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USD790039S1 - Showerhead for a semiconductor processing chamber - Google Patents

Showerhead for a semiconductor processing chamber Download PDF

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Publication number
USD790039S1
USD790039S1 US29/560,680 US201629560680F USD790039S US D790039 S1 USD790039 S1 US D790039S1 US 201629560680 F US201629560680 F US 201629560680F US D790039 S USD790039 S US D790039S
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United States
Prior art keywords
showerhead
processing chamber
semiconductor processing
view
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/560,680
Inventor
Lara Hawrylchak
Kong Lung Samuel Chan
Aaron Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/560,680 priority Critical patent/USD790039S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAN, KONG LUNG SAMUEL, HAWRYLCHAK, LARA, MILLER, AARON
Priority to TW105305434F priority patent/TWD182750S/en
Application granted granted Critical
Publication of USD790039S1 publication Critical patent/USD790039S1/en
Active legal-status Critical Current
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FIG. 1 is an isometric top view of a showerhead for a semiconductor processing chamber showing my new design.
FIG. 2 is an isometric bottom view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a front elevational view thereof indicated by lines 5-5 of FIG. 3, the rear elevational view being a mirror image.
FIG. 6 is a side elevational view thereof indicated by lines 6-6 of FIG. 3, the opposite side elevational view being a mirror image.
FIG. 7 is a cross-sectional view thereof taken along lines 7-7 of FIG. 3.
FIG. 8 is a cross-sectional view thereof taken along lines 8-8 of FIG. 3.
FIG. 9 is an enlarged view of a portion of FIG. 7.
FIG. 10 is an enlarged view of another portion of FIG. 7; and,
FIG. 11 is an enlarged view of a portion of FIG. 8.

Claims (1)

    CLAIM
  1. The ornamental design for a showerhead for a semiconductor processing chamber, as shown and described.
US29/560,680 2016-04-08 2016-04-08 Showerhead for a semiconductor processing chamber Active USD790039S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/560,680 USD790039S1 (en) 2016-04-08 2016-04-08 Showerhead for a semiconductor processing chamber
TW105305434F TWD182750S (en) 2016-04-08 2016-09-13 Showerhead for a semiconductor processing chamber(3)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/560,680 USD790039S1 (en) 2016-04-08 2016-04-08 Showerhead for a semiconductor processing chamber

Publications (1)

Publication Number Publication Date
USD790039S1 true USD790039S1 (en) 2017-06-20

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US29/560,680 Active USD790039S1 (en) 2016-04-08 2016-04-08 Showerhead for a semiconductor processing chamber

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US (1) USD790039S1 (en)
TW (1) TWD182750S (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD823985S1 (en) * 2016-12-16 2018-07-24 Kohler Co. Showerhead with non-uniform arrangement of spray nozzles of varying sizes
USD868993S1 (en) * 2017-08-31 2019-12-03 Hitachi High-Technologies Corporation Electrode plate for a plasma processing apparatus
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD967351S1 (en) 2020-10-20 2022-10-18 Applied Materials, Inc. Showerhead reflector
USD968563S1 (en) 2019-08-29 2022-11-01 Kohler Co. Showerhead
USD969980S1 (en) 2020-10-20 2022-11-15 Applied Materials, Inc. Deposition chamber showerhead
USD975239S1 (en) * 2019-10-30 2023-01-10 Kohler Co. Showerhead
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
US11577260B2 (en) 2018-08-22 2023-02-14 Kohler Co. Showerhead
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086677A (en) 1998-06-16 2000-07-11 Applied Materials, Inc. Dual gas faceplate for a showerhead in a semiconductor wafer processing system
US20030140851A1 (en) 2002-01-25 2003-07-31 Applied Materials, Inc. Gas distribution showerhead
US20050173569A1 (en) 2004-02-05 2005-08-11 Applied Materials, Inc. Gas distribution showerhead for semiconductor processing
US20060021703A1 (en) 2004-07-29 2006-02-02 Applied Materials, Inc. Dual gas faceplate for a showerhead in a semiconductor wafer processing system
US20060234514A1 (en) 2003-11-19 2006-10-19 Applied Materials, Inc. Gas distribution showerhead featuring exhaust apertures
USD566228S1 (en) * 2007-03-09 2008-04-08 Speakman Company Shower
USD593640S1 (en) * 2008-01-31 2009-06-02 Hansgrohe Ag Showerhead
US20090179085A1 (en) 2008-01-10 2009-07-16 Applied Materials, Inc. Heated showerhead assembly
US7658800B2 (en) * 2006-10-18 2010-02-09 Advanced Micro-Fabrication Equipment, Inc. Asia Gas distribution assembly for use in a semiconductor work piece processing reactor
USD639385S1 (en) * 2010-04-08 2011-06-07 Grohe Ag Shower head
USD641829S1 (en) * 2010-10-29 2011-07-19 Novellus Systems, Inc. Plasma reactor showerhead face plate having concentric ridge pattern
USD694359S1 (en) * 2012-07-11 2013-11-26 Hansgrohe Se Overhead shower
USD707328S1 (en) * 2013-02-07 2014-06-17 Hansgrohe Se Showerhead
USD733257S1 (en) * 2014-02-14 2015-06-30 Hansgrohe Se Overhead shower
USD736348S1 (en) * 2014-07-07 2015-08-11 Jiangmen Triumph Rain Showers Co., LTD Spray head for a shower
USD751176S1 (en) * 2014-08-07 2016-03-08 Hansgrohe Se Overhead shower
USD752708S1 (en) * 2014-12-01 2016-03-29 Shong I Copper Co., Ltd. Showerhead
US9343307B2 (en) 2013-12-24 2016-05-17 Ultratech, Inc. Laser spike annealing using fiber lasers
US9353439B2 (en) * 2013-04-05 2016-05-31 Lam Research Corporation Cascade design showerhead for transient uniformity
USD757893S1 (en) * 2014-11-04 2016-05-31 Custom Molded Products, Inc. Jet nozzle insert
US9464353B2 (en) * 2013-11-21 2016-10-11 Wonik Ips Co., Ltd. Substrate processing apparatus
US9484190B2 (en) * 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086677A (en) 1998-06-16 2000-07-11 Applied Materials, Inc. Dual gas faceplate for a showerhead in a semiconductor wafer processing system
US20030140851A1 (en) 2002-01-25 2003-07-31 Applied Materials, Inc. Gas distribution showerhead
US20060234514A1 (en) 2003-11-19 2006-10-19 Applied Materials, Inc. Gas distribution showerhead featuring exhaust apertures
US20050173569A1 (en) 2004-02-05 2005-08-11 Applied Materials, Inc. Gas distribution showerhead for semiconductor processing
US20060021703A1 (en) 2004-07-29 2006-02-02 Applied Materials, Inc. Dual gas faceplate for a showerhead in a semiconductor wafer processing system
US7658800B2 (en) * 2006-10-18 2010-02-09 Advanced Micro-Fabrication Equipment, Inc. Asia Gas distribution assembly for use in a semiconductor work piece processing reactor
USD566228S1 (en) * 2007-03-09 2008-04-08 Speakman Company Shower
US20090179085A1 (en) 2008-01-10 2009-07-16 Applied Materials, Inc. Heated showerhead assembly
USD593640S1 (en) * 2008-01-31 2009-06-02 Hansgrohe Ag Showerhead
USD639385S1 (en) * 2010-04-08 2011-06-07 Grohe Ag Shower head
USD641829S1 (en) * 2010-10-29 2011-07-19 Novellus Systems, Inc. Plasma reactor showerhead face plate having concentric ridge pattern
USD694359S1 (en) * 2012-07-11 2013-11-26 Hansgrohe Se Overhead shower
USD707328S1 (en) * 2013-02-07 2014-06-17 Hansgrohe Se Showerhead
US9353439B2 (en) * 2013-04-05 2016-05-31 Lam Research Corporation Cascade design showerhead for transient uniformity
US9464353B2 (en) * 2013-11-21 2016-10-11 Wonik Ips Co., Ltd. Substrate processing apparatus
US9343307B2 (en) 2013-12-24 2016-05-17 Ultratech, Inc. Laser spike annealing using fiber lasers
US9484190B2 (en) * 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
USD733257S1 (en) * 2014-02-14 2015-06-30 Hansgrohe Se Overhead shower
USD736348S1 (en) * 2014-07-07 2015-08-11 Jiangmen Triumph Rain Showers Co., LTD Spray head for a shower
USD751176S1 (en) * 2014-08-07 2016-03-08 Hansgrohe Se Overhead shower
USD757893S1 (en) * 2014-11-04 2016-05-31 Custom Molded Products, Inc. Jet nozzle insert
USD752708S1 (en) * 2014-12-01 2016-03-29 Shong I Copper Co., Ltd. Showerhead

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD823985S1 (en) * 2016-12-16 2018-07-24 Kohler Co. Showerhead with non-uniform arrangement of spray nozzles of varying sizes
USD837935S1 (en) * 2016-12-16 2019-01-08 Kohler Co. Showerhead with non-uniform arrangement of spray nozzles of varying sizes
USD838339S1 (en) * 2016-12-16 2019-01-15 Kohler Co. Showerhead with non-uniform arrangement of spray nozzles of varying sizes
USD868993S1 (en) * 2017-08-31 2019-12-03 Hitachi High-Technologies Corporation Electrode plate for a plasma processing apparatus
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11577260B2 (en) 2018-08-22 2023-02-14 Kohler Co. Showerhead
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD968563S1 (en) 2019-08-29 2022-11-01 Kohler Co. Showerhead
USD1038327S1 (en) 2019-10-30 2024-08-06 Kohler Co. Showerhead
USD1004052S1 (en) 2019-10-30 2023-11-07 Kohler Co. Showerhead
USD975239S1 (en) * 2019-10-30 2023-01-10 Kohler Co. Showerhead
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD969980S1 (en) 2020-10-20 2022-11-15 Applied Materials, Inc. Deposition chamber showerhead
USD967351S1 (en) 2020-10-20 2022-10-18 Applied Materials, Inc. Showerhead reflector
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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Publication number Publication date
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