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USD964443S1 - Gas inlet attachment for wafer processing apparatus - Google Patents

Gas inlet attachment for wafer processing apparatus Download PDF

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Publication number
USD964443S1
USD964443S1 US29/770,855 US202129770855F USD964443S US D964443 S1 USD964443 S1 US D964443S1 US 202129770855 F US202129770855 F US 202129770855F US D964443 S USD964443 S US D964443S
Authority
US
United States
Prior art keywords
processing apparatus
gas inlet
wafer processing
inlet attachment
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/770,855
Inventor
Satoru Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MURATA, SATORU
Application granted granted Critical
Publication of USD964443S1 publication Critical patent/USD964443S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top and right side perspective view of a gas inlet attachment for wafer processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 4.

Claims (1)

    CLAIM
  1. The ornamental design for a gas inlet attachment for wafer processing apparatus, as shown and described.
US29/770,855 2020-08-18 2021-02-17 Gas inlet attachment for wafer processing apparatus Active USD964443S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-017141D 2020-08-18
JP2020017141F JP1685215S (en) 2020-08-18 2020-08-18 Gas introduction pipe for substrate processing equipment

Publications (1)

Publication Number Publication Date
USD964443S1 true USD964443S1 (en) 2022-09-20

Family

ID=75900508

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/770,855 Active USD964443S1 (en) 2020-08-18 2021-02-17 Gas inlet attachment for wafer processing apparatus

Country Status (3)

Country Link
US (1) USD964443S1 (en)
JP (1) JP1685215S (en)
TW (1) TWD215922S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1017561S1 (en) * 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484122A (en) * 1968-01-12 1969-12-16 Herman J Schellstede Drill pipe protector and method of constructing the same
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20130220221A1 (en) * 2012-02-23 2013-08-29 Applied Materials, Inc. Method and apparatus for precursor delivery
USD720051S1 (en) * 2011-01-20 2014-12-23 Victaulic Company Pipe element
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US20170241015A1 (en) * 2016-02-18 2017-08-24 Horiba Stec, Co., Ltd. Vaporizer and thin film deposition apparatus including the same
USD818509S1 (en) * 2017-02-10 2018-05-22 Hakko Corporation Nozzle for soldering iron
USD827150S1 (en) * 2016-08-29 2018-08-28 Hitachi High-Technologies Corporation Column pipe
JP1624352S (en) 2018-07-19 2019-02-12
JP1648531S (en) 2019-01-28 2019-12-23
USD872843S1 (en) * 2017-12-06 2020-01-14 Michael Stoffa, Sr. Valve attachment for a pipe
USD873392S1 (en) * 2017-08-31 2020-01-21 Rotary Connections International Ltd. Drill pipe
USD890572S1 (en) * 2018-07-19 2020-07-21 Kokusai Electric Corporation Gas supply nozzle for substrate processing apparatus
USD944661S1 (en) * 2019-07-17 2022-03-01 Kokusai Electric Corporation Calibrator for wafer handling robots

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484122A (en) * 1968-01-12 1969-12-16 Herman J Schellstede Drill pipe protector and method of constructing the same
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD720051S1 (en) * 2011-01-20 2014-12-23 Victaulic Company Pipe element
US20130220221A1 (en) * 2012-02-23 2013-08-29 Applied Materials, Inc. Method and apparatus for precursor delivery
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US20170241015A1 (en) * 2016-02-18 2017-08-24 Horiba Stec, Co., Ltd. Vaporizer and thin film deposition apparatus including the same
USD827150S1 (en) * 2016-08-29 2018-08-28 Hitachi High-Technologies Corporation Column pipe
USD818509S1 (en) * 2017-02-10 2018-05-22 Hakko Corporation Nozzle for soldering iron
USD873392S1 (en) * 2017-08-31 2020-01-21 Rotary Connections International Ltd. Drill pipe
USD872843S1 (en) * 2017-12-06 2020-01-14 Michael Stoffa, Sr. Valve attachment for a pipe
JP1624352S (en) 2018-07-19 2019-02-12
USD890572S1 (en) * 2018-07-19 2020-07-21 Kokusai Electric Corporation Gas supply nozzle for substrate processing apparatus
USD924953S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Gas inlet attachment for substrate processing apparatus
JP1648531S (en) 2019-01-28 2019-12-23
USD901564S1 (en) 2019-01-28 2020-11-10 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD944661S1 (en) * 2019-07-17 2022-03-01 Kokusai Electric Corporation Calibrator for wafer handling robots

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1017561S1 (en) * 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

Also Published As

Publication number Publication date
TWD215922S (en) 2021-12-11
JP1685215S (en) 2024-05-10

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