US4628227A - Mica-electrode laminations for the generation of ions in air - Google Patents
Mica-electrode laminations for the generation of ions in air Download PDFInfo
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- US4628227A US4628227A US06/479,547 US47954783A US4628227A US 4628227 A US4628227 A US 4628227A US 47954783 A US47954783 A US 47954783A US 4628227 A US4628227 A US 4628227A
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- electrode
- ion generator
- mica
- electrodes
- adhesive
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
- G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
- G03G15/1665—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer by introducing the second base in the nip formed by the recording member and at least one transfer member, e.g. in combination with bias or heat
- G03G15/167—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer by introducing the second base in the nip formed by the recording member and at least one transfer member, e.g. in combination with bias or heat at least one of the recording member or the transfer member being rotatable during the transfer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2092—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using pressure only
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/32—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head
- G03G15/321—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image
- G03G15/323—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image by modulating charged particles through holes or a slit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2911—Mica flake
Definitions
- the present invention relates to the fabrication of laminations of mica and conductive materials, and in particular to the manufacture of ion generating apparatus incorporating such laminations.
- Mica has long been known by those skilled in the art to be a suitable dielectric material for use in many different applications. Mica possesses superior dielectric properties, including a high dielectric constant and good dielectric strength. As a stable, inorganic material mica resists eroding by a number of different substances. Mica may be easily fabricated in thin, uniform dielectric layers with thicknesses of 1 mil and less. When fabricated in these thicknesses, mica is an extremely sturdy, durable material.
- the ion generator 10 comprises two conducting electrodes 12 and 13 separated by a dielectric layer 11.
- a pool of negative and positive ions is generated in the areas of proximity of the apertured electrode 13 and the surface of the mica.
- an air gap breakdown occurs relative to a region 11-r of dielectric 11, creating an ion pool in hole 13-h which is formed in electrode 13.
- glow discharge ion generator such as that of the present invention, produces a high percentage of usable ions and hence surprisingly high ion output current densities.
- the screen potential 54 isolates any potential on the dielectric surface 100 from the ion generator, thereby preventing accidental image erasure.
- the screen electrode furthermore provides an electrostatic lensing effect which may be used to control the size and shape of the latent electrostatic image created on dielectric 100.
- the ion generators shown in FIGS. 1 and 2 require exposure of the dielectric 11 and the apertured electrode 13 to air.
- mica as the dielectric
- materials such as ozone and nitric acids, which are produced as normal byproducts of the ion generation process.
- traditional methods of laminating thicker layers of conducting foils, such as bonding the layers with thermoset adhesives present the problem that mica is easily delaminated, i.e. cleaved into layers. This might happen at elevated temperatures, or due to the presence of atmospheric moisture.
- the laminates of the invention resist delamination due to moisture, and erosion due to ozone, nitric acid, and other substances.
- the laminates of the invention should be suitable for the generation of ions in air.
- Another object of the invention is the achievement of a mica-conductor laminate which exposes the various layers to air.
- a related object is the avoidance of delamination due to atmospheric moisture and other environmental substances.
- Yet another object of the invention is the fabrication of a mica-electrode laminate which is physically stable over a wide range of temperatures.
- a related object is the achievement of an ion generator which can carry high peak voltage RF signals over a long service life.
- a further object of the invention is the fabrication of ion generators which provide satisfactory ion output currents without requiring high drive voltages.
- a related object is the achievement of an efficient, economical ion generator. It is furthermore desirable to maintain reliable ion current outputs at a plurality of ion generation sites, over the service life of the ion generator.
- the invention provides a method for fabricating laminations of mica and conductive materials, which are used in constructing apparatus for generating ions in air.
- the laminations of the invention include a sheet of mica, one or more metallic sheets, and bonding layers of thermoplastic adhesive.
- these bonding layers are comprised of thin films of thermoplastic organopolysiloxane adhesives.
- the metallic sheets are advantageously etched to form electrodes on one or both faces of the mica sheet.
- these laminations form the core structure of ion emitting devices of the type disclosed in commonly assigned U.S. Pat. Nos. 4,155,093, and 4,160,157.
- sheets of mica and conductive material such as foil are bonded together by thin films of thermoplastic adhesive.
- adhesives are pressure sensitive in nature. Suitable chemical types include silicon-based and acrylic-based adhesives.
- An especially preferred class of adhesives are thermoplastic organopolysiloxane pressure sensitive adhesives.
- the adhesive film advantageously has a thickness in the range 0.5 ⁇ -5 ⁇ , with the lower end of the range being preferred.
- the bonding material is selected from the class of thermoplastic organopolysiloxane adhesives; i.e. which are relatively plastic at temperatures up to 100° C., and above. It is especially preferred to employ materials which have a pressure sensitive adhesive characteristic at ambient temperatures.
- Suitable, commercially available adhesives include various alkyl aryl polysiloxanes, and especially methyl phenyl and methyl polysiloxanes.
- a dimethyl diphenyl polysiloxane, or dimethyl polysiloxane is copolymerized with an MQ resin.
- the resulting formulation is catalyzed with a peroxide catalyst; illustratively an aryl peroxide such as benzoyl peroxide or 2.4 dichlorobenzoyl peroxide.
- the bonding material comprises an acrylic based adhesive including a polymer selected from the group consisting of acrylic acid, acrylic esters, and acrylamides.
- the adhesive is formed of an ethyl acrylate or 2 ethyl-hexyl acrylate, which may be employed alone, or copolymerized. These acrylic esters may further be copolymerized with vinyl acetate. Another suitable species is polyvinyl acetate. Maleic anhydrides or metal chelates may be added to any of the above acrylic adhesives to achieve enhanced cross-linking.
- portions of the conductive layer or layers may be selectively removed by etching to create a desired pattern.
- This method may be used to create electrodes of a given configuration.
- the conductive layer is comprised of a foil of stainless steel, copper, nickel, or other metals which may be etched.
- the edges of the mica and conductive layers may be coated with pressure sensitive adhesive for protective purposes.
- the lamination may be dipped in pressure sensitive adhesive to avoid exposing the edges to environmental influences.
- Such protective measures may be omitted when utilizing a dry film photoresist.
- the mica layer or layers may be fabricated in a thickness range from 2 ⁇ -75 ⁇ , most preferably 10 ⁇ -15 ⁇ .
- such layer or layers is bonded to a conductive layer or layers having a thickness greater than 6 ⁇ , preferably around 25 ⁇ .
- a mica-foil lamination is fabricated to create apparatus for generating ions in air.
- a layer of mica having a thickness around 15 ⁇ is bonded at each face to a 25 ⁇ thick stainless steel foil, this bonding being accomplished by a layer of organopolysiloxane pressure sensitive adhesive approximately 2 ⁇ in thickness.
- the foil layers are photoetched with matrix electrode patterns on opposite faces of the mica sheet.
- the lamination is bonded on one face to a mounting block which acts as a heat sink, and provides structural support.
- the electrodes include apertures to provide ion generation sites.
- the ion generator may further include "screen" electrodes and dielectric spacer layers in accordance with U.S. Pat. No. 4,160,257.
- FIG. 1 is a sectional view of a prior art ion generator, disclosed in U.S. Pat. No. 4,155,093;
- FIG. 2 is a sectional view of an ion generator of the type disclosed in U.S. Pat. No. 4,160,257, fabricated using the method of the present invention
- FIG. 3 is a plan view of a multiplexed ion generator of the type shown in FIG. 1;
- FIG. 4 is a sectional view of a mica-foil lamination in accordance with a preferred embodiment of the invention.
- FIG. 5A is a partial schematic sectional view of an actuated ion generator of the type shown in FIG. 2, with a thick layer of adhesive, showing electrical field lines;
- FIG. 5B is a schematic view of the ion generator of FIG. 5A, after extended operation.
- FIG. 6 is a cutaway perspective view of a multiplexable ion generator of the type shown in FIGS. 2 and 3, with laminated heat sink.
- an ion generator of the geometry of U.S. Pat. No. 4,160,257 may be fabricated using a layer of mica laminated to thin sheets of metallic foil, by etching the foil to create an array of electrodes on each side of the mica.
- One such electrode pattern is illustrated at 10" in the plan view of FIG. 3, showing a series of finger electrodes 13 on one side of a mica sheet 11, and a transverse series of selector bars 12 (seen in phantom) on the other side of the mica sheet.
- An array of apertures 13-h are located in the finger electrodes 13 at the crossover points with selector bars 12. It is a particularly advantageous aspect of the invention that the use of a mica sheet 11 as the dielectric allows the fabrication of an ion generator with uniform ion output current densities at various apertures 13-h over the expanse of the dielectric.
- a mica sheet 11 of uniform thickness is bonded to two layers of foil 30 and 35. Foil layers 30 and 35 may be etched to form electrodes, as discussed below.
- the preferred dielectric material is Muscovite mica, H 2 KAl 3 (SiO 4 ) 3 . Muscovite mica, and in particular Ruby mica, is known for its superior dielectric properties, notably a high Q value.
- a matrix electrode ion generator 10 FIG. 3
- film mica which is split from the best qualities of block mica. It is desirable to have a sheet of uniform thickness in the range from about 2 ⁇ -75 ⁇ , most preferably 10 ⁇ -15 ⁇ .
- the thinner mica sheets are generally harder to handle and more expensive, while the thicker mica requires higher RF voltages between electrodes 12 and 13 (see FIG. 1).
- the mica should be free of cracks, fractures, and similar defects.
- the single mica sheet 11 is replaced with a series of side-by-side mica splittings. Care should be taken to provide a series of mica chips of closely matching thicknesses.
- thermoplastic adhesive 33 and 37 The bond between mica sheet 11 and foil layers 30 and 35 (FIG. 4) is achieved by extremely thin layers of thermoplastic adhesive 33 and 37.
- thermoplastic materials having adhesive bonding properties are suitable for layers 33 and 37.
- layers 33 and 37 are composed of a material having pressure sensitive adhesive properties at ambient conditions and good adhesive bonding properties between dissimilar materials, namely mica and metallic foil, which bonding properties are maintained at elevated temperature conditions.
- the adhesive layers 33 and 37 exhibit flexibility at elevated operating temperatures.
- the adhesive should be sufficiently flexible and plastic under these elevated temperatures that the mica does not delaminate upon heating and cooling between ambient temperatures and about 150° F. This is a critical requirement in view of the danger of differential thermal expansion of the mica and foil layers. In the absence of a layer of flexible adhesive to act as a buffer, this might induce a shear force in the mica 11, causing the mica to cleave at a surface layer.
- adhesives there are a variety of commercially available adhesives which can meet the above requirements over prolonged periods of operation.
- preferred classes of adhesive are silicone-based adhesives, particularly polysiloxanes, and acrylic-based polymer adhesives, particularly those within the acrylic acid or acrylic ester chemical classes.
- Polysiloxane adhesives are especially useful in the construction and operation of ion generators such as those of FIGS. 1 and 2, due to the chemical nature of these materials. These adhesives are notably resistant to moisture and chemicals, such as ozone or nitric acid, which may be formed in trace amounts when the dielectric laminate of the invention is subjected to a high voltage alternating potential on the order of kilovolts to generate ions in air. Adhesive layers formed of these classes resist degradation by etching chemicals such as ferric chloride and potassium hydroxide, which are commonly used to strip photoresist from the metallic foil to create electrodes 12, 13, as discussed below. Fluorinated hydrocarbon solvents and developers should be avoided when employing silicone-based adhesives.
- silicone-based adhesives in particular polysiloxane adhesives
- silicone adhesives selected from the organopolysiloxane class are more readily available or more readily synthesized than other polysiloxanes.
- Suitable materials within these subclasses of organopolysiloxanes include, for example, methyl phenyl polysiloxanes and methyl polysiloxanes. Particularly, dimethyl diphenyl polysiloxane or dimethylpolysiloxane are preferred; adhesives within these subclasses may be used alone or advantageously copolymerized with an MQ resin.
- MxQy a peroxide catalyst
- aryl peroxide such as 2,4 benzoyl peroxide.
- a suitable mixture of dimethyl diphenyl polysiloxane gum and MQ resin for use in forming adhesive film layers 33 and 37 is commercially available under the trade name SILGRIP SR 6574 from the General Electric Company of Waterford, N.Y.
- a suitable mixture of dimethylpolysiloxane gum and MQ resin is commercially available under the trade designation 280 A adhesive from Dow Corning Co. of Midland, Mich.
- Either of the above mixtures may be polymerized using, for example, an aryl peroxide type catalyst such as one containing 2,4, dichloro benzoyl peroxide, and a phlegmatic agent such as dibutyl phthalate.
- This catalyst is available under trade name CADOX TDP from Noury Chemical Company, Burt, N.Y. It should be appreciated that the catalyst, while preferred, can be omitted and the polymerization initiated by other means such as radiation (electron beam) curing.
- suitable adhesives include polymers selected from the group acrylic acid, acrylic esters and acrylamide.
- Preferred acrylic-based adhesives may be formed of acrylic esters such as ethyl acrylate or 2 ethyl-hexyl acrylate. These acrylic esters may be polymerized alone or copolymerized with each other. Additionally either ethyl acrylate or 2 ethyl hexyl acrylate or mixtures thereof may be copolymerized with vinyl acetate to form an adhesive for film layers 33 and 37.
- a suitable adhesive may also be formed of polyvinyl acetate.
- the adhesive film layer may also include acrylic acid and/or acrylamide as copolymers with any of the above-mentioned acrylic based polymer formulations.
- Maleic anhydride or metal chelates may be added to the above acrylic-based polymers to enhance cross linking of the polymer.
- An illustrative acrylic-based adhesive composed of an acrylic resin solution containing 2-ethyl-hexyl acrylate is available under the trade name GELVA Multipolymer Solution RA-2102 from Monsanto Chemical Company, St. Louis, Mo. If this latter acrylic resin solution is used, a catalyst is not required.
- the solution may simply be diluted with additional solvent such as butyl acetate to a viscosity of about 90 centipoise for facilitate even coating of the mica with the solution prior to curing the adhesive by convective heating.
- the mica is coated with a pressure sensitive adhesive formulation using any well known technique which permits precise control over the coating thickness.
- the adhesive layers desirably have extremely thin thicknesses in the range 0.5 ⁇ -5 ⁇ , most preferably in the range 0.6 ⁇ -2.5 ⁇ .
- the thickness may be determined after lamination by subtracting the known thickness of the mica and foil sheets from the total thickness of the laminate.
- the adhesive may be applied manually, as by brush coating, spraying, and dipping.
- a preferred method of coating is that of dipping the mica into a bath of pressure sensitive adhesive, followed by withdrawal of the mica at a calibrated speed. Generally, a faster speed of withdrawal results in a thicker pressure sensitive adhesive coating on each side of the mica sheet 11.
- FIGS. 5A and 5B are schematic sectional diagrams showing an ion generator 10' of the type generally illustrated in FIG. 2.
- the ion generator 10' illustratively consists of a 25 ⁇ thick mica layer 11 having an apertured electrode 13 bonded on one face, and a driver electrode 12 on the other.
- the bonding material is a 10 ⁇ thick layer of pressure sensitive adhesive.
- FIGS. 5A and 5B show characteristic field lines during electrical actuation of ion generator 10'.
- a 2600 volt RF signal between electrodes 12 and 13 causes the formation of a pool of positive and negative ions in the aperture 13-h.
- the control electrode 13 is held at a negative 600 volt potential with respect to ground (i.e.
- negative ions are projected from aperture 13-h to the dielectric surface 100.
- the pattern of ion projection and ion current output may be analyzed in terms of the electrical field lines induced by the various imposed potentials, including that caused by the surface charge at 11-r within aperture 13-h. In order to obtain high ion output currents without requiring unduly large and expensive driving voltages, it is desirable to minimize the diversion of ions from the aperture 13-h to locations other than the dielectric 100.
- One of the principal determinants of output currents is the degree to which ions are diverted from aperture 13-h to regions adjacent the junction of control electrode 13, adhesive 33, and mica 11.
- FIGS. 5A and 5B wherein the latter represents a later stage of operation of an ion generator 10' with a thick adhesive layer 33, there is a tendency during the continued operation of ion generator 10' to etch away a portion 33-h of the adhesive 33 in this region.
- This is the natural effect of the high temperature, high voltage ion fields found in this area, which will cause the plasma erosion of even relatively durable adhesives such as organopolysiloxane type adhesives.
- the rate of adhesive undercutting during ion generation and resulting loss of ion current output increases with increasing adhesive film thickness.
- the adhesive film 33 consists of a layer of organopolysiloxane adhesive having a thickness in the range 0.5 ⁇ -5 ⁇ more preferably 0.6 ⁇ -2.5 ⁇ .
- the pressure sensitive adhesive is applied to the mica in solution.
- the resin may be diluted to a desired viscosity using a variety of solvents, well known to those skilled in the art. In general, higher viscosity formulations will result in a thicker layer of pressure sensitive adhesive for a given method of application.
- the pressure sensitive adhesive formulation has a viscosity in the range from about 10 cps.-100 cps. The mixture advantageously is filtered prior to coating onto the mica sheet 11.
- the coating of mica sheet 11 preferably involves dipping the sheet into the pressure sensitive adhesive bath to completely cover both sides.
- a protective layer of tape may be applied to the edges of the mica-foil lamination.
- the tape provides protection against migration of moisture between layers of the mica.
- the tape may be removed after processing of the mica, during which it provides a protective layer, as further discussed herein.
- the tape is coated on one face with pressure sensitive adhesive which may be the same type as used to bond the mica-foil layers.
- the foil layers 30 and 35 advantageously comprise a metal which may be etched in a pattern of electrodes 12, 13.
- Illustrative materials include nickel, copper, tantalum, and titanium; the preferred material, however, is stainless steel.
- a foil having a thickness from about 6 ⁇ -50 ⁇ is desirable, with the preferred thickness being around 25 ⁇ .
- the foil sheets 30 and 35 are cut to desired dimensions, and cleaned prior to application to the mica sheet 11. Each sheet is placed in registration with one face of the mica sheet, and then bonded to the mica by applying pressure evenly over the foil layers. In an alternative embodiment, foil sheets 30 and 35 are coated with the bonding material, followed by lamination to mica sheet 11.
- foil sheets 30 and 35 are pretreated by exposure, developing, and etching in patterns which broadly define the outlines of electrode patterns 12 and 13.
- the prepatterned foil sheets 30 and 35 are then laminated to the mica 11, and etched in electrode patterns as described below. It is important to carry out the lamination process in a dust-free environment, and then inspect at various stages for dust particles and other foreign matter, which may later create a risk of electrical arcing and otherwise impair performance of ion generator 10'.
- the foil is selectively removed to create a desired pattern, as for example the pattern of electrodes 12 and 13 shown in FIG. 3.
- the desired pattern is created by a photoetching process. This involves coating the foil with a photoresistant material; covering the coated foil with a photomask to create the desired patterns; exposing the masked laminate to ultraviolet radiation; and etching the irradiated foil in order to remove those portions which have been rendered soluble during the preceding steps.
- the preferred version of this process uses a positive photoresist, which is characterized in that those areas which are exposed to ultraviolet radiation will be rendered soluble and later dissolved.
- a suitable sealing material is a several mil thick sprayed-on silicone conformal coating.
- steps should be taken to remove excess adhesive, especially any adhesive located in apertures 13-h (FIG. 1).
- the lamination may be reheated for additional adhesive curing, and a further coating layer for electrodes 13 may be applied if this material has been attacked during the cleaning step.
- the fabrication process includes additional steps for forming dielectric spacer layer 51 and screen electrode 52.
- One method of forming dielectric spacer 51 is by screen printing a dielectric material, such as a UV curable material, or silicone layer.
- the screen electrode 52 preferably comprises a layer of foil which has been etched in an array of screen apertures 53 matching apertures 13-h of electrode 13.
- the screen electrode may be bonded to the dielectric spacer layer using, for example, any of the silicone adhesives disclosed above.
- the dielectric spacer 51 may comprise a unitary sheet laminated over electrodes 12, including a series of slots 55.
- the mica-electrode laminate is appended to a heat sink 60 (FIG. 6).
- the heat sink 60 is applied to the lamination face containing selector bars 23 in order to absorb heat resulting from high voltage alternating potentials.
- a variety of materials are suitable as well known in the art; in the case of electrically conductive materials, an insulating layer 65 should be included to isolate the heat sink from selector bars 23.
- Such a heat sink also advantageously acts as a mounting block to provide structural rigidity, maintaining ion generator 10 flat in the plane of the mica, which is an important characteristic.
- a mica-electrode lamination of the type illustrated in FIG. 2 was fabricated as follows:
- a pressure sensitive adhesive was formulated of 220 parts by weight of a polysiloxane mixture, SILGRIP SR6574 of the General Electric Co., Waterford N.Y., containing dimethyl diphenyl siloxane gum plus MQ resin.
- the polysiloxane was admixed with 1 part by weight of 2,4 dichlorobenzoyl peroxide catalyst plus 1 part by weight phlegmatic agent dibutyl phthalate; sold under the tradename CADOX TDP by Noury Chemical Co., Burt, N.Y.
- the mixture was then diluted to a viscosity of about 90 centipoise with butyl acetate solvent.
- the resulting liquid adhesive formulation was filtered under a pressure of approximately 30 psi and poured into a graduate.
- a 1" ⁇ 9" sheet of ruby Muscovite mica having a thickness in the range 20-25 microns was cleaned using lint-free tissues and methyl ethyl ketone (MEK). After drying, the mica sheet was suspended from a dipping fixture and lowered into the pressure-sensitive adhesive formulation until all but two millimeters was submersed. The mica was then withdrawn from the adhesive bath at a speed of 2 cm/minute, providing a layer of adhesive approximately 3 microns in thickness. The coated mica was stored in a dust-free jar and placed in a 150° C. oven for five minutes in order to cure the pressure-sensitive adhesive.
- MEK methyl ethyl ketone
- Example I The mica-electrode lamination of Example I was further processed as set forth below, to provide an ion generator of the type illustrated in FIGS. 2, 6.
- the lamination was placed in a mounting fixture with the selector bars 12 upward.
- the lamination was bonded to a Kapton film 65 (Kapton is a registered trademark of E.I. Dupont de Nemours & Co., Wilmington, DE) to provide an insulating support surface for electrode leads.
- Kapton film 65 Kapton is a registered trademark of E.I. Dupont de Nemours & Co., Wilmington, DE
- a stainless steel mounting block of dimensions compatible with the Kapton sheet was prepared for mounting by application of a layer of adhesive resin in accordance with the formulation set forth in Example I, followed by smoothing of the adhesive using a metering blade.
- the mounting block 60 was clamped in registration with the Kapton film, and any excess adhesive at the edges was removed using cotton swabs.
- the completed structure was set aside for 24 hours to allow the adhesive to set.
- Screen electrodes 52 were formed by photoetching a stainless steel foil in a pattern of apertures 53 corresponding to apertures 13-h in electrode 13. Two 2.5 mil thick layers of Riston 3315 dry film photoresists were laminated onto the finger electrode face, then developed in a pattern of dielectric spacer layer 51 (FIG. 2), with 15 mil wide slots 55 surrounding each row of finger electrodes 13. The foil layer containing screen electrode 52 was then bonded to spacer layer 51 using the polysiloxane pressure sensitive adhesive of Example I.
- the complete ion generator consisted of an array of 16 drive lines and 96 control electrodes which formed a total of 1536 crossover locations capable of placing 1536 latent image dots across a 19.25 cm. wide dielectric surface 100 (FIG. 2). Corresponding to each crossover location was a 0.15 mm diameter etched hole 53 in the screen electrode. Bias potentials of the various electrodes were as follows (with the counterelectrode 105 maintained at ground potential):
- control eletrode -400 volts (during the application of a -400 volts print pulse, this voltage becomes -700 volts)
- driver electrode bias with respect to screen electrode +300 volts
- a mica-electrode laminate was fabricated as described in Example I, except that an acrylic-based pressure sensitive adhesive was employed.
- the pressure sensitive adhesive was formulated of an acrylic resin solution available under the trade name GELVA Multipolymer Solution RA2101 containing 2 ethyl-hexyl acrylate, which was diluted to a viscosity of about 50 centipoise using butyl acetate.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US06/479,547 US4628227A (en) | 1980-10-06 | 1983-03-28 | Mica-electrode laminations for the generation of ions in air |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US06/194,649 US4381327A (en) | 1980-10-06 | 1980-10-06 | Mica-foil laminations |
US06/479,547 US4628227A (en) | 1980-10-06 | 1983-03-28 | Mica-electrode laminations for the generation of ions in air |
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US06/194,649 Continuation-In-Part US4381327A (en) | 1980-08-21 | 1980-10-06 | Mica-foil laminations |
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US4628227A true US4628227A (en) | 1986-12-09 |
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US06/479,547 Expired - Lifetime US4628227A (en) | 1980-10-06 | 1983-03-28 | Mica-electrode laminations for the generation of ions in air |
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US4745421A (en) * | 1983-12-09 | 1988-05-17 | Delphax Systems | Ionic print cartridge and printer |
US4749911A (en) * | 1987-03-30 | 1988-06-07 | Rpc Industries | Ion plasma electron gun with dose rate control via amplitude modulation of the plasma discharge |
US4891656A (en) * | 1988-12-14 | 1990-01-02 | Delphax Systems | Print cartridge with non-divergent electrostatic field |
US4990942A (en) * | 1990-04-04 | 1991-02-05 | Delphax Systems | Printer RF line control |
US5014076A (en) * | 1989-11-13 | 1991-05-07 | Delphax Systems | Printer with high frequency charge carrier generation |
US5170189A (en) * | 1990-08-07 | 1992-12-08 | Fuji Xerox Co., Ltd. | Electrostatic latent image forming device with integral feeder terminal connection |
US5278588A (en) * | 1991-05-17 | 1994-01-11 | Delphax Systems | Electrographic printing device |
US5646669A (en) * | 1992-10-22 | 1997-07-08 | Fuji Xerox Co., Ltd. | Corrosion resistant electrostatic recording head with multiple layers |
US5669973A (en) * | 1995-06-06 | 1997-09-23 | David Sarnoff Research Center, Inc. | Apparatus for electrostatically depositing and retaining materials upon a substrate |
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US6061074A (en) * | 1996-01-29 | 2000-05-09 | International Business Machines Corporation | Ion generator for ionographic print heads |
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US6239823B1 (en) | 1998-06-11 | 2001-05-29 | Richard Allen Fotland | Electrostatic latent image forming printhead having separate discharge and modulation electrodes |
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US4745421A (en) * | 1983-12-09 | 1988-05-17 | Delphax Systems | Ionic print cartridge and printer |
US4749911A (en) * | 1987-03-30 | 1988-06-07 | Rpc Industries | Ion plasma electron gun with dose rate control via amplitude modulation of the plasma discharge |
US4891656A (en) * | 1988-12-14 | 1990-01-02 | Delphax Systems | Print cartridge with non-divergent electrostatic field |
US5014076A (en) * | 1989-11-13 | 1991-05-07 | Delphax Systems | Printer with high frequency charge carrier generation |
US4990942A (en) * | 1990-04-04 | 1991-02-05 | Delphax Systems | Printer RF line control |
US5170189A (en) * | 1990-08-07 | 1992-12-08 | Fuji Xerox Co., Ltd. | Electrostatic latent image forming device with integral feeder terminal connection |
US5278588A (en) * | 1991-05-17 | 1994-01-11 | Delphax Systems | Electrographic printing device |
US5646669A (en) * | 1992-10-22 | 1997-07-08 | Fuji Xerox Co., Ltd. | Corrosion resistant electrostatic recording head with multiple layers |
US6074688A (en) * | 1995-06-06 | 2000-06-13 | Delsys Pharmaceautical Corporation | Method for electrostatically depositing a medicament powder upon predefined regions of a substrate |
US6319541B1 (en) | 1995-06-06 | 2001-11-20 | Delsys Pharmaceutical Corporation | Method and apparatus for electrostatically depositing a medicament powder upon predefined regions of a substrate |
US6007630A (en) * | 1995-06-06 | 1999-12-28 | David Sarnoff Research Center Inc. | Method and apparatus for electrostatically depositing a medicament powder upon predefined regions of a substrate |
US5669973A (en) * | 1995-06-06 | 1997-09-23 | David Sarnoff Research Center, Inc. | Apparatus for electrostatically depositing and retaining materials upon a substrate |
US6802313B2 (en) | 1995-06-06 | 2004-10-12 | Sarnoff Corporation | Method and apparatus for electrostatically depositing a medicament powder upon predefined regions of a substrate |
US5714007A (en) * | 1995-06-06 | 1998-02-03 | David Sarnoff Research Center, Inc. | Apparatus for electrostatically depositing a medicament powder upon predefined regions of a substrate |
US6061074A (en) * | 1996-01-29 | 2000-05-09 | International Business Machines Corporation | Ion generator for ionographic print heads |
US6475351B2 (en) | 1998-06-10 | 2002-11-05 | Delsys Pharmaceutical Corporation | AC waveforms biasing for bead manipulating chucks |
US6149774A (en) * | 1998-06-10 | 2000-11-21 | Delsys Pharmaceutical Corporation | AC waveforms biasing for bead manipulating chucks |
US6239823B1 (en) | 1998-06-11 | 2001-05-29 | Richard Allen Fotland | Electrostatic latent image forming printhead having separate discharge and modulation electrodes |
US20050158366A1 (en) * | 1999-04-27 | 2005-07-21 | Richard Fotland | Method and apparatus for producing uniform small portions of fine powders and articles thereof |
US6923979B2 (en) | 1999-04-27 | 2005-08-02 | Microdose Technologies, Inc. | Method for depositing particles onto a substrate using an alternating electric field |
US7632533B2 (en) | 1999-04-27 | 2009-12-15 | Microdose Therapeutx, Inc. | Method and apparatus for producing uniform small portions of fine powders and articles thereof |
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WO2007075586A3 (en) * | 2005-12-22 | 2008-01-24 | Harshad K Uka | Flexible circuit |
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