[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

USD942406S1 - Electric terminal - Google Patents

Electric terminal Download PDF

Info

Publication number
USD942406S1
USD942406S1 US29/723,349 US202029723349F USD942406S US D942406 S1 USD942406 S1 US D942406S1 US 202029723349 F US202029723349 F US 202029723349F US D942406 S USD942406 S US D942406S
Authority
US
United States
Prior art keywords
electric terminal
view
design
elevation view
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/723,349
Inventor
Patrizio Vinciarelli
Michael LaFleur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vicor Corp
Original Assignee
Vicor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vicor Corp filed Critical Vicor Corp
Priority to US29/723,349 priority Critical patent/USD942406S1/en
Assigned to VICOR CORPORATION reassignment VICOR CORPORATION MERGER (SEE DOCUMENT FOR DETAILS). Assignors: VLT, INC.
Assigned to VLT, INC. reassignment VLT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAFLEUR, MICHAEL B., VINCIARELLI, PATRIZIO
Application granted granted Critical
Publication of USD942406S1 publication Critical patent/USD942406S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top, front, right perspective view of an electric terminal showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Broken lines formed by equal length dashes show unclaimed portions of the design. Broken lines formed of unequal length dashes (i.e., dash-dot) show boundaries between claimed and unclaimed portions of the design. The equal length broken lines having a jagged z-shaped element form no part of the claimed design and are shown broken away to indicate that no particular length or width of the portion between the break lines is claimed.

Claims (1)

    CLAIM
  1. The ornamental design for an electric terminal, as shown and described.
US29/723,349 2013-10-17 2020-02-06 Electric terminal Active USD942406S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/723,349 USD942406S1 (en) 2013-10-17 2020-02-06 Electric terminal

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29/470,060 USD754083S1 (en) 2013-10-17 2013-10-17 Electric terminal
US29/556,621 USD798249S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/614,894 USD834548S1 (en) 2013-10-17 2017-08-24 Electric terminal
US29/669,185 USD877708S1 (en) 2013-10-17 2018-11-06 Electrical terminal
US29/723,349 USD942406S1 (en) 2013-10-17 2020-02-06 Electric terminal

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/669,185 Division USD877708S1 (en) 2013-10-17 2018-11-06 Electrical terminal

Publications (1)

Publication Number Publication Date
USD942406S1 true USD942406S1 (en) 2022-02-01

Family

ID=55700350

Family Applications (7)

Application Number Title Priority Date Filing Date
US29/470,060 Active USD754083S1 (en) 2013-10-17 2013-10-17 Electric terminal
US29/556,619 Active USD775093S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/556,621 Active USD798249S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/556,618 Active USD775092S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/614,894 Active USD834548S1 (en) 2013-10-17 2017-08-24 Electric terminal
US29/669,185 Active USD877708S1 (en) 2013-10-17 2018-11-06 Electrical terminal
US29/723,349 Active USD942406S1 (en) 2013-10-17 2020-02-06 Electric terminal

Family Applications Before (6)

Application Number Title Priority Date Filing Date
US29/470,060 Active USD754083S1 (en) 2013-10-17 2013-10-17 Electric terminal
US29/556,619 Active USD775093S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/556,621 Active USD798249S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/556,618 Active USD775092S1 (en) 2013-10-17 2016-03-02 Electric terminal
US29/614,894 Active USD834548S1 (en) 2013-10-17 2017-08-24 Electric terminal
US29/669,185 Active USD877708S1 (en) 2013-10-17 2018-11-06 Electrical terminal

Country Status (1)

Country Link
US (7) USD754083S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD986174S1 (en) * 2020-07-10 2023-05-16 Xinghui Peng Power connector

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD742581S1 (en) * 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
JP1582228S (en) * 2016-08-02 2017-07-24
USD845906S1 (en) * 2017-03-09 2019-04-16 Sendyne Corporation Electrical shunt
JP1641098S (en) * 2018-06-26 2019-09-09
USD888673S1 (en) 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1664282S (en) * 2019-07-24 2020-07-27
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD934820S1 (en) 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD947801S1 (en) * 2019-11-07 2022-04-05 Phoenix Contact Gmbh & Co. Kg Printed circuit board
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device

Citations (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579046A (en) 1969-05-02 1971-05-18 Jordan Controls Inc Electrical housing assembly having a plurality of chambers with adjacent circuit board elements
US4338621A (en) 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
US4698663A (en) 1986-09-17 1987-10-06 Fujitsu Limited Heatsink package for flip-chip IC
USD317300S (en) 1987-07-04 1991-06-04 Terutomi Hasegawa Semi-conductor mounting substrate
US5066999A (en) 1989-10-23 1991-11-19 Micron Technology, Inc. Resistor under wirebond pad
USD363920S (en) * 1992-12-02 1995-11-07 K. W. Muth Company, Inc. Electrical circuit board
US5742005A (en) 1994-09-14 1998-04-21 Sumitomo Wiring Systems, Ltd. Electrical connection box
US5757082A (en) 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5994772A (en) 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
US6078505A (en) 1999-05-14 2000-06-20 Triquint Semiconductor, Inc. Circuit board assembly method
US6348742B1 (en) 1999-01-25 2002-02-19 Clear Logic, Inc. Sacrificial bond pads for laser configured integrated circuits
US6391681B1 (en) 2001-03-16 2002-05-21 Micron Technology, Inc. Semiconductor component having selected terminal contacts with multiple electrical paths
US6476505B2 (en) 1999-04-27 2002-11-05 Oki Electric Industry Co, Ltd. Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners
US6483038B2 (en) 2000-05-23 2002-11-19 Samsung Electronics Co., Ltd. Memory card
USD466093S1 (en) 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6494723B2 (en) 2000-03-31 2002-12-17 Autonetworks Technologies, Ltd. Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal
USD485536S1 (en) 2003-03-10 2004-01-20 Pulse Engineering, Inc. Electronics component assembly
US6723924B2 (en) 2002-09-03 2004-04-20 Sumitomo Wiring Systems, Ltd. Electrical conductor assembly
US6753482B1 (en) 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
US6905347B2 (en) 2002-11-08 2005-06-14 Sumitomo Wiring Systems, Ltd. Electrical junction box with connector and fuse modules
US20060097374A1 (en) 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD540272S1 (en) 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD547371S1 (en) 2005-10-22 2007-07-24 Karl Frederick Miller Reminder form
US20090004776A1 (en) 2007-06-28 2009-01-01 Ning Ye Method of fabricating a memory card using sip/smt hybrid technology
USD601520S1 (en) 2005-01-14 2009-10-06 Panasonic Corporation Electric circuit board
USD612347S1 (en) 2005-01-14 2010-03-23 Panasonic Corporation Electric circuit board
US7709292B2 (en) 2006-09-29 2010-05-04 Sadwick Laurence P Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
USD633054S1 (en) 2009-07-28 2011-02-22 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633450S1 (en) 2009-07-28 2011-03-01 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD638810S1 (en) 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
USD638809S1 (en) 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
USD684547S1 (en) 2011-08-30 2013-06-18 Panasonic Corporation Fixing base for an electroluminescence module
USD690277S1 (en) 2011-09-07 2013-09-24 Panasonic Corporation Electroluminescence module
USD690672S1 (en) 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD694200S1 (en) 2011-09-07 2013-11-26 Panasonic Corporation Electroluminescence module
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
US20140070381A1 (en) 2012-09-12 2014-03-13 Kabushiki Kaisha Toshiba Semiconductor memory card
US20140099805A1 (en) 2012-10-10 2014-04-10 Motorola Mobility Llc Electronic connector capable of accepting a single subscriber identity mopdule or a memory card
US20140106621A1 (en) 2012-10-11 2014-04-17 Carry Technology Co., Ltd. Memory card adapter device
USD708595S1 (en) 2013-01-11 2014-07-08 Panasonic Corporation Electroluminescence module
USD708594S1 (en) 2013-01-11 2014-07-08 Panasonic Corporation Panel board for electroluminescence module
US20140355218A1 (en) * 2011-05-11 2014-12-04 Vlt, Inc. Panel-Molded Electronic Assemblies
US8966747B2 (en) * 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
USD730304S1 (en) 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD736216S1 (en) 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD754083S1 (en) 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
US9936580B1 (en) * 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
US10785871B1 (en) * 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals

Patent Citations (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579046A (en) 1969-05-02 1971-05-18 Jordan Controls Inc Electrical housing assembly having a plurality of chambers with adjacent circuit board elements
US4338621A (en) 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
US4698663A (en) 1986-09-17 1987-10-06 Fujitsu Limited Heatsink package for flip-chip IC
USD317300S (en) 1987-07-04 1991-06-04 Terutomi Hasegawa Semi-conductor mounting substrate
US5066999A (en) 1989-10-23 1991-11-19 Micron Technology, Inc. Resistor under wirebond pad
USD363920S (en) * 1992-12-02 1995-11-07 K. W. Muth Company, Inc. Electrical circuit board
US5742005A (en) 1994-09-14 1998-04-21 Sumitomo Wiring Systems, Ltd. Electrical connection box
US5757082A (en) 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5994772A (en) 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
US6348742B1 (en) 1999-01-25 2002-02-19 Clear Logic, Inc. Sacrificial bond pads for laser configured integrated circuits
US6476505B2 (en) 1999-04-27 2002-11-05 Oki Electric Industry Co, Ltd. Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners
US6078505A (en) 1999-05-14 2000-06-20 Triquint Semiconductor, Inc. Circuit board assembly method
US6494723B2 (en) 2000-03-31 2002-12-17 Autonetworks Technologies, Ltd. Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal
US6483038B2 (en) 2000-05-23 2002-11-19 Samsung Electronics Co., Ltd. Memory card
US6391681B1 (en) 2001-03-16 2002-05-21 Micron Technology, Inc. Semiconductor component having selected terminal contacts with multiple electrical paths
US6537850B1 (en) 2001-03-16 2003-03-25 Micron Technology, Inc. Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
USD466093S1 (en) 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
US6753482B1 (en) 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
US6723924B2 (en) 2002-09-03 2004-04-20 Sumitomo Wiring Systems, Ltd. Electrical conductor assembly
US6905347B2 (en) 2002-11-08 2005-06-14 Sumitomo Wiring Systems, Ltd. Electrical junction box with connector and fuse modules
USD485536S1 (en) 2003-03-10 2004-01-20 Pulse Engineering, Inc. Electronics component assembly
US20060097374A1 (en) 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD612347S1 (en) 2005-01-14 2010-03-23 Panasonic Corporation Electric circuit board
USD601520S1 (en) 2005-01-14 2009-10-06 Panasonic Corporation Electric circuit board
USD540272S1 (en) 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD547371S1 (en) 2005-10-22 2007-07-24 Karl Frederick Miller Reminder form
US7709292B2 (en) 2006-09-29 2010-05-04 Sadwick Laurence P Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
US20090004776A1 (en) 2007-06-28 2009-01-01 Ning Ye Method of fabricating a memory card using sip/smt hybrid technology
USD633054S1 (en) 2009-07-28 2011-02-22 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633450S1 (en) 2009-07-28 2011-03-01 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD638810S1 (en) 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
USD638809S1 (en) 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
US8966747B2 (en) * 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
US20140355218A1 (en) * 2011-05-11 2014-12-04 Vlt, Inc. Panel-Molded Electronic Assemblies
USD684547S1 (en) 2011-08-30 2013-06-18 Panasonic Corporation Fixing base for an electroluminescence module
USD690277S1 (en) 2011-09-07 2013-09-24 Panasonic Corporation Electroluminescence module
USD694200S1 (en) 2011-09-07 2013-11-26 Panasonic Corporation Electroluminescence module
USD690672S1 (en) 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
US20140070381A1 (en) 2012-09-12 2014-03-13 Kabushiki Kaisha Toshiba Semiconductor memory card
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
US20140099805A1 (en) 2012-10-10 2014-04-10 Motorola Mobility Llc Electronic connector capable of accepting a single subscriber identity mopdule or a memory card
US20140106621A1 (en) 2012-10-11 2014-04-17 Carry Technology Co., Ltd. Memory card adapter device
USD708594S1 (en) 2013-01-11 2014-07-08 Panasonic Corporation Panel board for electroluminescence module
USD708595S1 (en) 2013-01-11 2014-07-08 Panasonic Corporation Electroluminescence module
USD754083S1 (en) 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD775093S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD775092S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD798249S1 (en) 2013-10-17 2017-09-26 Vlt, Inc. Electric terminal
USD834548S1 (en) * 2013-10-17 2018-11-27 Vlt, Inc. Electric terminal
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD730304S1 (en) 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD736213S1 (en) 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
US9936580B1 (en) * 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
US10785871B1 (en) * 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Mitsubishi Electric Corporation, Release No. 2647, Mitsubishi Electric Launches 1200V/50A Large-Type Dual In-Line Package Intelligent Power Module, Jan. 26, 2012, 2 pages.
Protek Devices, Package Outline, 16 Pin Drip Package, 2000, 2 pages.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD986174S1 (en) * 2020-07-10 2023-05-16 Xinghui Peng Power connector

Also Published As

Publication number Publication date
USD754083S1 (en) 2016-04-19
USD775092S1 (en) 2016-12-27
USD775093S1 (en) 2016-12-27
USD798249S1 (en) 2017-09-26
USD877708S1 (en) 2020-03-10
USD834548S1 (en) 2018-11-27

Similar Documents

Publication Publication Date Title
USD942406S1 (en) Electric terminal
USD713003S1 (en) Showerhead
USD753426S1 (en) Chair
USD717924S1 (en) Faucet
USD708714S1 (en) Faucet
USD718430S1 (en) Toilet
USD713939S1 (en) Faucet
USD712521S1 (en) Faucet
USD764215S1 (en) Chair
USD713941S1 (en) Water distribution components
USD718418S1 (en) Showerhead
USD714425S1 (en) Faucet
USD804750S1 (en) Pressure washer
USRE45585E1 (en) Stimulation device
USD737866S1 (en) Mixing drum
USD735295S1 (en) Showerhead
USD713938S1 (en) Faucet
USD722145S1 (en) Sink
USD742080S1 (en) Pressure washer
USD805788S1 (en) Cleaning tool
USD703792S1 (en) Faucet
USD721167S1 (en) Sink
USD712510S1 (en) Showerhead
USD801134S1 (en) Food serving station
USD741668S1 (en) Utensil

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY