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USD665367S1 - Package carrier - Google Patents

Package carrier Download PDF

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Publication number
USD665367S1
USD665367S1 US29/399,348 US201129399348F USD665367S US D665367 S1 USD665367 S1 US D665367S1 US 201129399348 F US201129399348 F US 201129399348F US D665367 S USD665367 S US D665367S
Authority
US
United States
Prior art keywords
package carrier
view
package
carrier
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/399,348
Inventor
Tsung-Kang Ying
Li-Chuan Chen
Tzu-Chieh Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silitek Electronic Guangzhou Co Ltd, Lite On Technology Corp filed Critical Silitek Electronic Guangzhou Co Ltd
Priority to US29/399,348 priority Critical patent/USD665367S1/en
Assigned to LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. reassignment LITE-ON TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, LI-CHUAN, LIN, TZU-CHIEH, YING, TSUNG-KANG
Application granted granted Critical
Publication of USD665367S1 publication Critical patent/USD665367S1/en
Assigned to LITE-ON ELECTRONICS (GUANGZHOU) LIMITED reassignment LITE-ON ELECTRONICS (GUANGZHOU) LIMITED CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a “package carrier” showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view viewed from another visual angle.
The dashed lines in the drawings are for illustrative purpose only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a “package carrier, ” as shown and described.
US29/399,348 2011-08-12 2011-08-12 Package carrier Active USD665367S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/399,348 USD665367S1 (en) 2011-08-12 2011-08-12 Package carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/399,348 USD665367S1 (en) 2011-08-12 2011-08-12 Package carrier

Publications (1)

Publication Number Publication Date
USD665367S1 true USD665367S1 (en) 2012-08-14

Family

ID=46613859

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/399,348 Active USD665367S1 (en) 2011-08-12 2011-08-12 Package carrier

Country Status (1)

Country Link
US (1) USD665367S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040232435A1 (en) * 2003-02-28 2004-11-25 Osram Opto Semiconductors Gmbh Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
US20070269927A1 (en) * 2003-02-28 2007-11-22 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
US20090283781A1 (en) * 2008-05-16 2009-11-19 Cree Hong Kong Limited Mini V SMD
USD606950S1 (en) * 2009-04-10 2009-12-29 Kabushiki Kaisha Toshiba Light-emitting diode
USD607421S1 (en) * 2008-05-27 2010-01-05 Alti-Electronics Co., Ltd Light emitting diode
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
USD622232S1 (en) * 2009-10-26 2010-08-24 Foxsemicon Integrated Technology, Inc. Light emitting diode
US20100213502A1 (en) * 2009-02-24 2010-08-26 Tsutomu Kashiwagi Optical semiconductor device encapsulated with silicone resin
US20100308352A1 (en) * 2009-06-09 2010-12-09 Advanced-Connectek Inc. Carrier structure for mounting led chips
US20100307799A1 (en) * 2009-06-06 2010-12-09 Chiang Cheng-Feng Carrier Structure for Electronic Components and Fabrication Method of the same
US7855392B2 (en) * 2007-12-03 2010-12-21 Lite-On Technology Corp. Optoelectronic semiconductor component capable of centralizing emitted light
US7888689B2 (en) * 2006-05-18 2011-02-15 Samsung Led Co., Ltd. Light emitting package and light emitting package array
USD651183S1 (en) * 2010-02-01 2011-12-27 Foxsemicon Integrated Technology, Inc. Light-emitting diode
US8089075B2 (en) * 2009-04-17 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LFCC package with a reflector cup surrounded by a single encapsulant
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070269927A1 (en) * 2003-02-28 2007-11-22 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
US20040232435A1 (en) * 2003-02-28 2004-11-25 Osram Opto Semiconductors Gmbh Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US7888689B2 (en) * 2006-05-18 2011-02-15 Samsung Led Co., Ltd. Light emitting package and light emitting package array
US7855392B2 (en) * 2007-12-03 2010-12-21 Lite-On Technology Corp. Optoelectronic semiconductor component capable of centralizing emitted light
US20090283781A1 (en) * 2008-05-16 2009-11-19 Cree Hong Kong Limited Mini V SMD
USD607421S1 (en) * 2008-05-27 2010-01-05 Alti-Electronics Co., Ltd Light emitting diode
US20100213502A1 (en) * 2009-02-24 2010-08-26 Tsutomu Kashiwagi Optical semiconductor device encapsulated with silicone resin
USD606950S1 (en) * 2009-04-10 2009-12-29 Kabushiki Kaisha Toshiba Light-emitting diode
US8089075B2 (en) * 2009-04-17 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LFCC package with a reflector cup surrounded by a single encapsulant
US20100307799A1 (en) * 2009-06-06 2010-12-09 Chiang Cheng-Feng Carrier Structure for Electronic Components and Fabrication Method of the same
US20100308352A1 (en) * 2009-06-09 2010-12-09 Advanced-Connectek Inc. Carrier structure for mounting led chips
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
USD622232S1 (en) * 2009-10-26 2010-08-24 Foxsemicon Integrated Technology, Inc. Light emitting diode
USD651183S1 (en) * 2010-02-01 2011-12-27 Foxsemicon Integrated Technology, Inc. Light-emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element

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