WO1994000270A1 - Laser machining apparatus - Google Patents
Laser machining apparatus Download PDFInfo
- Publication number
- WO1994000270A1 WO1994000270A1 PCT/JP1993/000847 JP9300847W WO9400270A1 WO 1994000270 A1 WO1994000270 A1 WO 1994000270A1 JP 9300847 W JP9300847 W JP 9300847W WO 9400270 A1 WO9400270 A1 WO 9400270A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- processing
- machining
- corner
- point
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
Definitions
- the present invention relates to a laser processing apparatus that performs cutting by irradiating a work with a laser beam, and more particularly to a laser processing apparatus that performs corner processing under predetermined processing conditions.
- FIG. 5 is a diagram showing a conventional corner processing method, in which (a) shows a processing path, and (b), (c) and (d) show processing condition patterns.
- the machining path is point A-corner B point ⁇ C point. Corner processing is performed at point B.
- the vertical axis represents the machining condition Ml
- the horizontal axis represents the machining position or machining time.
- the processing conditions Ml are the cutting processing speed F-, the peak output S which is the output command value of the laser beam, the frequency P. and the duty i: h Q.
- the machining method shown in FIG. 5 (b) is a method in which the machining condition M1 is changed at the corner B by the actual movement of the work, ie, the feedback of the actual driving speed of the table.
- the acceleration / deceleration time constant of the actual table improves the machining shape accuracy. This is set small enough to control the machining condition M1 only during the period around the corner B, and there is almost no difference from the case where the control is not performed. For this reason, the actual effect cannot be obtained.
- the machining method shown in Fig. 5 (c) stops the laser output at the corner B point and reduces It is a method to proceed to the next processing after natural cooling or forced cooling. In this method, it is necessary to make the laser output stop time long enough for sufficient cooling at the corner B point.
- the machining method shown in Fig. 5 (d) is a machining method that combines both (b) and (c) above. This method has the problems described in (b) and (c) as they are.
- the present invention has been made in view of such a point, and an object of the present invention is to provide a laser processing apparatus capable of stably and reliably performing corner cutting processing under practically effective processing conditions.
- a laser processing apparatus that performs a cutting process by irradiating a laser beam to a work, when the work is applied along a processing path having a corner, the cutting process after the turning of the corner is changed stepwise.
- a laser processing apparatus characterized in that the laser processing is performed under the following processing conditions.
- FIG. 1 shows a ⁇ -chart for performing a cutting process according to the present invention.
- Fig. 2 is a block diagram of the laser processing device of the present invention.
- FIG. 3 is a diagram showing the processing conditions of the corner cutting processing according to the present invention, wherein (a) shows the processing path and (b) shows the processing condition pattern.
- FIG. 4 shows the processing conditions
- FIG. 5 is a diagram showing a conventional corner machining method, in which (a) shows a machining path, and (b), (c) and (d) show machining condition patterns.
- FIG. 2 is a block diagram of the laser processing apparatus of the present invention.
- Processor 1 is based on the control program stored in R ⁇ M 2 Reads the machining program stored in RAM 3 and controls the operation of the entire laser machining system.
- the IZ unit 4 converts the control signal from the processor 1 and sends it to the laser oscillator 5.
- the laser oscillator 5 emits a pulsed laser beam 6 according to the converted control signal.
- the laser beam 6 is reflected by the bending mirror 7 and sent to the processing machine body 8.
- the processing machine body 8 is provided with a table 10 to which the work 9 is fixed and a processing head 11 for irradiating the work 9 with a laser beam.
- the laser beam 6 introduced into the processing head 11 is squeezed by the nozzle 11 a and irradiated on the workpiece 9.
- the processing machine body 8 is provided with servo motors 12 and 13 for controlling the movement of the table 10 in two directions of the X axis and the Y axis. These servomotors 12 and 13 are connected to servo amplifiers 15 and 16, respectively, and are controlled to rotate according to axis control signals from the processor 1.
- the cutting speed F is controlled.
- FIG. 3A and 3B are diagrams showing processing conditions of the corner cutting processing according to the present invention, wherein FIG. 3A shows a processing path, and FIG. 3B shows a processing condition pattern.
- the machining path is point ⁇ corner B point ⁇ point C, and corner processing is performed by turning back at point B.
- the vertical axis represents the machining condition M
- the horizontal axis represents the machining position or machining time.
- the processing condition M is a cutting processing speed F, a peak output S which is a laser beam output command value, a frequency P and a duty ratio Q-, and a processing condition continuation distance or time K.
- FIG. 1 is a flowchart for executing a cutting process according to the present invention.
- the number following S indicates the step number.
- [S1] It is determined whether or not the machining path (trajectory) according to the currently executed machining program corresponds to the corner B point. If it is at the corner B, proceed to the next step S 2, otherwise proceed to step S 3. This determination is made based on the machining program trajectory data D stored in the RAM 3.
- Step-shaped cutting is performed according to the processing conditions M stored in the RAM 3 in advance. That is, once when it reaches the working condition to the corner point B is set to a low level or value 0, then the processing position Ru is increased to the normal machining condition M D stepwise with (time).
- FIG. 4 shows the processing conditions.
- the processing condition M is set for each processing condition examination, that is, according to the work material and plate thickness.
- each item of the processing condition M includes the cutting acceleration F, the peak output S which is the output command value of the laser beam 6, the frequency P and the duty ratio Cl, and the processing condition continuation distance or time (for each step). (Continuous distance or time) K, and the condition is set to increase stepwise from step 1 to step n.
- the processing condition continuation distance or time
- the machining condition M that increases in this step, the machining condition is not changed in a portion where sufficient actual effect cannot be obtained, for example, before reaching the corner B point, and the actual effect after the corner B point is not obtained.
- the machining conditions are increased stepwise only in the areas where For this reason, it is possible to optimally maintain the heat balance at the corner B point where the heat effect is extremely large. In other words, it is possible to stably and reliably perform the cutting at the corner B at a practically effective cutting condition.
- the cutting process after the turning of the corner is performed under stepwise changing processing conditions.
- the part where the actual effect cannot be obtained for example, the processing condition is not changed before reaching the corner, and the part where the actual effect can be obtained after the turning point of the corner Only in step, increase the processing conditions step by step. Therefore, it is possible to optimally maintain the heat balance at the corners where the heat effect is extremely large. That is, it is possible to stably and surely perform the cutting of the corner under the working condition having a practical effect.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940700566A KR970005925B1 (ko) | 1992-06-25 | 1993-06-22 | 레이저 가공 장치 |
EP93913565A EP0600097B1 (en) | 1992-06-25 | 1993-06-22 | Laser machining apparatus |
DE69310680T DE69310680T2 (de) | 1992-06-25 | 1993-06-22 | Schneidlaser |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4167641A JPH067973A (ja) | 1992-06-25 | 1992-06-25 | レーザ加工装置 |
JP4/167641 | 1992-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994000270A1 true WO1994000270A1 (en) | 1994-01-06 |
Family
ID=15853541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1993/000847 WO1994000270A1 (en) | 1992-06-25 | 1993-06-22 | Laser machining apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US5449881A (ja) |
EP (1) | EP0600097B1 (ja) |
JP (1) | JPH067973A (ja) |
KR (1) | KR970005925B1 (ja) |
DE (1) | DE69310680T2 (ja) |
WO (1) | WO1994000270A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642497A (en) * | 1995-01-30 | 1997-06-24 | Tektronix, Inc. | Digital disk recorder using a port clock having parallel tracks along a timeline with each track representing an independently accessible media stream |
CN116323085A (zh) * | 2020-10-16 | 2023-06-23 | 百超激光有限公司 | 用于智能拐角切割的方法、计算机程序和激光切割系统 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3175463B2 (ja) * | 1994-02-24 | 2001-06-11 | 三菱電機株式会社 | レーザ切断方法 |
JP3159593B2 (ja) * | 1994-02-28 | 2001-04-23 | 三菱電機株式会社 | レーザ加工方法及びその装置 |
CN1126633C (zh) * | 1995-01-13 | 2003-11-05 | 东海工业缝纫机株式会社 | 激光加工机和具有激光加工功能的缝纫机 |
JP3185580B2 (ja) * | 1995-01-31 | 2001-07-11 | 三菱電機株式会社 | レーザ加工装置および加工方法 |
ATE458579T1 (de) * | 2007-06-30 | 2010-03-15 | Trumpf Werkzeugmaschinen Gmbh | Werkzeugmaschine und verfahren zum bearbeiten eines werkstückes |
DE102008016733A1 (de) * | 2008-03-31 | 2009-10-08 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren und NC-Teileprogramm zur Steuerung einer Laserschneidanlage |
US8878634B2 (en) * | 2008-11-26 | 2014-11-04 | Kyocera Corporation | Bandpass filter, and wireless communication module and wireless communication device using the bandpass filter |
CN102357735B (zh) * | 2011-09-22 | 2015-05-13 | 中国航天科技集团公司第五研究院第五一0研究所 | 基于可控光束剖面形状与功率分布的双扫描三维激光刻蚀加工方法 |
CN104607805B (zh) * | 2015-01-12 | 2016-07-06 | 飞虎激光科技有限公司 | 一种拐角处激光切割方法 |
WO2018104575A1 (en) * | 2016-12-08 | 2018-06-14 | Corelase Oy | Laser processing apparatus and method |
FI3731991T3 (fi) * | 2017-12-29 | 2023-05-11 | Corelase Oy | Laserprosessointilaite ja -menetelmä |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61189893A (ja) * | 1985-02-18 | 1986-08-23 | Matsushita Electric Ind Co Ltd | レ−ザ加工装置 |
JPS61189887A (ja) * | 1985-02-18 | 1986-08-23 | Matsushita Electric Ind Co Ltd | レ−ザ加工方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127775A (ja) * | 1983-12-15 | 1985-07-08 | Mitsubishi Electric Corp | レ−ザ制御装置 |
CA1265209A (en) * | 1984-02-17 | 1990-01-30 | Robert Langen | Process to remove contaminants, particularly rust/from metallic surfaces |
DE3410913A1 (de) * | 1984-03-24 | 1985-10-03 | Trumpf GmbH & Co, 7257 Ditzingen | Werkzeugmaschine zur mechanischen und laserstrahl-bearbeitung eines werkstuecks |
JPS61123489A (ja) * | 1984-11-16 | 1986-06-11 | Matsushita Electric Ind Co Ltd | レ−ザ加工装置 |
JPS61154783A (ja) * | 1984-12-28 | 1986-07-14 | Matsushita Electric Ind Co Ltd | レ−ザ加工方法 |
US4649256A (en) * | 1985-01-10 | 1987-03-10 | Nippon Steel Corporation | High-frequency electric resistance welding method using irradiation with a laser beam |
JP2766389B2 (ja) * | 1990-10-18 | 1998-06-18 | ファナック株式会社 | レーザ加工方法 |
-
1992
- 1992-06-25 JP JP4167641A patent/JPH067973A/ja active Pending
-
1993
- 1993-06-22 EP EP93913565A patent/EP0600097B1/en not_active Expired - Lifetime
- 1993-06-22 KR KR1019940700566A patent/KR970005925B1/ko not_active IP Right Cessation
- 1993-06-22 WO PCT/JP1993/000847 patent/WO1994000270A1/ja active IP Right Grant
- 1993-06-22 DE DE69310680T patent/DE69310680T2/de not_active Expired - Fee Related
-
1994
- 1994-02-07 US US08/193,020 patent/US5449881A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61189893A (ja) * | 1985-02-18 | 1986-08-23 | Matsushita Electric Ind Co Ltd | レ−ザ加工装置 |
JPS61189887A (ja) * | 1985-02-18 | 1986-08-23 | Matsushita Electric Ind Co Ltd | レ−ザ加工方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP0600097A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642497A (en) * | 1995-01-30 | 1997-06-24 | Tektronix, Inc. | Digital disk recorder using a port clock having parallel tracks along a timeline with each track representing an independently accessible media stream |
CN116323085A (zh) * | 2020-10-16 | 2023-06-23 | 百超激光有限公司 | 用于智能拐角切割的方法、计算机程序和激光切割系统 |
Also Published As
Publication number | Publication date |
---|---|
EP0600097B1 (en) | 1997-05-14 |
EP0600097A4 (en) | 1994-09-07 |
EP0600097A1 (en) | 1994-06-08 |
KR970005925B1 (ko) | 1997-04-22 |
DE69310680D1 (de) | 1997-06-19 |
US5449881A (en) | 1995-09-12 |
DE69310680T2 (de) | 1998-01-02 |
JPH067973A (ja) | 1994-01-18 |
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