WO1997043655A1

WO1997043655A1 - Test device, particularly for a multicontact electronic component

Info

Publication number: WO1997043655A1
Application number: PCT/FR1997/000854
Authority: WO
Inventors: Claude Chasserieau
Original assignee: Claude Chasserieau
Priority date: 1996-05-14
Filing date: 1997-05-14
Publication date: 1997-11-20
Also published as: FR2748813A1; FR2748813B1

Abstract

A test device including means (1) for immobilising electrically insulating upper (3) and lower (4) parallel plates defining a cavity (10) and respectively comprising a plurality of third (39) and first (37) through-holes arranged in a predetermined pattern, and a plurality of elongate electrically conductive contact means (30) respectively secured to the upper plate adjacent the third through-holes, and having a calibrated length (L). The cavity (10) houses means (5, 6, 8) for controllably moving the plurality of contact means between the upper and lower plates to cause one-sided buckling of the plurality of contact means.

Description

Test device, in particular of a multi-contact electronic component

The invention relates to the field of testing electronic components, such as for example a micro-computer chip, by making mechanical contacts at selected locations thereof, where their inputs, outputs and power supplies are located.

In what follows, the inputs, outputs and power supplies of the component or components to be tested will be called "contacts".

Due to the increasingly smaller dimensions of the electronic components, their contacts have dimensions which can be less than 80 microns, and the distance between the two adjacent first contacts can be of the order of approximately 100 microns.

These contacts are arranged according to a predetermined diagram, which can be perfectly geometric or of any shape, and their number on the same electronic component can reach several hundred.

Consequently, the test devices for such electronic components require a multiplicity of contact means in order to be able to test substantially all of their contacts, or even the contacts of several electronic components placed in parallel.

Test devices are already known, the contact means of which are horizontal needles, curved in line with certain contacts of the electronic component to be tested, which is integral with a plate (called a "wafer") whose movement is controlled by a manipulator wafer, and soldered by one of their ends on a printed circuit serving as an interface with a programmed electronic tester. Such testing devices do not, or very difficult, allow component testing electronics whose contacts are arranged in a matrix form. In addition, they do not allow easy testing of several identical electronic components in parallel.

Furthermore, from the US Patent of the IBM Company No. 4,027,935, test devices of the type are known comprising:

- upper and lower plates substantially parallel, electrically insulating, defining a cavity of selected height, and respectively comprising a multiplicity of zones and a multiplicity of first through holes arranged according to said predetermined diagram;

- means for immobilizing the upper and lower plates; and - a multiplicity of elongate contact means, electrically conductive, respectively secured by first ends of said zones of the multiplicity of zones, and of calibrated length greater than the height chosen so that their second ends emerge from said cavity after crossing the multiplicity of first through holes.

The contact means must all have, before their installation in the cavity, a predefined curvature. Given their dimensions, obtaining this curvature imposes on them very specific shapes which makes their cost very high and weakens them. In addition, obtaining several hundred contact means having the same predefined curvature involves significant additional costs.

Furthermore, in order to take account of the curvature of the contact means, the zones of the upper plate must be slightly offset from the first corresponding through holes on the lower plate, which complicates the mounting of this type of device.

Finally, due to the embodiment of the contact means, this type of test device can only very it is difficult to test electronic components whose center distance between first neighboring contacts is less than about 140 microns.

Consequently, an object of the invention is to provide a test device which does not have the drawbacks of the devices of the prior art, in particular in terms of cost, robustness, and adaptation to the different types of electronic components of very small dimensions.

To this end, the invention provides a test device of the type described in the introduction, and in which the cavity houses means for controlled movement, in at least one direction, of the multiplicity of contact means between the upper and lower plates. , so that this multiplicity of contact means exhibits a unidirectional buckling for the purpose of testing the multiplicity of contacts that the electronic component to be tested comprises.

Thus, the contact means are only put under stress (unidirectional pre-buckling) when the test of an electronic component begins. In addition, the stress can be controlled, and therefore adapted to the electronic component to be tested. This therefore makes it possible to facilitate the establishment of all the mechanical contacts, in a perfectly non-destructive and substantially coplanar manner.

According to another characteristic of the invention, the displacement means comprise an intermediate plate comprising a multiplicity of second through holes arranged according to the predetermined diagram and suitable for being traversed by the multiplicity of contact means, and nozzle means ¬ tement comprising, on the one hand, at least one rail secured to the immobilization means and adapted to support the sliding of the intermediate plate, and on the other hand a means suitable for cooperating with this intermediate plate to allow its controlled sliding depending on the direction of travel chosen. In this way, the displacement means ensure perfect unidirectionality of the buckling of the contact means, which further reinforces the quality of the mechanical contacts.

Preferably, the rail is positioned substantially parallel to the upper and lower plates, so that the displacement of the intermediate plate can be carried out substantially perpendicular to the contact means, when the latter are not yet subject to buckling. Of course, such a rail is not necessarily straight.

According to yet another characteristic of the invention, the upper plate comprises in each of the zones, which are situated on its external face opposite the cavity, a third through hole suitable for being crossed by the first end of a contact means, and each first end of the contact means is provided with a means forming a stop suitable for immobilizing the first end on the zone corresponding to the third hole through which it passes, so that the distance which separates the first and second ends from a contact means is substantially equal to the calibrated length.

The third holes are substantially positioned above the first holes so that before displacement the contact means are substantially rectilinear, and perpendicular to the upper and lower plates.

According to yet another characteristic of the invention, the test device comprises alignment means solidai¬ res of the immobilization means and adapted to allow alignment thereof relative to the electronic component to be tested.

Thus, since the electronic component to be tested is placed in a position which makes it invisible when one is above the upper plate, provision is made alignment means, for example provided with a marking, in order to provide a reference in position.

In a particularly advantageous manner, the test device further comprises a conduit communicating with the cavity in order to supply it with cooling air. This allows temperature testing of the electronic component.

Preferably, the abutment of a contact means is produced by crushing material from its first end.

The first ends of the contact means are connected by their respective stops to inputs of an integrated or printed circuit board, which is itself connected to the electronic tester.

Preferably, this connection between the contact means and the inputs is made at their first ends by electrically conductive connecting wires.

According to the invention, the connecting wire and the contact means form either a single element, or two separate elements connected.

In a first embodiment, the first extremi¬ ties of the contact means, provided with their respective stops, are secured to the upper plate by bonding using an insulating material.

It is also possible to provide reception means capable of receiving the wafer of integrated circuits, while accommodating at least part of the immobilization means secured to the upper, intermediate and lower plates.

In a second embodiment of the invention, the receiving means comprise an upper wall which is substantially parallel to the upper plate, and comprising a opening suitable for receiving an additional plate provided with a multiplicity of fourth through holes always arranged according to the predetermined diagram and suitable for being traversed by the multiplicity of connecting wires connected to the first ends of the contact means. Preferably, the immobilization of the contact means is obtained by bonding the connecting wires to the additional plate, at the level of the fourth holes which they pass through, using an insulating material.

According to yet another characteristic of the invention, the second ends of the contact means can be either tapered at an angle between about 10 ° and about 50 ° while having an eccentricity of less than about 5 microns, or produced in the form of a substantially planar end face (or perpendicular to the general direction of alignment of the second ends of the contact means).

Very advantageously, the contact means are made of a stainless conductive material, and the second ends of these contact means are covered with an electrically conductive protective film. In this way, the quality of the mechanical contacts established by the contact means can remain constant for long periods of use, and on the other hand, the life of these contact means is extended.

Preferably, the contact means are made in the form of flexible conductive wire with a diameter greater than about 30 microns.

In the description which follows, given by way of example, reference is made to the appended drawings, in which:

- Figure 1 schematically illustrates, in a cross-sectional view, a device according to the invention, in a preferred embodiment; - Figure 2 illustrates the device of Figure 1 in a bottom view;

- Figures 3a and 3b respectively illustrate two variants of a first embodiment of a contact means according to the invention, and the type of contact that such contact means can test on an electronic component that;

- Figures 4a and 4b illustrate two variants of a second embodiment of a contact means according to the invention, as well as the type of contact that such contact means are intended to test; and

- Figure 5 is a block diagram of the invention, applied to a simplified embodiment of the device illustrated in Figure 1.

The accompanying drawings contain numerous elements of a certain character, which it is difficult to define completely by the text. Consequently, they are therefore an integral part of the description, and may contribute to the definition of the invention.

We first refer to Figures 1 and 2 to describe a test device according to the invention, in a preferred embodiment.

FIG. 2 is a view from below of the device illustrated in FIG. 1, and conversely, FIG. 1 is a sectional view along the axis I-I of the device of FIG. 2.

The test device comprises in particular a first body 1 shaped, and preferably made of a metallic material, provided with a recessed central part in which are located, in an upper part, an upper plate 3, in a lower part , a lower plate 4 and in an intermediate part between the upper 3 and lower 4 plates, an intermediate plate support 5 6.

In the example illustrated, the support 5 comprises at least one rail, and preferably two rails arranged in a plane substantially parallel to the plane containing the upper 3 and lower 4 plates. The ends of these two rails 5 are integral with a wall transverse 7 of the first body 1.

The intermediate plate 6 is arranged so that it can slide under control on the two rails 5, in at least one direction parallel to the upper 3 and lower 4 plates. The sliding (or displacement) of this intermediate plate 6 is controlled by a adjustable stop 8, which is produced for example in the form of a screw of which an external threaded part cooperates with a housing 9 provided with a corresponding internal thread preferably provided in the body 1. In the example illustrated, the screw comprises an end portion in the form of a screw head provided with an external thread and capable of being operated from the outside of the device by a user, for example using a screwdriver. In this way, the screw can only translate in the direction of movement of the intermediate plate 6 in the event of rotation. In other words, depending on whether the end portion of the adjustable stop 8 is screwed or unscrewed, the intermediate plate 6 is translated forward or backward parallel to the upper plates 3 and lower 4.

The upper 3 and lower 4 plates have substantially identical dimensions, and are substantially superimposed on each other, thus delimiting a cavity 10 in which the intermediate plate 6 can move. The shape of this cavity is, in the illustrated example, appreciably parallelepipedic. However, it is clear that this cavity can take any shape suitable for the electronic component (s) to be tested. The first body 1 may also include a conduit 11, one end of which communicates with the cavity 10, and the opposite end with a valve 12 provided with a rigid body positioned substantially perpendicular to the plates 3, 4 and 6. Thus, in connecting the valve 12 to a device for supplying treated air, it is possible to cool the interior of the cavity 10, and consequently the elements of the device, and in particular the plates (in particular lower and intermediate) and the means of contact, which undergo heating due to the thermal radiation of the heating system of the wafer, which supports them, when the latter is temperature tested.

Preferably, a cover 13 is provided which is transverse to the plates 3, 4 and 6, in order to limit the volume of this cavity 10 and therefore improve its cooling.

The test device according to the invention may also comprise a second body 14, forming a receptacle, of shape adapted to at least part of the external shape of the first body 1, and comprising in an upper part an upper wall 24 provided with a opening 15 of dimensions at least equal to those of the upper plate 3 and a passage 16 to allow the introduction of the rigid body of the valve 12. The valve 12 can thus serve as a keying means when the first is introduced body 1 in the second body 14 forming a receptacle.

In the embodiment illustrated in FIGS. 1 and 2, the first 1 and second 14 bodies have generally circular external shapes that are substantially circular, while the plates 3, 4 and 6 are substantially rectangular. Of course, this embodiment is not limiting.

The second body 14 comprises on the periphery of its lower part (intended to cooperate with the lower part of the first body 1) a radial extension 17 substantially planar and large enough to support a printed circuit board 18 (to which we will return later) provided in its central part with a recess of diameter substantially equal, by value greater, to the external diameter of the transverse walls which delimit the second body 14 substantially perpendicular to the various plates.

There is also provided a ring 19 of shape adapted to the shape of the external walls of the second body 14 and intended to be placed above the printed circuit board 18. In order to secure the first body 1, the second body 14, the card of printed circuits 18 and the ring 19, removable fixing means 20 are provided. Such fixing means can be produced, for example in the form of screws, the threaded part of which can cooperate with a threaded housing provided either in the first body 1, ie in the ring 19. To do this, it is therefore necessary to provide passages in the second body 14, as well as in the printed circuit board 18.

The respective positions of the various components of the test device can be facilitated, by the presence of two pins 21, and by rapid snap-on means composed, for example, of two preformed spring wires integral with the first body 5 and intended for come to cooperate, for their immobilization, in a groove (not shown in the figures) machined on the two pins 21.

Such a device is provided for testing the inputs, outputs and power supplies (which are called "contacts") of an electronic component which is installed below its lower plate 4 on a plate or "wafer" (not shown). ) integral with an XYZ three-dimensional wafer manipulator. As a result, the electronic component to be tested is not visible when the test device is placed above it. However, given the reduced size (approximately 80 microns) of the contacts of the electronic component, it is essential to be able to position said device relative to the electronic component with great precision. To do this, the invention provides alignment means 22 forming a sight made of a transparent material, and on which are machined or screen-printed marks 23. This sight 22 is placed substantially at the same level as the bottom plate 4.

When the device comprises both the first 1 and second 14 bodies, in order to allow the observation of the markings 23 which are made on this sight 22, there is provided in the upper wall 24 of the second body 14 a recess 25 forming window, above the target area 22.

The sight 22, the lower plate 4 and the upper plate 3 are secured to the first body 1 by fixing means 26 of the screw type. The centering of these three elements (upper 3 and lower 4 and aiming plates 22) can be ensured by two pins 27.

Reference is now made more particularly to FIGS. 3 and 4.

The object of the device according to the invention is to allow the establishment of mechanical contacts on contacts 28 of an electronic component 29 to be tested.

To do this, there are provided contact means 30 longili¬ genes, a first end 31 is intended to be connected by a connecting means 32 to an input 33 of the printed circuit board 18, while the second end 34, opposite at the first end, is intended to establish mechanical contact with one of the contacts 28 of the electronic component 29 to be tested.

Preferably, these elongate contact means 30 are produced in the form of flexible wires of diameter adapted to the dimensions of the contacts 28 to be tested, which are generally made in hollow (see figure 3B) or in bump (see figure 4B).

Of course, the test device can be provided to carry out at the same time the test of hollow contacts 28a and of bump contacts 28b.

When the contact to be tested is made in hollow 28a, it is necessary that the contact means 30 has a second tapered end 34 (in the shape of a point). Such a point can be produced, for example, by high precision grinding. Preferably, the tip forms an angle of approximately 30 ° with the general axis XX of the elongate contact means 30. But this angle can be chosen smaller (approximately 10 °) or greater (approximately 50 °) if the component requires.

Preferably, the tips must not have an eccentricity greater than about 5 microns, and preferably less than 3 microns.

When the contact is in a bump 28b, the second end 34 of the contact means 30 is terminated by an end face 35 which is flat and substantially perpendicular to the axis XX.

This flat face can be considered as a point whose angle is. 90 °. Consequently, this type of planar end face 35 can also be obtained by grinding.

The first end 31 of a contact means 30 has a shoulder 36 of diameter greater than the general diameter of said contact means. This shoulder 36 is preferably obtained by crushing the contact means, but it can also be produced by adding a ring.

The shoulder makes it possible to calibrate the lengths L between the first 31 and second 34 ends of the contact means 30. Of course, the contact means have the same calibrated length L, but they could also have different lengths if necessary.

Whether it is a point or a flat end face, the contact means 30 can be produced in two different forms. In a first form (FIGS. 3b and 4b), the connecting wire 32, which makes it possible to connect the contact means to the corresponding input 33 on the printed circuit board 18, is in fact an extension of the contact means 30. In other words, the connecting wire and the contact means are one, the first end part 31 then being only an intermediate part comprising the shoulder 36.

In a second embodiment (FIGS. 3a and 4a), the connecting wire 32 is independent of the contact means 30, and consequently it can be joined to the latter once the contact means are installed in the test device. In this case, the connecting wire 32 is not necessarily of the same diameter as the contact means 30 to which it must be connected.

Reference is now made, more particularly, to FIG. 5 to describe the operating principle of the device according to the invention.

The test device according to the invention is particularly suitable for carrying out a simultaneous analysis of all of the contacts 28 of an electronic component 29 at least, which, due to recent technological advances, may include several hundred or even one thousand contacts 28 arranged according to a predetermined pattern.

All these contacts must imperatively be tested together. Consequently, the test device must include as many contact means 30 as there are contacts 28 to be tested on the electronic component 29, and this regardless of the arrangement (or predetermined diagram) of the multiplicity of contacts 28 . Since the predetermined diagram can take any type of form, whether matrix or even quasi-random, the contact means 30 can therefore only be positioned substantially perpendicular to the plane containing the contacts 28 of the electronic component 29. Consequently, the multiplicity of contact means 30 must be positioned substantially perpendicular to the upper 3, intermediate 6 and lower 4 plates.

To do this, the three plates 3, 6 and 4 each have a multiplicity of through holes of diameter very slightly greater than the diameter of the contact means 30. The holes made in the lower plate 4 are called "first through holes 37". second through holes 38 ", the holes made in the intermediate plate 6 and" third through holes "the holes made in the upper plate 3.

There is a known law which links the deflection force to the deflected length and diameter of the contact means. Consequently, the length and the diameter of the contact means are chosen so that the latter exert optimum pressure on the contacts 28.

When the material forming the contact means is a metallic alloy of the Paliney type (registered trademark), the total length is typically around 7.5 mm, and the diameter of the contact means is between around 30 microns and 150 microns, and more preferably equal to around 65 microns. According to the invention, the deflection length is adjustable, as will be seen below, which makes it possible to precisely regulate the pressure exerted by the end of the contact means on the contacts 28.

In the rest position, the multiplicity of first holes 37, second holes 38 and third holes 39 are arranged according to the same predetermined pattern, identical to that formed by the contacts 28 on the electronic component 29. These four identical predetermined patterns are substantially superimposed on each other.

The diameter of the through holes is equal to the diameter of the contact means 30 increased by about 10 microns.

After installation of the upper 3, intermediate 6 and lower 4 plates in the recess 2 of the first body 1, the contact means 30 are introduced into each of the third holes 39 of the multiplicity of third holes of the upper plate 3. After crossing of this multiplicity of third holes 39, the second ends 34 of the contact means 30 penetrate into the cavity 10, then pass through the multiplicity of second through holes 38 of the intermediate plate 6, and finally through the multiplicity of first through holes 37 before emerge outside the cavity 10 opposite the housing provided for the electronic component 29 to be tested.

Each of the contact means 30 continues to be moved substantially transversely to the plane containing the three plates 3, 6 and 4 until their respective shoulders 36 come into contact with the upper face 40 of the upper plate 3, opposite the cavity. 10, by forming stops 36. The multiplicity of contact means 30 is then positioned, and the distance which separates the upper face 40 from the upper plate 3 is found substantially at the distance L from the second ends 34 of the contact means 30 (when all the contact means are of the same length).

It then only remains to connect each of the contact means 30 to the input 33 which corresponds to it on the printed circuit board 18, which is either integral with the second body 14 (see FIGS. 1 and 2), or placed at side of the test device.

As described above, this connection can be achieved in two different ways depending on whether one uses connecting wires 32 dependent on the contact means 30 (first embodiment), or independent of the latter (second embodiment).

When the connecting wire 32 is dependent on the contact means 30, that is to say when they are one, use is made of the embodiment of the test device described above and comprising the lower plates 4, intermediate 6 and upper 3 housed in the first body 1, which is optionally integrated in the second body 14. The upper plate 3 being in the open air, the parts of the contact means forming connecting wires 32 possibly pass through the opening 15 made in the upper wall 24 of the second body 14 (when the latter is used). We then proceed to the final immobilization of the first ends 31 of the contact means 30 at the upper face 40 of the upper plate 3. To do this, we stick, using an insulating adhesive, epoxy type , the abutment shoulders 36 at the level of zones 41 respectively surrounding the multiplicity of third through holes 39 on the upper face 40 of the upper plate 3. The first ends 31 of the contact means 30 are then perfectly immobilized.

When the connecting wire 32 is independent of the contact means 30, that is to say when they are produced separately, the test device comprising the lower 4, intermediate 6 and upper 3 plates housed in the first body is used 1, which is integrated in the second body 14.

To allow immobilization of the first ends 31 of the contact means, there is provided (see FIG. 1), above the upper plate 3, a fourth plate 44 called "additional plate" which is housed in the opening 15 of the upper wall 24 of the second body 14, preferably between the recess 25 forming a window and the passage 16 of the valve body 12. This fourth plate 44 is housed substantially parallel to the other three plates and comprises a multiplicity of fourth through holes 43 arranged, also, according to the predetermined diagram and substantially superimposed on the multiplicities of first 37 and third 39 through holes. These fourth through holes 43 being intended to receive the connecting wires 32, which can be of diameter greater than that of the contact means 32 (apart from the shoulder 36), are not necessarily of the same diameter as those of the first 37 , second 38 and third 39 through holes.

In this second embodiment, the immobilization of the first ends 31 of the contact means 30 is not necessarily carried out at the level of the upper face 40 of the upper plate 3. This is indeed, preferably, carried out at level of the upper face 45 of the additional plate 44, which is opposite to the cavity 10.

But, of course, one could also envisage immobilizing the contact means 30 at the level of the upper face 40 of the upper plate 3, as described above.

Due to the presence of the additional plate 44, it is necessary first to install the contact means 30 in the first body 1, and to house the latter in the second body 14. Then the ends of the wires are secured 32 at the first ends 31 at the shoulders 36. The printed circuit board 18 is then placed on the radial part 17 of the second body 14, then the ring 19 is placed on the printed circuit board 18. The assembly is then secured using pins 21 and screws 20. The opposite ends of the connecting wires 32 are then passed through the multiplicity of fourth through holes 43. It then remains to secure the additional plate 44 to the second body 14, which can be obtained by rapid locking means, and then by welding the free ends of the connecting wires 32 at the corresponding inputs 33 of the printed circuit board 18 which is now attached to the test device.

It is clear that the first embodiment of the contact means is preferably used in the first embodiment of the test device, while the second embodiment of the contact means is preferably used for the second embodiment of the test device according to the invention. But it is not forbidden to do it differently.

Due, firstly, to the non-flatness of the upper face 40 of the upper plate 3, secondly, the dispersion of the calibrated lengths L of the contact means 30, and thirdly , since the different contacts 28 are not all substantially coplanar, the establishment of all the mechanical contacts between the contact means 30 and the contacts 28 of the electronic component 29 to be tested would be made particularly difficult if said means of contact 30 res¬ continuously continuously substantially perpendicular to the different plates 3, 4 and 6. In fact, the pressure to be exerted to bend a multiplicity of elongated elements, although flexible, is very high, and would risk damaging certain contacts 28 of the electronic component 29.

This is why, according to the invention, first of all the positioning of the electronic component is carried out using the edge manipulator of which it is integral, so that certain contact means 30 establish mechanical contacts with the component to be tested. . Then, by acting on the screw head of the adjustable stop 8, the controlled sliding of the intermediate plate 6 is caused in a direction parallel to the upper 3 and lower 4 plates, and substantially perpendicular to the general axis XX of the contact means. 30. This causes a controlled pre-buckling of all of the contact means 30 housed in the cavity 10. The contact means 30 then have a much greater elasticity than that which they have when they are not subjected to this pre-buckling (bending). Using the wafer manipulator, the electronic component 29 to be tested is brought closer to the test device, so that the second ends 34 of the contact means 30 all establish mechanical contacts with the contacts 28. This amounts to causing the complete buckling of the contact means 30. This operation, which is carried out without difficulty due to the preliminary pre-buckling, makes it possible to ensure excellent mechanical contacts in spite of eventual dispersions of the lengths L of the contact means 30, not flatness of the upper surface 40 of the upper plate 3, and of the non-flatness of the contacts 28. The mechanical contacts established are then durable, effective, and make it possible to avoid damaging the contacts 28 (inputs, outputs , power supplies) of the electronic components to be tested.

Since the contact means are intended to perform electrical measurements on the contacts, it is clear that said contact means must be made of an electrically conductive material, as well as the connecting wires 32. Consequently, it is clear that the materials used on the one hand for the different upper, intermediate, lower and additional plates must be made of insulating materials. On the other hand, the other parts constituting the test device can be made of non-insulating materials, such as for example in metal alloys.

Preferably, a stainless coating is applied, at least to the second ends 34 of the contact means 28, in order to improve the quality of the mechanical contact and to extend the period of use of said contact means. This period of use can be further increased when a hardening treatment is carried out on the flat end face or on the tapered tip. The invention is not limited to the two embodiments described above, but it embraces all the variants that a person skilled in the art may develop within the scope of the claims below.

Thus, the shape of the test device is not necessarily circular, but it can take any type of shape in order to allow the testing of a wide variety of electronic components.

In addition, test devices can be provided in which the respective calibrated lengths of the contact means are not the same, in order to test different types of contacts, such as recessed contacts and bump contacts, or even contacts of the same type but arranged on different levels. Thus, it is conceivable to mix contact means 30 with a point with contact means with a flat face.

Similarly, one could use a multiplicity of contact means in which the taper of the points would not be identical.

Claims

claims

1. Test device, in particular of an electronic component provided (29) with a multiplicity of contacts (28) arranged according to a predetermined diagram, of the type comprising a first body (1) housing upper plates (3), intermediate (6) and lower (4) delimiting a cavity (10), substantially parallel, electrically insulating, and comprising respectively a multiplicity of first (37), second (38) and third (39) through holes arranged according to said diagram predetermined and suitable for being traversed by a multiplicity of elongate contact means (30), electrically conductive, and of calibrated length (L) greater than the distance separating the upper and lower plates so that they open out of the cavity (10 ), said intermediate plate (6) being able to be moved by displacement means (5,8), in at least one direction, to allow a unidirectional buckling of the contact means (30) for testing the multiplicity of contacts (28) of said electronic component (29); characterized in that it comprises a second body (14) suitable for receiving a printed circuit board (18) and for removably accommodating at least part of the first body (1) secured to the upper plates (3), intermediate diary (6) and lower (4), and comprising an upper wall (24) provided with an opening 15 intended to be placed above said upper plate (3) to allow the connection of said contact means (30) to inputs (33) of said printed circuit board (18).

2. Test device according to claim 1, caracté¬ ized in that it comprises removable fixing means (20) adapted to allow the joint immobilization of the first (1) and second (14) body and the wafer. printed circuits (18).

3. Test device according to one of claims 1 and 2, characterized in that it comprises alignment means (22) adapted to allow the alignment of the first body (1) relative to the electronic component (29).

4. Test device according to claim 3, characterized in that the alignment means (22) and the lower (4) and upper (3) plates are secured to the first body 1 by fixing means (26) .

5. Test device according to one of claims 3 and 4, characterized in that it comprises two pins (27) intended to facilitate the relative positioning of the upper (3) and lower (4) plates and alignment means (22).

6. Test device according to one of claims 4 and

5, characterized in that the second body (14) comprises a recess (25) placed above the alignment means (22) so as to allow their viewing.

7. Test device according to one of claims 1 to

6, characterized in that the second body (14) comprises a first conduit (16) communicating with the outside, and in that the first body (1) comprises a second conduit (11) communicating with the cavity (10) and with the first conduit (16) for supplying said cavity with cooling air.

8. Test device according to one of claims 1 to

7, characterized in that each third through hole (39) of the multiplicity of third through holes is respectively positioned substantially above a first through hole (38) of the multiplicity of first through holes.

9. Test device according to one of claims 1 to 8, characterized in that the displacement means comprise adjustment means comprising at least one rail (5) secured to the first body (1) in a sensitive position ¬ parallel to said upper (3), lower (4) and intermediate (6) plates, and capable of supporting sliding sow said intermediate plate (6), as well as a means (8) adapted to cooperate with said intermediate plate (6) to allow its controlled sliding.

10. Test device according to one of claims 1 to 9, characterized in that each contact means (30) includes a first end (31) provided with means (36) forming a stop suitable for immobilizing it on an external face (40) of the upper plate (3), oriented towards the opening (15) of the second body (14), at the level of a third through hole (39), so that the distance which separates the first and second ends is equal to the calibrated length (L).

11. Test device according to claim 10, carac¬ terized in that the stop (36) is produced by crushing material from the first end (31) of a contact means (30).

12. Test device according to claims 10 and 11, characterized in that the connection between each contact means and the corresponding input (33) is made at its first end (31) by a connecting wire (32) electrically conductive.

13. Test device according to claim 12, carac¬ terized in that the connecting wire (32) and the contact means (30) form a single element.

14. Test device according to claim 12, carac¬ terized in that the connecting wire and the contact means (30) are separate elements from each other.

15. Test device according to one of claims 12 to 14, characterized in that the opening (15) of the receiving means (14) is suitable for receiving an additional plate (44) provided with a multiplicity of fourth through holes (43) arranged according to said predetermined diagram and suitable for being crossed by the multiplicity of connecting wires (32).

16. Test device according to one of claims 10 to 15, characterized in that the first end (31) of a contact means (30), provided with its stop (36), is secured to the plate upper (3) by bonding using an insulating material (42).

17. Test device according to claim 15, charac _¬ terized in that each connecting wire (32) is secured to the additional plate (44), at the fourth through hole (43) which it crosses, by bonding to using insulating material (42).

18. Test device according to one of claims 10 to

17, characterized in that the contact means (30) comprise second ends (34), opposite the first ends, opening out of said cavity (10), and tapered at an angle between about 10 ° and about 50 ° and have an eccentricity of less than 5 μm.

19. Test device according to one of claims 10 to 17, characterized in that the contact means (30) comprise second ends (34), opposite the first ends, opening out of said cavity (10), and having a substantially planar end face (35).

20. Test device according to one of claims 18 and

19, characterized in that the second ends (34) of the contact means (30) are covered with an electrically conductive protective film.

21. Test device according to one of claims 1 to

20, characterized in that the contact means (30) are made of a stainless conductive material.

22. Test device according to one of claims 1 to 21, characterized in that the contact means (30) are flexible conductive wires with a diameter greater than 30 μm.