WO1996017501B1

WO1996017501B1 - Chemically grafted electrical devices

Info

Publication number: WO1996017501B1
Application number: PCT/US1995/015509
Authority: WO
Filing date: 1995-11-30
Publication date: 1996-08-01

Abstract

An electrical device is provided having a conductive coating or layer (20) chemically grafted to a support structure (18) to produce a durable, conductive surface permanently attached to the underlying substrate material. The grafted layer (20) can be embodied in an electrical contact (16), and can also be embodied as electrical traces (72) and contact areas (66) of circuit board (60) and electrical and electronic devices and components. In another embodiment, the grafted layer (20) can be provided in an RFI/EMI shield or ground plane.

Claims

-ib-AMENDED CLAIMS[received by the International Bureau on 28 May 1996(28.05.96); original claims 3, 4, 6 and 7 cancelled; original claims1, 2, 5, 11, 13 and 15-18 amended; remaining claims unchanged; claims renumbered 1-14(3 pages)]

1. (amended) An electrical device comprising: a substrate having a surface; a conductive layer composed of a plurality of conductive particles each having a conductive coating; the conductive coatings of the particles being chemically bonded together and to the substrate surface.

2. (amended) The electrical device of claim 1 wherein the conductive layer is composed of a plurality of conductive particles each having a conductive polymer coating.

[5]2. (amended) An electrical material comprising: a substrate having a surface; a conductive coating chemically bonded to the substrate surface, the conductive coating composed of a chemically bonded conductive polymer matrix containing conductive particles.

[8]4.. The electrical material of claim [5]3. wherein the substrate is non-conductive.

[9]5_. The electrical material of claim [8]4_ wherein the substrate is rigid.

[10]e>. The electrical material of claim [8]4_ wherein the substrate is flexible.

[11]Z- (amended) The electrical material of claim [8]4_. wherein the [chemically bonded] conductive coating is applied to [one or more] selected areas of the substrate surface.

[12] 8. The electrical material of claim [5]3. wherein the substrate is conductive. -16-

[13]9.. (amended) The electrical material of claim [5]3. further including [a metal] an additional conductive layer disposed over the [chemically bonded] conductive layer.

[14]10.. The electrical material of claim [5]2 wherein the conductive particles are metal.

[15]ϋ. (amended) The electrical material of claim [5]2 wherein the substrate is flexible and wherein the [chemically bonded] conductive coating is flexible.

[16]12.. (amended) An electrical interconnect comprising: an elongated body of thermosetting material shaped to mate with a corresponding electrical contact element; a conductive layer chemically grafted to at least a portion of the surface of the [core material] thermosetting material: the [core] thermosetting material being sized to be [inserted] insertable into the [mateable] mating electrical contact element and operative to expand in response to applied heat to form a permanent gas tight seal between the grafted conductive surface and a mating conductive surface of the electrical contact element.

[17]jL2. (amended) An electrical interconnect comprising: at least one annular ring having a resilient core and a chemically grafted conductive layer thereon; the annular ring being disposed around and in alignment with an opening in a substrate, the conductive layer of the annular ring being in electrical contact with a conductive element on the substrate; the opening through the annular ring being smaller than the dimension of an electrical terminal inserted therethrough such that a compressive force is provided between the inserted [lead] electrical terminal and the surrounding ring. [18]i_4. (amended) An electrical interconnect comprising: a substrate of rigid material having on at least a portion of one surface thereof a [second substrate of] resilient material; and a conductive material chemically grafted to the exposed surface of the [second substrate] resilient material to provide a flexible conductive contact area, said conductive material composed of a chemically bonded polymer matrix containing conductive particles.