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WO1997008925A1 - Procede pour etablir une connexion entre au moins deux conducteurs electriques dont l'un est monte sur un substrat de support - Google Patents

Procede pour etablir une connexion entre au moins deux conducteurs electriques dont l'un est monte sur un substrat de support Download PDF

Info

Publication number
WO1997008925A1
WO1997008925A1 PCT/DE1996/001504 DE9601504W WO9708925A1 WO 1997008925 A1 WO1997008925 A1 WO 1997008925A1 DE 9601504 W DE9601504 W DE 9601504W WO 9708925 A1 WO9708925 A1 WO 9708925A1
Authority
WO
WIPO (PCT)
Prior art keywords
tool
conductor
carrier substrate
substrate
connection
Prior art date
Application number
PCT/DE1996/001504
Other languages
German (de)
English (en)
Inventor
Josef Mundigl
Michael Huber
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1997008925A1 publication Critical patent/WO1997008925A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • an intermediate product can be a semiconductor chip arranged on an electrically conductive lead frame and connected to a planar antenna coil applied to a carrier film by means of lamination and etching technology, by connecting both the chip and the coil to the lead frame become.
  • connection of the two metals is usually carried out by means of pressure using a suitable tool, such as a joining die, ultrasound and / or heat preferably being used as an additional energy source.
  • a suitable tool such as a joining die, ultrasound and / or heat preferably being used as an additional energy source.
  • the tool must come into contact with one of the partners to be connected, the partners also necessarily having to be in contact with one another. It is a problem if one of the partners is attached to a carrier substrate.
  • the carrier substrate must be prepared. This preparation, such as making an opening, sometimes requires a very precisely positioned machining process and is therefore generally associated with additional costs.
  • the object of the present invention is therefore to provide a method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate by means of lamination and etching technology, in which no preparation of the carrier substrate is necessary.
  • the method according to the invention can be used particularly advantageously when using carrier substrates with low temperature conductivity since, in the manner according to the invention, the same energy source that is used for the mechanical introduction of energy for the actual connection of the two electrical conductors is also used for melting the carrier. serves substrate. In this way it is possible to melt the material of the carrier substrate, to connect the two electrical conductors to one another in a simple and thus inexpensive manner without special preparation and pretreatment of the carrier.
  • This type of connection technology according to the invention has the particular advantage that the process sequence can be automated very easily and in this way complex work steps can be saved.
  • Figures 1 and 2 a first variant and Figures 3 and 4 a second variant of the inventive method.
  • a first joining partner 2 which can be a lead frame, for example, is arranged on a base 1.
  • a second joining partner consists of a carrier substrate 3, on which a conductor track 4 is applied, for example in the form of a planar coil.
  • This conductor track 4 is to be connected to the first joining partner 2 by means of a tool 5.
  • energy is supplied by means of pressure and heat and / or ultrasound, so that the two joining partners 2, 3 and 4 come into contact with one another.
  • the tool 5 heats the underlying carrier material 3 via the heat and / or ultrasound coupling.
  • the conductor 4 is pressed onto the underlying joining partner 2 and connected to it. This state is shown in FIG. 2. It would of course also be possible to supply the heat energy required for melting the carrier material as a laser beam.
  • FIG. 3 A further embodiment of the method according to the invention, in which the conductor 4 applied to the carrier substrate 3 comes into direct contact with the first joining partner 2 and the tool 5 is placed on the carrier substrate 3, is shown in the figures 3 and 4.
  • the same elements as in Figures 1 and 2 are provided with the same reference numerals.
  • the joining die 5 heats the carrier material when it is placed on the substrate carrier 3.
  • the melting carrier material 3 is displaced with appropriate mechanical force coupling.
  • the contact to the first joining partner 2 can be established and the actual metal connection can thus be initiated.
  • the method according to the invention is essentially dependent on the geometrical and material-specific parameters of the conductors 2, 4 and the carrier substrate 3. It is also possible to contact several electrical conductors on corresponding carrier substrates in one working step.
  • the carrier substrate should advantageously have a melting point that is as low as possible and the electrical conductor on the carrier substrate should have a good thermal conductivity.
  • the conductors to be connected should have surfaces which are easy to alloy in order to enable a connection at an already low temperature.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé pour établir une connexion entre au moins un premier conducteur électrique formant une première connexion associée (2) et un deuxième conducteur (4) appliqué par stratification ou gravure sur un substrat de support (3) et formant, conjointement avec ce substrat, une deuxième connexion associée. Au moins ces deux connexions associées (2, 3 et 4) sont tout d'abord amenées en contact l'une avec l'autre à l'aide d'un outil (5) auquel est fournie une énergie mécanique, et le substrat (3) est ensuite fondu, au voisinage de l'outil (5), par apport supplémentaire de chaleur. Cela amène le substrat à céder sous l'outil (5), et au moins les conducteurs électriques (2, 4) sont ainsi reliés l'un à l'autre au moyen de l'outil (5).
PCT/DE1996/001504 1995-08-30 1996-08-13 Procede pour etablir une connexion entre au moins deux conducteurs electriques dont l'un est monte sur un substrat de support WO1997008925A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19531970.2 1995-08-30
DE19531970A DE19531970A1 (de) 1995-08-30 1995-08-30 Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist

Publications (1)

Publication Number Publication Date
WO1997008925A1 true WO1997008925A1 (fr) 1997-03-06

Family

ID=7770804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001504 WO1997008925A1 (fr) 1995-08-30 1996-08-13 Procede pour etablir une connexion entre au moins deux conducteurs electriques dont l'un est monte sur un substrat de support

Country Status (2)

Country Link
DE (1) DE19531970A1 (fr)
WO (1) WO1997008925A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346538B1 (en) 1997-12-18 2002-02-12 Basf Aktiengesellschaft Fungicide mixtures based on amide compounds and pyridine derivatives
US6489348B1 (en) * 1997-12-18 2002-12-03 Basf Aktiengesellschaft Fungicidal mixtures based on amide compounds and pyridine derivatives
CN106034378A (zh) * 2015-03-11 2016-10-19 深圳市英内尔科技有限公司 一种新型材质的卷对卷柔性线路板及其制作方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049708A1 (fr) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Procede de realisation de connexions electriques entre des conducteurs separes par un dielectrique
DE10205521A1 (de) * 2002-02-08 2003-08-28 Heraeus Gmbh W C Verfahren zur elektrischen Kontaktierung zweier Metallstrukturen
WO2007059797A1 (fr) * 2005-11-25 2007-05-31 Fci Procede de soudage de pistes conductrices entre elles
EP3297409B1 (fr) * 2016-09-16 2022-10-12 OSRAM GmbH Procédé de connexion de modules d'éclairage et dispositif correspondant

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3499098A (en) * 1968-10-08 1970-03-03 Bell Telephone Labor Inc Interconnected matrix conductors and method of making the same
GB1197407A (en) * 1967-06-21 1970-07-01 Siemens Ag Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies
GB1359551A (en) * 1972-02-15 1974-07-10 Welding Inst Resistance welding
US4028798A (en) * 1976-04-09 1977-06-14 General Electric Company Method of making electrical connections
DE4301692A1 (en) * 1992-01-24 1993-07-29 Matsushita Electric Ind Co Ltd Electrically connecting together 2-printed type circuit boards - by e.g. applying circuit of conducting thermoplastics to two insulating sheets, ultrasonically bonding them together under pressure and cooling
JPH05299561A (ja) * 1992-04-16 1993-11-12 Hitachi Cable Ltd 複合リードフレームの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346950A (en) * 1965-06-16 1967-10-17 Ibm Method of making through-connections by controlled punctures
US3563822A (en) * 1968-07-03 1971-02-16 Branson Instr Method for welding thermoplastic parts by sonic energy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1197407A (en) * 1967-06-21 1970-07-01 Siemens Ag Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies
US3499098A (en) * 1968-10-08 1970-03-03 Bell Telephone Labor Inc Interconnected matrix conductors and method of making the same
GB1359551A (en) * 1972-02-15 1974-07-10 Welding Inst Resistance welding
US4028798A (en) * 1976-04-09 1977-06-14 General Electric Company Method of making electrical connections
DE4301692A1 (en) * 1992-01-24 1993-07-29 Matsushita Electric Ind Co Ltd Electrically connecting together 2-printed type circuit boards - by e.g. applying circuit of conducting thermoplastics to two insulating sheets, ultrasonically bonding them together under pressure and cooling
JPH05299561A (ja) * 1992-04-16 1993-11-12 Hitachi Cable Ltd 複合リードフレームの製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 18, no. 95 (E - 1509) 16 February 1994 (1994-02-16) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346538B1 (en) 1997-12-18 2002-02-12 Basf Aktiengesellschaft Fungicide mixtures based on amide compounds and pyridine derivatives
US6489348B1 (en) * 1997-12-18 2002-12-03 Basf Aktiengesellschaft Fungicidal mixtures based on amide compounds and pyridine derivatives
CN106034378A (zh) * 2015-03-11 2016-10-19 深圳市英内尔科技有限公司 一种新型材质的卷对卷柔性线路板及其制作方法

Also Published As

Publication number Publication date
DE19531970A1 (de) 1997-03-06

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