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USD940090S1 - Leadframe - Google Patents

Leadframe Download PDF

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Publication number
USD940090S1
USD940090S1 US29/699,936 US201929699936F USD940090S US D940090 S1 USD940090 S1 US D940090S1 US 201929699936 F US201929699936 F US 201929699936F US D940090 S USD940090 S US D940090S
Authority
US
United States
Prior art keywords
leadframe
view
elevational view
mirror image
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/699,936
Inventor
Li-Ju Huang
Michael Yimin Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diodes Inc
Original Assignee
Diodes Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/692,906 external-priority patent/USD939458S1/en
Application filed by Diodes Inc filed Critical Diodes Inc
Priority to US29/699,936 priority Critical patent/USD940090S1/en
Assigned to DIODES INCORPORATED reassignment DIODES INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, LI-JU, ZHANG, MICHAEL YIMIN
Priority to US29/814,007 priority patent/USD980811S1/en
Priority to US29/814,009 priority patent/USD969093S1/en
Application granted granted Critical
Publication of USD940090S1 publication Critical patent/USD940090S1/en
Priority to US17/803,180 priority patent/US20230317567A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of a leadframe showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof, the rear elevational view being a mirror image thereof; and,
FIG. 5 is a right side elevational view thereof, the left side elevational view being a mirror image thereof.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.

Claims (1)

    CLAIM
  1. The ornamental design for a leadframe, as shown and described.
US29/699,936 2019-05-29 2019-07-30 Leadframe Active USD940090S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/699,936 USD940090S1 (en) 2019-05-29 2019-07-30 Leadframe
US29/814,007 USD980811S1 (en) 2019-05-29 2021-11-02 Leadframe
US29/814,009 USD969093S1 (en) 2019-05-29 2021-11-02 Leadframe
US17/803,180 US20230317567A1 (en) 2019-05-29 2022-08-31 Leadframe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/692,906 USD939458S1 (en) 2019-05-29 2019-05-29 Leadframe
US29/699,936 USD940090S1 (en) 2019-05-29 2019-07-30 Leadframe

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/692,906 Continuation-In-Part USD939458S1 (en) 2019-05-29 2019-05-29 Leadframe

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US29/814,007 Division USD980811S1 (en) 2019-05-29 2021-11-02 Leadframe
US29814008 Division 2019-05-29 2021-11-02
US29/814,009 Division USD969093S1 (en) 2019-05-29 2021-11-02 Leadframe

Publications (1)

Publication Number Publication Date
USD940090S1 true USD940090S1 (en) 2022-01-04

Family

ID=79165852

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/699,936 Active USD940090S1 (en) 2019-05-29 2019-07-30 Leadframe
US29/814,007 Active USD980811S1 (en) 2019-05-29 2021-11-02 Leadframe
US29/814,009 Active USD969093S1 (en) 2019-05-29 2021-11-02 Leadframe

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/814,007 Active USD980811S1 (en) 2019-05-29 2021-11-02 Leadframe
US29/814,009 Active USD969093S1 (en) 2019-05-29 2021-11-02 Leadframe

Country Status (1)

Country Link
US (3) USD940090S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954006S1 (en) * 2020-11-03 2022-06-07 Linxens Holding Microcircuit for smart card
USD969093S1 (en) * 2019-05-29 2022-11-08 Diodes Incorported Leadframe
USD969764S1 (en) * 2019-05-29 2022-11-15 Diodes Incorported Leadframe

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150084172A1 (en) * 2013-09-26 2015-03-26 Byung Tai Do Integrated circuit packaging system with side solderable leads and method of manufacture thereof
US20150221584A1 (en) * 2014-02-05 2015-08-06 Texas Instruments Incorporated Stacked Synchronous Buck Converter Having Chip Embedded in Outside Recess of Leadframe
US20180130723A1 (en) * 2014-03-07 2018-05-10 Bridge Semiconductor Corporation Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same
US20180182642A1 (en) * 2016-12-23 2018-06-28 Texas Instruments Incorporated Qfn pin routing thru lead frame etching
US10128171B1 (en) * 2016-03-25 2018-11-13 Marvell International Ltd. Leadframe with improved half-etch layout to reduce defects caused during singulation
US10347571B1 (en) * 2018-01-09 2019-07-09 Macom Technology Solutions Holdings, Inc. Intra-package interference isolation
US20190295934A1 (en) * 2018-03-23 2019-09-26 Stmicroelectronics S.R.L. Leadframe package using selectively pre-plated leadframe
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
US20190355651A1 (en) * 2018-05-21 2019-11-21 Texas Instruments Incorporated Two sided bondable lead frame
US20200035586A1 (en) * 2018-07-25 2020-01-30 Semiconductor Components Industries, Llc Chip-on-lead semiconductor device packages with electrically isolated signal leads
US20200194351A1 (en) * 2018-12-12 2020-06-18 Stmicroelectronics, Inc. Compact leadframe package
US20200194357A1 (en) * 2018-12-14 2020-06-18 Texas Instruments Incorporated Package with dies mounted on opposing surfaces of a leadframe
US20200211933A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Leadframe die pad with partially-etched groove between through-hole slots
US20200258825A1 (en) * 2019-02-12 2020-08-13 Texas Instruments Incorporated High current packages with reduced solder layer count
US20200303609A1 (en) * 2019-03-22 2020-09-24 Samsung Electronics Co., Ltd. Light-emitting device packages
US20200312958A1 (en) * 2019-03-27 2020-10-01 Intel Corporation Source or drain structures with phosphorous and arsenic co-dopants
US20200312754A1 (en) * 2019-04-01 2020-10-01 Fuji Electric Co., Ltd. Semiconductor device
US20200343168A1 (en) * 2019-04-25 2020-10-29 Stmicroelectronics, Inc. Lead stabilization in semiconductor packages
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
US20200411421A1 (en) * 2019-06-28 2020-12-31 Semiconductor Components Industries, Llc Semiconductor device assemblies
US20210020553A1 (en) * 2016-03-21 2021-01-21 Infineon Technologies Ag Leadframe leads having fully plated end faces
US20210090980A1 (en) * 2019-09-25 2021-03-25 Texas Instruments Incorporated Semiconductor package with solder standoff
US20210193541A1 (en) * 2019-12-20 2021-06-24 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component Carrier and Method of Manufacturing the Same
US20210225742A1 (en) * 2020-01-22 2021-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7242076B2 (en) * 2004-05-18 2007-07-10 Fairchild Semiconductor Corporation Packaged integrated circuit with MLP leadframe and method of making same
US20090278241A1 (en) * 2008-05-08 2009-11-12 Yong Liu Semiconductor die package including die stacked on premolded substrate including die
US20150200156A1 (en) * 2014-01-13 2015-07-16 Altera Corporation Module having mirror-symmetric terminals and methods of forming the same
US10446414B2 (en) * 2017-12-22 2019-10-15 Texas Instruments Incorporated Semiconductor package with filler particles in a mold compound
USD939458S1 (en) * 2019-05-29 2021-12-28 Diodes Incorporated Leadframe
USD940090S1 (en) * 2019-05-29 2022-01-04 Diodes Incorporated Leadframe
US11462467B2 (en) * 2020-07-14 2022-10-04 Advanced Semiconductor Engineering, Inc. Lead frame, package structure comprising the same and method for manufacturing the package structure
US11430720B2 (en) * 2020-07-27 2022-08-30 Texas Instruments Incorporated Recess lead for a surface mount package
US11791247B2 (en) * 2020-09-30 2023-10-17 Semiconductor Components Industries, Llc Concealed gate terminal semiconductor packages and related methods
US11410915B2 (en) * 2020-11-03 2022-08-09 Advanced Semiconductor Engineering, Inc. Semiconductor package structure including an encapsulant having a cavity exposing an interposer

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150084172A1 (en) * 2013-09-26 2015-03-26 Byung Tai Do Integrated circuit packaging system with side solderable leads and method of manufacture thereof
US20150221584A1 (en) * 2014-02-05 2015-08-06 Texas Instruments Incorporated Stacked Synchronous Buck Converter Having Chip Embedded in Outside Recess of Leadframe
US20180130723A1 (en) * 2014-03-07 2018-05-10 Bridge Semiconductor Corporation Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same
US20210020553A1 (en) * 2016-03-21 2021-01-21 Infineon Technologies Ag Leadframe leads having fully plated end faces
US10128171B1 (en) * 2016-03-25 2018-11-13 Marvell International Ltd. Leadframe with improved half-etch layout to reduce defects caused during singulation
US20180182642A1 (en) * 2016-12-23 2018-06-28 Texas Instruments Incorporated Qfn pin routing thru lead frame etching
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
US10347571B1 (en) * 2018-01-09 2019-07-09 Macom Technology Solutions Holdings, Inc. Intra-package interference isolation
US20190295934A1 (en) * 2018-03-23 2019-09-26 Stmicroelectronics S.R.L. Leadframe package using selectively pre-plated leadframe
US20190355651A1 (en) * 2018-05-21 2019-11-21 Texas Instruments Incorporated Two sided bondable lead frame
US20200035586A1 (en) * 2018-07-25 2020-01-30 Semiconductor Components Industries, Llc Chip-on-lead semiconductor device packages with electrically isolated signal leads
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
US20200194351A1 (en) * 2018-12-12 2020-06-18 Stmicroelectronics, Inc. Compact leadframe package
US20200194357A1 (en) * 2018-12-14 2020-06-18 Texas Instruments Incorporated Package with dies mounted on opposing surfaces of a leadframe
US20200211933A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Leadframe die pad with partially-etched groove between through-hole slots
US20200258825A1 (en) * 2019-02-12 2020-08-13 Texas Instruments Incorporated High current packages with reduced solder layer count
US20200303609A1 (en) * 2019-03-22 2020-09-24 Samsung Electronics Co., Ltd. Light-emitting device packages
US20200312958A1 (en) * 2019-03-27 2020-10-01 Intel Corporation Source or drain structures with phosphorous and arsenic co-dopants
US20200312754A1 (en) * 2019-04-01 2020-10-01 Fuji Electric Co., Ltd. Semiconductor device
US20200343168A1 (en) * 2019-04-25 2020-10-29 Stmicroelectronics, Inc. Lead stabilization in semiconductor packages
US20200411421A1 (en) * 2019-06-28 2020-12-31 Semiconductor Components Industries, Llc Semiconductor device assemblies
US20210090980A1 (en) * 2019-09-25 2021-03-25 Texas Instruments Incorporated Semiconductor package with solder standoff
US20210193541A1 (en) * 2019-12-20 2021-06-24 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component Carrier and Method of Manufacturing the Same
US20210225742A1 (en) * 2020-01-22 2021-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969093S1 (en) * 2019-05-29 2022-11-08 Diodes Incorported Leadframe
USD969764S1 (en) * 2019-05-29 2022-11-15 Diodes Incorported Leadframe
USD969763S1 (en) * 2019-05-29 2022-11-15 Diodes Incorporated Leadframe
USD980811S1 (en) * 2019-05-29 2023-03-14 Diodes Incorporated Leadframe
USD985518S1 (en) * 2019-05-29 2023-05-09 Diodes Incorporated Leadframe
USD954006S1 (en) * 2020-11-03 2022-06-07 Linxens Holding Microcircuit for smart card

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Publication number Publication date
USD980811S1 (en) 2023-03-14
USD969093S1 (en) 2022-11-08

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