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USD1034575S1 - Chip imaging module array - Google Patents

Chip imaging module array Download PDF

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Publication number
USD1034575S1
USD1034575S1 US29/719,195 US202029719195F USD1034575S US D1034575 S1 USD1034575 S1 US D1034575S1 US 202029719195 F US202029719195 F US 202029719195F US D1034575 S USD1034575 S US D1034575S
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Prior art keywords
imaging module
module array
chip imaging
view
chip
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US29/719,195
Inventor
William W. Hunter
Scot B. Herbst
Jonathan D. Isom
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Pattern Bioscience Inc
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Pattern Bioscience Inc
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Priority to US29/719,195 priority Critical patent/USD1034575S1/en
Assigned to PATTERN BIOSCIENCE, INC. reassignment PATTERN BIOSCIENCE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISOM, JONATHAN D., HERBST, SCOT B., Hunter, William W.
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Description

FIG. 1 is a front perspective view of an array of stacked imaging modules that includes a first embodiment of my design, each of the imaging modules including, at its front, a currently unclaimed door that slidable outward to permit the imaging module's receipt of one or more microfluidic chips.
FIG. 2 is a top view of the first embodiment.
FIG. 3 is a bottom view of the first embodiment.
FIG. 4 is a front view of the first embodiment.
FIG. 5 is a rear view of the first embodiment.
FIG. 6 is a right side view of the first embodiment, which is a mirror image of a left side view of the first embodiment.
The first embodiment extends to—but does not include—the dash dot boundary lines drawn around the chip imaging modules at their fronts.
FIG. 7 is a front perspective view of an array of side-by-side imaging modules that includes a second embodiment of my design, each of the imaging modules including, at its front, a currently unclaimed door that slidable outward to permit the imaging module's receipt of one or more microfluidic chips.
FIG. 8 is a top view of the first embodiment.
FIG. 9 is a bottom view of the first embodiment.
FIG. 10 is a front view of the first embodiment.
FIG. 11 is a rear view of the first embodiment; and,
FIG. 12 is a right side view of the first embodiment, which is a mirror image of a left side view of the first embodiment.
The second embodiment extends to—but does not include—the dash dot boundary lines drawn around the chip imaging modules at their fronts.
The evenly-spaced broken lines in the figures depict features of the chip imaging modules that form no part of the claimed design. The unevenly-spaced broken lines in the figures depict boundaries of the claimed design and form no part thereof. Surface shading in the figures is provided solely to indicate contour. Any surfaces of portion of my chip imaging module array not shown in the figure or otherwise described in the specification form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a chip imaging module array, as shown and described.
US29/719,195 2020-01-01 2020-01-01 Chip imaging module array Active USD1034575S1 (en)

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USD349889S (en) * 1992-12-07 1994-08-23 BlackCurrant Technology Automatic data backup unit
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US5515239A (en) * 1994-02-18 1996-05-07 Quantum Corporation Stackable modular storage tower
USD368256S (en) * 1994-07-28 1996-03-26 Polaroid Corporation Scanner for use with a computer
USD365333S (en) * 1994-08-18 1995-12-19 Quantum Corporation Stackable modular storage tower assembly of selectable height
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