US5064511A - Electrochemical graining of aluminum or aluminum alloy surfaces - Google Patents
Electrochemical graining of aluminum or aluminum alloy surfaces Download PDFInfo
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- US5064511A US5064511A US07/527,904 US52790490A US5064511A US 5064511 A US5064511 A US 5064511A US 52790490 A US52790490 A US 52790490A US 5064511 A US5064511 A US 5064511A
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- dicarboxylic acid
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 25
- 229910000838 Al alloy Inorganic materials 0.000 title claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000003792 electrolyte Substances 0.000 claims abstract description 31
- 239000002253 acid Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 22
- 235000014655 lactic acid Nutrition 0.000 claims abstract description 14
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract 25
- 239000011248 coating agent Substances 0.000 claims abstract 3
- 238000000576 coating method Methods 0.000 claims abstract 3
- 239000007864 aqueous solution Substances 0.000 claims description 22
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical class C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- 235000015165 citric acid Nutrition 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 238000007788 roughening Methods 0.000 claims description 10
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 7
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 7
- 150000003639 trimesic acids Chemical class 0.000 claims description 7
- 238000002048 anodisation reaction Methods 0.000 claims description 5
- WZHCOOQXZCIUNC-UHFFFAOYSA-N cyclandelate Chemical compound C1C(C)(C)CC(C)CC1OC(=O)C(O)C1=CC=CC=C1 WZHCOOQXZCIUNC-UHFFFAOYSA-N 0.000 claims description 5
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 238000007743 anodising Methods 0.000 claims 2
- 150000002913 oxalic acids Chemical class 0.000 claims 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 abstract description 17
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 abstract description 12
- 238000007639 printing Methods 0.000 abstract description 10
- 239000004310 lactic acid Substances 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 abstract 1
- 235000011044 succinic acid Nutrition 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 235000011167 hydrochloric acid Nutrition 0.000 description 6
- 239000001384 succinic acid Substances 0.000 description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical class OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229940021013 electrolyte solution Drugs 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003444 succinic acids Chemical class 0.000 description 2
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- PYRZPBDTPRQYKG-UHFFFAOYSA-N cyclopentene-1-carboxylic acid Chemical compound OC(=O)C1=CCCC1 PYRZPBDTPRQYKG-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Definitions
- the present invention relates to the techniques of graining an aluminum surface by using alternate current and suitable electrolytes for preparing printing matrixes.
- such technique consists of roughening the metal surface, so as to condition it, on the one hand, for retaining the photosensitive layer which will thus better adhere to the substrate during the printing stage, and on the other hand, for retaining water in the non-printing areas.
- the principle of the offset printing is based on the chemical-physical equilibrium between hydrophilic and hydrophobic parts and the basis of such equilibrium is established by a good technique of roughening the metal substrate surface.
- a “good roughening technique” is meant a technique capable of uniformly acting on the aluminum surface, so as to create a series of holes evenly spaced apart one from the other, having a frequency per unit surface as high as possible, and depths as homogeneous as possible.
- the reason of these requirements resides in the fact that the higher is the frequency of the holes produced by graining, the higher will be the adhesion of the photosensitive layer on the metal and thus the number of copies which the printing plate will be capable of producing. Moreover, for the same reason the higher will be the wettability with water of the nonprinting areas.
- Another very important parameter, at the same frequency of number of holes produced per unit surface, consists of the average depth of the same.
- the manufacturers of printing plates try to reach a compromise between shallow holes which produce the so called fine grain, allow for a better reproduction of the image to be printed, require minor amounts of water, but which at the same time loose more easily the veil of absorbed water with the risk of forming the so called ink veil, and deep holes which produce the so called coarse grain and which, if on the one hand do not allow for the same good reproduction as the fine grain, allow for a greater wettability of the non-printing areas and, at the end, for a greater reliability for the printer.
- the depth of the holes produced in the graining stage is measured with an apparatus called "roughness-meter” (profilemeter) having a very sensitive tip which is passed on the coarsened surface.
- the signal recorded by this tip is electronically amplified and gives a measure of the hole depth.
- Ra average roughness
- Ra is normally measured in microns (micro-meters).
- the above disclosed coarsening effect can be obtained with a simple aqueous solution of hydrochloric acid (HCl) with concentrations ranging from 3g/1 to 15g/1, by passing alternate current between the aluminum plate and a counter-electrode thereof at a current density of 2 to 5 Ampere/sq.dm for 30" to 120".
- HCl hydrochloric acid
- the grain thus obtained is more satisfactory, can be better controlled in view of obtaining increasing values on Ra scale, and is more homogeneous than that produced through previously known techniques, however the electrolytes involved smell disagreeably and are thus undesirable from a hygienic point of view.
- An object of the present invention is to provide aqueous electrolyte solutions which allow to obtain an even finer grading in the roughness values Ra than obtainable with the above mentioned known processes.
- an aqueous solution of electrolytes comprising hydrochloric acid in a concentration of 2.5 to 20 g/l and at least one acid selected from the group of oxy-acids, dicarboxylic acids and their derivatives, and mixtures thereof, in a concentration of 1 to 100 g/l.
- the oxy-acids comprise: glycolic, lactic, alpha-oxy-butyric, mandelic, glyceric, malic, tartaric, mesotartaric, citric acids.
- the dicarboxylic acids and their derivatives comprise: oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, terephthalic, hemimellitic, trimellitic, trimesic acids, and succinic, maleic and phthalic anhydride.
- a process of surface roughening or graining which comprises electrolytically treating aluminum plates in an aqueous solution of electrolytes, as mentioned above, by passing alternate current at a voltage of 5 to 42 Volts, preferably 10 to 30 Volts, and a current density of 1.5 to 10 Ampere/sq. dm, for a duration of 30" to 5' and with a distance between the plate and electrode ranging from 10 to 250 mm and at a temperature comprised between 10° and 40°, preferably between 15° and 30° C.
- a metal plate or matrix once a metal plate or matrix has been treated in accordance with the above disclosed process, it can be anodized in aqueous solutions containing sulfuric, phosphoric, oxalic or other acids, singularly or in various combinations one with the other, according to a technique already widely known, and can be coated with photosensitive layers, as is known to those skilled in the art.
- the Ra values have been determined by using a Taylor Hobson Subtronic 3P (Denmark) profilemeter (roughness-meter).
- the plate After its electrolytical treatment the plate, "grained" as specified above, can be subjected to an anodization process by passing direct current through a further aqueous electrolyte solution, such as of sulfuric acid, phosphoric acid, oxalic acid, or a mixture thereof.
- a further aqueous electrolyte solution such as of sulfuric acid, phosphoric acid, oxalic acid, or a mixture thereof.
- the so anodized plate can be coated with a photosensitive layer, as commonly practised in the field.
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- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Printing Plates And Materials Therefor (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Electrolytic Production Of Metals (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Aluminum or its alloys are electrochemically grained by using alternate current and an aqueous electrolyte comprising specific amounts of hydrochloric acid and an oxy-acid and/or a dicarboxylic acid, preferably lactic acid and/or succinic acid, respectively. Aluminum (or an alloy thereof) thus grained, can be coated with a photosensitive layer whereby forming a printing plate. Before coating it with the photosensitive layer, the plate can also be anodized by techniques well known to those skilled in the art.
Description
The present invention relates to the techniques of graining an aluminum surface by using alternate current and suitable electrolytes for preparing printing matrixes.
As is known, in the field of the aluminum surface treatment, better known as graining, such technique consists of roughening the metal surface, so as to condition it, on the one hand, for retaining the photosensitive layer which will thus better adhere to the substrate during the printing stage, and on the other hand, for retaining water in the non-printing areas. The principle of the offset printing is based on the chemical-physical equilibrium between hydrophilic and hydrophobic parts and the basis of such equilibrium is established by a good technique of roughening the metal substrate surface.
By a "good roughening technique" is meant a technique capable of uniformly acting on the aluminum surface, so as to create a series of holes evenly spaced apart one from the other, having a frequency per unit surface as high as possible, and depths as homogeneous as possible. The reason of these requirements resides in the fact that the higher is the frequency of the holes produced by graining, the higher will be the adhesion of the photosensitive layer on the metal and thus the number of copies which the printing plate will be capable of producing. Moreover, for the same reason the higher will be the wettability with water of the nonprinting areas.
This will obviously contribute in the utmost manner to the separation of the lipophilic portion, i.e. printing portion, and hydrophilic non-printing portion. This because during the printing stage the ink will be fixed on the lipophilic areas which, as said, form the photosensitive layer.
Another very important parameter, at the same frequency of number of holes produced per unit surface, consists of the average depth of the same. In this respect it is to be stated that the manufacturers of printing plates try to reach a compromise between shallow holes which produce the so called fine grain, allow for a better reproduction of the image to be printed, require minor amounts of water, but which at the same time loose more easily the veil of absorbed water with the risk of forming the so called ink veil, and deep holes which produce the so called coarse grain and which, if on the one hand do not allow for the same good reproduction as the fine grain, allow for a greater wettability of the non-printing areas and, at the end, for a greater reliability for the printer.
The depth of the holes produced in the graining stage is measured with an apparatus called "roughness-meter" (profilemeter) having a very sensitive tip which is passed on the coarsened surface. The signal recorded by this tip is electronically amplified and gives a measure of the hole depth.
The most widely used value for the roughness measurement is Ra (average roughness) which indicates the average of the distances of the surface profile above and below a reference line defined as a line so drawn that the sum of the areas encompassed by the surface profile above the line is equal to the sum of those below the line.
Ra is normally measured in microns (micro-meters).
Now, as is known to those skilled in the art, the above disclosed coarsening effect, better known as graining, can be obtained with a simple aqueous solution of hydrochloric acid (HCl) with concentrations ranging from 3g/1 to 15g/1, by passing alternate current between the aluminum plate and a counter-electrode thereof at a current density of 2 to 5 Ampere/sq.dm for 30" to 120".
Actually, by varying the various cited parameters it is lo possible to obtain with this system a variation of the depth of the graining holes, but in order to obtain an acceptable homogeneity of the surface it is necessary to monitor very carefully the concentration of the acid and of the dissolved aluminum which is present in chloride form. Besides, at the lower concentration limits of HCl the obtained grain is fine, but there are ample areas completely and inhomogeneously flat. At high concentrations, the coarsening homogeneity is greater, but there are great probabilities of metal "dust" being formed which is then difficult to remove.
Mixed electrolytes, such as HCl and phosphoric acid, give better results, in that a lower Ra value and higher homogeneity can be obtained, but they raise rather big problems of formation of black aluminum metal powder, just called "dust" in the field.
Another electrolyte used with good results is nitric acid which however presents serious problems of environment polution in so far as treatment of gaseous and liquid effluents is concerned.
Certain patents, see GB 1598701, cite instead electrolytes still comprising hydrochloric acid and also comprising monocarboxylic acids with 1 to 4 carbon atoms.
According to that patent the grain thus obtained is more satisfactory, can be better controlled in view of obtaining increasing values on Ra scale, and is more homogeneous than that produced through previously known techniques, however the electrolytes involved smell disagreeably and are thus undesirable from a hygienic point of view.
An object of the present invention is to provide aqueous electrolyte solutions which allow to obtain an even finer grading in the roughness values Ra than obtainable with the above mentioned known processes.
A further object of this invention is to provide aqueous solutions of electrolytes based on compounds which are generally in powder form and are far less polluting, at least from the point of view of their smell, than are the solutions of carboxylic acids.
According to a first feature of this invention an aqueous solution of electrolytes is provided comprising hydrochloric acid in a concentration of 2.5 to 20 g/l and at least one acid selected from the group of oxy-acids, dicarboxylic acids and their derivatives, and mixtures thereof, in a concentration of 1 to 100 g/l.
Advantageously the oxy-acids comprise: glycolic, lactic, alpha-oxy-butyric, mandelic, glyceric, malic, tartaric, mesotartaric, citric acids.
The dicarboxylic acids and their derivatives comprise: oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, terephthalic, hemimellitic, trimellitic, trimesic acids, and succinic, maleic and phthalic anhydride.
According to another feature of this invention a process of surface roughening or graining is provided which comprises electrolytically treating aluminum plates in an aqueous solution of electrolytes, as mentioned above, by passing alternate current at a voltage of 5 to 42 Volts, preferably 10 to 30 Volts, and a current density of 1.5 to 10 Ampere/sq. dm, for a duration of 30" to 5' and with a distance between the plate and electrode ranging from 10 to 250 mm and at a temperature comprised between 10° and 40°, preferably between 15° and 30° C.
Advantageously, once a metal plate or matrix has been treated in accordance with the above disclosed process, it can be anodized in aqueous solutions containing sulfuric, phosphoric, oxalic or other acids, singularly or in various combinations one with the other, according to a technique already widely known, and can be coated with photosensitive layers, as is known to those skilled in the art.
The invention is further illustrated by the following examples of practical embodiments thereof.
Two sheets each having a surface of 3 sq.dm, made of an aluminum alloy consisting of 99.52% aluminum, 0.11% silicium, 0.32% iron, 0.018% copper, 0.006% manganese, 0.001% chromium, 0.003% nickel, 0.005% zinc, 0.019 % titanium, were immersed in an aqueous solution comprising hydrochloric acid at a concentration of 10 g/l and citric acid at a concentration of 20 g/l. The distance between the two sheets was of 160 nm. Current has been applied for 2'with the following results.
______________________________________ SURFACE VOLT AMPERE/DMQ Ra (μ) APPEARANCE ______________________________________ 15 5,1 0,42 FINE, SUFFICIENTLY HOMOGENEOUS GRAIN 18 6,3 0,70 MEDIUM GRAIN, WELL-HOMOGENEOUS 21 7 0,85 SUFFICIENTLY COARSE AND HOMOGENEOUS GRAIN ______________________________________
Two sheets of aluminum alloy having the composition of Example1, were immersed in an aqueous solution comprising hydrochloric and glycolic acids, by placing them at a mutual distance of 200 mm, and were electrochemically grained for 1'45" with the following results:
______________________________________ CONCEN- AMPERE/ SURFACE TRATIONS VOLT DMQ Ra (μ) APPEARANCE ______________________________________ HCl 12 g/l 18 4,2 0,53 FINE AND Lactic acid HOMOGENEOUS 10 g/l GRAIN HCl 12 g/l 18 7,8 0,77 MEDIUM, VERY glycolic acid HOMOGENEOUS 20 g/l GRAIN HCl 12 g/l 20 9,1 0,92 COARSE, VERY glycolic acid HOMOGENEOUS 20 g/l GRAIN ______________________________________
Two sheets of aluminum alloy consisting of 97.98% aluminum, 0.30% silicium, 0.54% iron, 0.006% copper, 1.15% manganese, 0.002% magnesium, 0.003% chromium, 0.005% zinc, 0.009% titanium, were placed in an aqueous solution containing hydrochloric and lactic acids, at a mutual distance of 180 mm. Alternate current was passed for 2'3", with the following results:
______________________________________ CONCEN- AMPERE/ SURFACE TRATIONS VOLT DMQ Ra (μ) APPEARANCE ______________________________________ HCl 3,5 g/l 20 2,1 0,32 VERY FINE lactic acid GRAIN, FAIRLY 10 g/l HOMOGENEOUS HCl 3,5 g/l 20 2,7 0,55 FINE GRAIN, lactic acid WELL HOMO- 20 g/l GENEOUS HCl 10 g/l 20 6,5 0,63 MEDIUM GRAIN, lactic acid EXCEPTIO- 40 g/l NALLY HOMO- GENEOUS ______________________________________
Two sheets of aluminum of the same composition as in Example 3, were placed in an aqueous solution containing hydrochloric and succinic acids, at a mutual distance of 160 mm. Alternate current was passed for 2', with the following results:
______________________________________ CONCEN- AMPERE/ SURFACE TRATIONS VOLT DMQ Ra (μ) APPEARANCE ______________________________________ HCl 10 g/l 18 6,5 0,54 FAIRLY FINE Succinic acid GRAIN, VERY 10 g/l HOMOGENEOUS HCl 10 g/l 18 8,5 0,69 MEDIUM, VERY succinic acid HOMOGENEOUS 20 g/l GRAIN HCl 10 g/l 18 11,2 0,71 MEDIUM GRAIN, succinic acid EXCEPTIO- 40 g/l NALLY HOMO- GENEOUS ______________________________________
Two sheets of aluminum alloy consisting of 98.55% aluminum, 0.066% silicium, 0.67% iron, 0.070% copper, 0.004% manganese, 0.60% magnesium, 0.001% chromium, 0.004% nickel, 0.006% zinc, 0.024% titanium, were put in an aqueous solution containing hydrochloric, lactic and succinic acids, at a mutual distance of 200 mm. Alternative current was passed for 1'25", with the following results:
______________________________________ CONCEN- AMPERE/ SURFACE TRATIONS VOLT DMQ Ra (μ) APPEARANCE ______________________________________ HCl 12 g/l 21 5,3 0,51 ENOUGH FINE lactic acid AND HOMO- 10 g/l GENEOUS succinic acid 5 g/l HCl 12 g/l 21 7,4 0,67 MEDIUM, VERY lactic acid HOMOGENEOUS 10 g/l GRAIN succinic acid 10 g/l HCl 12 g/l 25 8,8 0,77 RATHER lactic acid COARSE GRAIN, 10 g/l VERY HOMO- succinic acid GENEOUS 10 g/l ______________________________________
In examples 1 to 5 the Ra values have been determined by using a Taylor Hobson Subtronic 3P (Denmark) profilemeter (roughness-meter).
After its electrolytical treatment the plate, "grained" as specified above, can be subjected to an anodization process by passing direct current through a further aqueous electrolyte solution, such as of sulfuric acid, phosphoric acid, oxalic acid, or a mixture thereof.
Finally the so anodized plate can be coated with a photosensitive layer, as commonly practised in the field.
Claims (24)
1. An electrolyte for electrolytically graining aluminum or aluminum alloys comprising an aqueous solution of hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least one further acid selected from at least an oxy-acid, at least a dicarboxylic acid or its derivatives, and their mixtures, at a concentration of 1 to 100 g/l, wherein said dicarboxylic acid is selected from the group comprising oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, hemimellitic, trimellitic and trimesic acids.
2. An electrolyte according to claim 1, wherein said oxy-acid is selected from the group comprising glycolic, lactic, alpha-oxy-butyric, mandelic, glyceric malic, tartaric, mesotartaric and citric acids.
3. An electrolyte according to claim 1, wherein said oxy-acid is selected from the group comprising glycolic, lactic and citric acids.
4. An electrolyte for electrolytically graining aluminum or aluminum alloys comprising an aqueous solution of hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least one further acid selected from at least an oxy-acid, at least a dicarboxylic acid or its derivatives, and their mixtures, at a concentration of 1 to 100 g/l, wherein said derivative of a dicarboxylic acid is selected from the group comprising succinic, maleic and phthalic anhydrides.
5. An electrolyte according to claim 4, wherein said oxy-acid is selected from the group comprising glycolic, lactic, alpha-oxy-butyric, mandelic, glyceric, malic, tartaric, mesotartaric and citric acids.
6. An electrolyte according to claim 4, wherein said oxy-acid is selected from the group comprising glycolic, lactic and citric acids.
7. An electrolyte for electrolytically graining aluminum or aluminum alloys comprising an aqueous solution of hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least an oxy-acid and a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said dicarboxylic acid is selected from the group comprising oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, hemimellitic, trimellitic and trimesic acids.
8. An electrolyte according to claim 7, wherein said oxy-acid is selected from the group comprising glycolic, lactic, alpha-oxy-butyric, mandelic, glyceric, malic, tartaric, mesotartaric and citric acids.
9. An electrolyte according to claim 7, wherein said oxy-acid is selected from the group comprising glycolic, lactic and citric acids.
10. An electrolyte for electrolytically graining aluminum or aluminum alloys comprising an aqueous solution of hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least an oxy-acid and a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said derivative of a dicarboxylic acid is selected from the group comprising succinic, maleic and phthalic anhydrides.
11. An electrolyte according to claim 10, wherein said oxy-acid is selected from the group comprising glycolic, lactic, alpha-oxy-butyric, mandelic, glyceric, malic, tartaric, mesotartaric and citric acids.
12. An electrolyte according to claim 10, wherein said oxy-acid is selected from the group comprising glycolic, lactic and citric acids.
13. An electrolyte for electrolytically graining aluminum for aluminum alloys comprising an aqueous solution of hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said dicarboxylic acid is selected from the group comprising oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, hemimellitic, trimellitic and trimesic acids.
14. An electrolyte for electrolytically graining aluminum or aluminum alloys comprising an aqueous solution of hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said derivative of a dicarboxylic acid is selected from the group comprising succinic, maleic and phthalic anhydrides.
15. A process of surface roughening or graining comprising electrolytically treating one or more aluminum plates in an aqueous solution of electrolytes, said solution comprising hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least one further acid selected from at least an oxy-acid, at least a dicarboxylic acid or its derivatives, and their mixtures, at a concentration of 1 to 100 d/l, wherein said dicarboxylic acid is selected from the group comprising oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, hemimellitic, trimellitic and trimesic acids, said treating being carried out by applying alternate current at a voltage of 5 to 42 volts, preferably 10 to 30 volts, at a current density of 1.5 to 10 Ampere/sq. dm for a duration ranging from 30" to 5', and at a temperature ranging from 10° to 40° C., preferably from 15° to electrode ranging from 10 to 250 mm.
16. A process according to claim 15, comprising a stage of anodization of the grained plate comprising immersing the plate in an anodizing bath comprising an anodization electrolyte selected from sulfuric, phosphoric, oxalic acids, and a mixture thereof, and passing direct current through the bath.
17. A process according to claim 16, comprising a stage of coating the anodized plate with at least a photosensitive layer.
18. A process of surface roughening or graining comprising electrolytically treating one or more aluminum plates in an aqueous solution of electrolytes, said solution comprising hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least one further acid selected from at least an oxy-acid, at least a dicarboxylic acid or its derivatives, and their mixtures, at a concentration of 1 to 100 g/l, wherein said derivative of a dicarboxylic acid is selected from the group comprising succinic, maleic and phthalic anhydrides, said treating being carried out by applying alternate current at a voltage of 5 to 42 volts, preferably 10 to 30 volts, at a current density of 1.5 to 10 Ampere/sq. dm for a duration ranging from 30" to 5', and at a temperature ranging from 10° to 40° C., preferably from 15° to 30°, the distance between the plate and a respective electrode ranging from 10 to 250 mm.
19. A process according to claim 18, comprising a stage of anodization of the grained plate comprising immersing the plate in an anodizing bath comprising an anodization electrolyte selected from sulfuric, phosphoric, oxalic acids, and a mixture thereof, and passing direct current through the bath.
20. A process according to claim 19, comprising a stage of coating the anodized plate with at least a photosensitive layer.
21. A process of surface roughening or graining comprising electrolytically treating one or more aluminum plates in an aqueous solution of electrolytes, said solution comprising hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least an oxy-acid and a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said dicarboxylic acid is selected from the group comprising oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, hemimellitic, trimellitic and trimesic acids, said treating being carried out by applying alternate current at a voltage of 5 to 42 volts, preferably 10 to 30 volts, at a current density of 1.5 to 10 Ampere/sq. dm for a duration ranging from 30" to 5', and at a temperature ranging from 10° to 40° C., preferably from 15° to 30°, the distance between the plate and a respective electrode ranging from 10 to 250 mm.
22. A process of surface roughening or graining comprising electrolytically treating one or more aluminum plates in an aqueous solution of electrolytes, said solution comprising hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least an oxy-acid and a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said derivative of a dicarboxylic acid is selected from the group comprising succinic, maleic and phthalic anhydrides, said treating being carried out by applying alternate current at a voltage of 5 to 42 volts, preferably 10 to 30 volts, at a current density of 1.5 to 10 Ampere/sq. dm for a duration ranging from 30" to 5', and at a temperature ranging from 10° to 40° C., preferably from 15° to 30°, the distance between the plate and a respective electrode ranging from 10 to 250 mm.
23. A process of surface roughening or graining comprising electrolytically treating one or more aluminum plates in an aqueous solution of electrolytes, said solution comprising hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said dicarboxylic acid is selected from the group comprising oxalic, malonic, succinic, glutaric, adipic, pimelic, suberic, azelaic, sebacic, maleic, fumaric, phthalic, isophthalic, hemimellitic, trimellitic and trimesic acids, said treating being carried out by applying alternate current at a voltage of 5 to 42 volts, preferably 10 to 30 volts, at a current density of 1.5 to 10 Ampere/sq.dm for a duration ranging from 30" to 5', and at a temperature ranging from 10° to 40° C., preferably from 15° to 30°, the distance between the plate and a respective electrode ranging from 10 to 250 mm.
24. A process of surface roughening or graining comprising electrolytically treating one or more aluminum plates in an aqueous solution of electrolytes, said solution comprising hydrochloric acid in a concentration ranging from 2.5 to 20 g/l and at least a dicarboxylic acid or its derivatives at a concentration of 1 to 100 g/l, wherein said derivative of a dicarboxylic acid is selected from the group comprising succinic, maleic and phthalic anhydrides, said treating being carried out by applying alternate current at a voltage of 5 to 42 volts, preferably 10 to 30 volts, at a current density of 1.5 to 10 Ampere/sq. dm for a duration ranging from 30" to 5', and at a temperature ranging from 10° to 40° C., preferably from 15° to 30°, the distance between the plate and a respective electrode ranging from 10 to 250 mm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8984942A IT1235332B (en) | 1989-06-05 | 1989-06-05 | ELECTROCHEMICAL GRANITE OF ALUMINUM OR ALUMINUM ALLOY SURFACES |
IT84942A/89 | 1989-06-05 |
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US5064511A true US5064511A (en) | 1991-11-12 |
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US07/527,904 Expired - Fee Related US5064511A (en) | 1989-06-05 | 1990-05-24 | Electrochemical graining of aluminum or aluminum alloy surfaces |
Country Status (13)
Country | Link |
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US (1) | US5064511A (en) |
EP (1) | EP0401601B1 (en) |
JP (1) | JPH0324289A (en) |
KR (1) | KR910001093A (en) |
AT (1) | ATE114740T1 (en) |
AU (1) | AU5617690A (en) |
BR (1) | BR9002643A (en) |
CA (1) | CA2018180A1 (en) |
DD (1) | DD298364A5 (en) |
DE (1) | DE69014418T2 (en) |
HU (1) | HUT54316A (en) |
IT (1) | IT1235332B (en) |
ZA (1) | ZA904194B (en) |
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US5449448A (en) * | 1993-03-19 | 1995-09-12 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing anode foil for aluminium electrolytic capacitors |
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US20080003411A1 (en) * | 2006-06-29 | 2008-01-03 | Joseph Hunter | Aluminum lithographic substrate and method of making |
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- 1990-05-23 AT AT90109843T patent/ATE114740T1/en not_active IP Right Cessation
- 1990-05-23 EP EP90109843A patent/EP0401601B1/en not_active Expired - Lifetime
- 1990-05-23 DE DE69014418T patent/DE69014418T2/en not_active Expired - Fee Related
- 1990-05-24 US US07/527,904 patent/US5064511A/en not_active Expired - Fee Related
- 1990-05-31 AU AU56176/90A patent/AU5617690A/en not_active Abandoned
- 1990-06-01 DD DD90341254A patent/DD298364A5/en not_active IP Right Cessation
- 1990-06-01 ZA ZA904194A patent/ZA904194B/en unknown
- 1990-06-04 BR BR909002643A patent/BR9002643A/en not_active Application Discontinuation
- 1990-06-04 HU HU903321A patent/HUT54316A/en unknown
- 1990-06-04 KR KR1019900008213A patent/KR910001093A/en not_active Application Discontinuation
- 1990-06-04 CA CA002018180A patent/CA2018180A1/en not_active Abandoned
- 1990-06-05 JP JP2145525A patent/JPH0324289A/en active Pending
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US5449448A (en) * | 1993-03-19 | 1995-09-12 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing anode foil for aluminium electrolytic capacitors |
US7964085B1 (en) | 2002-11-25 | 2011-06-21 | Applied Materials, Inc. | Electrochemical removal of tantalum-containing materials |
US9068273B2 (en) | 2002-11-25 | 2015-06-30 | Quantum Global Technologies LLC | Electrochemical removal of tantalum-containing materials |
US7910218B2 (en) | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
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US20060105182A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Erosion resistant textured chamber surface |
US7579067B2 (en) | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
US8021743B2 (en) | 2004-11-24 | 2011-09-20 | Applied Materials, Inc. | Process chamber component with layered coating and method |
US20100086805A1 (en) * | 2004-11-24 | 2010-04-08 | Applied Materials, Inc. | Process chamber component with layered coating and method |
US9481608B2 (en) | 2005-07-13 | 2016-11-01 | Applied Materials, Inc. | Surface annealing of components for substrate processing chambers |
US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US7762114B2 (en) | 2005-09-09 | 2010-07-27 | Applied Materials, Inc. | Flow-formed chamber component having a textured surface |
US11658016B2 (en) | 2005-10-31 | 2023-05-23 | Applied Materials, Inc. | Shield for a substrate processing chamber |
US10347475B2 (en) | 2005-10-31 | 2019-07-09 | Applied Materials, Inc. | Holding assembly for substrate processing chamber |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
US8790499B2 (en) | 2005-11-25 | 2014-07-29 | Applied Materials, Inc. | Process kit components for titanium sputtering chamber |
US20090084683A1 (en) * | 2006-02-28 | 2009-04-02 | Agfa Graphics Nv | Method for making a lithographic printing plate support |
US20080003411A1 (en) * | 2006-06-29 | 2008-01-03 | Joseph Hunter | Aluminum lithographic substrate and method of making |
US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
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US11248281B2 (en) * | 2017-08-29 | 2022-02-15 | Nippon Light Metal Company, Ltd. | Aluminum member and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
DD298364A5 (en) | 1992-02-20 |
BR9002643A (en) | 1991-08-20 |
IT8984942A0 (en) | 1989-06-05 |
AU5617690A (en) | 1990-12-06 |
DE69014418T2 (en) | 1995-04-20 |
EP0401601B1 (en) | 1994-11-30 |
IT1235332B (en) | 1992-06-26 |
JPH0324289A (en) | 1991-02-01 |
HU903321D0 (en) | 1990-10-28 |
DE69014418D1 (en) | 1995-01-12 |
CA2018180A1 (en) | 1990-12-05 |
ZA904194B (en) | 1991-03-27 |
EP0401601A1 (en) | 1990-12-12 |
HUT54316A (en) | 1991-02-28 |
ATE114740T1 (en) | 1994-12-15 |
KR910001093A (en) | 1991-01-30 |
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