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WO1990012484A1 - Device for cutting to length and bending connector leads - Google Patents

Device for cutting to length and bending connector leads Download PDF

Info

Publication number
WO1990012484A1
WO1990012484A1 PCT/DE1990/000189 DE9000189W WO9012484A1 WO 1990012484 A1 WO1990012484 A1 WO 1990012484A1 DE 9000189 W DE9000189 W DE 9000189W WO 9012484 A1 WO9012484 A1 WO 9012484A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
bending
circuit board
edge
wire
Prior art date
Application number
PCT/DE1990/000189
Other languages
German (de)
French (fr)
Inventor
Rudolf Burger
Karl Eidling
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1990012484A1 publication Critical patent/WO1990012484A1/en
Priority to FI914808A priority Critical patent/FI914808A0/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board

Definitions

  • the invention relates to a device for cutting and bending connecting wires of electronic components during their assembly on printed circuit boards by means of lower tools.
  • the connecting wires are pressed against the printed circuit board bore after the cutting process and cut to length from a bending jaw, and are thus bent over.
  • the consequence of this is that, due to relatively small position inaccuracies between the hole in the circuit board and the bending jaw, poor bending results are achieved, conductor tracks are damaged, short circuits occur or the electronic components can fall out of the circuit board.
  • the invention is based on the object of providing a lower tool which enables a defined cutting to length and an error-free bending of connecting wires of electronic components when they are mounted on printed circuit boards, a secure mounting of the components being guaranteed until soldering in and no short circuits occurring .
  • This object is achieved by using a device in which a first cutting and bending jaw with a Cutting edge and at least one gripping prong and a second cutting bending jaw with a structure, a bending edge, an edge and a surface are present, the cutting edge interacting with the edge, the gripping prongs interacting with the surface, the connecting wire being bent around the bending edge and in a connecting wire can be cut to length and bent in one operation.
  • the invention is based on the finding that exact cutting to length and a defined bending of connecting wires is possible by means of two counter-bending jaws acting against one another without any force being exerted on the printed circuit board or the bore therein.
  • This produces a solely '1 between the two cutting-bending jaws flow-off allows fender cutting and bending operation, wherein a terme ⁇ certain turning angle is a cutting-bending jaw achievable by the configuration of the surface.
  • the positioning between the lower tool and the bore takes place in relatively large tolerance ranges.
  • a predetermined distance between the underside of the circuit board and the interface at which the connecting wire is cut to length is set by the construction of a cutting and bending jaw on which the printed circuit board is placed.
  • the construction of the device according to the invention is simplified by a pivot point common to the cutting-bending process for both cutting-bending jaws.
  • the lower tool is rotatably mounted for targeted adjustment of the bending direction of the connecting wires.
  • Figure 1 shows a device with circuit board and component in the starting position.
  • FIG. 2 shows a device corresponding to FIG. 1 in the working position.
  • Figure 3 shows a device in the end position.
  • the first cutting and bending jaws 1 shows a first cutting-bending jaw 1 and a second cutting-bending jaw 2 together with a printed circuit board 13 and an electronic component 12 and an associated connecting wire 14.
  • the circuit board 13, which is usually made of plastic, has the bore 11.
  • the stops 9 ensure a defined end position of the two cutting and bending jaws 1, 2.
  • the first cutting and bending jaws 1 has a cutting edge 3 which interacts with the edge 4 of the second cutting and bending jaw 2 for the cutting process.
  • the bending edge 6 interacts with the gripping prongs 10, the connecting wire 14 being bent until it rests on the surface 7.
  • the turning angle is determined by the inclination of the surface 7.
  • the common pivot point 8 of the two cutting and bending jaws 1, 2 is indicated in the drawing.
  • FIG. 2 shows the device in the working position, the second cutting-bending jaw 2 having already been guided up to the stop 9.
  • the spacing X between the interface, defined by the cutting edge 3 and the edge 4, and the underside of the printed circuit board 13 is thus set by the structure 5.
  • the circuit board 13 rests on the cutting and bending jaws 2.
  • the first cutting-bending jaw 1 is still moving towards the stop 9 in the snapshot shown.
  • a fixed stop for the circuit board 13 can be attached to the lower tool in such a way that the bending edge 6 of the cutting and bending jaw 2 is in contact with one another defined distance of 0.1 mm below the circuit board.
  • FIG. 3 the cutting and bending processes have ended.
  • the connecting wire 14 is cut to length, lies against the surface 7 and is bent around the bending edge 6. In this state, the first cutting and bending jaw 1 also abuts the stop 9.
  • a more or less strong notch in the connecting wire 14 is achieved by the first cutting-bending jaw 1 by means of the gripping prongs 10.
  • This notch effect ensures that the wire is positively gripped during the bending process and is bent in a defined manner around the bending edge 6 of the second cutting and bending jaw 2.
  • a sliding of the connecting wire 14 upwards is thereby ruled out, even with low component holding forces, such as in the case of manual assembly.
  • Another advantage of this indentation by the gripping prongs 10 results in the further processing in a subsequent soldering process.
  • the solderability is increased by tearing open oxide layers that may be present on the connecting wire 14.
  • the use of the gripping prongs makes it possible to process connecting wires 14 with different diameters. With relatively small jaw forces, wire diameters of, for example, 0.3 to 1 mm can be processed, round and rectangular cross sections being possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Processing (AREA)

Abstract

The invention concerns a device designed to overcome problems associated with the wiring up of electronic components (12) on printed circuit boards (13). These problems are the difficulties encountered in positioning the soldering tool with respect to the bore (11) by means of which the connector leads pass through the circuit board (13), as well as the tendency of components (12) not to remain in place between insertion and soldering and the frequent occurrence of short-circuits caused by bent leads (14) on the underneath of the circuit board (13). The device has two cutting/bending jaws (1, 2), mounted at a common fulcrum, which act together in such a way, in the cutting and bending operation by which the connector wire (14) is cut to length and bent, that no significant forces are exerted on the circuit board (13). A nose (5) ensures that a defined length of wire (14) is cut off. Serrations (10) produce notching in the wire, thus facilitating bending and improving the soldering properties.

Description

Vorrichtung zum Ablängen und Biegen von AnschlußdrähtenDevice for cutting and bending connecting wires
Die Erfindung betrifft eine Vorrichtung zum Ablängen und Biegen von AnschluBdrähten von elektronischen Bauteilen bei deren Mon¬ tage auf Leiterplatten mittels Unterwerkzeuge.The invention relates to a device for cutting and bending connecting wires of electronic components during their assembly on printed circuit boards by means of lower tools.
Bei der Bestückung von Leiterplatten mit bedrahteten Bauteilen müssen deren Anschlußdrähte auf der Unterseite der Leiterplatte definiert abgelängt werden. Ein anschließendes Umbiegen sorgt dafür, daß bis zum Einlöten des Bauteils ein sicherer Halt ge¬ währleistet ist. Bei diesem Biegevorgang soll jedoch durch den Anschlußdraht kein Kurzschluß an benachbarten auf derWhen assembling printed circuit boards with wired components, their connecting wires must be cut to length on the underside of the printed circuit board. Subsequent bending ensures that a secure hold is ensured until the component is soldered in. In this bending process, however, no short circuit to adjacent ones on the
Unterseite der Leiterplatte liegenden Leiterbahnen entstehen. Für das Ablängen und Umbiegen werden in der Regel sogenannte Unterwerkzeuge eingesetzt, die aus Schneidbacken und Biegebacken bestehen.Undersides of the printed circuit board are created. So-called lower tools, which consist of cutting jaws and bending jaws, are generally used for cutting and bending.
Bei bekannten Unterwerkzeugen werden die Anschlußdrähte nach dem Schneidvorgang beim Ablängen von einem Biegebacken gegen die Leiterplattenbohrung gedrückt und somit umgebogen. Das hat zur Folge, daß durch relativ kleine Positionsungenauigkeiten zwischen der Bohrung der Leiterplatte und der Biegebacke schlechte Biegeergebnisse erzielt werden, Leiterbahnen be¬ schädigt werden, Kurzschlüsse entstehen oder die elektronischen Bauteile teilweise aus der Leiterplatte herausfallen können.In the case of known lower tools, the connecting wires are pressed against the printed circuit board bore after the cutting process and cut to length from a bending jaw, and are thus bent over. The consequence of this is that, due to relatively small position inaccuracies between the hole in the circuit board and the bending jaw, poor bending results are achieved, conductor tracks are damaged, short circuits occur or the electronic components can fall out of the circuit board.
Der Erfindung liegt die Aufgabe zugrunde, ein Unterwerkzeug zur Verfügung zu stellen, das ein definiertes Ablängen und ein feh¬ lerfreies Biegen von Anschlußdrähten elektronischer Bauteile bei deren Montage auf Leiterplatten ermöglicht, wobei eine sichere Halterung der Bauteile bis zum Einlöten gewährleistet ist und keinerlei Kurzschlüsse entstehen.The invention is based on the object of providing a lower tool which enables a defined cutting to length and an error-free bending of connecting wires of electronic components when they are mounted on printed circuit boards, a secure mounting of the components being guaranteed until soldering in and no short circuits occurring .
Die Lösung dieser Aufgabe wird durch den Einsatz einer Vorrich¬ tung erbracht, bei der ein erster Schneid-Biegebacken mit einer Schneidkante und mindestens einem Greifzacken und ein zweiter Schneid-Biegebacken mit einem Aufbau, einer Biegekante, einer Kante und einer Fläche vorhanden sind, wobei die Schneidkante mit der Kante zusammenwirkt, die Greifzacken mit der Fläche zusammenwirken, der Anschlußdraht um die Biegekante gebogen wird und in einem Arbeitsgang ein Anschlußdraht abgelängt und umgebogen werden kann.This object is achieved by using a device in which a first cutting and bending jaw with a Cutting edge and at least one gripping prong and a second cutting bending jaw with a structure, a bending edge, an edge and a surface are present, the cutting edge interacting with the edge, the gripping prongs interacting with the surface, the connecting wire being bent around the bending edge and in a connecting wire can be cut to length and bent in one operation.
Der Erfindung liegt die Erkenntis zugrunde, daß durch zwei gegeneinander wirkende Schneid-Biegebacken ein exaktes Ablängen und ein definiertes Umbiegen von Anschlußdrähten möglich ist, ohne daß eine Kraft auf die Leiterplatte bzw. die darin vor¬ handene Bohrung ausgeübt wird. Hierdurch wird ein ausschließlich'1 zwischen den beiden Schneid-Biegebacken ablau- fender Abläng- und Biegevorgang ermöglicht, wobei ein vorbe¬ stimmter Abbiegewinkel durch die Ausgestaltung der Fläche einer Schneid-Biegebacke erzielbar ist. Die Positionierung zwischen UnterWerkzeug und Bohrung erfolgt in relativ großen Toleranzbereichen.The invention is based on the finding that exact cutting to length and a defined bending of connecting wires is possible by means of two counter-bending jaws acting against one another without any force being exerted on the printed circuit board or the bore therein. This produces a solely '1 between the two cutting-bending jaws flow-off allows fender cutting and bending operation, wherein a vorbe¬ certain turning angle is a cutting-bending jaw achievable by the configuration of the surface. The positioning between the lower tool and the bore takes place in relatively large tolerance ranges.
In einer weiteren Ausgestaltung der Erfindung wird durch einen Aufbau einer Schneid-Biegebacke, auf den die Leiterplatte aufgelegt ist, ein vorbestimmter Abstand zwischen der Unterseite der l* iterplatte und der Schnittstelle, an der der Anschlußdraht abgelängt wird, eingestellt.In a further embodiment of the invention, a predetermined distance between the underside of the circuit board and the interface at which the connecting wire is cut to length is set by the construction of a cutting and bending jaw on which the printed circuit board is placed.
Durch einen für den Schneid-Biegevorgang gemeinsamen Drehpunkt für beide Schneid-Biegebacken wird die Konstruktion der erfindungsgemäßen Vorrichtung vereinfacht.The construction of the device according to the invention is simplified by a pivot point common to the cutting-bending process for both cutting-bending jaws.
Zur gezielten Einstellung der Biegerichtung der Anschlußdrähte ist das Unterwerkzeug drehbar gelagert.The lower tool is rotatably mounted for targeted adjustment of the bending direction of the connecting wires.
Im folgenden wird anhand der schematischen Figuren ein Ausfüh- rungsbeispiel beschrieben.An exemplary embodiment is described below with reference to the schematic figures.
Figur 1 zeigt eine Vorrichtung mit Leiterplatte und Bauelement in der Ausgangsstellung. Figur 2 zeigt eine Vorrichtung entsprechend Figur 1 in der Ar¬ beitsstellung.Figure 1 shows a device with circuit board and component in the starting position. FIG. 2 shows a device corresponding to FIG. 1 in the working position.
Figur 3 zeigt eine Vorrichtung in der Endstellung.Figure 3 shows a device in the end position.
In der Figur 1 ist ein erster Schneid-Biegebacken 1 und ein zweiter Schneid-Biegebacken 2 zusammen mit einer Leiterplatte 13 und einem elektronischen Bauteil 12 sowie einem zugehörigen Anschlußdraht 14 dargestellt. Die Leiterplatte 13, die in der Regel aus Kunststoff hergestellt ist, weist die Bohrung 11 auf. Die Anschläge 9 sorgen für eine definierte Endstellung der beiden Schneid-Biegebacken 1, 2. Der erste Schneid-Biegebacken 1 weist eine Schneidkante 3 auf, die mit der Kante 4 des zweiten Schneid-Biegebackens 2 für den Schneidvorgang zusammenwirkt. Für den folgenden Biegevorgang wirkt die Biegekante 6 mit den Greifzacken 10 zusammen, wobei der Anschlußdraht 14 soweit gebogen wird, bis er an der Fläche 7 anliegt. Durch die Anstellung der Fläche 7 ist der Abbiegewinkel bestimmt. Der gemeinsame Drehpunkt 8 der beiden Schneid-Biegebacken 1, 2 ist in der Zeichnung angedeutet.1 shows a first cutting-bending jaw 1 and a second cutting-bending jaw 2 together with a printed circuit board 13 and an electronic component 12 and an associated connecting wire 14. The circuit board 13, which is usually made of plastic, has the bore 11. The stops 9 ensure a defined end position of the two cutting and bending jaws 1, 2. The first cutting and bending jaws 1 has a cutting edge 3 which interacts with the edge 4 of the second cutting and bending jaw 2 for the cutting process. For the following bending process, the bending edge 6 interacts with the gripping prongs 10, the connecting wire 14 being bent until it rests on the surface 7. The turning angle is determined by the inclination of the surface 7. The common pivot point 8 of the two cutting and bending jaws 1, 2 is indicated in the drawing.
Die Figur 2 zeigt die Vorrichtung in Arbeitsstellung, wobei der zweite Schneid-Biegebacken 2 bereits bis zum Anschlag 9 geführt wurde. Somit ist durch den Aufbau 5 der Abstand X zwischen der Schnittstelle, festgelegt durch die Schneidkante 3 und die Kante 4, und der Unterseite der Leiterplatte 13 eingestellt. Hierbei liegt die Leiterplatte 13 auf dem Schneid-Biegebacken 2 auf. Der erste Schneid-Biegebacken 1 bewegt sich in der darge¬ stellten Momentaufnahme noch auf den Anschlag 9 zu.FIG. 2 shows the device in the working position, the second cutting-bending jaw 2 having already been guided up to the stop 9. The spacing X between the interface, defined by the cutting edge 3 and the edge 4, and the underside of the printed circuit board 13 is thus set by the structure 5. Here, the circuit board 13 rests on the cutting and bending jaws 2. The first cutting-bending jaw 1 is still moving towards the stop 9 in the snapshot shown.
Um eine mögliche Beschädigung der Leiterplatte 13 durch die Be¬ wegung des Schneid-Biegebackens 2 zu verhindern, kann ein fest¬ stehender Anschlag für die Leiterplatte 13 so am Unterwerkzeug angebracht werden, daß sich die Biegekante 6 des Schneid-Biege- backens 2 mit einem definierten Abstand von z.B. 0,1 mm unter der Leiterplatte bewegen kann. In der Figur 3 sind der Schneid- und der Biegevorgang beendet. Der Anschlußdraht 14 ist auf Länge geschnitten, liegt an der Fläche 7 an und ist um die Biegekante 6 herumgebogen. In diesem Zustand liegt auch der erste Schneid-Biegebacken 1 am Anschlag 9 an. In Abhängigkeit vom Durchmesser der verarbeiteten Anschlußdrähte 14 wird durch den ersten Schneid-Biegebacken 1 mittels der Greifzacken 10 eine mehr oder weniger starke Einkerbung im Anschlußdraht 14 erzielt. Durch diese Kerbwirkung wird erreicht, daß beim Biegevorgang der Draht formschlüssig erfaßt wird und definiert um die Biege¬ kante 6 des zweiten Schneid-Biegebackens 2 gebogen wird. Ein Abgleiten des Anschlußdrahtes 14 nach oben ist dadurch selbst bei geringen Bauteile-Haltekräften wie z.B. bei der Handbe¬ stückung ausgeschlossen. Ein weiterer Vorteil dieser Einker- bung durch die Greifzacken 10 ergibt sich bei der weiteren Ver¬ arbeitung bei einem anschließenden Lötverfahren. Durch das Aufreißen von Oxidschichten, die auf dem Anschlußdraht 14 vor¬ handen sein können wird die Lötbarkeit erhöht. Durch den Einsatz der Greifzacken wird es ermöglicht, Anschlußdrähte 14 mit unterschiedlichen Durchmessern zu verarbeiten. Bei relativ kleinen Backenkräften können Drahtdurchmesser von beispiels¬ weise 0,3 bis 1 mm verarbeitet werden, wobei runde und recht¬ eckige Querschnitte möglich sind. Mit einer erfindungsgemäßen Vorrichtung ist bezüglich der Positionierung der Leiterplatte 13 und den darin enthaltenen Bohrungen 11 in Bezug aufIn order to prevent possible damage to the circuit board 13 by the movement of the cutting and bending jaw 2, a fixed stop for the circuit board 13 can be attached to the lower tool in such a way that the bending edge 6 of the cutting and bending jaw 2 is in contact with one another defined distance of 0.1 mm below the circuit board. In FIG. 3, the cutting and bending processes have ended. The connecting wire 14 is cut to length, lies against the surface 7 and is bent around the bending edge 6. In this state, the first cutting and bending jaw 1 also abuts the stop 9. Depending on the diameter of the processed connecting wires 14, a more or less strong notch in the connecting wire 14 is achieved by the first cutting-bending jaw 1 by means of the gripping prongs 10. This notch effect ensures that the wire is positively gripped during the bending process and is bent in a defined manner around the bending edge 6 of the second cutting and bending jaw 2. A sliding of the connecting wire 14 upwards is thereby ruled out, even with low component holding forces, such as in the case of manual assembly. Another advantage of this indentation by the gripping prongs 10 results in the further processing in a subsequent soldering process. The solderability is increased by tearing open oxide layers that may be present on the connecting wire 14. The use of the gripping prongs makes it possible to process connecting wires 14 with different diameters. With relatively small jaw forces, wire diameters of, for example, 0.3 to 1 mm can be processed, round and rectangular cross sections being possible. With a device according to the invention, with regard to the positioning of the printed circuit board 13 and the bores 11 contained therein, with respect to FIG
Schneid-Biegebacken nur ein geringer Aufwand nötig. Positions- ungenauigkeiten von ca. + 0,5 mm beeinflussen das Biegeer¬ gebnis nicht nachteilig.Cutting and bending jaws require little effort. Position inaccuracies of approximately + 0.5 mm do not adversely affect the bending result.
3 Patentansprüche 3 Figuren 3 claims 3 figures

Claims

Patentansprüche Claims
1. Vorrichtung zum Ablängen und Biegen von Anschlußdrähten (14) von elektronischen Bauteilen (12) bei deren Montage auf Leiter¬ platten (13) mittels Unterwerkzeuge, bestehend aus1. Device for cutting and bending connecting wires (14) of electronic components (12) during their assembly on printed circuit boards (13) by means of lower tools, consisting of
- einer ersten Schneid-Biegebacke (1) mit einer Schneidkante (3) und mindestens einem Greifzacken (10), - einer zweiten Schneid-Biegebacke (2) mit einem Aufbau (5), einer Biegekante (6), einer Kante (4) und einer Fläche (7), wobei die Schneidkante (3) mit der Kante (4) und die Greif¬ zacken (10) mit der Fläche (7) zusammenwirken und in einem Ar¬ beitsvorgang einen Anschlußdraht (14) ablängen und biegen.- a first cutting-bending jaw (1) with a cutting edge (3) and at least one gripping prong (10), - a second cutting-bending jaw (2) with a structure (5), a bending edge (6), an edge (4) and a surface (7), the cutting edge (3) interacting with the edge (4) and the gripping prongs (10) interacting with the surface (7) and cutting and bending a connecting wire (14) in one operation.
2. Vorrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Leiterplatte (13) während eines Arbeitsvorganges auf dem Aufbau (5) der zweiten Schneid-Biegebacke (2) aufliegt, wobei ein vorbestimmter Abstand (x) zwischen Kante (4) und Leiterplatte (13) entsteht.2. Apparatus according to claim 1, characterized in that the printed circuit board (13) rests on the structure (5) of the second cutting and bending jaw (2) during a working process, a predetermined distance (x) between the edge (4) and the printed circuit board (13 ) arises.
3. Vorrichtung nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß die erste und die zweite Schneid-Biegebacke (1,2) einen ge¬ meinsamen Drehpunkt (8) für den Schneid-Biegevorgang aufweisen.3. Device according to one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that the first and the second cutting-bending jaw (1,2) have a common pivot point (8) for the cutting-bending process.
4. Vorrichtung nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß beide Schneid-Biegebacken (1,2) um eine senkrecht zur Lei¬ terplatte (13) stehende und durch den Anschlußdraht (14) verlaufende Achse drehbar sind, womit die Biegerichtung des An¬ schlußdrahtes (14) variierbar ist. 4. Device according to one of the preceding claims, characterized in that both cutting-bending jaws (1,2) are rotatable about a perpendicular to the Lei¬ terplatte (13) and through the connecting wire (14) axis, whereby the bending direction of the An¬ closing wire (14) is variable.
PCT/DE1990/000189 1989-04-13 1990-03-14 Device for cutting to length and bending connector leads WO1990012484A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FI914808A FI914808A0 (en) 1989-04-13 1991-10-11 ANORDNING FOER ATT KAPA OCH BOEJA ANSLUTNINGSTRAODAR.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3912175.5 1989-04-13
DE19893912175 DE3912175A1 (en) 1989-04-13 1989-04-13 DEVICE FOR CUTTING AND BENDING CONNECTING WIRE

Publications (1)

Publication Number Publication Date
WO1990012484A1 true WO1990012484A1 (en) 1990-10-18

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ID=6378625

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1990/000189 WO1990012484A1 (en) 1989-04-13 1990-03-14 Device for cutting to length and bending connector leads

Country Status (4)

Country Link
EP (1) EP0467894A1 (en)
JP (1) JPH04502384A (en)
DE (1) DE3912175A1 (en)
WO (1) WO1990012484A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101912933A (en) * 2010-08-13 2010-12-15 深圳创维－Rgb电子有限公司 Pin shearing moving cutter of automatic insertion of electronic component
CN110730612A (en) * 2019-10-24 2020-01-24 深圳市菲浦斯智能装备有限公司 Riveting foot mechanism
JP2023060222A (en) * 2022-01-13 2023-04-27 株式会社Fuji Cutting/bending device

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
DE102006053696A1 (en) * 2006-11-13 2008-05-29 Häusermann GmbH Plant for the production of a printed circuit board with additive and integrated and ultrasonically contacted copper elements

Citations (3)

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Publication number Priority date Publication date Assignee Title
DE2808343A1 (en) * 1977-03-01 1978-09-07 Universal Instruments Corp CUTTING AND CLINCH DEVICE FOR MACHINERY FOR INSERTING ELECTRONIC COMPONENTS IN A CIRCUIT BOARD
US4425947A (en) * 1981-11-03 1984-01-17 Usm Corporation Single point cut and clench mechanism
DE3523662A1 (en) * 1985-06-28 1987-01-08 Siemens Ag Cutting and bending head for the terminating wires of electronic components

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Publication number Priority date Publication date Assignee Title
JPS6019907B2 (en) * 1980-08-01 1985-05-18 三光化学株式会社 Method for producing aromatic glycidyl ether

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
DE2808343A1 (en) * 1977-03-01 1978-09-07 Universal Instruments Corp CUTTING AND CLINCH DEVICE FOR MACHINERY FOR INSERTING ELECTRONIC COMPONENTS IN A CIRCUIT BOARD
US4425947A (en) * 1981-11-03 1984-01-17 Usm Corporation Single point cut and clench mechanism
DE3523662A1 (en) * 1985-06-28 1987-01-08 Siemens Ag Cutting and bending head for the terminating wires of electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101912933A (en) * 2010-08-13 2010-12-15 深圳创维－Rgb电子有限公司 Pin shearing moving cutter of automatic insertion of electronic component
CN110730612A (en) * 2019-10-24 2020-01-24 深圳市菲浦斯智能装备有限公司 Riveting foot mechanism
CN110730612B (en) * 2019-10-24 2021-06-29 冷晓勇 Riveting foot mechanism
JP2023060222A (en) * 2022-01-13 2023-04-27 株式会社Fuji Cutting/bending device
JP7411841B2 (en) 2022-01-13 2024-01-11 株式会社Fuji Cutting/bending equipment

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Publication number Publication date
EP0467894A1 (en) 1992-01-29
DE3912175A1 (en) 1990-10-18
JPH04502384A (en) 1992-04-23

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