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USD934188S1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
USD934188S1
USD934188S1 US29/725,275 US202029725275F USD934188S US D934188 S1 USD934188 S1 US D934188S1 US 202029725275 F US202029725275 F US 202029725275F US D934188 S USD934188 S US D934188S
Authority
US
United States
Prior art keywords
power semiconductor
semiconductor module
view
module
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/725,275
Inventor
Kotaro Shibata
Hideki Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAWADA, HIDEKI, SHIBATA, KOTARO
Application granted granted Critical
Publication of USD934188S1 publication Critical patent/USD934188S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top and right side perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is an enlarged right side view thereof; and,
FIG. 6 is an enlarged left side view thereof.
The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor module, as shown and described.
US29/725,275 2019-08-29 2020-02-24 Power semiconductor module Active USD934188S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-19211F JP1659716S (en) 2019-08-29 2019-08-29
JP2019-019211 2019-08-29

Publications (1)

Publication Number Publication Date
USD934188S1 true USD934188S1 (en) 2021-10-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/725,275 Active USD934188S1 (en) 2019-08-29 2020-02-24 Power semiconductor module

Country Status (2)

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US (1) USD934188S1 (en)
JP (1) JP1659716S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969761S1 (en) * 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module

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USD799439S1 (en) 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1603980S (en) 2017-09-07 2018-05-14
JP1603793S (en) 2017-09-29 2018-05-14
JP1605558S (en) 2017-01-05 2018-06-04
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD888674S1 (en) * 2018-10-17 2020-06-30 Oupiin Electronic (Kunshan) Co., Ltd. Circuit board with zigzag routes
USD892754S1 (en) 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD903611S1 (en) 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471089A (en) * 1992-06-30 1995-11-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor power module
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6774465B2 (en) 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
JP1536359S (en) 2014-08-19 2015-10-26
JP1536360S (en) 2014-08-19 2015-10-26
USD775091S1 (en) 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
JP1536191S (en) 2014-08-19 2015-10-26
USD776071S1 (en) 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
US20160190915A1 (en) 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
US20160284618A1 (en) 2015-03-25 2016-09-29 Mitsubishi Electric Corporation Semiconductor device
US20160336245A1 (en) 2015-05-15 2016-11-17 Mitsubishi Electric Corporation Power semiconductor device
US20160372392A1 (en) * 2015-06-18 2016-12-22 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device fabrication method
USD790491S1 (en) 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
US9660356B1 (en) 2015-11-25 2017-05-23 Fuji Electric Co., Ltd. Semiconductor device
USD799439S1 (en) 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD875058S1 (en) * 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
JP1585831S (en) 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1605558S (en) 2017-01-05 2018-06-04
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
JP1585830S (en) 2017-01-05 2017-09-11
JP1585962S (en) 2017-01-05 2017-09-11
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD847103S1 (en) 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
JP1603980S (en) 2017-09-07 2018-05-14
JP1603793S (en) 2017-09-29 2018-05-14
USD847104S1 (en) 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD892754S1 (en) 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD888674S1 (en) * 2018-10-17 2020-06-30 Oupiin Electronic (Kunshan) Co., Ltd. Circuit board with zigzag routes
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969761S1 (en) * 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) * 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module

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