US7790579B2 - Semiconductor storage device, semiconductor device, and manufacturing method therefor - Google Patents
Semiconductor storage device, semiconductor device, and manufacturing method therefor Download PDFInfo
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- US7790579B2 US7790579B2 US11/398,534 US39853406A US7790579B2 US 7790579 B2 US7790579 B2 US 7790579B2 US 39853406 A US39853406 A US 39853406A US 7790579 B2 US7790579 B2 US 7790579B2
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000003860 storage Methods 0.000 title description 5
- 230000007547 defect Effects 0.000 claims abstract description 21
- 230000004888 barrier function Effects 0.000 claims abstract description 9
- 238000005247 gettering Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000002161 passivation Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 abstract description 3
- 239000000356 contaminant Substances 0.000 description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 10
- 229910001431 copper ion Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000015654 memory Effects 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000792 Monel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/12042—LASER
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the present invention relates to a semiconductor device, and particularly to a thin-film semiconductor chip.
- Thin chips are also used in the fabrication of an SiP (System in Package) or an MCP (Multi Chip Package), for which a plurality of semiconductor chips are mounted, at high density and in multiple layers, in a single package.
- SiP System in Package
- MCP Multi Chip Package
- a diffusion layer and an electrode are formed on the top surface of a silicon substrate, and while the bottom surface is ground using a grindstone, a crystal defect layer is introduced. Titanium, Monel and silver are deposited, in the named order, on the bottom surface, to form the crystal defect layer and obtain an ohmic electrode.
- an ohmic electrode is obtained by using a grindstone having a large grain size to intentionally introduce a crystal defect.
- a semiconductor chip is sealed using a resin, and is attached, at its bottom surface, to an assembly board.
- a crystal defect layer is deposited on the bottom surface of the semiconductor chip, an ionized contaminant from the assembly board can be prevented from entering the semiconductor chip through its bottom surface.
- a contaminant that has passed through the resin can not be prevented from entering the semiconductor chip at a side surface.
- a defect layer for gettering a contaminant is formed on the side surfaces of a semiconductor chip.
- a defect layer for gettering a contaminant is formed on the bottom surface and the side surfaces of a semiconductor chip.
- the defect layer is at least deposited on the side surfaces of the semiconductor chip, a contaminant passed through an assembly apparatus or another member can be prevented from entering the semiconductor chip at its side surfaces, or at the bottom and the side surfaces, of the chip.
- a semiconductor chip can be protected from a contaminant, such as metal ions, during the assembly processing.
- FIG. 1 is a diagram showing a semiconductor chip according to a first embodiment of the present invention
- FIGS. 2A and 2B are diagrams showing a method for manufacturing a package that employs the semiconductor chip of the first embodiment
- FIG. 3 is a diagram showing the continuation of the manufacturing method shown in FIG. 2 ;
- FIG. 4 is a diagram showing a modification of the first embodiment.
- FIG. 5 is a diagram showing a semiconductor device according to a second embodiment of the present invention.
- FIG. 1 is a diagram showing a semiconductor chip according to a first embodiment of the present invention.
- a crystal defect layer 2 for gettering a contaminant of metal ions, such as copper ions, is deposited on the side and the bottom surfaces of a semiconductor chip 1 .
- the presence of the crystal defect layer 2 prevents a contaminant from entering the semiconductor chip 1 through its side surfaces and its bottom surface.
- FIGS. 2A , 2 B and 3 are diagrams showing a method for manufacturing a semiconductor device according to the present invention. The manufacturing method will now be explained.
- a diffusion layer, a source and gate electrodes and a circuit which are components of a nonvolatile memory cell, are deposited on the top surface of an 800 ⁇ m thick semiconductor substrate 3 made, for example, of silicon.
- a passivation film 4 made of SiN or SiON, for example, is deposited on the top surface of the resultant substrate 3 . Since a fine nitride film is employed as the passivation film 4 , a heavy element, such as a copper ion, can not pass through it.
- the bottom surface of the semiconductor substrate 3 is mechanically ground, using a grindstone, until the thickness thereof is, for example, 110 to 120 ⁇ m.
- a grindstone should be selected that has a grain size large enough to form a crystal defect layer 2 on the bottom surface of the semiconductor substrate 3 .
- the crystal defect layer 2 is a gettering layer for capturing a contaminant, such as a copper ion.
- the semiconductor substrate 3 is cut, using a blade cutter or a laser cutter, to separate the semiconductor chip 1 , and the side surfaces of the chip are ground, using the grindstone, to obtain the crystal defect layer 2 for the side surfaces (see FIG. 2B ). It should be noted that so long as a defect layer that can capture a contaminant has already been obtained for the side surfaces of the semiconductor chip 1 when the semiconductor substrate 3 is cut using the blade cutter, the mechanical grinding process may not be performed.
- a blade used for grinding the bottom surface and a blade used for cutting out the semiconductor chip 1 may have the same sharpness, and a blade #2000, for example, is employed. In this case, the side and the bottom surfaces have about the same roughness. This processing is employed to manufacture the semiconductor chip 1 .
- the semiconductor chip 1 is mounted on the top surface of an assembly board 6 using mounting tape 11 . Then, a pad 8 on the semiconductor chip 1 and a pad 9 on the assembly board 6 are electrically connected by a wire 10 . And thereafter, a sealing resin 5 is applied to seal the semiconductor chip 1 . Finally, soldering balls 7 are attached to the bottom surface of the assembly board 6 . This processing is employed to obtain a BGA (Ball Grid Array) package.
- BGA All Grid Array
- the assembly board 6 is a printed board fabricated by gluing a copper foil to an insulating plate composed of a non-conductive material.
- the printed wiring for the assembly board 6 is then formed by patterning the copper foil.
- a solder resist coating is applied to all portions of the top surface of the printed board 6 other than the printed wiring to which the wire 10 is soldered. Since copper is diffused in the solder resist, the copper ions in the solder resist are diffused during the assembly process shown in FIGS. 2 and 3 . According to the invention, however, since the crystal defect layer 2 has been deposited on the bottom surface of the semiconductor chip 1 , the copper ions are captured by the crystal defect layer 2 and are prevented from entering the semiconductor chip 1 .
- the copper ions are diffused throughout the sealing resin 5 and reach the side surfaces of the semiconductor chip 1 , they are absorbed by the defect layer deposited on the side surfaces of the semiconductor chip 1 and are prevented from entering the semiconductor chip 1 . Further, since the passivation film 4 has been formed on the top surface of the semiconductor chip 1 , the entry of copper ions through the top surface can also be prevented.
- An example charge storage memory can be a flash memory or a DRAM memory.
- FIG. 4 is a diagram showing a modification of the first embodiment wherein semiconductor chips of the invention are laminated to constitute an MCP (a Multi Chip Package).
- This package is an assembly composed of semiconductor chips, such as a flash memory, an SRAM and a DRAM.
- a semiconductor chip 1 for example, is a flash memory, and a semiconductor chip 12 is a DRAM. It should be noted that mounting tape 11 is not shown in FIG. 4 .
- FIG. 5 is a diagram showing a semiconductor device according to a second embodiment of the present invention.
- a semiconductor chip 1 is mounted on an assembly board 6 using a mounting member 12 that contains silver, so that the entire bottom surface of the semiconductor chip 1 is covered with the mounting member 12 .
- a Schottky barrier is formed between the entire bottom surface of a semiconductor device 3 and the mounting member 12 . And since copper ions are very heavy, so long as the Schottky barrier is present, copper ions from the assembly board 6 can not pass the barrier and enter the semiconductor chip 1 .
- a manufacturing method used to produce this semiconductor device is as follows.
- the semiconductor chip 1 is securely mounted on the assembly board 6 by using the silver-containing mounting member 12 , so that the entire bottom surface of the chip 1 is covered with the mounting member 12 . Since the other processes are the same as those in FIGS. 2 and 3 , no further explanation for them will be given.
- a semiconductor device employing both the first and the second embodiments can also be provided. That is, a semiconductor device is also available wherein a crystal defect layer is deposited on the bottom surface of the semiconductor chip shown in FIG. 5 , and the Schottky barrier is positioned between the defect layer and the assembly board. Furthermore, although in the second embodiment a mounting member containing silver is employed to form the Schottky barrier, so long as a Schottky barrier can be formed, another metal may be employed.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Semiconductor Memories (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/398,534 US7790579B2 (en) | 2004-03-12 | 2006-04-06 | Semiconductor storage device, semiconductor device, and manufacturing method therefor |
US11/956,358 US8039940B2 (en) | 2004-03-12 | 2007-12-14 | Semiconductor storage device, semiconductor device, and manufacturing method therefor |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-070537 | 2004-03-12 | ||
JP2004070537A JP4885426B2 (en) | 2004-03-12 | 2004-03-12 | Semiconductor memory device, semiconductor device and manufacturing method thereof |
US11/078,447 US7327019B2 (en) | 2004-03-12 | 2005-03-14 | Semiconductor device of a charge storage type |
US11/398,534 US7790579B2 (en) | 2004-03-12 | 2006-04-06 | Semiconductor storage device, semiconductor device, and manufacturing method therefor |
Related Parent Applications (1)
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US11/078,447 Division US7327019B2 (en) | 2004-03-12 | 2005-03-14 | Semiconductor device of a charge storage type |
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US11/956,358 Continuation US8039940B2 (en) | 2004-03-12 | 2007-12-14 | Semiconductor storage device, semiconductor device, and manufacturing method therefor |
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US20060180891A1 US20060180891A1 (en) | 2006-08-17 |
US7790579B2 true US7790579B2 (en) | 2010-09-07 |
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US11/398,534 Active 2025-10-19 US7790579B2 (en) | 2004-03-12 | 2006-04-06 | Semiconductor storage device, semiconductor device, and manufacturing method therefor |
US11/956,358 Active 2025-04-30 US8039940B2 (en) | 2004-03-12 | 2007-12-14 | Semiconductor storage device, semiconductor device, and manufacturing method therefor |
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CN (1) | CN1667809A (en) |
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JP4759948B2 (en) * | 2004-07-28 | 2011-08-31 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
KR20110050208A (en) * | 2009-11-06 | 2011-05-13 | 삼성전자주식회사 | Stack type semiconductor device having different backside structure chips and electronic apparatus including the same |
JP5968713B2 (en) * | 2012-07-30 | 2016-08-10 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
DE102013105729A1 (en) * | 2013-06-04 | 2014-12-04 | Infineon Technologies Ag | Chip card module and method for producing a chip card module |
WO2024135670A1 (en) * | 2022-12-20 | 2024-06-27 | 先端システム技術研究組合 | Semiconductor module |
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Also Published As
Publication number | Publication date |
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US8039940B2 (en) | 2011-10-18 |
CN1667809A (en) | 2005-09-14 |
US20050218490A1 (en) | 2005-10-06 |
US7327019B2 (en) | 2008-02-05 |
US20060180891A1 (en) | 2006-08-17 |
JP2005260042A (en) | 2005-09-22 |
US20080099883A1 (en) | 2008-05-01 |
JP4885426B2 (en) | 2012-02-29 |
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