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USD778851S1 - Substrate for an electronic circuit - Google Patents

Substrate for an electronic circuit Download PDF

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Publication number
USD778851S1
USD778851S1 US29/564,507 US201629564507F USD778851S US D778851 S1 USD778851 S1 US D778851S1 US 201629564507 F US201629564507 F US 201629564507F US D778851 S USD778851 S US D778851S
Authority
US
United States
Prior art keywords
substrate
electronic circuit
view
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/564,507
Inventor
Manabu Matsumoto
Isao Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2014-10418F external-priority patent/JP1519751S/ja
Priority claimed from JPD2014-10421F external-priority patent/JP1520124S/ja
Priority claimed from JPD2014-10419F external-priority patent/JP1520122S/ja
Priority claimed from JPD2014-10420F external-priority patent/JP1520123S/ja
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMOTO, MANABU, OZAWA, ISAO
Priority to US29/564,507 priority Critical patent/USD778851S1/en
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of USD778851S1 publication Critical patent/USD778851S1/en
Application granted granted Critical
Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATION reassignment KIOXIA CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA MEMORY CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Images

Description

FIG. 1 is a perspective view of a substrate for an electronic circuit showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view, a left side elevational view being a mirror image thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the drawings represent portions of the substrate for an electronic circuit that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate for an electronic circuit, as shown and described.
US29/564,507 2014-05-15 2016-05-13 Substrate for an electronic circuit Active USD778851S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/564,507 USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2014-010421 2014-05-15
JP2014-010418 2014-05-15
JPD2014-10421F JP1520124S (en) 2014-05-15 2014-05-15
JP2014-010419 2014-05-15
JPD2014-10419F JP1520122S (en) 2014-05-15 2014-05-15
JPD2014-10420F JP1520123S (en) 2014-05-15 2014-05-15
JPD2014-10418F JP1519751S (en) 2014-05-15 2014-05-15
JP2014-010420 2014-05-15
US29/500,896 USD764424S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit
US29/564,507 USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/500,896 Division USD764424S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit

Publications (1)

Publication Number Publication Date
USD778851S1 true USD778851S1 (en) 2017-02-14

Family

ID=56682979

Family Applications (4)

Application Number Title Priority Date Filing Date
US29/500,896 Active USD764424S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit
US29/564,493 Active USD778850S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,507 Active USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,531 Active USD778852S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/500,896 Active USD764424S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit
US29/564,493 Active USD778850S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/564,531 Active USD778852S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Country Status (1)

Country Link
US (4) USD764424S1 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
TWD189698S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189696S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189700S (en) 2017-06-30 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189699S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189697S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
USD821987S1 (en) * 2016-04-27 2018-07-03 Ngk Insulators, Ltd. Flexible printed circuits
TWD192227S (en) 2017-03-16 2018-08-11 新世紀光電股份有限公司 Part of the LED package
USD825499S1 (en) 2016-09-29 2018-08-14 Genesis Photonics Inc. Light emitting diode package
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
USD830348S1 (en) * 2013-09-26 2018-10-09 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD840404S1 (en) * 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD843334S1 (en) * 2016-05-11 2019-03-19 Ngk Insulators, Ltd. Flexible printed circuits
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD886751S1 (en) 2016-09-29 2020-06-09 Genesis Photonics Inc. Light emitting diode module
USD892774S1 (en) * 2013-09-26 2020-08-11 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module

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* Cited by examiner, † Cited by third party
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USD742581S1 (en) * 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
CA169446S (en) * 2016-01-22 2017-02-21 Shenzhen Longsys Electronics Co Ltd Ssd storage module
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD934820S1 (en) 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD1031678S1 (en) * 2021-05-13 2024-06-18 Mississippi State University, Office of Technology Management Combined electrical enclosure and mount for wearable plug and play device

Citations (33)

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Publication number Priority date Publication date Assignee Title
US5858481A (en) 1996-01-30 1999-01-12 Matsushita Electric Industrial Co., Ltd. Electronic circuit substrate
US6410355B1 (en) * 1998-06-11 2002-06-25 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20030094628A1 (en) 2001-11-21 2003-05-22 Yeh Nai Hua Memory module structure
US20060168721A1 (en) 2005-01-28 2006-08-03 Mcguire Carney J Portable, flexible cushion for poolside use
USD526972S1 (en) 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD531139S1 (en) 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
US7307848B2 (en) * 2003-07-17 2007-12-11 Sandisk Corporation Memory card with raised portion
US7306161B2 (en) * 2003-07-17 2007-12-11 Sandisk Corporation Memory card with chamfer
US20080123318A1 (en) 2006-11-08 2008-05-29 Atmel Corporation Multi-component electronic package with planarized embedded-components substrate
USD608741S1 (en) 2008-03-13 2010-01-26 Panasonic Corporation Substrate for electric circuit
US20100326710A1 (en) 2009-06-29 2010-12-30 Guigen Zhang Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
US7864540B2 (en) * 2003-07-17 2011-01-04 Sandisk Corporation Peripheral card with sloped edges
USD633673S1 (en) 2010-02-10 2011-03-01 The Libman Company Cloth
USD633672S1 (en) 2010-02-10 2011-03-01 The Libman Company Pad
US20110051351A1 (en) 2009-08-25 2011-03-03 Elpida Memory, Inc. Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD670917S1 (en) 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD673922S1 (en) 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD702445S1 (en) 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD716743S1 (en) * 2014-03-25 2014-11-04 Transcend Information, Inc. Printed circuit board of solid-state memory
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD730304S1 (en) 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1946293A1 (en) * 2005-11-07 2008-07-23 Telefonaktiebolaget L M Ericsson (PUBL) Method and arrangement in a mobile telecommunication network

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5858481A (en) 1996-01-30 1999-01-12 Matsushita Electric Industrial Co., Ltd. Electronic circuit substrate
US6410355B1 (en) * 1998-06-11 2002-06-25 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD471524S1 (en) 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20030094628A1 (en) 2001-11-21 2003-05-22 Yeh Nai Hua Memory module structure
US7306161B2 (en) * 2003-07-17 2007-12-11 Sandisk Corporation Memory card with chamfer
US7307848B2 (en) * 2003-07-17 2007-12-11 Sandisk Corporation Memory card with raised portion
US7864540B2 (en) * 2003-07-17 2011-01-04 Sandisk Corporation Peripheral card with sloped edges
USD526972S1 (en) 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD531139S1 (en) 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
US20060168721A1 (en) 2005-01-28 2006-08-03 Mcguire Carney J Portable, flexible cushion for poolside use
US20080123318A1 (en) 2006-11-08 2008-05-29 Atmel Corporation Multi-component electronic package with planarized embedded-components substrate
USD608741S1 (en) 2008-03-13 2010-01-26 Panasonic Corporation Substrate for electric circuit
US20100326710A1 (en) 2009-06-29 2010-12-30 Guigen Zhang Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
US20110051351A1 (en) 2009-08-25 2011-03-03 Elpida Memory, Inc. Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
USD633672S1 (en) 2010-02-10 2011-03-01 The Libman Company Pad
USD633673S1 (en) 2010-02-10 2011-03-01 The Libman Company Cloth
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD670917S1 (en) 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD673922S1 (en) 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD702445S1 (en) 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD716743S1 (en) * 2014-03-25 2014-11-04 Transcend Information, Inc. Printed circuit board of solid-state memory
USD730304S1 (en) 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10382816B2 (en) 2013-03-13 2019-08-13 Nagrastar, Llc Systems and methods for performing transport I/O
USD840404S1 (en) * 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
USD830348S1 (en) * 2013-09-26 2018-10-09 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD892774S1 (en) * 2013-09-26 2020-08-11 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD821987S1 (en) * 2016-04-27 2018-07-03 Ngk Insulators, Ltd. Flexible printed circuits
USD843334S1 (en) * 2016-05-11 2019-03-19 Ngk Insulators, Ltd. Flexible printed circuits
USD843957S1 (en) 2016-09-29 2019-03-26 Genesis Photonics Inc. Light emitting diode package
USD886751S1 (en) 2016-09-29 2020-06-09 Genesis Photonics Inc. Light emitting diode module
USD825499S1 (en) 2016-09-29 2018-08-14 Genesis Photonics Inc. Light emitting diode package
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
TWD192227S (en) 2017-03-16 2018-08-11 新世紀光電股份有限公司 Part of the LED package
TWD189697S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189699S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189696S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189698S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189700S (en) 2017-06-30 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module

Also Published As

Publication number Publication date
USD778852S1 (en) 2017-02-14
USD764424S1 (en) 2016-08-23
USD778850S1 (en) 2017-02-14

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