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USD909317S1 - Semiconductor package - Google Patents

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Publication number
USD909317S1
USD909317S1 US29/709,609 US201929709609F USD909317S US D909317 S1 USD909317 S1 US D909317S1 US 201929709609 F US201929709609 F US 201929709609F US D909317 S USD909317 S US D909317S
Authority
US
United States
Prior art keywords
semiconductor package
view
design
broken lines
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/709,609
Inventor
Hiroshi Itakura
Keitaro Yamagishi
Yoshihiro Akeboshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2017-6619F external-priority patent/JP1586816S/ja
Priority claimed from JPD2017-6620F external-priority patent/JP1586817S/ja
Priority claimed from JPD2017-6616F external-priority patent/JP1586397S/ja
Priority claimed from JPD2017-6617F external-priority patent/JP1586814S/ja
Priority claimed from JPD2017-6618F external-priority patent/JP1586815S/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/709,609 priority Critical patent/USD909317S1/en
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMAGISHI, KEITARO, AKEBOSHI, YOSHIHIRO, ITAKURA, Hiroshi
Application granted granted Critical
Publication of USD909317S1 publication Critical patent/USD909317S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top and left side perspective view of a semiconductor package showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a left side view thereof; the right side view being a mirror image thereof;
FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 2, with the internal structure shown in broken lines; and,
FIG. 8 is a perspective view of FIG. 1, shown in a state of use.
The parts shown in even dashed broken lines do not form part of the claimed design. The dot and dashed lines mean a boundary between the claimed portion and the non-claimed portion and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor package, as shown and described.
US29/709,609 2017-03-30 2019-10-16 Semiconductor package Active USD909317S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/709,609 USD909317S1 (en) 2017-03-30 2019-10-16 Semiconductor package

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2017-006620 2017-01-18
JP2017-006618 2017-03-30
JP2017-006617 2017-03-30
JP2017-006616 2017-03-30
JPD2017-6619F JP1586816S (en) 2017-03-30 2017-03-30
JPD2017-6620F JP1586817S (en) 2017-03-30 2017-03-30
JP2017-006619 2017-03-30
JPD2017-6616F JP1586397S (en) 2017-03-30 2017-03-30
JPD2017-6617F JP1586814S (en) 2017-03-30 2017-03-30
JPD2017-6618F JP1586815S (en) 2017-03-30 2017-03-30
US29/614,124 USD877707S1 (en) 2017-03-30 2017-08-16 Semiconductor package
US29/709,609 USD909317S1 (en) 2017-03-30 2019-10-16 Semiconductor package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/614,124 Division USD877707S1 (en) 2017-03-30 2017-08-16 Semiconductor package

Publications (1)

Publication Number Publication Date
USD909317S1 true USD909317S1 (en) 2021-02-02

Family

ID=69700765

Family Applications (5)

Application Number Title Priority Date Filing Date
US29/614,124 Active USD877707S1 (en) 2017-03-30 2017-08-16 Semiconductor package
US29/709,607 Active USD908646S1 (en) 2017-03-30 2019-10-16 Semiconductor package
US29/709,608 Active USD908647S1 (en) 2017-03-30 2019-10-16 Semiconductor package
US29/709,610 Active USD909318S1 (en) 2017-03-30 2019-10-16 Semiconductor package
US29/709,609 Active USD909317S1 (en) 2017-03-30 2019-10-16 Semiconductor package

Family Applications Before (4)

Application Number Title Priority Date Filing Date
US29/614,124 Active USD877707S1 (en) 2017-03-30 2017-08-16 Semiconductor package
US29/709,607 Active USD908646S1 (en) 2017-03-30 2019-10-16 Semiconductor package
US29/709,608 Active USD908647S1 (en) 2017-03-30 2019-10-16 Semiconductor package
US29/709,610 Active USD909318S1 (en) 2017-03-30 2019-10-16 Semiconductor package

Country Status (1)

Country Link
US (5) USD877707S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1008969S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Connector
USD1008968S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Connector

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package
USD1030941S1 (en) * 2020-08-05 2024-06-11 Liaoning Qingyang Explosive Materials Co., Ltd Detonator cover
USD1009943S1 (en) * 2022-03-22 2024-01-02 Schott Ag Air bag detonator

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US2817046A (en) * 1953-03-24 1957-12-17 Weiss Shirley Irving Filament bar casing and method of making same
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
US3458779A (en) 1967-11-24 1969-07-29 Gen Electric Sic p-n junction electroluminescent diode with a donor concentration diminishing from the junction to one surface and an acceptor concentration increasing in the same region
US3510732A (en) * 1968-04-22 1970-05-05 Gen Electric Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein
US3562609A (en) * 1968-06-04 1971-02-09 Gen Electric Solid state lamp utilizing emission from edge of a p-n junction
US3614550A (en) * 1969-01-09 1971-10-19 Ibm A semiconductor laser device with improved operating efficiency
US3715636A (en) * 1972-01-03 1973-02-06 Gen Electric Silicon carbide lamp mounted on a ceramic of poor thermal conductivity
US3774086A (en) * 1972-09-25 1973-11-20 Gen Electric Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element
US3805347A (en) * 1969-12-29 1974-04-23 Gen Electric Solid state lamp construction
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination
US4032963A (en) * 1974-09-03 1977-06-28 Motorola, Inc. Package and method for a semiconductor radiant energy emitting device
US4143394A (en) * 1976-07-30 1979-03-06 Licentia Patent-Verwaltungs-G.M.B.H. Semiconductor luminescence device with housing
US4152624A (en) * 1978-03-16 1979-05-01 Monsanto Company Molded LED indicator
US4267559A (en) 1979-09-24 1981-05-12 Bell Telephone Laboratories, Incorporated Low thermal impedance light-emitting diode package
USD277955S (en) 1981-10-30 1985-03-12 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD278048S (en) 1981-10-30 1985-03-19 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD278049S (en) 1981-10-30 1985-03-19 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD280812S (en) 1982-05-07 1985-10-01 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD288805S (en) * 1983-12-16 1987-03-17 Sumitomo Electric Industries, Ltd. Photodiode
US4878107A (en) * 1985-10-29 1989-10-31 Hopper William R Touch sensitive indicating light
US5266817A (en) 1992-05-18 1993-11-30 Lin Paul Y S Package structure of multi-chip light emitting diode
US5459350A (en) 1993-01-13 1995-10-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed type semiconductor device
US5512784A (en) 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
US5564819A (en) 1994-04-04 1996-10-15 Rohm Co., Ltd. LED lamp and arrangement for mounting LED lamps on a substrate
USD420983S (en) 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6034424A (en) * 1996-07-31 2000-03-07 Sumitomo Electric Industries, Ltd. Package and optoelectronic device
US6147367A (en) 1997-12-10 2000-11-14 Industrial Technology Research Institute Packaging design for light emitting diode
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6404065B1 (en) 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
USD476296S1 (en) 2001-09-06 2003-06-24 Sharp Kabushiki Kaisha Semiconductor device
USD482666S1 (en) 2001-11-30 2003-11-25 Nichia Corporation Light emitting diode (LED)
USD483338S1 (en) * 2002-07-10 2003-12-09 Mitsubishi Denki Kabushiki Kaisha Optical module
USD484105S1 (en) * 2002-07-10 2003-12-23 Mitsubishi Denki Kabushiki Kaisha Optical module
US6707073B1 (en) * 1999-06-29 2004-03-16 Rohm Co., Ltd. Semiconductor laser device with press-formed base and heat sink
USD489695S1 (en) 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD494147S1 (en) * 2002-07-10 2004-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
US6784464B2 (en) * 2000-03-14 2004-08-31 Sharp Kabushiki Kaisha Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding
US6803608B1 (en) * 2003-06-10 2004-10-12 Wen-Ching Chen Light emitting diode used as an illuminant of an image sensor
USD505664S1 (en) * 2002-07-10 2005-05-31 Mitsubishi Denki Kabushiki Kaisha Optical package
USD515520S1 (en) 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
US20080111087A1 (en) * 2005-11-22 2008-05-15 Matsushita Electric Works, Ltd. Infrared Detector and Process for Fabricating the Same
USD623547S1 (en) 2009-06-23 2010-09-14 Panasonic Electric Works Co., Ltd. Detecting sensor
USD623548S1 (en) 2009-06-23 2010-09-14 Panasonic Electric Works Co., Ltd. Detecting sensor
USD623546S1 (en) 2009-06-23 2010-09-14 Panasonic Electric Works Co., Ltd. Detecting sensor
US7834433B2 (en) * 2007-01-10 2010-11-16 Shanghai Kaihong Technology Co., Ltd. Semiconductor power device
US7889770B2 (en) * 2002-03-25 2011-02-15 Sanyo Electric Co., Ltd. Semiconductor laser device
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package

Patent Citations (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2498585A (en) * 1945-01-01 1950-02-21 Thomas C Flanagan Piezoelectric crystal holder
US2817046A (en) * 1953-03-24 1957-12-17 Weiss Shirley Irving Filament bar casing and method of making same
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
US3458779A (en) 1967-11-24 1969-07-29 Gen Electric Sic p-n junction electroluminescent diode with a donor concentration diminishing from the junction to one surface and an acceptor concentration increasing in the same region
US3510732A (en) * 1968-04-22 1970-05-05 Gen Electric Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein
US3562609A (en) * 1968-06-04 1971-02-09 Gen Electric Solid state lamp utilizing emission from edge of a p-n junction
US3614550A (en) * 1969-01-09 1971-10-19 Ibm A semiconductor laser device with improved operating efficiency
US3805347A (en) * 1969-12-29 1974-04-23 Gen Electric Solid state lamp construction
US3715636A (en) * 1972-01-03 1973-02-06 Gen Electric Silicon carbide lamp mounted on a ceramic of poor thermal conductivity
US3774086A (en) * 1972-09-25 1973-11-20 Gen Electric Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element
US4032963A (en) * 1974-09-03 1977-06-28 Motorola, Inc. Package and method for a semiconductor radiant energy emitting device
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination
US4143394A (en) * 1976-07-30 1979-03-06 Licentia Patent-Verwaltungs-G.M.B.H. Semiconductor luminescence device with housing
US4152624A (en) * 1978-03-16 1979-05-01 Monsanto Company Molded LED indicator
US4267559A (en) 1979-09-24 1981-05-12 Bell Telephone Laboratories, Incorporated Low thermal impedance light-emitting diode package
USD277955S (en) 1981-10-30 1985-03-12 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD278048S (en) 1981-10-30 1985-03-19 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD278049S (en) 1981-10-30 1985-03-19 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD280812S (en) 1982-05-07 1985-10-01 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD288805S (en) * 1983-12-16 1987-03-17 Sumitomo Electric Industries, Ltd. Photodiode
US4878107A (en) * 1985-10-29 1989-10-31 Hopper William R Touch sensitive indicating light
US5266817A (en) 1992-05-18 1993-11-30 Lin Paul Y S Package structure of multi-chip light emitting diode
US5459350A (en) 1993-01-13 1995-10-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed type semiconductor device
US5564819A (en) 1994-04-04 1996-10-15 Rohm Co., Ltd. LED lamp and arrangement for mounting LED lamps on a substrate
US5512784A (en) 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
US6034424A (en) * 1996-07-31 2000-03-07 Sumitomo Electric Industries, Ltd. Package and optoelectronic device
US6147367A (en) 1997-12-10 2000-11-14 Industrial Technology Research Institute Packaging design for light emitting diode
US6404065B1 (en) 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD420983S (en) 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6707073B1 (en) * 1999-06-29 2004-03-16 Rohm Co., Ltd. Semiconductor laser device with press-formed base and heat sink
US6784464B2 (en) * 2000-03-14 2004-08-31 Sharp Kabushiki Kaisha Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding
USD476296S1 (en) 2001-09-06 2003-06-24 Sharp Kabushiki Kaisha Semiconductor device
USD482666S1 (en) 2001-11-30 2003-11-25 Nichia Corporation Light emitting diode (LED)
US7889770B2 (en) * 2002-03-25 2011-02-15 Sanyo Electric Co., Ltd. Semiconductor laser device
USD489695S1 (en) 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
USD494147S1 (en) * 2002-07-10 2004-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
USD484105S1 (en) * 2002-07-10 2003-12-23 Mitsubishi Denki Kabushiki Kaisha Optical module
USD505664S1 (en) * 2002-07-10 2005-05-31 Mitsubishi Denki Kabushiki Kaisha Optical package
USD483338S1 (en) * 2002-07-10 2003-12-09 Mitsubishi Denki Kabushiki Kaisha Optical module
US6803608B1 (en) * 2003-06-10 2004-10-12 Wen-Ching Chen Light emitting diode used as an illuminant of an image sensor
US20080111087A1 (en) * 2005-11-22 2008-05-15 Matsushita Electric Works, Ltd. Infrared Detector and Process for Fabricating the Same
US7834433B2 (en) * 2007-01-10 2010-11-16 Shanghai Kaihong Technology Co., Ltd. Semiconductor power device
USD623547S1 (en) 2009-06-23 2010-09-14 Panasonic Electric Works Co., Ltd. Detecting sensor
USD623548S1 (en) 2009-06-23 2010-09-14 Panasonic Electric Works Co., Ltd. Detecting sensor
USD623546S1 (en) 2009-06-23 2010-09-14 Panasonic Electric Works Co., Ltd. Detecting sensor
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1008969S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Connector
USD1008968S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Connector

Also Published As

Publication number Publication date
USD909318S1 (en) 2021-02-02
USD877707S1 (en) 2020-03-10
USD908646S1 (en) 2021-01-26
USD908647S1 (en) 2021-01-26

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