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USD853977S1 - Heat sink plate - Google Patents

Heat sink plate Download PDF

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Publication number
USD853977S1
USD853977S1 US29/618,583 US201729618583F USD853977S US D853977 S1 USD853977 S1 US D853977S1 US 201729618583 F US201729618583 F US 201729618583F US D853977 S USD853977 S US D853977S
Authority
US
United States
Prior art keywords
heat sink
sink plate
view
plate
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/618,583
Other languages
English (en)
Inventor
Il-ho Kim
Meoung-Whan Cho
Young-Suk Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goodsystem Co Ltd
Original Assignee
Goodsystem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goodsystem Co Ltd filed Critical Goodsystem Co Ltd
Assigned to THE GOODSYSTEM CO., LTD. reassignment THE GOODSYSTEM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, MEOUNG-WHAN, KIM, IL-HO, KIM, YOUNG-SUK
Application granted granted Critical
Publication of USD853977S1 publication Critical patent/USD853977S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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US29/618,583 2017-04-25 2017-09-22 Heat sink plate Active USD853977S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2017-0019170 2017-04-25
KR20170019170 2017-04-25

Publications (1)

Publication Number Publication Date
USD853977S1 true USD853977S1 (en) 2019-07-16

Family

ID=61968417

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/618,583 Active USD853977S1 (en) 2017-04-25 2017-09-22 Heat sink plate

Country Status (2)

Country Link
US (1) USD853977S1 (fr)
JP (1) JP1602558S (fr)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090229864A1 (en) * 2005-09-15 2009-09-17 Mitsubishi Materials Corporation Insulating circuit board and insulating circuit board having cooling sink
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
US20100193941A1 (en) * 2009-02-04 2010-08-05 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
US20130277034A1 (en) * 2012-04-19 2013-10-24 Showa Denko K.K. Heat dissipation device and method for manufacturing the same
US20130328200A1 (en) * 2012-06-12 2013-12-12 Electronics And Telecommunications Research Institute Direct bonded copper substrate and power semiconductor module
US20150284296A1 (en) * 2012-11-20 2015-10-08 Tokuyama Corporation Metal/ceramic bonding substrate and method for producing same
US20160014878A1 (en) * 2014-04-25 2016-01-14 Rogers Corporation Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
US20170205149A1 (en) * 2016-01-15 2017-07-20 Hamilton Sundstrand Corporation Heat exchanger channels
US20170309499A1 (en) * 2014-10-16 2017-10-26 Mitsubishi Materials Corporation Power-module substrate with cooler and method of producing the same
US20180218920A1 (en) * 2017-02-02 2018-08-02 Panasonic Intellectual Property Management Co., Ltd. Graphite heat sink
US20180301391A1 (en) * 2015-10-08 2018-10-18 Mitsubishi Materials Corporation Heat-sink-attached power-module substrate and power module
US20180315679A1 (en) * 2015-10-07 2018-11-01 Ceramtec Gmbh Circuit cooled on two-sides
US20190037692A1 (en) * 2012-07-06 2019-01-31 Nhk Spring Co., Ltd. Method of manufacturing a circuit board laminate

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090229864A1 (en) * 2005-09-15 2009-09-17 Mitsubishi Materials Corporation Insulating circuit board and insulating circuit board having cooling sink
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
US20100193941A1 (en) * 2009-02-04 2010-08-05 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
US20130277034A1 (en) * 2012-04-19 2013-10-24 Showa Denko K.K. Heat dissipation device and method for manufacturing the same
US20130328200A1 (en) * 2012-06-12 2013-12-12 Electronics And Telecommunications Research Institute Direct bonded copper substrate and power semiconductor module
US20190037692A1 (en) * 2012-07-06 2019-01-31 Nhk Spring Co., Ltd. Method of manufacturing a circuit board laminate
US20150284296A1 (en) * 2012-11-20 2015-10-08 Tokuyama Corporation Metal/ceramic bonding substrate and method for producing same
US20160014878A1 (en) * 2014-04-25 2016-01-14 Rogers Corporation Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
US20170309499A1 (en) * 2014-10-16 2017-10-26 Mitsubishi Materials Corporation Power-module substrate with cooler and method of producing the same
US20180315679A1 (en) * 2015-10-07 2018-11-01 Ceramtec Gmbh Circuit cooled on two-sides
US20180301391A1 (en) * 2015-10-08 2018-10-18 Mitsubishi Materials Corporation Heat-sink-attached power-module substrate and power module
US20170205149A1 (en) * 2016-01-15 2017-07-20 Hamilton Sundstrand Corporation Heat exchanger channels
US20180218920A1 (en) * 2017-02-02 2018-08-02 Panasonic Intellectual Property Management Co., Ltd. Graphite heat sink

Also Published As

Publication number Publication date
JP1602558S (fr) 2018-04-23

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