive force of the resin is high and a high level of heat resistance can be imparted. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, examples of the present invention will be described together with comparative examples. However, the technical scope of the present invention is not limited to these examples.

Prior to the description of the examples and the like, methods for measuring and evaluating physical properties in the following description will be described.

測定 Method of measuring physical properties

Weight average molecular weight

It was measured by GPC and expressed in terms of polystyrene.

Melting point

The temperature of the main endothermic peak was determined as the melting point by a differential scanning calorimeter.

Gaffs

According to the differential scanning calorimeter, the temperature at the inflection point on the low temperature side of the stepwise change portion was taken as the glass transition point.

〇Adhesion method

The adhesive film was punched out with a card-shaped mold. After being sandwiched between untreated PET thicknesses of 100 Am (S-10 diamond foil, manufactured by Hoechst), 15 CTCX was heated with a hot press at 0.25 MPa for 15 minutes. The adhesion was measured.

〇Adhesive performance (based on JI SK-6854 “Adhesive peeling adhesion strength test method”) Cut the bonded PET resin card into 25 bands, and at 23 ° C, with a pulling speed of 20 OmmZ minutes Was measured. The measurement was performed at the initial stage (immediately after bonding), after 24 hours at 85 ° C and 95% RH (relative humidity), and at 1 day at 23 ° C and 65% RH. Example 1 -

合成 Synthesis of polyester resin

In a four-neck flask equipped with a stirrer, nitrogen inlet tube, distillation tube, and thermometer, dimethyl terephthalate 0.65 mol, 1,4-butanediol 0.8 mol, ethylene glycol

1.2 mol and 0.2 ^× 10 ² mol of tetra-n-butyl titanate as a catalyst were charged, the temperature was raised while introducing nitrogen, and methanol was distilled at 130 to 200 ° C. Thereafter, 0.18 mol of sebacic acid and 0.18 mol of adipic acid were added, and water was distilled at 200-240 ° C. Then, while gradually reducing the pressure, 1 mmHg at 260 ° 〇 The reaction was continued under reduced pressure for 3 hours. The obtained polyester resin had a melting point of 120 ° C., a glass transition point of 0 ° C., and a weight average molecular weight of 18,000. The composition of the monomer by NMR analysis was as follows: molar ratio of nodipic acid terephthalate, zinc sebacate, and ethylene glycolone 1,4-butanediol = 64Z18Z18Z6040. This is polyester resin A.

〇Adhesive preparation

100 parts by weight of polyester resin A, 100 L of low-density polyethylene resin Mirason (melt flow rate: 9.5 g 0 min, manufactured by Mitsui Chemicals, Inc .; hereinafter referred to as polyethylene resin A) 30 parts by weight, γ- Two parts by weight of glycidoxypropyltrimethoxysilane (hereinafter referred to as “organoalkoxysilane”) were mixed with a twin-screw extruder to prepare a 40 m film adhesive.

〇Adhesive performance

Using this film adhesive, a card was formed by laminating PET by the above-mentioned bonding method, and a peel strength and wet heat durability test were performed. Table 1 shows the results. Examples 2 to 6

In the same manner as in Example 1, polyester resin A, polyethylene resin A, low-density polyethylene resin Mirason FL 60 (melt flow rate 70 g / 10 minutes, manufactured by Mitsui Chemicals, Inc., hereinafter referred to as polyethylene resin B) ), Using organic alkoxysila A, and ^-(3,4-epoxycyclohexyl) ethyltrimethoxysilane (hereinafter referred to as organic alkoxysilane B). Epicote 1007, a bisphenol A type epoxy resin that is solid at 122 to 132 ° (: made by Yuka Shell Epoxy Co., Ltd., hereinafter referred to as epoxy resin A), YS resin TO—105, which is an aromatic modified terpene resin (softening point 105t, Yas Hara Chemical Co., Ltd. ), Terpene A.) and talc were blended in the proportions shown in Table 1 to prepare an adhesive, a film was prepared, and a card laminated with PET was prepared. Table 1 shows the results of the peel strength and wet heat durability tests.

table 1

Examples 7 to 10, Comparative Examples 1 to 3

In the same manner as in Example 1, a polyester resin having the polymerization composition shown in Table 2 was synthesized. In the table, the monomer composition ratio in the produced polyester resin is indicated by a molar ratio, and the resin physical properties are also indicated.

Based on 100 parts by weight of the polyester resin, 30 parts by weight of the polyethylene resin A, 2 parts by weight of the organic alkoxysilane A, and 20 parts by weight of the epoxy resin A A film adhesive was prepared by blending, and a PET resin card was further prepared to evaluate the bonding performance. The results are shown in Table 2.

Table 2

Comparative Example 4

Evaflex EV-150, an ethylene-vinyl acetate resin (melt flow rate 30 g / 10 min, vinyl acetate content 33% by weight, manufactured by Mitsui Chemicals, Inc.) 100 parts by weight of polyethylene used in the above examples Evaluation was made in the same manner as in Example 1 using an adhesive containing 30 parts by weight of resin A, 20 parts by weight of bisphenol A type epoxy resin, and 2 parts by weight of organic alkoxysilane A. Melting point: 105 ° C, glass The transition point is 10 ° C, the peel strength is 10N / 25mm at the initial stage, and 3N / 25 after the durability test. Met. Industrial applicability

Since the adhesive composition of the present invention is a hot-melt adhesive having no volatile components, it has low risk of ignition and odor, is excellent in safety, and has high-speed adhesiveness in which bonding is completed after cooling. It has excellent workability and productivity because it can be processed into film. When applied to resin cards, especially cards made of PET or PVC film, it has excellent adhesion, high heat resistance and durability, and maintains high adhesion even under various severe conditions. Therefore, it can be widely applied to IC cards used in such industries as credit cards, bank cards, ID cards, commuter passes, telephone cards, driver's licenses, expressway toll collection cards, passports, insurance cards, etc. Things.

Claims

The scope of the claims

1. A hot melt adhesive composition for a resin-laminated IC card, comprising a saturated copolymerized polyester resin having a weight average molecular weight of 8,000 or more and 100,000 or less as a main component.

2. The composition according to claim 1, wherein the acid component of the saturated copolymerized polyester resin is derived from an aromatic dibasic acid, an aliphatic dibasic acid, an alicyclic dibasic acid, or an ester-forming product thereof.

3. The composition according to claim 1, wherein the polyol component of the saturated copolymerized polyester resin is derived from an aliphatic glycol or an alicyclic dalicol.

4. The composition according to claim 1, wherein at least 30 mol% of the acid component of the saturated copolymerized polyester resin is an aromatic dibasic acid or an ester-forming product thereof.

5. The composition according to claim 1, wherein at least 30 mol% of the polyol component of the saturated copolymerized polyester resin is ethylene dalicol and / or 1,4-butanediol.

6. At least 30 mol% of the acid component of the saturated copolymerized polyester resin is an aromatic dibasic acid or its ester-former, and at least 30 mol% of the polyol component is ethylene glycol and / or 1,4-butanediol. The composition of claim 1.

7. The composition according to claim 1, wherein the saturated copolymerized polyester resin has a main endothermic peak temperature having a heat of fusion of 1 JZg or more as measured by a differential scanning calorimeter of 50 ° C to 200 ° C.

8. The composition according to claim 1, further comprising at least one selected from the group consisting of polyethylene or a derivative thereof, an epoxy resin, a terpene resin, a phenoxy resin, a petroleum resin, a phenol resin, and a rosin resin.

9. The composition of claim 1, further comprising an organic alkoxysilane.

1 0. The melt flow rate of polyethylene or its derivative is 0.5g / 10min or more l O Og / 10min or less (190 ° C, load 2.16kgf, according to JIS-K-7660-1981 9. The composition according to claim 8, which is:

1 1. The composition according to claim 8, wherein the terpene resin is an aromatic terpene resin.

2. The composition according to claim 8, wherein the epoxy resin is a bisphenol A type epoxy resin.

3. The composition according to claim 9, wherein the organic alkoxysilane has an epoxy group.

A resin-stacked IC card, characterized in that a resin sheet is laminated and bonded to the IC card body on which electronic components are mounted, using the composition according to any one of claims 1 to 13.