USD749051S1 - Light emitting diode (LED) package - Google Patents
Light emitting diode (LED) package Download PDFInfo
- Publication number
- USD749051S1 USD749051S1 US29/439,629 US201229439629F USD749051S US D749051 S1 USD749051 S1 US D749051S1 US 201229439629 F US201229439629 F US 201229439629F US D749051 S USD749051 S US D749051S
- Authority
- US
- United States
- Prior art keywords
- view
- led
- package
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines are for illustrative purposes only and form no part of the claimed design. The gray or stippled trench portions of the embodiment illustrated in FIGS. 8 , 9, 11, and 13 represent that the stippled portions are a different material having different visual effects than other, adjacent portions. The gray or stippled trace portions illustrated in FIGS. 22 , 23, and 25-28 represent a metallic surface having a metallic visual effect.
Claims (1)
- The ornamental design for a light emitting diode (LED) package, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/439,629 USD749051S1 (en) | 2012-05-31 | 2012-12-13 | Light emitting diode (LED) package |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/423,422 USD709464S1 (en) | 2012-05-31 | 2012-05-31 | Light emitting diode (LED) package |
US13/554,776 US10439112B2 (en) | 2012-05-31 | 2012-07-20 | Light emitter packages, systems, and methods having improved performance |
US29/439,629 USD749051S1 (en) | 2012-05-31 | 2012-12-13 | Light emitting diode (LED) package |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/423,422 Continuation-In-Part USD709464S1 (en) | 2012-05-31 | 2012-05-31 | Light emitting diode (LED) package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD749051S1 true USD749051S1 (en) | 2016-02-09 |
Family
ID=55235897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/439,629 Active USD749051S1 (en) | 2012-05-31 | 2012-12-13 | Light emitting diode (LED) package |
Country Status (1)
Country | Link |
---|---|
US (1) | USD749051S1 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD772181S1 (en) * | 2015-04-02 | 2016-11-22 | Genesis Photonics Inc. | Light emitting diode package substrate |
USD777122S1 (en) * | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD783547S1 (en) * | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
TWD188043S (en) | 2016-09-29 | 2018-01-21 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD191441S (en) | 2016-09-29 | 2018-07-01 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD191442S (en) | 2016-09-29 | 2018-07-01 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD193987S (en) | 2017-06-30 | 2018-11-11 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD193991S (en) | 2017-06-30 | 2018-11-11 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD194240S (en) | 2017-03-16 | 2018-11-21 | 新世紀光電股份有限公司 | Portion of led package |
USD844183S1 (en) | 2016-08-19 | 2019-03-26 | Citizen Electronics Co., Ltd. | Light emitting diode |
USD844576S1 (en) | 2017-07-25 | 2019-04-02 | Citizen Electronics Co., Ltd. | Light emitting diode |
USD854195S1 (en) | 2016-09-29 | 2019-07-16 | Genesis Photonics Inc. | Light emitting diode package |
US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
USD886751S1 (en) | 2016-09-29 | 2020-06-09 | Genesis Photonics Inc. | Light emitting diode module |
USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
USD996377S1 (en) * | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
Citations (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
JP2002057374A (en) | 2000-08-08 | 2002-02-22 | Matsushita Electric Ind Co Ltd | Semiconductor light-emitting device |
JP2003258310A (en) | 2002-03-01 | 2003-09-12 | Citizen Electronics Co Ltd | Surface mounting light emitting diode and its producing method |
US20040262738A1 (en) | 2003-06-27 | 2004-12-30 | Lee Kong Weng | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
US20070158668A1 (en) | 2005-08-25 | 2007-07-12 | Cree, Inc. | Close loop electrophoretic deposition of semiconductor devices |
US20080001160A1 (en) | 2006-06-29 | 2008-01-03 | Cree, Inc. | LED package with flexible polyimid circuit and method of manufacturing LED package |
US20080026498A1 (en) | 2006-07-31 | 2008-01-31 | Eric Tarsa | Light emitting diode package element with internal meniscus for bubble free lens placement |
US20080035947A1 (en) | 2003-12-09 | 2008-02-14 | Weaver Jr Stanton Earl | Surface Mount Light Emitting Chip Package |
JP2008034513A (en) | 2006-07-27 | 2008-02-14 | Sumitomo Metal Electronics Devices Inc | Substrate for mounting light emitting element, and its manufacturing method |
US20080054286A1 (en) * | 2005-01-27 | 2008-03-06 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
US20080074029A1 (en) | 2006-09-12 | 2008-03-27 | Toyoda Gosei, Co., Ltd. | Light emitting device and method of making the same |
US20080173884A1 (en) | 2007-01-22 | 2008-07-24 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080179611A1 (en) | 2007-01-22 | 2008-07-31 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080258130A1 (en) | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
DE102007029369A1 (en) | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Opto-electronic semiconductor component, has opaque material for covering conductive strips of connection carrier and areas of chip connection region and for uncovering radiation passage surface of opto-electronic semiconductor chip |
US20090050907A1 (en) | 2005-01-10 | 2009-02-26 | Cree, Inc. | Solid state lighting component |
US20090108281A1 (en) * | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US20090146159A1 (en) | 2007-12-05 | 2009-06-11 | Samsung Electronics Co., Ltd. | Light-emitting device, method of manufacturing the light-emitting device and liquid crystal display having the light-emitting device |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US20100140634A1 (en) | 2009-11-09 | 2010-06-10 | Cree Led Lighting Solutions, Inc. | Solid state emitter package including red and blue emitters |
US20100155748A1 (en) | 2009-01-14 | 2010-06-24 | Cree Hong Kong Limited | Aligned multiple emitter package |
US20100155763A1 (en) | 2008-01-15 | 2010-06-24 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
US20100207534A1 (en) | 2007-10-09 | 2010-08-19 | Philips Solid-State Lighting Solutions, Inc. | Integrated led-based luminare for general lighting |
US7791061B2 (en) | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
US20100237377A1 (en) | 2005-10-27 | 2010-09-23 | Park Bo Geun | Light emitting diode package and method of manufacturing the same |
US20100237775A1 (en) | 2009-03-20 | 2010-09-23 | Everlight Electronics Co., Ltd. | Light emitting diode package structure and manufacturing method thereof |
US20100252851A1 (en) * | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
US20100277919A1 (en) | 2007-07-13 | 2010-11-04 | Rohm Co., Ltd. | Led module and led dot matrix display |
USD628966S1 (en) * | 2009-12-22 | 2010-12-14 | Panasonic Corporation | Light-emitting diode |
USD631020S1 (en) * | 2010-04-29 | 2011-01-18 | Edison Opto Corporation | LED package |
US20110062482A1 (en) * | 2010-01-20 | 2011-03-17 | Bridgelux, Inc. | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces |
US20110127912A1 (en) * | 2009-11-30 | 2011-06-02 | Young Jin Lee | Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
US20110220926A1 (en) | 2010-03-09 | 2011-09-15 | Hye Young Kim | Light emitting device package and lighting system including the same |
US8058088B2 (en) | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
USD650343S1 (en) * | 2011-01-31 | 2011-12-13 | Cree, Inc. | Multiple configuration light emitting device package |
US20120069564A1 (en) | 2010-09-20 | 2012-03-22 | Cree, Inc. | Multi-chip led devices |
US20120086024A1 (en) | 2010-10-07 | 2012-04-12 | Andrews Peter S | Multiple configuration light emitting devices and methods |
USD658139S1 (en) * | 2011-01-31 | 2012-04-24 | Cree, Inc. | High-density emitter package |
USD660257S1 (en) * | 2011-01-31 | 2012-05-22 | Cree, Inc. | Emitter package |
US20120199852A1 (en) | 2011-02-04 | 2012-08-09 | Cree, Inc. | Light-emitting diode component |
US20120286304A1 (en) * | 2011-05-10 | 2012-11-15 | Letoquin Ronan P | Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods |
US20120305949A1 (en) | 2011-01-31 | 2012-12-06 | Matthew Donofrio | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies |
US20120326159A1 (en) | 2011-06-24 | 2012-12-27 | Cree, Inc. | Led structure with enhanced mirror reflectivity |
USD674758S1 (en) * | 2011-10-31 | 2013-01-22 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode |
USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
US20130092960A1 (en) * | 2007-10-31 | 2013-04-18 | Ruud Lighting, Inc. | Multi-Die LED Package |
US20130105835A1 (en) * | 2011-10-31 | 2013-05-02 | Lite-On Technology Corp. | Light-emitting diode device |
US8575734B2 (en) | 2010-07-15 | 2013-11-05 | Lg Innotek Co., Ltd. | Lead frame |
WO2013181537A1 (en) | 2012-05-31 | 2013-12-05 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
US20130322070A1 (en) | 2012-05-31 | 2013-12-05 | Cree, Inc. | Light emitter packages, systems, and methods |
US8610145B2 (en) | 2003-09-30 | 2013-12-17 | Kabushiki Kaisha Toshiba | Light emitting device |
CN302758425S (en) | 2014-03-12 | |||
USD709464S1 (en) | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
USD711841S1 (en) | 2012-08-23 | 2014-08-26 | Cree, Inc. | Light emitting diode (LED) package |
USD713804S1 (en) | 2012-05-14 | 2014-09-23 | Cree, Inc. | Light emitting diode (LED) package with multiple anodes and cathodes |
-
2012
- 2012-12-13 US US29/439,629 patent/USD749051S1/en active Active
Patent Citations (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN302758425S (en) | 2014-03-12 | |||
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
JP2002057374A (en) | 2000-08-08 | 2002-02-22 | Matsushita Electric Ind Co Ltd | Semiconductor light-emitting device |
JP2003258310A (en) | 2002-03-01 | 2003-09-12 | Citizen Electronics Co Ltd | Surface mounting light emitting diode and its producing method |
US20040262738A1 (en) | 2003-06-27 | 2004-12-30 | Lee Kong Weng | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
US8610145B2 (en) | 2003-09-30 | 2013-12-17 | Kabushiki Kaisha Toshiba | Light emitting device |
US20080035947A1 (en) | 2003-12-09 | 2008-02-14 | Weaver Jr Stanton Earl | Surface Mount Light Emitting Chip Package |
US7791061B2 (en) | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
US20110012143A1 (en) | 2005-01-10 | 2011-01-20 | Cree, Inc. | Solid state lighting component |
US20090050907A1 (en) | 2005-01-10 | 2009-02-26 | Cree, Inc. | Solid state lighting component |
US20080054286A1 (en) * | 2005-01-27 | 2008-03-06 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
US20070158668A1 (en) | 2005-08-25 | 2007-07-12 | Cree, Inc. | Close loop electrophoretic deposition of semiconductor devices |
US20100237377A1 (en) | 2005-10-27 | 2010-09-23 | Park Bo Geun | Light emitting diode package and method of manufacturing the same |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
US20080001160A1 (en) | 2006-06-29 | 2008-01-03 | Cree, Inc. | LED package with flexible polyimid circuit and method of manufacturing LED package |
JP2008034513A (en) | 2006-07-27 | 2008-02-14 | Sumitomo Metal Electronics Devices Inc | Substrate for mounting light emitting element, and its manufacturing method |
US20080026498A1 (en) | 2006-07-31 | 2008-01-31 | Eric Tarsa | Light emitting diode package element with internal meniscus for bubble free lens placement |
US20080074029A1 (en) | 2006-09-12 | 2008-03-27 | Toyoda Gosei, Co., Ltd. | Light emitting device and method of making the same |
US20080179611A1 (en) | 2007-01-22 | 2008-07-31 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080173884A1 (en) | 2007-01-22 | 2008-07-24 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080258130A1 (en) | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
DE102007029369A1 (en) | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Opto-electronic semiconductor component, has opaque material for covering conductive strips of connection carrier and areas of chip connection region and for uncovering radiation passage surface of opto-electronic semiconductor chip |
US20100277919A1 (en) | 2007-07-13 | 2010-11-04 | Rohm Co., Ltd. | Led module and led dot matrix display |
US20100207534A1 (en) | 2007-10-09 | 2010-08-19 | Philips Solid-State Lighting Solutions, Inc. | Integrated led-based luminare for general lighting |
US20100252851A1 (en) * | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US20090108281A1 (en) * | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US20130092960A1 (en) * | 2007-10-31 | 2013-04-18 | Ruud Lighting, Inc. | Multi-Die LED Package |
US20090146159A1 (en) | 2007-12-05 | 2009-06-11 | Samsung Electronics Co., Ltd. | Light-emitting device, method of manufacturing the light-emitting device and liquid crystal display having the light-emitting device |
US20100155763A1 (en) | 2008-01-15 | 2010-06-24 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
US8058088B2 (en) | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
US20100155748A1 (en) | 2009-01-14 | 2010-06-24 | Cree Hong Kong Limited | Aligned multiple emitter package |
US20100237775A1 (en) | 2009-03-20 | 2010-09-23 | Everlight Electronics Co., Ltd. | Light emitting diode package structure and manufacturing method thereof |
US20100140634A1 (en) | 2009-11-09 | 2010-06-10 | Cree Led Lighting Solutions, Inc. | Solid state emitter package including red and blue emitters |
US20110127912A1 (en) * | 2009-11-30 | 2011-06-02 | Young Jin Lee | Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
USD628966S1 (en) * | 2009-12-22 | 2010-12-14 | Panasonic Corporation | Light-emitting diode |
US20110062482A1 (en) * | 2010-01-20 | 2011-03-17 | Bridgelux, Inc. | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces |
US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
US20110220926A1 (en) | 2010-03-09 | 2011-09-15 | Hye Young Kim | Light emitting device package and lighting system including the same |
USD631020S1 (en) * | 2010-04-29 | 2011-01-18 | Edison Opto Corporation | LED package |
US8575734B2 (en) | 2010-07-15 | 2013-11-05 | Lg Innotek Co., Ltd. | Lead frame |
US20120069564A1 (en) | 2010-09-20 | 2012-03-22 | Cree, Inc. | Multi-chip led devices |
US20120086024A1 (en) | 2010-10-07 | 2012-04-12 | Andrews Peter S | Multiple configuration light emitting devices and methods |
USD650343S1 (en) * | 2011-01-31 | 2011-12-13 | Cree, Inc. | Multiple configuration light emitting device package |
USD658139S1 (en) * | 2011-01-31 | 2012-04-24 | Cree, Inc. | High-density emitter package |
USD660257S1 (en) * | 2011-01-31 | 2012-05-22 | Cree, Inc. | Emitter package |
US20120305949A1 (en) | 2011-01-31 | 2012-12-06 | Matthew Donofrio | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies |
US20120199852A1 (en) | 2011-02-04 | 2012-08-09 | Cree, Inc. | Light-emitting diode component |
US20120286304A1 (en) * | 2011-05-10 | 2012-11-15 | Letoquin Ronan P | Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods |
US20120326159A1 (en) | 2011-06-24 | 2012-12-27 | Cree, Inc. | Led structure with enhanced mirror reflectivity |
US20130105835A1 (en) * | 2011-10-31 | 2013-05-02 | Lite-On Technology Corp. | Light-emitting diode device |
USD674758S1 (en) * | 2011-10-31 | 2013-01-22 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode |
USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
USD713804S1 (en) | 2012-05-14 | 2014-09-23 | Cree, Inc. | Light emitting diode (LED) package with multiple anodes and cathodes |
US20130322068A1 (en) | 2012-05-31 | 2013-12-05 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
US20130322070A1 (en) | 2012-05-31 | 2013-12-05 | Cree, Inc. | Light emitter packages, systems, and methods |
WO2013181538A1 (en) | 2012-05-31 | 2013-12-05 | Cree, Inc. | Light emitter packages, systems, and methods |
USD709464S1 (en) | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
WO2013181537A1 (en) | 2012-05-31 | 2013-12-05 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
EP2856525A1 (en) | 2012-05-31 | 2015-04-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
EP2856524A1 (en) | 2012-05-31 | 2015-04-08 | Cree, Inc. | Light emitter packages, systems, and methods |
USD711841S1 (en) | 2012-08-23 | 2014-08-26 | Cree, Inc. | Light emitting diode (LED) package |
Non-Patent Citations (25)
Title |
---|
"High Flux Density and Efficacy," Luxeon M Datasheet DSI03, 2012, pp. 1-22, Philips Lumileds Company, United States. |
Chinese Notice of Allowance for Application No. 201330525231.0 dated Apr. 10, 2014. |
Chinese Notice of Grant for Application No. 201230586339.6 dated Apr. 15, 2013. |
Chinese Notice of Issuance for Application No. 201330525210.9 dated Feb. 19, 2014. |
Chinese Notice of Issuance for Application No. 201330525357.8 dated Feb. 19, 2014. |
Chinese Office Action for Application No. 201330248426.5 dated Aug. 19, 2013. |
Chinese Office Action for Application No. 201330525231.0 dated Jan. 13, 2014. |
English Translation of DE 10 2007 029 369 A1 dated Jan. 1 , 2009. |
International Search Report and Written Opinion for Application No. PCT/US2013/043618 dated Sep. 25, 2013. |
International Search Report and Written Opinion for Application No. PCT/US2013/043619 dated Sep. 26, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/554,776 dated Apr. 24, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/554,776 dated Jan. 12, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/713,410 dated Jul. 6, 2015. |
Notice of Allowance for Application No. 29/423,422 dated Nov. 19, 2013. |
Notice of Allowance for U.S. Appl. No. 29/423,422 dated Mar. 3, 2014. |
Notice of Allowance for U.S. Appl. No. 29/491,974 dated Aug. 4, 2015. |
Notice of Issuance for U.S. Appl. No. 201330248426.5 dated Nov. 19, 2013. |
Restriction Requirement for U.S. Appl. No. 13/554,776 dated Jun. 14, 2013. |
Restriction Requirement for U.S. Appl. No. 13/713,410 dated Feb. 26, 2015. |
Restriction Requirement for U.S. Appl. No. 13/713,410 dated Oct. 6, 2014. |
Restriction Requirement for U.S. Appl. No. 29/423,422 dated Sep. 30, 2013. |
Shchekin, Oleg et al., "Evolutionary new chip design targets lighting systems," Compound Semiconductor, Mar. 2007, vol. 13 No. 2, Institute of Physics Publishing and IOP Publishing Ltd. |
U.S. Appl. No. 13/557,776, filed Jul. 20, 2012. |
U.S. Appl. No. 13/713,410, filed Dec. 13, 2012. |
U.S. Appl. No. 29/491,974, filed May 27, 2014. |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
USD777122S1 (en) * | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD790487S1 (en) * | 2015-04-02 | 2017-06-27 | Genesis Photonics Inc. | Light emitting diode package substrate |
USD772181S1 (en) * | 2015-04-02 | 2016-11-22 | Genesis Photonics Inc. | Light emitting diode package substrate |
USD783547S1 (en) * | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
USD844183S1 (en) | 2016-08-19 | 2019-03-26 | Citizen Electronics Co., Ltd. | Light emitting diode |
TWD191441S (en) | 2016-09-29 | 2018-07-01 | 新世紀光電股份有限公司 | Light emitting diode package |
USD854195S1 (en) | 2016-09-29 | 2019-07-16 | Genesis Photonics Inc. | Light emitting diode package |
USD886751S1 (en) | 2016-09-29 | 2020-06-09 | Genesis Photonics Inc. | Light emitting diode module |
TWD188043S (en) | 2016-09-29 | 2018-01-21 | 新世紀光電股份有限公司 | Light emitting diode package |
USD825499S1 (en) | 2016-09-29 | 2018-08-14 | Genesis Photonics Inc. | Light emitting diode package |
USD843957S1 (en) | 2016-09-29 | 2019-03-26 | Genesis Photonics Inc. | Light emitting diode package |
TWD191442S (en) | 2016-09-29 | 2018-07-01 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD194240S (en) | 2017-03-16 | 2018-11-21 | 新世紀光電股份有限公司 | Portion of led package |
TWD193991S (en) | 2017-06-30 | 2018-11-11 | 新世紀光電股份有限公司 | Light emitting diode package |
TWD193987S (en) | 2017-06-30 | 2018-11-11 | 新世紀光電股份有限公司 | Light emitting diode package |
USD844576S1 (en) | 2017-07-25 | 2019-04-02 | Citizen Electronics Co., Ltd. | Light emitting diode |
USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
USD996377S1 (en) * | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
USD1036711S1 (en) | 2022-02-17 | 2024-07-23 | Creeled, Inc. | Light-emitting diode package |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD749051S1 (en) | Light emitting diode (LED) package | |
USD709464S1 (en) | Light emitting diode (LED) package | |
USD702866S1 (en) | Light-emitting diode (LED) floodlight | |
USD841225S1 (en) | LED candle light | |
USD708156S1 (en) | Package for light emitting diode (LED) lighting | |
USD747528S1 (en) | LED light | |
USD662900S1 (en) | Heatsink for LED | |
USD648686S1 (en) | Light emitting diode (LED) package | |
USD736725S1 (en) | Light emitting device component | |
USD743586S1 (en) | LED light bulb | |
USD694463S1 (en) | Light fixture | |
USD704358S1 (en) | High brightness LED package | |
USD687980S1 (en) | LED light | |
USD689350S1 (en) | Cutting board | |
USD746240S1 (en) | LED package | |
USD710810S1 (en) | Light emitting diode | |
USD738832S1 (en) | Light emitting diode (LED) package | |
USD704154S1 (en) | Light emitter package | |
USD751228S1 (en) | LED night-light | |
CA153356S (en) | Led (light emitting diode) projection fixture | |
USD647222S1 (en) | Lamp | |
USD751229S1 (en) | LED night-light | |
USD691569S1 (en) | LED chip | |
USD699886S1 (en) | LED light fixture | |
USD774685S1 (en) | Cover for a light emitting diode strip |