USD814433S1

USD814433S1 - Semiconductor module

Info

Publication number: USD814433S1
Application number: US29/580,736
Authority: US
Inventors: Shin Soyano; Yoshikazu Takamiya; Keiichi Higuchi; Takahiro Koyama
Original assignee: Fuji Electric Co Ltd
Current assignee: Fuji Electric Co Ltd
Priority date: 2014-11-28
Filing date: 2016-10-12
Publication date: 2018-04-03
Anticipated expiration: 2033-04-03
Also published as: USD827593S1; USD774479S1

Description

FIG. 1 is a front view of a semiconductor module showing our new design.

FIG. 2 is a rear view of the semiconductor module of FIG. 1.

FIG. 3 is a left side view of the semiconductor module of FIG. 1.

FIG. 4 is a right side view of the semiconductor module of FIG. 1.

FIG. 5 is a top view of the semiconductor module of FIG. 1.

FIG. 6 is a bottom view of the semiconductor module of FIG. 1.

FIG. 7 is a front, right, and bottom perspective view of the semiconductor module of FIG. 1; and,

FIG. 8 is a rear, left, and top perspective view of the semiconductor module of FIG. 1.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Terminals extend from a circumferential edge part of a front surface. Rhombic plate members having rounded corners are centered along the long sides of the rear view, such that the longer diagonal line of each rhombic plate member extends along a long side.

Claims

CLAIM

The ornamental design for a semiconductor module, as shown and described.