USD941787S1 - Substrate transfer blade - Google Patents
Substrate transfer blade Download PDFInfo
- Publication number
- USD941787S1 USD941787S1 US29/726,488 US202029726488F USD941787S US D941787 S1 USD941787 S1 US D941787S1 US 202029726488 F US202029726488 F US 202029726488F US D941787 S USD941787 S US D941787S
- Authority
- US
- United States
- Prior art keywords
- substrate transfer
- transfer blade
- view
- blade
- elevation view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines in the drawings illustrate portions of the substrate transfer blade that form no part of the claimed design.
Claims (1)
- The ornamental design for a substrate transfer blade, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/726,488 USD941787S1 (en) | 2020-03-03 | 2020-03-03 | Substrate transfer blade |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/726,488 USD941787S1 (en) | 2020-03-03 | 2020-03-03 | Substrate transfer blade |
Publications (1)
Publication Number | Publication Date |
---|---|
USD941787S1 true USD941787S1 (en) | 2022-01-25 |
Family
ID=79602439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/726,488 Active USD941787S1 (en) | 2020-03-03 | 2020-03-03 | Substrate transfer blade |
Country Status (1)
Country | Link |
---|---|
US (1) | USD941787S1 (en) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080178801A1 (en) * | 2007-01-29 | 2008-07-31 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
US20170088949A1 (en) | 2015-09-30 | 2017-03-30 | Applied Materials, Inc. | High temperature vapor delivery system and method |
US20170287752A1 (en) | 2016-03-29 | 2017-10-05 | Applied Materials, Inc. | Integrated metrology and process tool to enable local stress/overlay correction |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD819580S1 (en) * | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
US20180261480A1 (en) | 2017-03-10 | 2018-09-13 | Applied Materials, Inc. | High pressure wafer processing systems and related methods |
USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
US20190096638A1 (en) * | 2017-09-22 | 2019-03-28 | Applied Materials, Inc. | Substrate processing chamber having improved process volume sealing |
US10347475B2 (en) * | 2005-10-31 | 2019-07-09 | Applied Materials, Inc. | Holding assembly for substrate processing chamber |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD904640S1 (en) * | 2019-01-21 | 2020-12-08 | Applied Materials, Inc. | Substrate carrier |
USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
-
2020
- 2020-03-03 US US29/726,488 patent/USD941787S1/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10347475B2 (en) * | 2005-10-31 | 2019-07-09 | Applied Materials, Inc. | Holding assembly for substrate processing chamber |
US20080178801A1 (en) * | 2007-01-29 | 2008-07-31 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
US20170088949A1 (en) | 2015-09-30 | 2017-03-30 | Applied Materials, Inc. | High temperature vapor delivery system and method |
JP2017101318A (en) | 2015-09-30 | 2017-06-08 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | High temperature vapor supply system and method |
US20170287752A1 (en) | 2016-03-29 | 2017-10-05 | Applied Materials, Inc. | Integrated metrology and process tool to enable local stress/overlay correction |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD819580S1 (en) * | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
US20180261480A1 (en) | 2017-03-10 | 2018-09-13 | Applied Materials, Inc. | High pressure wafer processing systems and related methods |
USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
US20190096638A1 (en) * | 2017-09-22 | 2019-03-28 | Applied Materials, Inc. | Substrate processing chamber having improved process volume sealing |
USD904640S1 (en) * | 2019-01-21 | 2020-12-08 | Applied Materials, Inc. | Substrate carrier |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
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Legal Events
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---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |